MTB13N03Q8

CYStech Electronics Corp. N-Channel Logic Level Enhancement Mode Power MOSFET Spec. No. : C728Q8 Issued Date : 2009.07.01 Revised Date : Page No. : 1/8 MTB13N03Q8 Description BVDSS ID RDSON(max) 30V 11A 12.5mΩ The MTB13N03Q8 is a N-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. Features • Single Drive Requirement • Low On-resistance • Fast Switching Characteristic • Dynamic dv/dt rating • Repetitive Avalanche Rated • Pb-free and Halogen-free package Symbol MTB13N03Q8 Outline SOP-8 Pin 1 G：Gate D：Drain S：Source MTB13N03Q8 CYStek Product Specification CYStech Electronics Corp. Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Spec. No. : C728Q8 Issued Date : 2009.07.01 Revised Date : Page No. : 2/8 Limits Unit Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @ TC=25°C Continuous Drain Current @ TC=100°C Pulsed Drain Current Avalanche Current Avalanche Energy @ L=0.1mH, ID=11A, RG=25Ω Repetitive Avalanche Energy @ L=0.05mH TA=25℃ Total Power Dissipation TA=100℃ Operating Junction and Storage Temperature Range VDS VGS ID IDM IAS EAS EAR PD Tj, Tstg 30 ±20 11 9 44 *1 11 6 3 *2 3 *3 1.5 -55~+175 V A mJ W °C Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a Value 25 50 *3 Unit °C/W °C/W Note : 1. Pulse width limited by maximum junction temperature 2. Duty cycle≤1% 3. Surface mounted on 1 in² copper pad of FR-4 board, 125°C/W when mounted on minimum copper pad Characteristics (TC=25°C, unless otherwise specified) Symbol Static BVDSS VGS(th) GFS IGSS IDSS ID(ON) RDS(ON) Dynamic Ciss Coss Crss MTB13N03Q8 Min. 30 1 11 - Typ. 1.5 36 11 14 1930 255 150 Max. 3 ±100 1 25 12.5 20 - Unit V V S nA μA A mΩ mΩ Test Conditions VGS=0, ID=250μA VDS = VGS, ID=250μA VDS =5V, ID=11A VGS=±20 VDS =24V, VGS =0 VDS =20V, VGS =0, TJ=125°C VDS =10V, VGS =10V VGS =10V, ID=11A VGS =4.5V, ID=9A *1 *1 *1 pF VGS=0V, VDS=15V, f=1MHz CYStek Product Specification CYStech Electronics Corp. Characteristics (TC=25°C, unless otherwise specified) Symbol Qg (VGS=10V) *1, 2 Qg (VGS=4.5V) *1, 2 Qgs *1, 2 Qgd *1, 2 td(ON) *1, 2 tr *1, 2 td(OFF) *1, 2 tf *1, 2 Rg Source-Drain Diode IS *1 ISM *3 VSD *1 trr Qrr Min. Typ. 22 13 4.5 7.2 10 8 28 5 2 20 10 Max. 2.5 10 1.2 Unit nC Test Conditions Spec. No. : C728Q8 Issued Date : 2009.07.01 Revised Date : Page No. : 3/8 VDS=15V, VGS=10V, ID=11A ns Ω VDS=15V, ID=1A, VGS=10V, RGS=2.7Ω VGS=15mV, VDS=0V, f=1MHz A V ns nC IF=IS, VGS=0V IF=IS, dIF/dt=100A/μs Note : *1.Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% *2.Independent of operating temperature *3.Pulse width limited by maximum junction temperature. Ordering Information Device MTB13N03Q8 Package SOP-8 (Pb-free & Halogen-free package) Shipping 2500 pcs / Tape & Reel Marking B13N03 MTB13N03Q8 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C728Q8 Issued Date : 2009.07.01 Revised Date : Page No. : 4/8 MTB13N03Q8 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves(Cont.) Spec. No. : C728Q8 Issued Date : 2009.07.01 Revised Date : Page No. : 5/8 MTB13N03Q8 CYStek Product Specification CYStech Electronics Corp. Reel Dimension Spec. No. : C728Q8 Issued Date : 2009.07.01 Revised Date : Page No. : 6/8 Carrier Tape Dimension MTB13N03Q8 CYStek Product Specification CYStech Electronics Corp. Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Spec. No. : C728Q8 Issued Date : 2009.07.01 Revised Date : Page No. : 7/8 Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds 240 +0/-5 °C 10-30 seconds 6°C/second max. 6 minutes max. Pb-free Assembly 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260 +0/-5 °C 20-40 seconds 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTB13N03Q8 CYStek Product Specification CYStech Electronics Corp. SOP-8 Dimension Top View A Right side View G Spec. No. : C728Q8 Issued Date : 2009.07.01 Revised Date : Page No. : 8/8 Marking: I B C H Device Name Date Code J D Front View Part A E Part A K L N O 8-Lead SOP-8 Plastic Package CYStek Package Code: Q8 M F *: Typical DIM A B C D E F G H Inches Min. Max. 0.1850 0.2007 0.1457 0.1614 0.2283 0.2441 0.0500* 0.0130 0.0201 0.1472 0.1527 0.0472 0.0638 0.1889 0.2007 Millimeters Min. Max. 4.70 5.10 3.70 4.10 5.80 6.20 1.27* 0.33 0.51 3.74 3.88 1.20 1.62 4.80 5.10 DIM I J K L M N O Inches Min. Max. 0.0031 0.0110 0.0157 0.0323 0.0074 0.0102 0.0145 0.0204 0.0118 0.0197 0.0031 0.0051 0.0000 0.0059 Millimeters Min. Max. 0.08 0.28 0.40 0.83 0.19 0.26 0.37 0.52 0.30 0.50 0.08 0.13 0.00 0.15 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTB13N03Q8 CYStek Product Specification