| A-71308-0224N | MOLEX2[MolexElectronicsLtd.] | A-71308-0224N - 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without PCB Locator Pegs - Molex Electronics Ltd. | | | 获取价格 |
| A-71308-0216N | MOLEX2[MolexElectronicsLtd.] | A-71308-0216N - 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without PCB Locator Pegs - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0054 | MOLEX2[MolexElectronicsLtd.] | A-70634-0054 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 20 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0037 | MOLEX2[MolexElectronicsLtd.] | A-70634-0037 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 3 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0022 | MOLEX2[MolexElectronicsLtd.] | A-70634-0022 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 23 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0020 | MOLEX2[MolexElectronicsLtd.] | A-70634-0020 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 21 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0018 | MOLEX2[MolexElectronicsLtd.] | A-70634-0018 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0014 | MOLEX2[MolexElectronicsLtd.] | A-70634-0014 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 15 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0011 | MOLEX2[MolexElectronicsLtd.] | A-70634-0011 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120 Pocket, Shrouded, with Press-fit Plastic Peg, 12 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70634-0001 | MOLEX2[MolexElectronicsLtd.] | A-70634-0001 - 2.54mm (.100) Pitch SL™ Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, .120" Pocket, Shrouded - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0100 | MOLEX2[MolexElectronicsLtd.] | A-70568-0100 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0088 | MOLEX2[MolexElectronicsLtd.] | A-70568-0088 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0084 | MOLEX2[MolexElectronicsLtd.] | A-70568-0084 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0083 | MOLEX2[MolexElectronicsLtd.] | A-70568-0083 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0079 | MOLEX2[MolexElectronicsLtd.] | A-70568-0079 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0068 | MOLEX2[MolexElectronicsLtd.] | A-70568-0068 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0058 | MOLEX2[MolexElectronicsLtd.] | A-70568-0058 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0051 | MOLEX2[MolexElectronicsLtd.] | A-70568-0051 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0048 | MOLEX2[MolexElectronicsLtd.] | A-70568-0048 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0046 | MOLEX2[MolexElectronicsLtd.] | A-70568-0046 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
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