| 70400-0183 | MOLEX1[MolexElectronicsLtd.] | 70400-0183 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 26, 3.81μm (150μ") Tin/Lead (SnPb) - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0181 | MOLEX1[MolexElectronicsLtd.] | 70400-0181 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 26, 3.81μm (150μ") Tin/Lead (SnPb) - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0080 | MOLEX1[MolexElectronicsLtd.] | 70400-0080 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 24, 3.81μm (150μ") Tin/Lead (SnPb), 11 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0077 | MOLEX1[MolexElectronicsLtd.] | 70400-0077 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 24, 3.81μm (150μ") Tin/Lead (SnPb), 8 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0074 | MOLEX1[MolexElectronicsLtd.] | 70400-0074 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female,Single Row, Version D, Back Ribs, Wire Size 24, 3.81μm (150μ") Tin/Lead (SnPb) - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0057 | MOLEX1[MolexElectronicsLtd.] | 70400-0057 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 24, 3.81μm (150μ") Tin/Lead (SnPb) - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0056 | MOLEX1[MolexElectronicsLtd.] | 70400-0056 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 24, 3.81μm (150μ") Tin/Lead (SnPb), 22 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0042 | MOLEX1[MolexElectronicsLtd.] | 70400-0042 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 24, 3.81μm (150μ") Tin/Lead (SnPb), 8 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0019 | MOLEX1[MolexElectronicsLtd.] | 70400-0019 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female,Single Row, Version A, Nonpolarized, Wire Size 24, 3.81μm (150μ") Tin/Lead (SnPb),20 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 70400-0006 | MOLEX1[MolexElectronicsLtd.] | 70400-0006 - 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Female,Single Row, Version A, Nonpolarized, Wire Size 24, 3.81μm (150μ") Tin/Lead (SnPb), 7 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0009060040 | MOLEX1[MolexElectronicsLtd.] | 0009060040 - 3.96mm (.156") KK® IDT Trifurconâ„¢ Contact, 4 Circuits, Tin (Sn), Feed-To, 18 Solid or Fused Stranded, Yellow ID Strip - Molex Electronics Ltd. | | | 获取价格 |
| 0009060020 | MOLEX1[MolexElectronicsLtd.] | 0009060020 - 3.96mm (.156") KK® IDT Trifurconâ„¢ Contact, 2 Circuits, Tin (Sn), Feed-To, 18 Solid or Fused Stranded, Yellow ID Strip - Molex Electronics Ltd. | | | 获取价格 |
| 0009017171 | MOLEX1[MolexElectronicsLtd.] | 0009017171 - 3.96mm (.156") Pitch KK® Crimp Housing, Edge Card Connector - Molex Electronics Ltd. | | | 获取价格 |
| 70280-0120 | MOLEX1[MolexElectronicsLtd.] | 70280-0120 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 80 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail - Molex Electronics Ltd. | | | 获取价格 |
| 70280-0103 | MOLEX1[MolexElectronicsLtd.] | 70280-0103 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 46 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail - Molex Electronics Ltd. | | | 获取价格 |
| 70280-0095 | MOLEX1[MolexElectronicsLtd.] | 70280-0095 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 70280-0083 | MOLEX1[MolexElectronicsLtd.] | 70280-0083 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 6 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail - Molex Electronics Ltd. | | | 获取价格 |
| 70280-0082 | MOLEX1[MolexElectronicsLtd.] | 70280-0082 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 4 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 70280-0070 | MOLEX1[MolexElectronicsLtd.] | 70280-0070 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 60 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 70280-0066 | MOLEX1[MolexElectronicsLtd.] | 70280-0066 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 52 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
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