CYStech Electronics Corp.
Dual N-CHANNEL ENHANCEMENT MODE POWER MOSFET
Spec. No. : C395Q8 Issued Date : 2006.10.25 Revised Date : Page No. : 1/3
MTDN4228Q8
Description
The MTDN4228Q8 provides the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The SOP-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters.
Features
• RDS(ON)=40mΩ@VGS=4.5V, ID=4A • Simple drive requirement • Low on-resistance • Fast switching speed • Dual N-ch MOSFET package • Pb-free package
Equivalent Circuit
MTDN4228Q8
Outline
SOP-8
G:Gate S:Source D:Drain
MTDN4228Q8
CYStek Product Specification
CYStech Electronics Corp.
Absolute Maximum Ratings (Ta=25°C)
Parameter Drain-Source Breakdown Voltage Gate-Source Voltage Continuous Drain Current @TA=25 °C (Note 1) Continuous Drain Current @TA=70 °C (Note 1) Pulsed Drain Current (Note 2) Total Power Dissipation @ TA=25 °C Linear Derating Factor Operating Junction Temperature Storage Temperature Thermal Resistance, Junction-to-Ambient
Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, t≤10s. 2.Pulse width limited by maximum junction temperature.
Spec. No. : C395Q8 Issued Date : 2006.10.25 Revised Date : Page No. : 2/3
Symbol BVDSS VGS ID ID IDM Pd Tj Tstg Rth,ja
Limits 30 ±20 6.8 5.5 40 2 0.016 -55~+150 -55~+150 62.5
Unit V V A A A W W / °C °C °C °C/W
Electrical Characteristics (Ta=25°C) Symbol Min. Typ. Max. BVDSS 30 VGS(th) 1 3 IGSS ±100 IDSS 1 26 *RDS(ON) 40 *GFS 15 Ciss 580 930 Coss 150 Crss 108 td(ON) 10 tr 9 td(OFF) 18 tf 6 Qg 9 15 Qgs 2 Qgd 6 *VSD 1.3
Unit V V nA μA mΩ S pF ns ns ns ns nC nC nC V
Test Conditions VGS=0, ID=250μA VDS=VGS, ID=-250μA VGS=±20V, VDS=0 VDS=30V, VGS=0 ID=6A, VGS=10V ID=4A, VGS=4.5V VDS=10V, ID=5A VDS=25V, VGS=0, f=1MHz VDD=15V, ID=1A, VGS=10V, RGEN=3.3Ω, RD=15Ω VDS=24V, ID=6.8A, VGS=4.5V, VGS=0V, ISD=1.7A
*Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2%
MTDN4228Q8
CYStek Product Specification
CYStech Electronics Corp.
SOP-8 Dimension
Top View A Right side View G
Spec. No. : C395Q8 Issued Date : 2006.10.25 Revised Date : Page No. : 3/3
Marking:
I B C H
4228SS
J D Front View
Part A
E
Part A
K L N O
8-Lead SOP-8 Plastic Package CYStek Package Code: Q8
M
F
*: Typical
DIM A B C D E F G H
Inches Min. Max. 0.1909 0.2007 0.1515 0.1555 0.2283 0.2441 0.0480 0.0519 0.0145 0.0185 0.1472 0.1527 0.0570 0.0649 0.1889 0.2007
Millimeters Min. Max. 4.85 5.10 3.85 3.95 5.80 6.20 1.22 1.32 0.37 0.47 3.74 3.88 1.45 1.65 4.80 5.10
DIM I J K L M N O
Inches Min. Max. 0.0019 0.0078 0.0118 0.0275 0.0074 0.0098 0.0145 0.0204 0.0118 0.0197 0.0031 0.0051 0.0000 0.0059
Millimeters Min. Max. 0.05 0.20 0.30 0.70 0.19 0.25 0.37 0.52 0.30 0.50 0.08 0.13 0.00 0.15
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTDN4228Q8
CYStek Product Specification
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