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| PL-05-3-254 | wakefield engineering inc | ULTIMIFLUX25.4X25.4X0.5MM | | | 获取价格 |
| PL-05-1-254 | wakefield engineering inc | ULTIMIFLUX25.4X25.4X0.5MM | | | 获取价格 |
| 175-6-230P | wakefield engineering inc | THERMAL PAD TO-220 .006" | | | 获取价格 |
| 173-9-230P | wakefield engineering inc | Thermal Pad Gray 19.05mm x 12.70mm Rectangle | | | 获取价格 |
| 132-11B9 | wakefield engineering inc | HEATSINKEXTRUDED | | | 获取价格 |
| 133-5B9 | wakefield engineering inc | HEATSINKEXTRUDED | | | 获取价格 |
| 132-11G9 | wakefield engineering inc | HEATSINKEXTRUDED | | | 获取价格 |
| 132-10G | wakefield engineering inc | HEATSINKEXTRUDED | | | 获取价格 |
| 133-10B | wakefield engineering inc | HEATSINKEXTRUDED | | | 获取价格 |
| 133-11G9 | wakefield engineering inc | HEATSINKEXTRUDED | | | 获取价格 |
| 658-45ABT4 | wakefield engineering inc | HEATSINK CPU 28MM SQ BLK W/TAPE | | | 获取价格 |
| 658-45ABT2 | wakefield engineering inc | HEATSINK CPU 28MM SQ BLK W/TAPE | | | 获取价格 |
| 392-300AG | wakefield engineering inc | HI-POWERHEATSINKSSR/IGBT/POWER | | | 获取价格 |
| 133-10G | wakefield engineering inc | HEATSINKEXTRUDED | | | 获取价格 |
| 303MM | wakefield engineering inc | HEATSINKCOMPACT | | | 获取价格 |
| 303M | wakefield engineering inc | HEATSINKCOMPACT | | | 获取价格 |
| 909-37-2-28-2-B-0 | wakefield engineering inc | HEATSINKPINFIN37X37MMCLIP | | | 获取价格 |
| 908-35-2-28-2-B-0 | wakefield engineering inc | HEATSINKPINFIN35X35MMCLIP | | | 获取价格 |
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