| A-71395-0068 | MOLEX2[MolexElectronicsLtd.] | A-71395-0068 - 2.54mm (.100) Pitch C-Grid® PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 68 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-71395-0014 | MOLEX2[MolexElectronicsLtd.] | A-71395-0014 - 2.54mm (.100) Pitch C-Grid® PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 14 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-71308-4126N | MOLEX2[MolexElectronicsLtd.] | A-71308-4126N - 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0085 | MOLEX2[MolexElectronicsLtd.] | A-70634-0085 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 16 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0080 | MOLEX2[MolexElectronicsLtd.] | A-70634-0080 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 11 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0071 | MOLEX2[MolexElectronicsLtd.] | A-70634-0071 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120" Pocket, Shrouded - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0052 | MOLEX2[MolexElectronicsLtd.] | A-70634-0052 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 18 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0048 | MOLEX2[MolexElectronicsLtd.] | A-70634-0048 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 14 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0015 | MOLEX2[MolexElectronicsLtd.] | A-70634-0015 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 16 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0007 | MOLEX2[MolexElectronicsLtd.] | A-70634-0007 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0102 | MOLEX2[MolexElectronicsLtd.] | A-70568-0102 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0097 | MOLEX2[MolexElectronicsLtd.] | A-70568-0097 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0096 | MOLEX2[MolexElectronicsLtd.] | A-70568-0096 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0087 | MOLEX2[MolexElectronicsLtd.] | A-70568-0087 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0082 | MOLEX2[MolexElectronicsLtd.] | A-70568-0082 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0078 | MOLEX2[MolexElectronicsLtd.] | A-70568-0078 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0075 | MOLEX2[MolexElectronicsLtd.] | A-70568-0075 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0073 | MOLEX2[MolexElectronicsLtd.] | A-70568-0073 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0059 | MOLEX2[MolexElectronicsLtd.] | A-70568-0059 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0057 | MOLEX2[MolexElectronicsLtd.] | A-70568-0057 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective - Molex Electronics Ltd. | | | 获取价格 |
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