BTN6718A3

CYStech Electronics Corp. NPN Epitaxial Planar Transistor Spec. No. : C823A3 Issued Date : 2006.10.16 Revised Date : Page No. : 1/5 BTN6718A3 Description The BTN6718A3 is designed for general purpose medium power amplifier and switching applications. Features • Low collector saturation voltage • High breakdown voltage, VCEO=100V (min.) • High collector current, IC(max)=1A (DC) • Pb-free package Symbol BTN6718A3 Outline TO-92 B：Base C：Collector E：Emitter ECB Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Note : Pulse test, PW ≤ 10ms, Duty ≤ 50%. Symbol VCBO VCEO VEBO IC ICP PD RθJA Tj Tstg Limits 100 100 5 1 2 (Note) 850 147 150 -55~+150 Unit V V V A A mW °C/W °C °C BTN6718A3 CYStek Product Specification CYStech Electronics Corp. Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(SAT) *hFE 1 *hFE 2 *hFE 3 fT Cob Min. 100 100 5 90 100 20 50 Typ. Max. 100 100 350 300 20 Unit V V V nA nA mV MHz pF Spec. No. : C823A3 Issued Date : 2006.10.16 Revised Date : Page No. : 2/5 Test Conditions IC=100μA IC=1mA IE=10μA VCB=80V, IE=0 VEB=4V, IC=0 IC=350mA, IB=35mA VCE=1V, IC=50mA VCE=1V, IC=250mA VCE=1V, IC=500mA VCE=10V, IC=50mA, f=100MHz VCB=10V, IE=0A, f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2% Ordering Information Device BTN6718A3 Package TO-92 (Pb-free) Shipping 2000 pcs / Tape & Box Marking N6718 BTN6718A3 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current 1000 1000 VCE(SAT) Current Gain---HFE VCE=2V Spec. No. : C823A3 Issued Date : 2006.10.16 Revised Date : Page No. : 3/5 Saturation Voltage vs Collector Current Saturation Voltage-(mV) IC=40IB 100 VCE=1V 100 IC=20IB IC=10IB 10 1 10 100 1000 10000 Collector Current ---IC(mA) 10 1 10 100 1000 10000 Collector Current ---IC(mA) Saturation Voltage vs Collector Current 10000 VBESAT@IC=10IB 1000 Power Derating Curve Power Dissipation-PD(mW) Saturation Voltage-(mV) 800 600 400 1000 200 100 1 10 100 1000 10000 Collector Current ---IC(mA) 0 0 50 100 150 200 Ambient Temperature ---TA(℃) BTN6718A3 CYStek Product Specification CYStech Electronics Corp. TO-92 Taping Outline H2A H2A D2 Spec. No. : C823A3 Issued Date : 2006.10.16 Revised Date : Page No. : 4/5 H2 H2 A H3 H4 H L L1 H1 F1 F2 T2 T T1 P1 P P2 D1 D W1 W DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 BTN6718A3 CYStek Product Specification CYStech Electronics Corp. TO-92 Dimension Marking: Spec. No. : C823A3 Issued Date : 2006.10.16 Revised Date : Page No. : 5/5 A B 1 2 3 α2 N6718 α3 C D H I E F G α1 Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 * 0.1000 * 0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTN6718A3 CYStek Product Specification