RS1G

RS1A THRU RS1K Features · For surface mounted applications in order optimize board space · Low profile package · Built-in strain relief, ideal for automated placement · Fast switching speed · Plastic package has Unerwrites Laboratory Flammability Classification 94V-0 · Low forward voltage drop · Glass passivated chip junction · High temperature soldering : 250℃/10 seconds, at terminals CURRENT 1.0 Ampere VOLTAGE 50 to 800 Volts DO-214AC (SMA) 0.058(1.47) 0.052(1.32) 0.110(2.79) 0.100(2.54) 0.177(4.50) 0.157(3.99) 0.012(0.31) 0.006(0.15) 0.090(2.29) 0.078(1.98) 0.060(1.52) 0.030(0.76) 0.005(0.127) MAX. 0.208(5.28) 0.194(4.93) Mechanical Data · Case : JEDEC SMA(DO-214AC) molded plastic body · Terminals : Solder plated solderable per MIL-STD-750, method 2026 · Polarity : Color band denotes cathode end · Mounting Position : Any · Weight : 0.002 ounce, 0.064 gram Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) Symbols Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=90℃ Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) at TL=90℃ Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current TA=25℃ at rated DC blocking voltage TA=125℃ Maximum reverse recovery time (Note 1) Typical thermal resistance (Note 3) Typical junction capacitance (Note 2) Operating junction and storage temperature range VRRM VRMS VDC I(AV) IFSM VF IR trr RθJL RθJA CJ TJ TSTG RS1A 50 35 50 RS1B 100 70 100 RS1D 200 140 200 1.0 30.0 1.30 5.0 50 150 RS1G 400 280 400 RS1J 600 420 600 RS1K 800 560 800 Units Volts Volts Volts Amp Amps Volts μA 250 35.0 105.0 10.0 -55 to +150 500 ns ℃/W 7.0 pF ℃ Notes: (1) Test conditions: IF=0.5A, IR=1.0A, Irr=0.25A. (2) Measured at 1MHz and applied reverse voltage of 4.0 Volts. (3) Thermal resistance from junction to ambient and from junction to lead mounted on PCB mounted on 0.2×0.2"(5.0×5.0mm) copper pad areas RATINGS AND CHARACTERISTIC CURVES RS1A THRU RS1K FIG.1-FORWARD CURRENT DERATING CURVE 1.2 AVERAGE FORWARD CURRENT (A) RESISTIVE OR INDUCTIVE LOAD FIG.2-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT(AMPERES) 50 TL=90℃ 8.3m SINGLE HALF SINE WAVE (JEDEC Method) 1.0 40 30 0.5 P.C.B.MOUNTED ON 0.2X0.2" (5.0X5.0mm) COPPER PAD AREAS 20 0 10 0 20 40 60 80 100 120 140 160 180 LEAD TEMPERATURE ( ℃) 0 1 2 4 6 8 10 20 40 60 100 NUMBER OF CYCLES AT 60Hz FIG.3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 20 10 FIG.4-TYPICAL JUNCTION CAPACITANCE 30 JUNCTION CAPACITANCE (pF) TJ=25℃ f=1.0MHz Vsig=50mVp-p INSTANTANEOUS FORWARD CURRENT(AMPERES) TJ=125℃ 10 1 TJ=25℃ 0.1 1 1 PULSE WIDTH=300ms 10 REVERSE VOLTAGE. (V) 100 0.01 0.4 0.6 0.8 1.0 1.2 1% DUTY CYCLE 1.4 1.6 1.8 INSTANTANEOUS FORWARD VOLTAGE (VOLTS) FIG.5-TYPICAL REVERSE CHARACTERISTICS 20 10 TJ=125℃ FIG.6-TYPICAL TRANSIENT THERMAL IMPEDANCE 100 TRANSIENT THERMAL IMPEDANCE (℃/W) MOUNTED ON 0.2X0.2" (5X5mm) COPPER PAD AREA INSTANTANEOUS REVERSE CURRENT MICROAMPERES 1 TJ=100℃ 10 0.1 0.01 0 20 40 60 80 TJ=25℃ 1 0.01 0.1 t,PULSE DURATION,sec 1 10 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%)