| 42225-0026 | MOLEX2[MolexElectronicsLtd.] | 42225-0026 - 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 26 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 42225-0019 | MOLEX2[MolexElectronicsLtd.] | 42225-0019 - 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 19 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 42225-0008 | MOLEX2[MolexElectronicsLtd.] | 42225-0008 - 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 8 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800241 | MOLEX2[MolexElectronicsLtd.] | 0015800241 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800189 | MOLEX2[MolexElectronicsLtd.] | 0015800189 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800165 | MOLEX2[MolexElectronicsLtd.] | 0015800165 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, - Molex Electronics Ltd. | | | 获取价格 |
| 0015800161 | MOLEX2[MolexElectronicsLtd.] | 0015800161 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800141 | MOLEX2[MolexElectronicsLtd.] | 0015800141 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800105 | MOLEX2[MolexElectronicsLtd.] | 0015800105 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015800067 | MOLEX2[MolexElectronicsLtd.] | 0015800067 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477740 | MOLEX2[MolexElectronicsLtd.] | 0015477740 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477718 | MOLEX2[MolexElectronicsLtd.] | 0015477718 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477716 | MOLEX2[MolexElectronicsLtd.] | 0015477716 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477708 | MOLEX2[MolexElectronicsLtd.] | 0015477708 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477672 | MOLEX2[MolexElectronicsLtd.] | 0015477672 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 72 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477666 | MOLEX2[MolexElectronicsLtd.] | 0015477666 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477662 | MOLEX2[MolexElectronicsLtd.] | 0015477662 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477660 | MOLEX2[MolexElectronicsLtd.] | 0015477660 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 60 Circuits, 0.38μm (15μ) Gold (Au) Selective - Molex Electronics Ltd. | | | 获取价格 |
| 0015477646 | MOLEX2[MolexElectronicsLtd.] | 0015477646 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
| 0015477642 | MOLEX2[MolexElectronicsLtd.] | 0015477642 - 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating - Molex Electronics Ltd. | | | 获取价格 |
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