| 0014450608 | MOLEX1[MolexElectronicsLtd.] | 0014450608 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ") Tin (Sn), 8 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0014450605 | MOLEX1[MolexElectronicsLtd.] | 0014450605 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ") Tin (Sn), 5 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0014450223 | MOLEX1[MolexElectronicsLtd.] | 0014450223 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ") Tin (Sn), 23 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0014450221 | MOLEX1[MolexElectronicsLtd.] | 0014450221 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ") Tin (Sn), 21 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0010897440 | MOLEX1[MolexElectronicsLtd.] | 0010897440 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 44 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail - Molex Electronics Ltd. | | | 获取价格 |
| 0010897422 | MOLEX1[MolexElectronicsLtd.] | 0010897422 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 42 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC TailPlating - Molex Electronics Ltd. | | | 获取价格 |
| 0010897421 | MOLEX1[MolexElectronicsLtd.] | 0010897421 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 42 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length - Molex Electronics Ltd. | | | 获取价格 |
| 0014450217 | MOLEX1[MolexElectronicsLtd.] | 0014450217 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ") Tin (Sn), 17 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0014450216 | MOLEX1[MolexElectronicsLtd.] | 0014450216 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ") Tin (Sn), 16 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0014450212 | MOLEX1[MolexElectronicsLtd.] | 0014450212 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ") Tin (Sn), 12 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0014450211 | MOLEX1[MolexElectronicsLtd.] | 0014450211 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ") Tin (Sn), 11 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0010897363 | MOLEX1[MolexElectronicsLtd.] | 0010897363 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 36 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.79mm (.110") PC Tail - Molex Electronics Ltd. | | | 获取价格 |
| 0010897362 | MOLEX1[MolexElectronicsLtd.] | 0010897362 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 36 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0014450207 | MOLEX1[MolexElectronicsLtd.] | 0014450207 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 24, 3.81μm (150μ") Tin (Sn), 7 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0010897320 | MOLEX1[MolexElectronicsLtd.] | 0010897320 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 32 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0014445425 | MOLEX1[MolexElectronicsLtd.] | 0014445425 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 0.76μm (30μ") Gold (Au), 25 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0010897301 | MOLEX1[MolexElectronicsLtd.] | 0010897301 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length - Molex Electronics Ltd. | | | 获取价格 |
| 0010897282 | MOLEX1[MolexElectronicsLtd.] | 0010897282 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 28 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail - Molex Electronics Ltd. | | | 获取价格 |
| 0014445420 | MOLEX1[MolexElectronicsLtd.] | 0014445420 - 2.54mm (.100") Pitch SLâ„¢ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 0.76μm (30μ") Gold (Au), 20 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0010897121 | MOLEX1[MolexElectronicsLtd.] | 0010897121 - 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 12 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length - Molex Electronics Ltd. | | | 获取价格 |
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