RB491DN3

CYStech Electronics Corp. Schottky barrier diode Spec. No. : C300N3 Issued Date : 2004.10.15 Revised Date : Page No. : 1/3 RB491DN3 Description Planar silicon Schottky barrier diode encapsulated in a SOT-23 plastic SMD package. Features •Small surface mounting type SOT-23 •Ultra low VF(VF=0.4V typ at 1A) •IF=1A guaranteed despite the size Applications •Low power rectification •For switching power supply Symbol RB491DN3 Outline SOT-23 Cathode 2 1 3 1. Anode 2. Not Connected 3. Cathode Anode Not Connected Absolute Maximum Ratings (Ta=25˚C) Parameter Peak reverse voltage DC reverse voltage DC forward current Peak forward surge current * Junction temperature Storage temperature * 60 Hz for 1 cycle Symbol VRM VR IF IFSM Tj Tstg Limits 25 20 1 3 125 -40~+125 Unit V V A A ˚C ˚C RB491DN3 CYStek Product Specification CYStech Electronics Corp. Electrical Characteristics (Ta=25°C) Parameter Forward Voltage Reverse Current Symbol VF IR IF=1A VR=20V Condition Min. - Spec. No. : C300N3 Issued Date : 2004.10.15 Revised Date : Page No. : 2/3 Typ - Max. 0.45 200 Unit V µA Note:ESD sensitive product handling required RB491DN3 CYStek Product Specification CYStech Electronics Corp. SOT-23 Dimension Spec. No. : C300N3 Issued Date : 2004.10.15 Revised Date : Page No. : 3/3 Marking: A L 3 B 1 2 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3 Style:Pin.1. Anode 2. Not Connected 3.Cathode D K S 1E T0T V G C H J *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. RB491DN3 CYStek Product Specification