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CSMC582XSC

CSMC582XSC

  • 厂商:

    CYSTEKEC(全宇昕)

  • 封装:

  • 描述:

    CSMC582XSC - 3.0Amp. Surface Mount Schottky Barrier Diodes - Cystech Electonics Corp.

  • 详情介绍
  • 数据手册
  • 价格&库存
CSMC582XSC 数据手册
CYStech Electronics Corp. 3.0Amp. Surface Mount Schottky Barrier Diodes Spec. No. : C330SC Issued Date : 2003.10.17 Revised Date : Page No. : 1/3 CSMC582XSC Series Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 Mechanical Data • Case: Molded plastic, SMC/JEDEC DO-214AB. • Terminals: Solder plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Mounting Position : Any. • Weight: 0.195 gram, 0.00585 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. ) Parameter Conditions Type Symbol CSMC CSMC CSMC Units 5820 5821 5822 Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous IF=3A (Note 1) forward voltage Maximum average forward rectified current 8.3ms single half sine wave superimposed Peak forward surge current on rated load(JEDEC method) VR=VRRM,TA=25℃(Note 1) Maximum DC reverse current VR=VRRM,TA=125℃(Note 1) Maximum thermal Junction to ambient(Note 2) resistance Diode junction capacitance f=1MHz and applied 4V reverse voltage Storage temperature Operating temperature Notes : 1.Pulse test, pulse width=300μsec, 2% duty cycle 2.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area. VRRM VRMS VR VF IO IFSM IR Rth,JA CJ Tstg TJ 20 14 20 0.475 30 21 30 0.500 3 80 2 20 55 (typ) 300 (typ) -55~+150 -55~+125 40 28 40 0.525 V V V V A A mA mA ℃/w pF ℃ ℃ CSMC582XSC CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Forward Current Derating Curve 3.5 Peak Forward Surge Current---IFSM(A) 90 80 70 60 50 40 30 20 10 0 1 10 Spec. No. : C330SC Issued Date : 2003.10.17 Revised Date : Page No. : 2/3 Maximum Non-Repetitive Forward Surge Current Average Forward Current---Io(A) 3 2.5 2 1.5 1 0.5 0 0 50 100 Ambient Temperature---TA(℃) 150 Tj=25℃, 8.3ms Single Half Sine Wave JEDEC method 100 Number of Cycles at 60Hz Forward Current vs Forward Voltage 100 Junction Capacitance---CJ(pF) 700 600 500 400 300 200 100 0.01 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 0 0.01 Junction Capacitance vs Reverse Voltage Forward Current---IF(A) 10 Tj=25℃, Pulse width=300μs 1% Duty cycle 1 0.1 0.1 1 10 Forward Voltage---VF(V) Reverse Voltage---VR(V) Reverse Leakage Current vs Reverse Voltage 100 Reverse Leakage Current---IR(mA) 10 1 Tj=75℃ 0.1 Tj=25℃ 0.01 0 20 40 60 80 100 120 140 Percentage of Rated Peak R everse Voltage---(%) CSMC582XSC CYStek Product Specification CYStech Electronics Corp. SMC/DO-214AB Dimension Spec. No. : C330SC Issued Date : 2003.10.17 Revised Date : Page No. : 3/3 Marking Code: Device Code CSMC 5820 SK32 CSMC 5821 SK33 CSMC 5822 SK34 SMC/DO-214AB Plastic Surface Mounted Package CYStek Package Code:SC *:Typical DIM A B C D Inches Min. Max. 0.260 0.276 0.173 0.189 0.012(typ) 0.144 0.152 Millimeters Min. Max. 6.6 7.0 4.4 4.8 0.3(typ) 3.6 3.8 DIM E F G H Inches Min. Max. 0.228 0.244 0.071 0.087 0.032(typ) 0.04(typ) Millimeters Min. Max. 5.8 6.2 1.8 2.2 0.8(typ) 1.0(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CSMC582XSC CYStek Product Specification
CSMC582XSC
1. 物料型号: - CSMC582XSC系列,包括CSMC5820、CSMC5821和CSMC5822三种型号。

2. 器件简介: - 这些是表面贴装肖特基势垒二极管,适用于低电压、高频逆变器、自由轮流通道和极性保护应用。

3. 引脚分配: - 根据封装SMC/DO-214AB,具有两个引脚,阳极和阴极,极性通过阴极带上的标记来指示。

4. 参数特性: - 重复峰值反向电压分别为20V、30V和40V(对应CSMC5820、CSMC5821和CSMC5822)。 - 最大RMS电压分别为14V、21V和28V。 - 最大直流阻断电压与重复峰值反向电压相同。 - 在3A电流下的最大瞬时正向电压分别为0.475V、0.500V和0.525V。 - 最大平均正向电流为3A。 - 峰值正向浪涌电流为80A(8.3ms单半正弦波叠加在额定负载上,JEDEC方法)。 - 在最大反向电压和125°C环境温度下的最大直流反向电流为20μA。

5. 功能详解: - 这些二极管具有低漏电流、高浪涌能力和高温度焊接特性(250°C/10秒在端子上)。 - 超过MIL-S-19500/228环境标准。

6. 应用信息: - 适用于表面贴装应用,特别是在低电压、高频逆变器、自由轮流通道和极性保护等领域。

7. 封装信息: - 封装类型为SMC/DO-214AB,塑封材料为UL94V-0等级的环氧树脂家族。 - 引脚为镀锡,符合MIL-STD-750方法2026的可焊性。 - 重量为0.195克或0.00585盎司。
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