SK32

CYStech Electronics Corp. 3.0Amp. Surface Mount Schottky Barrier Diodes Spec. No. : C754SA Issued Date : 2006.07.13 Revised Date : Page No. : 1/3 SK3XSA Series Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications • Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 • Low leakage current • High surge capability • High temperature soldering: 250°C/10 seconds at terminals • Exceeds environmental standards of MIL-S-19500/228 • Pb-free package Mechanical Data • Case: SMA/DO-214AC molded plastic. • Terminals: Solder plated, solderable per MIL-STD-750 method 2026 • Polarity: Indicated by cathode band. • Packaging: 12mm tape per EIA STD RS-481. • Weight: 0.064 gram, 0.002 ounce Maximum Ratings and Electrical Characteristics (Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. ) Parameter Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum instantaneous forward voltage, IF=3A Maximum average forward rectified current at TL (See Fig. 1 ) Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current @ TJ = 25℃ At Rated DC Blocking Voltage @ TJ = 100℃ Maximum thermal resistance, Junction to ambient(Note 1) Diode junction capacitance @ f = 1MHz and applied 4V reverse voltage Operating Junction and Storage temperature Rang SK3XSA Symbol VRRM VRMS VR VF IO IFSM SK32 20 14 20 0.5 SK34 40 28 40 Type SK36 60 42 60 0.7 3.0 80 SK38 80 56 80 SK3B 100 70 100 Units V V V V A A mA mA ℃/W pF ℃ 0.85 IR Rth,JA CJ TJ, Tstg 0.5 10 88 (typ) 200 (typ) -55 ~ +125 / -55 ~ +150 Notes : 1.Mounted on PCB with 14mm² (0.013mm thickness) copper pad area. CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Spec. No. : C754SA Issued Date : 2006.07.13 Revised Date : Page No. : 2/3 SK32-SK34 --- SK36-SK3B SK32-SK34 SK36 SK38-SK3B SK3XSA CYStek Product Specification CYStech Electronics Corp. SMA Dimension Spec. No. : C754SA Issued Date : 2006.07.13 Revised Date : Page No. : 3/3 Marking : Device SK32 Code SK32 Device SK3B Code SK3B SK34 SK34 SK36 SK36 SK38 SK38 A B C D H E F G SMA/DO-214AC Plastic Surface Mounted Package CYStek Package Code : SA *:Typical DIM A B C D Inches Min. Max. 0.055 0.062 0.098 0.114 0.157 0.181 0.078 0.096 Millimeters Min. Max. 1.40 1.60 2.50 2.90 4.00 4.60 2.00 2.44 DIM E F G H Inches Min. Max. 0.030 0.060 0.002 0.008 0.188 0.208 0.006 0.012 Millimeters Min. Max. 0.76 1.52 0.051 0.203 4.80 5.28 0.152 0.305 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. SK3XSA CYStek Product Specification