0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
S3D

S3D

  • 厂商:

    DAESAN(DAESAN)

  • 封装:

  • 描述:

    S3D - CURRENT 3.0 Amperes VOLTAGE 50 to 1000 Volts - Daesan Electronics Corp.

  • 详情介绍
  • 数据手册
  • 价格&库存
S3D 数据手册
S3A THRU S3M Features · For surface mounted applications · Glass passivated junction · Low profile package · Built-in strain relief, ideal for automated placement · Plastic package has Unerwrites Laboratory Flammability Classification 94V-0 · High temperature soldering guaranteed: 250℃/10 seconds, at terminals CURRENT 3.0 Amperes VOLTAGE 50 to 1000 Volts DO-214AB (SMC) 0.124(3.15) 0.108(2.75) 0.245(6.22) 0.220(5.59) 0.280(7.11) 0.260(6.60) 0.012(0.31) 0.006(0.15) 0.103(2.62) 0.079(2.00) 0.050(1.27) 0.030(0.76) 0.008(0.203) MAX. 0.320(8.13) 0.305(7.75) Mechanical Data · Case : JEDEC SMC(DO-214AB) molded plastic body · Terminals : Plated axial lead solderable per MIL-STD-750, method 2026 · Polarity : Color band denotes cathode end · Mounting Position : Any · Weight : 0.007 ounce, 0.25 gram Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) Symbols Maximum recurrent peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=75℃ (Note 2) Peak forward surge current 8.3ms half sine wave superimposed on rated load (JEDEC method) TL=75℃ Maximum instantaneous forward voltage at 1.0A Maximum reverse current at rated voltage TA=25℃ TA=125℃ VRRM VRMS VDC I(AV) IFSM VF IR RθJL RθJA trr CJ TJ TSTG S3A 50 35 50 S3B 100 70 100 S3D 200 140 200 S3G 400 280 400 3.0 100.0 1.15 1.0 250 13.0 47.0 2.5 60.0 -55 to +175 S3J 600 420 600 S3K 800 560 800 S3M 1000 700 1000 Units Volts Volts Volts Amps Amps Volts μA ℃/W μS pF ℃ Typical thermal resistance (Note 2) Typical reverse capacitance (Note 3) Typical junction capacitance (Note 1) Operating and storage temperature range Notes: (1) Measured at 1MHz and applied reverse voltage of 4.0V dc. (2) Thermal resistance from junction to ambient and from junction to lead mounted on 0.2×0.2"(0.5×0.5mm) copper opad areas. (3) Reverse recovery test conditions:IF=0.5A, IR=1.0A, Irr=0.25A RATINGS AND CHARACTERISTIC CURVES S3A THRU S3M FIG.1-FORWARD CURRENT DERATING CURVE 3.5 AVERAGE FORWARD CURRENT AMPERES 3.0 2.5 2.0 1.5 1.0 0.5 0 50 60 70 80 90 100 110 120 130 140 150 RESISTIVE OR INDUCTIVE LOAD P.C.B.MOUNTED ON 0.3X0.3"(8.0X8.0MM) COPPER PAD AREAS FIG.2-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 100 INSTANTANEOUS FORWARD CURRENT (AMPERES) 10 1 TJ=25℃ PULSE WIDTH=300mS 1% DUTY CYCLE 0.1 LEAD TEMPERATURE (℃) 0.01 0.6 0.8 1.0 1.2 1.3 INSTANTANEOUS FORWARD VOLTAGE (VOLTS) FIG.4-TYPICAL REVERSE CHARACTERISTICS INSTANTANEOUS REVERSE CURRENT (mA) 100 TJ=125℃ FIG.3-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 200 10 PEAK FORWARD SURGE CURRENT (AMPERES) 100 TL=25℃ 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 1.0 TJ=25℃ 0.1 0 20 40 60 80 100 10 1 10 NUMBER OF CYCLES AT 60Hz 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) FIG.6-TYPICAL TRANSIENT THERMAL IMPEDANCE FIG.5-TYPICAL JUNCTION CAPACITANCE 100 JUNCTION CAPACITANCE (pF) TJ=25℃ f=1.0MHz Vsig=50mVp-p 100 TRANSIENT THERMAL IMPEDANCE (℃/W) 10 1 10 1 10 REVERSE VOLTAGE. VOLTS 100 0.1 0.01 0.1 1 10 100 t,PULSE DURATION,sec
S3D
1. 物料型号: - DEC S3A至S3M。

2. 器件简介: - 该器件适用于表面贴装应用,具有玻璃钝化结、低轮廓封装、内置应力消除(适合自动化放置),塑料封装具有Underwriters Laboratories的94V-0可燃性分类,保证了高温焊接:250℃/10秒,端子符合MIL-STD-750标准方法2026的镀层轴向引脚可焊性。

3. 引脚分配: - 极性:色带表示阴极端。

4. 参数特性: - 最大重复峰值反向电压(VRRM):50至1000伏不等。 - 最大RMS电压(VRMS):35至700伏不等。 - 最大直流阻断电压(VDC):50至1000伏不等。 - 最大平均正向整流电流在TL=75°C时(注2):3.0安培。 - 峰值正向浪涌电流8.3毫秒半正弦波叠加在额定负载上(JEDEC方法)TL=75°C时(IFSM):100.0安培。 - 最大瞬时正向电压在1.0A时(VF):1.15伏。 - 最大反向电流在额定电压下(IR):1.0微安(25°C时)和250微安(125°C时)。 - 典型热阻(注2):13.0至47.0°C/W不等。 - 典型反向电容(注3):2.5微秒。 - 典型结电容(注1):60.0皮法。

5. 功能详解: - 该器件为整流器,具有不同的电压和电流等级,适用于不同的电力和耐压需求。

6. 应用信息: - 适用于需要整流功能的电力电子应用。

7. 封装信息: - 封装类型:JEDEC SMC(DO-214AB)模塑塑料体。 - 安装位置:任意。 - 重量:0.007盎司,0.25克。

很抱歉,暂时无法提供与“S3D”相匹配的价格&库存,您可以联系我们找货

免费人工找货