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RS2G

RS2G

  • 厂商:

    DAESAN(DAESAN)

  • 封装:

  • 描述:

    RS2G - CURRENT 1.5 Amperes VOLTAGE 50 to 800 Volts - Daesan Electronics Corp.

  • 数据手册
  • 价格&库存
RS2G 数据手册
RS2A THRU RS2K Features · For surface mounted applications in order optimize board space · Low profile package · Built-in strain relief, ideal for automated placement · Fast switching speed · Plastic package has Unerwrites Laboratory Flammability Classification 94V-0 · Low forward voltage drop · Glass passivated chip junction · High temperature soldering : 250℃/10 seconds at terminals CURRENT 1.5 Amperes VOLTAGE 50 to 800 Volts DO-214AA (SMB) 0.083(2.11) 0.075(1.91) 0.155(3.94) 0.130(3.30) 0.185(4.70) 0.160(4.06) 0.012(0.31) 0.006(0.15) 0.096(2.44) 0.083(2.13) 0.050(1.27) 0.030(0.76) 0.008(0.203) MAX. 0.220(5.59) 0.200(5.08) Mechanical Data · Case : JEDEC SMB(DO-214AA) molded plastic body · Terminals : Plated axial lead solderable per MIL-STD-750, method 2026 · Polarity : Color band denotes cathode end · Weight : 0.003 ounce, 0.093 gram Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) Symbols Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=100℃ Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) Maximum instantaneous forward voltage at 1.5A Maximum reverse current at rated voltage TA=25℃ TA=125℃ VRRM VRMS VDC I(AV) IFSM VF IR Trr RθJL RθJA CJ TJ TSTG RS2A 50 35 50 RS2B 100 70 100 RS2D 200 140 200 1.5 50.0 1.30 5.0 200 150 18.0 55.0 50.0 RS2G 400 280 400 RS2J 600 420 600 RS2K 800 560 800 Units Volts Volts Volts Amps Amps Volts μA Maximum reverse recovery time (Note 1) Typical thermal resistance (Note 3) Typical junction capacitance (Note 2) Operating junction and storage temperature range 250 500 nS ℃/W pF ℃ -55 to +150 Notes: (1) Test conditions: IF=0.5A, IR=1.0A, Irr=0.25A. (2) Measured at 1MHz and applied reverse voltage of 4.0 Volts. (3) Thermal resistance from junction to ambient and junction to lead mounted on PCB mounted on 0.27×0.27"(7.0×7.0mm) copper pad areas RATINGS AND CHARACTERISTIC CURVES RS2A THRU RS2K FIG.1-FORWARD CURRENT DERATING CURVE FIG.2-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT (AMPERES) 50 TL=100℃ 8.3m SINGLE HALF SINE WAVE (JEDEC Method) AVERAGE FORWARD CURRENT (A) 1.5 RESISTIVE OR INDUCTIVE LOAD 40 1.0 30 0.5 P.C.B.MOUNTED ON 0.27X0.27"(7.0X7.0mm) COPPER PAD AREAS 20 0 10 50 60 70 80 90 100 110 120 130 140 150 160 LEAD TEMPERATURE ( ℃) 0 1 2 4 6 8 10 20 40 60 100 NUMBER OF CYCLES AT 60Hz FIG.3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 20 10 FIG.4-TYPICAL JUNCTION CAPACITANCE 30 TJ=25℃ f=1.0MHz Vsig=50mVp-p INSTANTANEOUS FORWARD CURRENT (AMPERES) 1 TJ=25℃ JUNCTION CAPACITANCE (pF) 10 0.1 1 10 REVERSE VOLTAGE. (V) PULSE WIDTH=300ms 1% DUTY CYCLE 100 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 FIG.5-TYPICAL REVERSE CHARACTERISTICS 100 TJ=125℃ INSTANTANEOUS FORWARD VOLTAGE (VOLTS) INSTANTANEOUS REVERSE CURRENT MICROAMPERES 10 1 0.1 0 20 40 60 80 TJ=25℃ 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%)

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