| A-70568-0056 | MOLEX2[MolexElectronicsLtd.] | A-70568-0056 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0052 | MOLEX2[MolexElectronicsLtd.] | A-70568-0052 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0044 | MOLEX2[MolexElectronicsLtd.] | A-70568-0044 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0037 | MOLEX2[MolexElectronicsLtd.] | A-70568-0037 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0031 | MOLEX2[MolexElectronicsLtd.] | A-70568-0031 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0028 | MOLEX2[MolexElectronicsLtd.] | A-70568-0028 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0023 | MOLEX2[MolexElectronicsLtd.] | A-70568-0023 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0018 | MOLEX2[MolexElectronicsLtd.] | A-70568-0018 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0007 | MOLEX2[MolexElectronicsLtd.] | A-70568-0007 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0005 | MOLEX2[MolexElectronicsLtd.] | A-70568-0005 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 14 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0349 | MOLEX2[MolexElectronicsLtd.] | A-70567-0349 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0284 | MOLEX2[MolexElectronicsLtd.] | A-70567-0284 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0168 | MOLEX2[MolexElectronicsLtd.] | A-70567-0168 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0163 | MOLEX2[MolexElectronicsLtd.] | A-70567-0163 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0162 | MOLEX2[MolexElectronicsLtd.] | A-70567-0162 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0158 | MOLEX2[MolexElectronicsLtd.] | A-70567-0158 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0149 | MOLEX2[MolexElectronicsLtd.] | A-70567-0149 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0148 | MOLEX2[MolexElectronicsLtd.] | A-70567-0148 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0145 | MOLEX2[MolexElectronicsLtd.] | A-70567-0145 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0098 | MOLEX2[MolexElectronicsLtd.] | A-70567-0098 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits - Molex Electronics Ltd. | | | 获取价格 |
