SB550

CYStech Electronics Corp. 5.0Amp Schottky Barrier Rectifiers Reverse Voltage 20V to 60V Forward Current 5A Spec. No. : C762LD Issued Date : 2009.05.15 Revised Date : Page No. : 1/3 SB520 thru SB560 Features • Guard ring for over voltage protection. • Plastic package has UL flammability classification 94V-0 • Low power loss, high efficiency • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Outline DO-201AD Mechanical Data • Case : JEDEC DO-201AD molded plastic body • Epoxy : UL94V-0 rate flame retardant • Terminals: Plated axial leads, solderable per MIL-STD-750 method 2026. High temperature soldering guaranteed: 250°C/10seconds, 0.375”(9.5mm) lead length, 5lbs(2.3kg) tension • Polarity: Color band denotes cathode end. • Mounting Position : Any. • Weight: 0.041 oz., 1.15 gram Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%) Parameter Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage 1 Maximum instantaneous forward voltage at 5A Maximum average forward rectified current @ 0.375”(9.5mm) lead length (see Fig 1) Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) at rated TL TA=25°C Maximum DC reverse current at 1 rated DC blocking voltage TA=100°C Typical thermal resistance 2 Symbol VRRM VRMS VDC VF IF(AV) IFSM IR RθJA RθJL TJ TSTG Type Units SB520 SB530 SB540 SB550 SB560 20 30 40 50 60 V 14 21 28 35 42 V 20 30 40 50 60 V 0.55 0.67 V 5 150 0.5 50 25 8 -55 ~ +125 -55 ~ +150 -55 ~ +150 25 A A mA ℃/W ℃ ℃ Operating junction temperature range Storage temperature range Note: 1.Pulse test: pulse width≤300μs, duty cycle≤1% 2.Thermal resistance, junction to lead, vertical PCB mounted, 0.375”(9.5mm) lead length SB520 thru SB560 CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C762LD Issued Date : 2009.05.15 Revised Date : Page No. : 2/3 SB520 thru SB560 CYStek Product Specification CYStech Electronics Corp. DO-201AD Dimension Spec. No. : C762LD Issued Date : 2009.05.15 Revised Date : Page No. : 3/3 DO-201AD Molded Plastic Package CYStek Package Code: LD DIM A B C Inches Min. Max. ϕ0.048 ϕ0.052 1.000 0.285 0.375 Millimeters Min. Max. ϕ1.20 ϕ1.30 25.40 7.20 9.50 DIM D E Inches Min. Max. 1.000 ϕ0.190 ϕ0.210 Millimeters Min. Max. 25.40 ϕ4.80 ϕ5.30 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed. • Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SB520 thru SB560 CYStek Product Specification