| A-70568-0038 | MOLEX2[MolexElectronicsLtd.] | A-70568-0038 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0036 | MOLEX2[MolexElectronicsLtd.] | A-70568-0036 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0029 | MOLEX2[MolexElectronicsLtd.] | A-70568-0029 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0027 | MOLEX2[MolexElectronicsLtd.] | A-70568-0027 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 58 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0025 | MOLEX2[MolexElectronicsLtd.] | A-70568-0025 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0012 | MOLEX2[MolexElectronicsLtd.] | A-70568-0012 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 28 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0004 | MOLEX2[MolexElectronicsLtd.] | A-70568-0004 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 12 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0003 | MOLEX2[MolexElectronicsLtd.] | A-70568-0003 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70568-0002 | MOLEX2[MolexElectronicsLtd.] | A-70568-0002 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0358 | MOLEX2[MolexElectronicsLtd.] | A-70567-0358 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0346 | MOLEX2[MolexElectronicsLtd.] | A-70567-0346 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0281 | MOLEX2[MolexElectronicsLtd.] | A-70567-0281 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0280 | MOLEX2[MolexElectronicsLtd.] | A-70567-0280 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0275 | MOLEX2[MolexElectronicsLtd.] | A-70567-0275 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0212 | MOLEX2[MolexElectronicsLtd.] | A-70567-0212 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0211 | MOLEX2[MolexElectronicsLtd.] | A-70567-0211 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0207 | MOLEX2[MolexElectronicsLtd.] | A-70567-0207 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0165 | MOLEX2[MolexElectronicsLtd.] | A-70567-0165 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0152 | MOLEX2[MolexElectronicsLtd.] | A-70567-0152 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| A-70567-0142 | MOLEX2[MolexElectronicsLtd.] | A-70567-0142 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, - Molex Electronics Ltd. | | | 获取价格 |
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