Simplifying System IntegrationTM
73S8024C
Demo Board User Manual
November 11, 2009
Rev. 1.3
UM_8024C_061
73S8024C Demo Board User Manual
UM_8024C_061
© 2009 Teridian Semiconductor Corporation. All rights reserved.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Teridian Semiconductor Corporation makes no warranty for the use of its products, other than expressly
contained in the Company’s warranty detailed in the Teridian Semiconductor Corporation standard Terms
and Conditions. The company assumes no responsibility for any errors which may appear in this
document, reserves the right to change devices or specifications detailed herein at any time without
notice and does not make any commitment to update the information contained herein. Accordingly, the
reader is cautioned to verify that this document is current by comparing it to the latest version on
http://www.teridian.com or by checking with your sales representative.
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
2
Rev. 1.3
UM_8024C_061
73S8024C Demo Board User Manual
Table of Contents
1
Introduction ................................................................................................................................... 5
1.1 Package Contents.................................................................................................................... 5
1.2 Safety and ESD Notes ............................................................................................................. 5
2
Basic Connections ........................................................................................................................ 6
3
Hardware Description .................................................................................................................... 7
3.1 Demo Board Connectors, Jumpers and Test Points ................................................................. 7
3.2 Recommended Operating Conditions and Absolute Maximum Ratings ..................................... 9
3.3 73S8024C Pin Description ....................................................................................................... 9
3.4 73S8024C Pinout .................................................................................................................. 11
4
Design Considerations ................................................................................................................ 12
4.1 General Layout Rules ............................................................................................................ 12
4.2 Optimization for Compliance with EMV and NDS.................................................................... 12
5
73S8024C Demo Board Schematics, PCB Layouts and Bill of Materials .................................. 13
5.1 Schematic .............................................................................................................................. 13
5.2 Bill of Materials ...................................................................................................................... 14
5.3 PCB Layouts .......................................................................................................................... 15
6
Ordering Information ................................................................................................................... 18
7
Related Documentation ............................................................................................................... 18
8
Contact Information..................................................................................................................... 18
Revision History .................................................................................................................................. 19
Rev. 1.3
3
73S8024C Demo Board User Manual
UM_8024C_061
Figures
Figure 1: 73S8024C Demo Board ............................................................................................................ 5
Figure 2: 73S8024C Demo Board Basic Connections .............................................................................. 6
Figure 3: 73S8024C Demo Board Connectors, Jumpers and Test Points ................................................. 8
Figure 4: 73S8024C SO28 Pinout (Top View) ........................................................................................ 11
Figure 5: 73S8024C Demo Board Electrical Schematic .......................................................................... 13
Figure 6: 73S8024C Demo Board Top View........................................................................................... 15
Figure 7: 73S8024C Demo Board Bottom View...................................................................................... 15
Figure 8: 73S8024C Demo Board Top Signal Layer ............................................................................... 16
Figure 9: 73S8024C Demo Board Middle Layer 1, Ground Plane ........................................................... 16
Figure 10: 73S8024C Middle Layer 2, Supply Plane .............................................................................. 17
Figure 11: 73S8024C Demo Board Bottom Signal Layer ........................................................................ 17
Tables
Table 1: 73S8024C Demo Board Connector, Jumper and Test Points...................................................... 7
Table 2: Recommended Operating Conditions ......................................................................................... 9
Table 3: Absolute Maximum Ratings ........................................................................................................ 9
Table 4: 73S8024C Card Interface Pins ................................................................................................... 9
Table 5: 73S8024C Miscellaneous Pins ................................................................................................. 10
Table 6: 73S8024C Power and Ground Pins .......................................................................................... 10
Table 7: 72S8024C Microcontroller Interface Pins .................................................................................. 10
Table 8: 73S8024C Demo Board Bill of Materials ................................................................................... 14
Table 9: Order Numbers and Packaging Marks ...................................................................................... 18
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Rev. 1.3
UM_8024C_061
73S8024C Demo Board User Manual
1 Introduction
The 73S8024C Demo Board is a platform for evaluating the Teridian 73S8024C Smart Card Interface
device. The board incorporates the 73S8024C integrated circuit and has been designed to operate either
as a standalone platform (to be used in conjunction with an external microcontroller) or as a daughter
card to be used in conjunction with the 73S1121F evaluation platform.
The board has been designed to comply with the EMV 2000 Specification, Version 4.0. 73S8024C Demo
Boards can easily be modified to comply with NDS specifications by replacing a few external components
that are highlighted in this document.
Figure 1: 73S8024C Demo Board
1.1
Package Contents
The 73S8024C Demo Board Kit includes:
•
•
1.2
A 73S8024C Demo Board
The following documents on CD:
• 73S8024C Data Sheet
• 73S8024C Demo Board User Manual (this document)
• Application Note
Safety and ESD Notes
Extreme caution should be taken when handling the 73S8024C Demo Board after
connection to live voltages!
The 73S8024C Demo Board is ESD sensitive! ESD precautions should be taken when
handling this board!
Rev. 1.3
5
73S8024C Demo Board User Manual
UM_8024C_061
2 Basic Connections
The basic connections to the demo board are described below and shown in Figure 2.
1. Connect power supply: Apply 3.3 V to pin 10 of J4.
2. Control signals to the device can be connected through J2 and J4 (see Figure 2 and the Electrical
Schematic, Figure 5).
3. To set the clock frequency with an external clock source:
• Set JP1 to the SCLK setting.
• Apply clock source to pin 1 of J2.
• Apply 3.3V (1) or GND (0) to CLKDIV1 and CLKDIV2 pins to set the desired clock rate as follows:
CLKDIV1 = CLKDIV2 = 0
clock frequency = SCLK/8
CLKDIV1 = 0, CLKDIV2 =1 clock frequency = SCLK/4
CLKDIV1 = 1, CLKDIV2 =0 clock frequency = SCLK
CLKDIV1 = CLKDIV2 = 1
clock frequency = SCLK/2
4. To set the clock frequency using crystal Y1:
• The crystal included on the demo board is 12 MHz.
• Set JP1 to XTAL position.
• Apply 3.3V (1) or GND (0) to CLKDIV1 and CLKDIV2 pins to set the desired clock rate as follows:
CLKDIV1 = CLKDIV2 = 0
clock frequency = 1.5 MHz
CLKDIV1 = 0, CLKDIV2 =1 clock frequency = 3 MHz
CLKDIV1 = 1, CLKDIV2 =0 clock frequency = 12 MHz
CLKDIV1 = CLKDIV2 = 1
clock frequency = 6 MHz
External clock source. JP1 must be in
position SCLK when using an
external clock. Otherwise, pin SCLK
can be left open.
1
VDD Power Supply:
+2.7V to +3.6V
(3.3V Typ.) / 50mA
SCLK
VDD
I/OUC
AUX1UC
GND
RSTIN
AUX2UC
CMDVCC
OFF
PWRDN
5V/#V
CKDIV2
GND
CKDIV1
2
VPC Power
Supply:
Configure JP2
to 3.3V
Note: CLKSTOP and CLKLEV
can be left NC if unused.
5V/#V too, for 5V cards only.
Figure 2: 73S8024C Demo Board Basic Connections
6
Rev. 1.3
UM_8024C_061
73S8024C Demo Board User Manual
3 Hardware Description
3.1
Demo Board Connectors, Jumpers and Test Points
Table 1 describes the 73S8024C Demo Board connectors, jumpers and test points. The Item # in Table 1
refers to Figure 3.
Table 1: 73S8024C Demo Board Connector, Jumper and Test Points
Schematic/
Silkscreen
Reference
Connectors:
1
J2
Item
#
9
J4
16
J5
11
J6
Name
5V Board Supply /
Auxiliary Interface
3.3V Board Power /
Digital Control
Signals
Smart Card
Connector
Smart Card
Connector
Function
73S8024C auxiliary interface (I/OUC, AUX1UC,
AUX2UC), external clock (SCLK) and interrupt (OFF)
pins. The external clock (SCLK) can be left open when
JP1 is in position XTAL.
The 5V power supply is unused and must be left open
and JP2 must be inserted in position 3.3V.
3.3V board power supply and the 73S8024C host
control signals RSTIN, CMDVCC, 5V/#V, PWRDWN,
CLKDIV2 and CLKDIV1.
Smart card connector.
When inserting a card (credit card size format), contacts
must face up.
SIM/SAM smart card format connector.
J6 is wired in parallel to the smart card connector J5
(underneath the PCB). No SIM/SAM should be inserted
when using the credit-card size connector J5.
Jumpers:
3
JP1
Clock Selection
17
JP2
VPC Select
2
JP3
VDD Select
8
15
14
JP4
JP5
JP6
–
Card Polarity
Detect Select
Jumper to select between a crystal or an external clock
as the frequency reference to the device. The default
setting is for a crystal.
Jumper to select the value of the power supply for the
smart card DC-DC converter (73S8024C input VPC).
To support both card voltages, JP2 must be set to
position 3.3V. The default setting is 3.3V.
Jumper to select the digital voltage which supplies the
73S8024C. Must be set for 3.3V.
Not used.
The setting of JP5 and JP6 depends on the type of
smart card connector used (nominally open or closed)
and which 73S8024C card presence switch input is
used. The switch is nominally open for the 73S8024C
Demo Board. The jumpers can be set to:
1. Use of PRES (default): JP5 set to PRES; JP6 set
to VDD.
2. Use of PRES: JP5 set to PREB; JP6 set to GND.
Rev. 1.3
7
73S8024C Demo Board User Manual
Schematic/
Silkscreen
Reference
Test Points:
10
TP1
Item
#
20
7
12
6
13
5
4
TP2
TP3
TP4
TP5
TP6
TP7
TP8
Name
Pin 17 (VDDF_ADJ)
Factory Test
VCC
I/O
RST
C8
CLK
C4
UM_8024C_061
Function
VDD voltage fault adjustment. The pin to the left is
connected to the VDDF_ADJ pin of the 73S8024C and
the pin to the right is GND. When either a resistor R3,
or a resistor network R1 and R3 is populated on the
board, it adjusts the VDD fault level that internally
triggers a card deactivation sequence.
By default, the resistors R1 and R3 are not connected.
This provides a VDD fault level of 2.3V typical (internally
set to the 73S8024C). Refer to the 73S8024C Data
Sheet for further information about VDD fault level and
determination of the resistor values.
Factory test pin. Do not connect.
2-pin test points for each respective smart card signal.
The pin label name is the respective signal (i.e. VCC,
CLK) and the 2nd pin is GND.
Figure 3: 73S8024C Demo Board Connectors, Jumpers and Test Points
8
Rev. 1.3
UM_8024C_061
3.2
73S8024C Demo Board User Manual
Recommended Operating Conditions and Absolute Maximum Ratings
Table 2 lists the recommended operating conditions and Table 3 lists the absolute maximum ratings.
Operation outside these rating limits may cause permanent damage to the device.
Table 2: Recommended Operating Conditions
Parameter
Supply Voltage VDD
Supply Voltage VPC
Ambient Operating Temperature
Input Voltage for Digital Inputs
Rating
2.7 to 3.6 VDC
2.7 to 3.6 VDC
-40 °C to +85 °C
0 V to VDD + 0.3 V
Table 3: Absolute Maximum Ratings
Parameter
Supply Voltage VDD
Supply Voltage VPC
Input Voltage for Digital Inputs
Storage Temperature
Pin Voltage
Pin Current
ESD Tolerance – Card interface pins
ESD Tolerance – Other pins
Rating
-0.5 to 4.0 VDC
-0.5 to 4.0 VDC
-0.3 to (VDD+0.5) VDC
-60 °C to 150 °C
-0.3 to (VDD+0.5) VDC
±100 mA
+/- 6 kV
+/- 2 kV
ESD testing on Card pins is HBM condition, 3 pulses, each polarity referenced to ground.
3.3
73S8024C Pin Description
Table 4: 73S8024C Card Interface Pins
Rev. 1.3
Name
I/O
AUX1
AUX2
RST
CLK
Pin #
11
13
12
14
15
PRES
10
PRES
9
VCC
17
GND
14
Description
Card I/O: Data signal to/from card. Includes a pull-up resistor to VCC.
AUX1: Auxiliary data signal to/from card. Includes a pull-up resistor to VCC.
AUX2: Auxiliary data signal to/from card. Includes a pull-up resistor to VCC.
Card reset: provides reset (RST) signal to card.
Card clock: provides clock signal (CLK) to card. The rate of this clock is
determined by crystal oscillator frequency or external clock input and
CLKDIV selections.
Card Presence switch: active high indicates card is present. Should be tied
to GND when not used, but it includes a high-impedance pull-down resistor.
Card Presence switch: active low indicates card is present. Should be tied
to VDD when not used, but it includes a high-impedance pull-up resistor.
Card power supply: logically controlled by sequencer output of LDO
regulator. Requires an external filter capacitor to the card GND.
Card ground.
9
73S8024C Demo Board User Manual
UM_8024C_061
Table 5: 73S8024C Miscellaneous Pins
Name
XTALIN
Pin #
24
XTALOUT
25
VDDF_ADJ
18
NC
5,7
Description
Crystal oscillator input: can either be connected to crystal or driven as a
source for the card clock.
Crystal oscillator output: connected to crystal. Left open if XTALIN is being
used as external clock input.
VDD fault threshold adjustment input: this pin can be used to adjust the VDDF
values (controls deactivation of the card). Must be left open if unused.
Non-connected pin.
Table 6: 73S8024C Power and Ground Pins
Name
VDD
VPC
GND
GND
LIN
Pin #
21
6
4
22
5
Description
System interface supply voltage and supply voltage for internal circuitry.
DC-DC converter power supply source.
DC-DC converter ground.
Digital ground.
External inductor. Connect external inductor from pin 2 to VPC. Keep the
inductor close to pin 2.
Table 7: 72S8024C Microcontroller Interface Pins
Name
CMDVCC
5V/#V
PWRDN
CLKDIV1
CLKDIV2
10
Pin #
Description
19
Command VCC (negative assertion): Logic low on this pin causes the LDO
regulator to ramp the VCC supply to the card and initiates a card activation
sequence, if a card is present.
3
5 volt / 3 volt card selection: Logic one selects 5 volts for VCC and card
interface, logic low selects 3 volt operation. When the part is to be used with
a single card voltage, this pin should be tied to either GND or VDD. However,
it includes a high impedance pull-up resistor to default this pin high
(selection of 5V card) when not connected.
8
Power Down control input. Active high. When the Power Down mode is set
high, all internal analog functions are disabled to place the 73S8024C in its
lowest power consumption mode. The Power Down mode is only allowed
out of a card session (i.e. when CMDVCC = 1)
1
Sets the divide ratio from the XTAL oscillator (or external clock input) to the
card clock. These pins include pull-down resistors.
2
OFF
23
RSTIN
I/OUC
AUX1UC
20
26
27
AUX2UC
28
CLKDIV1 CLKDIV2
CLOCK RATE
0
0
XTALIN/8
0
1
XTALIN/4
1
1
XTALIN/2
1
0
XTALIN
Interrupt signal to the processor. Active low - multi-function indicating fault
conditions and/or card presence. Open drain output configuration; includes
an internal 22 kΩ pull-up to VDD.
Reset Input: This signal is the reset command to the card.
System controller data I/O to/from the card. Includes a pull-up resistor to VDD.
System controller auxiliary data I/O to/from the card. Includes a pull-up
resistor to VDD.
System controller auxiliary data I/O to/from the card. Includes a pull-up
resistor to VDD.
Rev. 1.3
UM_8024C_061
3.4
73S8024C Demo Board User Manual
73S8024C Pinout
CLKDIV1
1
28
AUX2UC
CLKDIV2
2
27
AUX1UC
5V/#V
3
26
I/OUC
GND
4
25
XTALOUT
LIN
5
24
XTALIN
VPC
6
23
OFF
NC
7
22
GND
73S8024C
PWRDN
8
21
VDD
PRES
9
20
RSTIN
PRES
10
19
CMDVCC
I/O
11
18
VDDF_ADJ
AUX2
12
17
VCC
AUX1
13
16
RST
GND
14
15
CLK
Figure 4: 73S8024C SO28 Pinout (Top View)
Rev. 1.3
11
73S8024C Demo Board User Manual
UM_8024C_061
4 Design Considerations
4.1
•
•
•
•
•
•
•
•
4.2
General Layout Rules
Route the auxiliary signals away from card interface signals.
Keep the CLK signal as short as possible and with few bends in the trace. Keep the route of the CLK
trace to one layer (avoid vias to other plane). Keep the CLK trace away from other traces, especially
RST and VCC. Filtering of the CLK trace is allowed for noise purpose. Up to 30 pF to ground is
allowed at the CLK pin of the smart card connector. In addition, the zero ohm series resistor, R7, can
be replaced for additional filtering (no more than 100 Ω).
Keep the VCC trace as short as possible. Make the trace a minimum of 0.5 mm thick. In addition,
keep the VCC away from other traces, especially RST and CLK.
Keep the trace from L1 to pin 5 of the IC as short as possible.
Keep the RST trace away from the VCC and CLK traces. Up to 30 pF to ground is allowed for
filtering.
Keep the 0.1 µF capacitor close to the VDD pin of the device and directly take the other end to
ground.
Keep the 0.1 µF capacitor close to the VPC pin of the device and directly take the other end to
ground.
Keep the 3.3 µF (1.0 µF for NDS) capacitor close to the VCC pin of the smart card connector and
directly take other end to ground.
Optimization for Compliance with EMV and NDS
The default configuration of the demo board contains a 27 pF capacitor (C12) from the CLK pin of the
smart connector to ground and a 27 pF capacitor (C13) from the RST pin of the smart connector to
ground. These capacitors serve as filters for the CLK and RST signals in the case of long traces or test
equipment perturbations. The capacitor on CLK reduces ringing on the trace, reduces coupling to other
traces and slows down the edge of the CLK signal. The capacitor on RST helps the perturbation
specification in a noisy environment. The filter capacitors can be useful in the EMV test environment and
have no effect on NDS testing.
C12 and C13 are represented on both the schematic and the BOM. These capacitors are optional filter
capacitors on the smart card lines CLK and RST, respectively for each card interface. These capacitors
may be adjusted (value not to exceed 30 pF) or removed to optimize performance in each specific
application (PCB, card clock frequency, compliance with applicable standards etc).
The default VCC capacitor of 3.3 µF is required to meet the dynamic VCC (smart card supply) transient
current requirement as specified in the EMV2000 version 4.0 specification. For compliance with NDS, a
smaller capacitor of 1 µF is required to meet the activation discharge time specification.
12
Rev. 1.3
UM_8024C_061
73S8024C Demo Board User Manual
5 73S8024C Demo Board Schematics, PCB Layouts and Bill of Materials
5.1
Schematic
J1
1
2
3
JP2
5.0V
3.3V
SCLK
SIO
S_C4
S_C8
INT2
GND
1
2
+
L1 must be
placed close
to pin 5
10uF
1
4
12.000MHz
PIN18
CLKDIV1
CLKDIV2
5V3V
GND_4
LIN
VPC
NC
PWRDN
PRES
PRES
I/O
AUX2
AUX1
GND_14
AUX2UC
AUX1UC
I/OUC
XTALOUT
XTALIN
OFF
GND
VDD
RSTIN
CMDVCC
VDDF_ADJ
VCC
RST
CLK
28
27
26
25
24
23
22
21
20
19
18
17
16
15
C4
C5
22pF
22pF
3.3V
3.3V
VDD
R4
0
C8
5.0V
0.1uF
1
2
3
JP3
VDD
SELECT
5V
JP3 must be
set to 3.3V
R7
R6
C9
0.47uF
0
73S8024C
JP4
1
2
3
R8
Ru
R9
Ru
C13
27pF
HEADER LOCK 3
Resistors
not
populated
C10
+
TSM_110_01_L_SV
Y1
1
2
R3
0.1uF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SSM_110_L_SV
USR0
USR1
USR2
USR3
USR4
USR5
USR6
USR7
GND
3.3V
PGND
U1
VDD
R5
10uF
+
C1
L1
10uF
J4
TP1
0
C2
TP2
5.0V
C3
5V
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
Resistors not
populated
R2
J3
Signal names
refer to
73S1121F
Evaluation
board.
R1
5V
C1, C2, C8, C9 and L1 must be
placed within 5mm of the U1 pins
and connected by thick track
(wider than 0.5mm)
TSM_110_01_L_SV
CLKDIV1
CLKDIV2
5V3VB
NC
PWRDN
CMDVCCB
RSTIN
GND
+3.3V
VDD
VPC
SELECT
1
2
3
3.3V
JP2 must be
set to 3.3V
J2
Signal names
refer to
73S1121F
Evaluation
board.
XTALIN
SELECT
XTAL
SSM_110_L_SV
1
2
3
4
5
6
7
8
9
10
JP1
SCLK
1
2
3
4
5
6
7
8
9
10
VPC
SCLK
SIO
SC4
SC8
OFFB
GND
GND
GND
+5V
+5V
10uF
R10
Ru
Connectors are positioned to allow
multiple 8024C boards (stacking) to a
73S1121F evaluation board. Also used for
connecting external signals when used as a
stand alone board.
C11
0.1uF
TP3
1
2
TP4
R13
Rd
I/O
PRESB
C8
1
2
3
1
2
VCC
1
2
RST
TP7
1
2
1
2
TP3 to TP8 to be placed
very close to the pads
of J5
CLK
TP8
PRES
1
2
CARD DETECT
POLARITY SELECT
C4
C12
27pF
GND
1
2
3
J5
Smart Card Connector
SW2
SW1
C7
C6
C5
C3
C2
C1
C8
I/O
VPP
GND
C4
CLK
RST
VCC
Card detection
switches are
normally open
SW-2
SW-1
8
7
6
5
4
3
2
1
VDD
8
7
6
5
4
3
2
1
VDD
10
9
JP6
R12
Rd
TP5
TP6
JP5
R11
Rd
J6
SIM/SAM Connector
Figure 5: 73S8024C Demo Board Electrical Schematic
Rev. 1.3
13
73S8024C Demo Board User Manual
5.2
UM_8024C_061
Bill of Materials
Table 8 provides the bill of materials for the 73S8024C Demo Board schematic provided in Figure 5.
Table 8: 73S8024C Demo Board Bill of Materials
1
Item
Quantity
1
2
3
4
5
6
7
3
2
2
1
2
1
5
8
Reference
Part
PCB Footprint
10 µF
0.1 µF
22 pF
3.3 µF
27 pF
10 µH
HEADER 3
1
C1,C3,C10
C2,C8
C4,C5
C11
C12, C13
L1
JP1,JP2,JP3,JP5,
JP6
JP4
9
10
2
2
J1,J3
J2,J4
SSM_110_L_SV
TSM_110_01_L_SV
11
1
J5
ITT_CCM02-2504
12
13
14
15
16
17
1
3
2
4
4
8
18
1
J6
R2,R4,R7
R5,R6
R1,R8,R9,R10
R3,R11,R12,R13
TP1,TP2,TP3,TP4,
TP5,TP6,TP7,TP8
U1
Smart Card
Connector
SIM/SAM Connector
0
X
Ru
Rd
TP2
19
20
1
2
Y1
C4,C5
Part Number
Manufacturer
ECJ-2FB0J106M
ECJ-1VB1C104K
ECJ-1VC1H220J
ECJ-2YB0J335K
ECJ-0EC1H270J
SLF6025
PZC36SAAN
Panasonic
Panasonic
Panasonic
Panasonic
Panasonic
TDK
Sullins
22-11-2032
Molex
Samtec
Samtec
ccm02-2504-ND
SSM_110_L_SV
TSM_110_01_L_S
V
ccm02-2504
ITT_CCM03-3754
603
603
603
603
2X1_Header
CCM03-3754CT-ND
P0.0GCT-ND
X
X
X
S1011-36-ND
CCM03-3754
ERJ-3GEY0R00V
X
X
X
PZC36SAAN
ITTCannon
Panasonic
73S8024C
28SOP
X
73S8024C
12.000 MHz
22 pF
HC-49US
603
X190-ND
ECS-120-20-4DN
PCC220ACVCT-ND ECJ-1VC1H220J
Teridian
Semiconductor
ECS
Panasonic
Header Lock 3
805
603
603
805
402
Digikey Part
Number
PCC2225CT-ND
PCC1762CT-ND
PCC220ACVCT-ND
PCC1925CT-ND
PCC270CQCT-ND
X
S1011-36-ND
3pins, 2.54 mm
pitch
3pins, 2.54 mm
WM2701-ND
pitch
SSM_110_L_SV
X
TSM_110_01_L_SV X
ITTCannon
Sullins
Ru and Rd are not populated on the board. They can be implemented to adjust the features of the smart card reader.
14
Rev. 1.3
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5.3
73S8024C Demo Board User Manual
PCB Layouts
Figure 6: 73S8024C Demo Board Top View
Figure 7: 73S8024C Demo Board Bottom View
Rev. 1.3
15
73S8024C Demo Board User Manual
UM_8024C_061
Figure 8: 73S8024C Demo Board Top Signal Layer
Figure 9: 73S8024C Demo Board Middle Layer 1, Ground Plane
16
Rev. 1.3
UM_8024C_061
73S8024C Demo Board User Manual
Figure 10: 73S8024C Middle Layer 2, Supply Plane
Figure 11: 73S8024C Demo Board Bottom Signal Layer
Rev. 1.3
17
73S8024C Demo Board User Manual
UM_8024C_061
6 Ordering Information
Table 9 lists the order number used to identify the 73S8024C Demo Board.
Table 9: Order Numbers and Packaging Marks
Part Description
73S8024C 28-Pin SO Demo Board
Order Number
73S8024C-DB
7 Related Documentation
The following 73S8024C documents are available from Teridian Semiconductor Corporation:
73S8024C Data Sheet
73S8024C Demo Board User Manual (this document)
Teridian 73S8024C versus Philips TDA8024T Application Note
8 Contact Information
For more information about Teridian Semiconductor products or to check the availability of the
73S8024C, contact us at:
6440 Oak Canyon Road
Suite 100
Irvine, CA 92618-5201
Telephone: (714) 508-8800
FAX: (714) 508-8878
Email: scr.support@teridian.com
For a complete list of worldwide sales offices, go to http://www.teridian.com.
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Rev. 1.3
UM_8024C_061
73S8024C Demo Board User Manual
Revision History
Revision
1.0
1.1
1.2
1.3
Rev. 1.3
Date
6/8/2004
8/2/2004
8/23/2005
11/11/2009
Description
First publication.
Minor corrections.
Added new logo.
Added Section 1.1, Package Contents.
Added Section 1.2, Safety and ESD Notes.
Added Section 6, Ordering Information.
Added Section 7, Related Documentation.
Added Section 8, Contact Information.
Miscellaneous editorial changes.
19
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