CASD501SG

CYStech Electronics Corp. Spec. No. : C336SG Issued Date : 2003.06.01 Revised Date : Page No. : 1/3 CASD501SG Surface Mount Small Signal Schottky Barrier Diodes Features • For surface mounted application • Extremely low VF • Extremely Thin Package • Low Stored Charge • Majority Carrier Conduction Mechanical Data • Case: Molded Plastic, JEDEC SOD-323. • Terminals: Solder plated, solderable per MIL-STD-750 Method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. • Weight: 0.0045 gram, 0.000159 ounce Maximum Ratings (Ta=25℃, unless otherwise noted) Parameter Repetitive Peak Reverse Voltage Continuous Reverse Voltage Average Rectified Current Peak Forward Surge Current Typical Junction Capacitance Operating Temperature Range Storage Temperature Range Symbol VRM VR IO IFSM CD TJ TSTG Conditions min typ max 45 40 100 unit V V mA mA pF +125 +125 °C °C 8.3ms single half sine-wave superimposed on rated load (JEDEC method) f = 1MHz and applied 10VDC Reverse Voltage -40 -40 1000 20 Electrical Characteristics (Ta=25℃, unless otherwise noted) Parameter Forward Voltage Reverse Leakage Current Symbol VF IR Conditions IF = 100mA DC VR = 10V DC min typ max 0.55 30 unit V µA CASD501SG CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Characteristics 100 10000 Spec. No. : C336SG Issued Date : 2003.06.01 Revised Date : Page No. : 2/3 Reverse Characteristics 125℃ Forward Current---I F(mA) 125℃ 25℃ Reverse Current---I R(μA) 1000 75℃ 10 -25℃ 100 75℃ 10 25℃ 1 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.1 0 10 20 30 40 Forward Voltage---VF(V) Reverse Voltage---VR(V) Forward Current Derating Curve (Mounting on glass epoxy PCBs) 120 Diode Capacitance vs Reverse Voltage 100 Diode Capacitance---C D(pF) Percentage of Average Forward Current---(%) 100 80 60 40 20 0 0 25 50 75 100 125 150 10 1 0 5 Ambient Temperature---Ta(℃) 10 15 20 25 Reverse Voltage---VR(V) 30 35 CASD501SG CYStek Product Specification CYStech Electronics Corp. SOD-323 Dimension Spec. No. : C336SG Issued Date : 2003.06.01 Revised Date : Page No. : 3/3 SOD-323 Plastic Surface Mounted Package CYStek Package Code:SG *:Typical DIM A B C Inches Min. Max. 0.090 0.106 0.045 0.053 0.012(typ) Millimeters Min. Max. 2.3 2.7 1.15 1.35 0.3(typ) DIM D R Inches Min. Max. 0.028 0.035 0.02(typ) Millimeters Min. Max. 0.7 0.9 0.5(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CASD501SG CYStek Product Specification