| 0015800201 | MOLEX2[MolexElectronicsLtd.] | 0015800201 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800169 | MOLEX2[MolexElectronicsLtd.] | 0015800169 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800147 | MOLEX2[MolexElectronicsLtd.] | 0015800147 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800145 | MOLEX2[MolexElectronicsLtd.] | 0015800145 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800143 | MOLEX2[MolexElectronicsLtd.] | 0015800143 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800085 | MOLEX2[MolexElectronicsLtd.] | 0015800085 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800081 | MOLEX2[MolexElectronicsLtd.] | 0015800081 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800069 | MOLEX2[MolexElectronicsLtd.] | 0015800069 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800065 | MOLEX2[MolexElectronicsLtd.] | 0015800065 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800061 | MOLEX2[MolexElectronicsLtd.] | 0015800061 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477770 | MOLEX2[MolexElectronicsLtd.] | 0015477770 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 70 Circuits, 0.76μm (30μ) Gold (Au) Selective - Molex Electronics Ltd. | | | 获取价格 |
| 0015477764 | MOLEX2[MolexElectronicsLtd.] | 0015477764 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477754 | MOLEX2[MolexElectronicsLtd.] | 0015477754 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477750 | MOLEX2[MolexElectronicsLtd.] | 0015477750 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477748 | MOLEX2[MolexElectronicsLtd.] | 0015477748 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 48 Circuits - Molex Electronics Ltd. | | | 获取价格 |
| 0015477724 | MOLEX2[MolexElectronicsLtd.] | 0015477724 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477722 | MOLEX2[MolexElectronicsLtd.] | 0015477722 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477720 | MOLEX2[MolexElectronicsLtd.] | 0015477720 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477664 | MOLEX2[MolexElectronicsLtd.] | 0015477664 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 64 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477654 | MOLEX2[MolexElectronicsLtd.] | 0015477654 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
工商网监