73M1922-DB

Simplifying System IntegrationTM 73M1922 Demo Board User Manual June 24, 2010 Rev. 5.1 UM_1922_006 73M1922 Demo Board User Manual UM_1922_006 © 2010 Teridian Semiconductor Corporation. All rights reserved. Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation. Simplifying System Integration is a trademark of Teridian Semiconductor Corporation. MicroDAA is a registered trademark of Teridian Semiconductor Corporation. Microsoft is a registered trademark of Microsoft Corporation. Windows is a registered trademark of Microsoft Corporation. All other trademarks are the property of their respective owners. Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms and Conditions. The company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice and does not make any commitment to update the information contained herein. Accordingly, the reader is cautioned to verify that this document is current by comparing it to the latest version on http://www.teridian.com or by checking with your sales representative. Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618 TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com 2 Rev. 5.1 UM_1922_006 73M1922 Demo Board User Manual Table of Contents 1 Introduction ................................................................................................................................... 5 1.1 Package Contents.................................................................................................................... 6 1.2 Safety and ESD Notes ............................................................................................................. 6 1.3 Demo Board Options................................................................................................................ 6 2 Connectors .................................................................................................................................... 7 3 Demo Board Schematics, PCB Layouts and Bill of Materials ..................................................... 8 3.1 Schematic ................................................................................................................................ 8 3.2 73M1922 20-Pin TSSOP Demo Board Layout .......................................................................... 9 3.3 Demo Board Physical Dimensions ......................................................................................... 12 3.4 Bill of Materials ...................................................................................................................... 13 3.5 Pin Descriptions ..................................................................................................................... 14 3.5.1 731922 MicroDAA Pinout ............................................................................................ 15 4 Related Documentation ............................................................................................................... 15 5 Contact Information..................................................................................................................... 15 Rev. 5.1 3 73M1922 Demo Board User Manual UM_1922_006 Figures Figure 1: MicroDAA System Block Diagram ............................................................................................. 5 Figure 2: 73M1922 MicroDAA 20-Pin TSSOP Demo Board Schematic Diagram ...................................... 8 Figure 3: 73M1922 20-Pin TSSOP Demo Board: Top Signal Layer .......................................................... 9 Figure 4: 73M1922 20-Pin TSSOP Demo Board: Layer 2, Ground Plane ................................................. 9 Figure 5: 73M1922 20-Pin TSSOP Demo Board: Layer 3, Supply Plane ................................................ 10 Figure 6: 73M1922 20-Pin TSSOP Demo Board: Bottom Signal Layer ................................................... 10 Figure 7: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Top .......................................................... 11 Figure 8: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Bottom ..................................................... 11 Figure 9: 73M1902/73M1912 20-Pin TSSOP Packages: Pinout (top view) ............................................. 15 Tables Table 1: 73M1922 Demo Board Connectors ............................................................................................ 7 Table 2: 73M1922 Demo Board Configuration Settings ............................................................................ 7 Table 3: JS1 Host Interface Connector..................................................................................................... 7 Table 4: 73M1922 20-Pin TSSOP Demo Board Bill of Materials ............................................................. 13 Table 5: 73M1902 HIC 20-Pin TSSOP Package Pin Definitions ............................................................. 14 Table 6: 73M1912 LIC 20-Pin TSSOP Package Pin Definitions .............................................................. 14 4 Rev. 5.1 UM_1922_006 73M1922 Demo Board User Manual 1 Introduction The 73M1922 MicroDAA Chipset Demo Board integrates silicon Data Access Arrangement (DAA) function along with Analog Front End functions chipsets for worldwide compliance. The 73M1922 MicroDAA chipset consists of a 73M1902 and a 73M1912. The 73M1902 is the Host Interface Chip (HIC) providing a host microprocessor or DSP interface by a synchronous serial port (Modem Analog Front End (MAFE)) and the 73M1912 is the Line Interface Chip (LIC) to connect to a telephone line. The 73M1922 chipset is packaged in two 20-pin TSSOP or two 32-pin QFN packages for a very small physical dimension and offers low cost global DAA design. GPIO FS FSB E 73M 1902 73M 1912 PULSE TRANSFORMER Line Interface Chip (Circuitry) SCLK SDIN I SDOUT N TYPE T SCKM E M/S RINT/RGDT F OSCIN A OSCOUT C AOUT Host Interface Chip (Circuitry) H O S T RGP RGN OFH DCI DCD DCB DCE TXN RXM RXP SRE ACS SRB L I N E I N T E R F A C E Shaded pins and names are optional depending on packages 73M1922 Figure 1: MicroDAA System Block Diagram The 73M1922 performs a modem codec function that interfaces a Host/DSP and the PSTN (Public Switched Telephone Network). The codec supports data rates up to V.92 with call progress signaling. In addition to the codec function, the 73M1922 MicroDAA chipset also performs other necessary DAA functions, such as CID (caller identification), ring detection, tip/ring polarity reversal detection, on/off hook switch control, pulse dialing, regulation of loop current (DC-IV), line impedance matching, line in use and parallel pickup detection. All data and control information between the LIC and the HIC is transferred across a low cost pulse transformer barrier. Also all clock and synchronization information needed in LIC is embedded in this data and control bit stream across the barrier transformer received from HIC and reconstructed within LIC. The LIC interface to tip/ring of the PSTN significantly lowers the number of external components and their cost. The DAA feature integrated in this chipset offers a configurable US, ETSI ES 203 021-2, or other World Wide DAA capability to the telephone line interface and an auxiliary DAC with gain control for line monitoring during the call progress period. Rev. 5.1 5 73M1922 Demo Board User Manual 1.1 UM_1922_006 Package Contents The 73M1922 Demo Board Kit includes: • • 1.2 A 73M1922 Demo Board (Rev. D1) The following documents on CD: • 73M1922 Demo Board User Manual (this document) • 73M1822/73M1922 Data Sheet • 73M1822/73M1922 Layout Guideline • 73M1x22 Worldwide Design Guide Safety and ESD Notes Connecting live voltages to the Demo Board system will result in potentially hazardous voltages on the boards. Extreme caution should be taken when handling the Demo Boards after connection to live voltages! The Demo Boards are ESD sensitive! ESD precautions should be taken when handling these boards! 1.3 Demo Board Options The 73M1922 Demo Board has 20-pin right angle connectors to plug on to a target DSP or CPU system. Each has a 3.3 V power receptacle for powering on-board circuits from target system or external power supply, or power can be supplied through the 20-pin connector along with the other signals. The 73M1922 Demo Board allows the evaluation of the 73M1922 chipset for universal modem, voice application and interface to a general DSP or CPU system use. 6 Rev. 5.1 UM_1922_006 73M1922 Demo Board User Manual 2 Connectors Table 1 shows all the connectors and jumpers available on 73M1922 MicroDAA Demo Board. JS1 is the main connector for interfacing to a host processor or DSP board. Line monitor/Call progress monitor speaker and driver circuits are also on board. J1 is a modular connector for phone line connection and J4 is for power connection from the main board or an external power supply. Table 1: 73M1922 Demo Board Connectors Schematic and PCB Reference Name Description JS1 3M CONN. 10X2 20-pin connector to interface 73M1922 Demo Board to a HOST controller main board. J1 RJ-11 Telephone line connector. J2 3.3 V supply Plug for connecting external 3.3 V DC power supply. Table 2: 73M1922 Demo Board Configuration Settings Schematic and PCB Reference Name Description R54 (20 TSSOP DB), TYPE Frame Sync Type: 0 Ω population: Late FSB (Default for Samsung ARM9 Interface). None: Early FSB. R64 (32 QFN DB only) MODE SCLK mode: 0 Ω population: 32 Clock. None: Continuous SCLK. (Default for Samsung ARM9 Interface) * NOTE: Due to the package restrictions, the MODE pin is not available in a 20-pin TSSOP package. And neither the Mode pin nor the TYPE pin is available in 42-pin QFN package. User should choose the right device option when ordering parts depending on the clock mode (32 clock or continuous) and Frame sync type (early or late frame sync) required. Refer to the ordering information section of the 73M1822/73M1922 Data Sheet. Table 3: JS1 Host Interface Connector PIN Number Name 1 NC 2 VCC 3 NC 4 RESET 5 Description PIN Number Name Description 11 RINGD 12 NC 13 NC 14 NC NC 15 AFEIN Serial Data In 6 NC 16 AFEOUT Serial Data Out 7 NC 17 SCLK Serial Clock 8 NC 18 FS Frame Sync 9 RINGD 19 NC 10 NC 20 GND Rev. 5.1 3.3V power supply Reset Input Ring Det.out Ring Det.out Ground 7 73M1922 Demo Board User Manual UM_1x22_006 3 Demo Board Schematics, PCB Layouts and Bill of Materials 3.1 Schematic R66 1M, 1% C1 0.022uF, 250V 1M, 1% C3 0.022uF, 250V F1 L1 BR1 1 + 1 MMBTA42 C14 3 TP10 TXM 1 HD04 2 R65 200 1 R6 100K, 1% R8 100K, 1% 0.1uF R11 3K R4 100K, 1% C50 100pF C6 1uF C33 1 R10 255, 1% 2 20 19 18 17 16 15 14 13 12 11 R5 8.2 C8 0.1uF 4.7uF C43 1nF D1 MMSZ4710 1 C37 0.01uF C12 2 C4 0.1uF 2.2uF C48 0.01uF 1 49.9 R51 49.9 GND CONN SOCKET 10X2 C38 U1 73M1902 FSBD SDOUT SDIN FS VND VND SCLK VPD OSCIN INT OSCOUT VPT/VPD VNPLL PRP AOUT PRM TYPE M/S VPA/VPM VNM/VNT R50 C47 1nF Q6 BCP56 TP18 VNS 1 2 3 4 5 6 7 8 9 10 R52 R53 C34 3,3uF 3 TP15 VPS 1 Q5 MMBTA06 GND VCC VCC 2 4 R58 1K 3 0.1uF R61 1K 2 4 6 8 10 12 14 16 18 20 1 3 5 7 9 11 13 49.9 15 17 19 49.9 NOTE: GND f or C35 and C36 connect to GND on the HOST side of the barrier R9 100K, 1% C7 1uF C24 1 JS1 2kOhm C36 220pF, 3KV 73M1912 C26 1nF 15pF 3.3uF L2 Q7 MMBTA42 2 C49 NC (1nF, 3kV) 1nF RJ-11 R3 412K, 1% 3 Q3 6 5 4 3 2 1 C10 0.47uF C13 15pF VCC C31 C32 20 19 18 17 16 15 14 13 12 11 DCB DCE DCD TXM RXM RXP VPS VNS ACS VBG 2 1 Pulse TFR DCI RGN RGP OFH VND/VNX SCP MID VPX SRE SRB R2 MMBTA92 10M 3 1 C9 0.47uF 3 4 T1 1 2 3 4 5 6 7 8 9 10 C41 220pF Q4 5.1K E1 TB3100H P3100SBRP 3 1 R12 U2 J1 - 2 2 TP14 OFH TRF600-150 4 R67 2kOhm C35 220pF, 3KV TP16 FSBD VCC 1 R54 0 C15 0.1uF C22 3,3uF C28 1nF VCC R46 J4 3.3V POWER C30 1nF C21 3.3uF C45 0.1uF C17 0.1uF GND 2 1 2 3 LS2 R49 3 TP1 GND U3 20K R48 20K VCC 4 1 1 1 C18 27pF 2 3 4 1 2 3 120K VCC C46 1nF Y2 24.576MHz C19 27pF C29 3,3uF C27 1uF -VIN CD VOUT1 VOUT2 V+ VREF1 VREF2 GND 5 8 6 7 AST-2308MR-R Projects Unlimited VCC C25 3,3uF NJM#2135M 8DMP Figure 2: 73M1922 MicroDAA 20-Pin TSSOP Demo Board Schematic Diagram 8 Rev. 5.0 UM_1922_006 3.2 73M1922 Demo Board User Manual 73M1922 20-Pin TSSOP Demo Board Layout Figure 3: 73M1922 20-Pin TSSOP Demo Board: Top Signal Layer Figure 4: 73M1922 20-Pin TSSOP Demo Board: Layer 2, Ground Plane 9 Rev. 5.0 73M1922 Demo Board User Manual UM_1922_006 Figure 5: 73M1922 20-Pin TSSOP Demo Board: Layer 3, Supply Plane Figure 6: 73M1922 20-Pin TSSOP Demo Board: Bottom Signal Layer 10 Rev. 5.0 UM_1922_006 73M1922 Demo Board User Manual Figure 7: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Top Figure 8: 73M1922 20-Pin TSSOP Demo Board: Silk Screen Bottom Rev. 5.0 11 73M1922 Demo Board User Manual 3.3 UM_1922_006 Demo Board Physical Dimensions PCB Dimensions • Size 73M1922DB Height w/ components and solder 73M1922DB 3.16 x 2.05” (80.20 x 52.50 mm) 0.65” (16.5 mm) Environmental • Operating Temperature (function of crystal oscillator affected outside • Storage Temperature °-40 to +85°C –10°C to +60°C) -65 to 150°C Power Supply • DC Input Voltage (powered from DC supply) • Supply Current 3.3 VDC ±10% 25 mA (off-hooked at room temperature) typical 12 Rev. 5.0 UM_1922_006 3.4 73M1922 Demo Board User Manual Bill of Materials Table 4: 73M1922 20-Pin TSSOP Demo Board Bill of Materials Qty Reference Part DigikeyPN MFRPN MFR 1 BR1 HD04 HD04DICT-ND HD04-T DIODES Inc. 2 1 C1,C3 C4 0.022uF, 250V 10uF 399-1242-1-ND 399-3522-1-ND C1206C223K5RACTU C0805C225K8RACTU Kemet Kemet 2 1 C6,C7 C8 1uF 4.7uF 587-1241-1-ND PCC2176CT-ND EMK107BJ105KA-TR ECJ-2FB0J475M Taiyo Yuden Panasonic 2 6 C10,C9 C12,15,17,33,38,49 0.47uF 0.1uF PCC1911CT-ND 399-1095-1-ND ECJ-1VB0J474K C0603C104K8RACTU Panasonic Kemet 2 2 C14,C13 C19,C18 15pF 27pF 445-1271-1-ND PCC270ACVCT-ND C1608COG1H150J ECJ-1VC1H270J TDK Panasonic 4 2 C21,C22,C32,C34 C35,C36 3.3uF 220pF, 3KV PCC1925CT-ND 445-2380-1-ND ECJ-2YB0J335K C4532COG3F221K Panasonic TDK 8 2 C26,28,30,31,39,43,46,47 1nF C37,C48 0.01uF PCC1772CT-ND 478-1227-1-ND ECJ-1VB1H102K 06035C103KAT2A Panasonic AVX 1 1 C50 C51 100pF 220pF, 630V 311-1069-1-ND 445-2338-1-ND CC0603JRNP09BN101 C3216COG2J221J Yageo TDK 1 1 E1 F1 TB3100H TRF600-150 TB3100H-FDICT 576-04611.25ER TB3100H-13-H 04611.25ER DIODES Littlefuse 1 1 JS1 J1 CONN 10X2 RJ-11 517-8520-4500 A31420-ND 8520-4500JL 5555163-1 3M AMP/Tyco 1 J4 RAPC712X Switchcraft Inc. 2 2 L1,L2 Q3,Q7 POWER CONN SC237-ND 2kOhm@ 100MHz, 200mA 240-2396-1-ND MMBTA42 863-MMBTA42LT1G HZ0805C202R-10 MMBTA42LT1G Steward ON Semi. 1 1 Q4 Q5 MMBTA92 MMBTA06 863-MMBTA92LT1G 863-MMBTA06LT1G MMBTA92LT1G MMBTA06LT1G ON Semi. ON Semi. 1 1 Q6 R2 BCP56 10M 568-1639-1-ND 541-10.0MCCT-ND BCP56 CRCW080510M0FKEA Philips Vishay 1 4 R3 R4,R6,R8,R9 412K, 1% 100K, 1% P412KHTR-ND P100KHCT-ND ERJ-3EKF4123V ERJ-3EKF1003V Panasonic Panasonic 1 1 R5 R10 8.2 255, 1% 541-8.20CCT-ND 311-255HRCT-ND CRCW08058R20FNEA RC0603FR-07255RL Vishay Yageo 1 1 R11 R12 3K 5.1K 311-3.00KHRCT-ND 311-5.10KHRCT-ND RC0603FR-073K0L RC0603FR-075K1L Yageo Yageo 4 1 R50,R51,R52,R53 R54 49.9 0 P49.9HCT-ND P0.0GCT-ND ERJ-3EKF49R9V ERJ-3GEY0R00V Panasonic Panasonic 2 1 R58,R61 R65 1K 200 P1.00KHCT-ND P200HCT-ND ERJ-3EKF1001V ERJ-3EKF2000V Panasonic Panasonic 2 2 R67,R66 TP1,10, 14, 15,16,18 1M, 1% Test Points 311-1.00MCRCT-ND 5002K-ND RC0805FR-071ML 5002 Yageo Keystone 1 1 T1 U1 Pulse TFR 73M1902 1 1 U2 Y2 73M1912 24.576MHz Rev. 5.0 ESMIT-4180/750110001 Sumida//Midcom 73M1902 Teridian 73M1912 815-ABMM2-24.576-E2T ABMM2-24.576MHZ-E2-T Teridian ABRACON 13 73M1922 Demo Board User Manual 3.5 UM_1922_006 Pin Descriptions Table 5 shows the 73M1902 20-pin TSSOP package pin names and Table 6 shows the 73M1912 20-pin TSSOP package pin definitions. Table 5: 73M1902 HIC 20-Pin TSSOP Package Pin Definitions Pin Name Pin Name 1 FSD 11 VNM/VNT 2 FS 12 M/S 3 VND 13 PRM 4 VPD/VPPLL 14 PRP 5 OSCIN 15 VPT/VPD 6 OSOUT 16 INT/RGDT 7 VNPLL/VNA 17 SCLK 8 AOUT 18 VND 9 TYPE 19 SDIN 10 VPA/VPM 20 SDOUT Table 6: 73M1912 LIC 20-Pin TSSOP Package Pin Definitions 14 Pin Name Pin Name 1 DCI 11 VBG 2 RGN 12 ACS 3 RGP 13 VNS 4 OFH 14 VPS 5 VNX/VNS 15 RXP 6 SCP 16 RXM 7 MID/LEV 17 TXM 8 VPX 18 DCD 9 SRE 19 DCE 10 SRB 20 DCB Rev. 5.0 UM_1922_006 73M1922 Demo Board User Manual 3.5.1 731922 MicroDAA Pinout Figure 9 shows the pinout top views of the 73M1902/73M1912 TSSOP packages. FSD 1 20 SDOUT 2 19 3 18 4 17 OSCIN 5 16 INT OSCOUT 6 15 VPT/VPD VNPLL/VNA 7 14 AOUT 8 TYPE FS VND VPD/VPPLL VPA/VPM DCI 1 20 DCB SDIN RGN 2 19 DCE VND RGP 3 18 DCD SCLK OFH 4 17 TXM VND/VNX 5 16 RXM SCP 6 15 RXP PRP MID 7 14 VPS/VPD 13 PRM VPX 8 13 VNS 9 12 M/S SRE 9 12 ACS 10 11 VNM/VNT SRB 10 11 VBG 73M1902 73M1912 Figure 9: 73M1902/73M1912 20-Pin TSSOP Packages: Pinout (top view) 4 Related Documentation The following 73M1x22 documents are available from Teridian Semiconductor Corporation: 73M1822/73M1922 Data Sheet 73M1922 Demo Board User Manual (this document) 73M1822/73M1922 Layout Guideline 73M1x22 Worldwide Design Guide 73M1822/73M1922 Evaluation System with Linux Softmodem User’s Guide 73M1x22/73M1x66B MicroDAA DC Control Loop Operation 73M1x22/73M1x66 MicroDAA Hybrid Operation 5 Contact Information For more information about Teridian Semiconductor products or to check the availability of the 73M1922, contact us at: 6440 Oak Canyon Road Suite 100 Irvine, CA 92618-5201 Telephone: (714) 508-8800 FAX: (714) 508-8878 Email: modem.support@teridian.com For a complete list of worldwide sales offices, go to http://www.teridian.com. 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