19-5348; Rev 2; 1/12
78M6612
Single-Phase, Dual-Outlet
Power and Energy Measurement IC
DATA SHEET
DS_6612_001
FEATURES
DESCRIPTION
The Teridian™ 78M6612 is a highly integrated, single-phase,
power and energy measurement and monitoring system-onchip (SoC) that includes a 32-bit compute engine (CE), an
MPU core, RTC, and flash. Our Single Converter
Technology® with a 22-bit delta-sigma ADC, four analog
inputs, digital temperature compensation, and precision
voltage reference supports a wide range of single-phase,
dual-outlet power measurement applications with very few
external components.
With measurement technology leveraged from Maxim’s flagship
utility metering ICs, the device offers features including 32 KB
of flash program memory, 2 KB shared RAM, three low-power
modes with internal timer or external event wake-up, two
UARTs, I2C/MICROWIRE® EEPROM I/F, and an in-system
programmable flash. Complete outlet measurement unit (OMU)
and AC power monitor (AC-PMON) firmware is available or can
be preloaded into the IC.
A complete array of ICE and development tools, programming
libraries and reference designs enable rapid development and
certification of power and energy measurement solutions that
meet the most demanding worldwide electricity metering
standards.
CT
LIVE
OUTLET
POWER SUPPLY
NEUT
CONVERTER
IA
V3.3A
V3.3
SYS
VA
IB
VB
TERIDIAN
78M6612
GNDA GNDD
PWR MODE
CONTROL
REGULATOR
VBAT
V2.5
VOLTAGE REF
VREF
VBIAS
TEMP
SENSOR
RAM
SERIAL PORTS
TX0
FLASH
RX0
RX1
COMPUTE
ENGINE
TX1
POWER
FAULT
32 kHz
COMPARATOR
V1
OSC/PLL
XIN
XOUT
MPU
OPTIONAL
WAKE-UP
BATTERY
DIO, PULSE
COM0..3
SEG0..18
SEG 24..31/
DIO 4..11
SEG 34..37/
DIO 14..17
OPTIONAL
2
I C or µWire
EEPROM
SEG 32,33,
38/ICE
RTC
TIMERS
ICE
ICE_E
V3P3D
GNDD
Teridian is a trademark and Single Converter Technology is a registered
trademark of Maxim Integrated Products, Inc.
MICROWIRE is a registered trademark of National Semiconductor Corp.
Rev 2
• Measures Each Outlet of a Duplex Receptacle with
a Single IC
• Provides Complete Energy Measurement and
Communication Protocol Capability in a Single IC
• Intelligent Switch Control Capability
• < 0.5% Wh Accuracy Over 2000:1 Current Range
and Over Temperature
• Exceeds IEC 62053/ANSIC12.20 Standards
• Voltage Reference < 40 ppm/°C
• Four Sensor Inputs – VDD Referenced
• Low Jitter Wh and VARh Pulse Test Outputs
(10 kHz max)
• Pulse Count for Pulse Outputs
• Line Frequency Count for RTC
• Digital Temperature Compensation
• Sag Detection for Phase A and B
• Independent 32-Bit Compute Engine
• 46-64 Hz Line Frequency Range with Same Calibration
• Phase Compensation (±7°)
• Battery Backup for RTC and Battery Monitor
• Three Battery Modes with Wake-Up Timer:
Brownout Mode (48 µA)
LCD Mode (5.7 µA)
Sleep Mode (2.9 µA)
• Energy Display on Main Power Failure
• Wake-Up Timer
• 22-Bit Delta-Sigma ADC
• 8-Bit MPU (80515), 1 Clock Cycle per Instruction
with Integrated ICE for MPU Debug
• RTC with Temperature Compensation
• Auto-Calibration
• Hardware watchdog Timer, Power-Fail Monitor
• LCD Driver (Up to 152 Pixels)
• Up to 18 General-Purpose I/O Pins
• 32 kHz Time Base
• 32 KB Flash with Security
• 2 KB MPU XRAM
• Two UARTs
• Digital I/O Pins Compatible with 5 V Inputs
• 64-Pin LQFP or 68-Pin QFN Package
• RoHS-Compliant (6/6) Lead(Pb)-Free Packages
• Complete Application Firmware Available
1
78M6612 Data Sheet
DS_6612_001
Table of Contents
1
Hardware Description .................................................................................................................... 7
1.1 Hardware Overview................................................................................................................. 7
1.2 Analog Front End (AFE) .......................................................................................................... 8
1.2.1 Input Multiplexer .......................................................................................................... 8
1.2.2 A/D Converter (ADC) ................................................................................................... 9
1.2.3 FIR Filter ..................................................................................................................... 9
1.2.4 Voltage References ..................................................................................................... 9
1.2.5 Temperature Sensor.................................................................................................... 9
1.2.6 Battery Monitor ............................................................................................................ 9
1.3 Digital Computation Engine (CE) ........................................................................................... 10
1.3.1 Real-Time Monitor ..................................................................................................... 10
1.3.2 Pulse Generator ........................................................................................................ 10
1.3.3 Data RAM (XRAM) .................................................................................................... 10
1.4 80515 MPU Core .................................................................................................................. 11
1.4.1 UARTs ...................................................................................................................... 11
1.5 On-Chip Resources............................................................................................................... 11
1.5.1 Oscillator ................................................................................................................... 11
1.5.2 PLL and Internal Clocks............................................................................................. 11
1.5.3 Real-Time Clock (RTC) ............................................................................................. 12
1.5.4 Temperature Sensor.................................................................................................. 12
1.5.5 Flash Memory ........................................................................................................... 12
1.5.6 Optical Interface ........................................................................................................ 13
1.5.7 Digital I/O .................................................................................................................. 13
1.5.8 LCD Drivers .............................................................................................................. 16
1.5.9 EEPROM Interface .................................................................................................... 16
1.5.10 Hardware Watchdog Timer ........................................................................................ 17
1.5.11 Test Ports (TXUXOUT pin) ........................................................................................ 17
2
Functional Description ................................................................................................................ 18
2.1 Theory of Operation .............................................................................................................. 18
2.2 Fault and Reset Behavior ...................................................................................................... 19
2.2.1 Reset Mode ............................................................................................................... 19
2.2.2 Power Fault Circuit .................................................................................................... 19
2.3 Data Flow ............................................................................................................................. 19
2.4 CE/MPU Communication ...................................................................................................... 20
3
Application Information ............................................................................................................... 21
3.1 Connection of Sensors (CT, Resistive Shunt) ........................................................................ 21
3.2 Connecting 5 V Devices ........................................................................................................ 22
3.3 Temperature Measurement ................................................................................................... 22
3.4 Temperature Compensation .................................................................................................. 22
3.5 Connecting LCDs .................................................................................................................. 23
2
3.6 Connecting I C EEPROMs .................................................................................................... 23
3.7 Connecting Three-Wire EEPROMs ....................................................................................... 24
3.8 UART0 (TX0/RX0) ................................................................................................................ 24
3.9 UART1 (TX1/RX1) ................................................................................................................ 25
3.10 Connecting V1 and Reset Pins .............................................................................................. 25
3.11 Connecting the Emulator Port Pins ........................................................................................ 26
3.12 Flash Programming ............................................................................................................... 26
3.13 MPU Firmware Library .......................................................................................................... 26
3.14 Crystal Oscillator ................................................................................................................... 26
3.15 Measurement Calibration ...................................................................................................... 27
4
Electrical Specifications .............................................................................................................. 28
4.1 Absolute Maximum Ratings ................................................................................................... 28
4.2 Recommended External Components ................................................................................... 29
2
Rev 2
DS_6612_001
4.3
4.4
4.5
78M6612 Data Sheet
Recommended Operating Conditions .................................................................................... 29
Performance Specifications ................................................................................................... 30
4.4.1 Input Logic Levels ..................................................................................................... 30
4.4.2 Output Logic Levels................................................................................................... 30
4.4.3 Power-Fault Comparator ........................................................................................... 30
4.4.4 Battery Monitor .......................................................................................................... 31
4.4.5 Supply Current .......................................................................................................... 31
4.4.6 V3P3D Switch ........................................................................................................... 31
4.4.7 2.5V Voltage Regulator ............................................................................................. 32
4.4.8 Low Power Voltage Regulator ................................................................................... 32
4.4.9 Crystal Oscillator ....................................................................................................... 32
4.4.10 VREF, VBIAS ............................................................................................................ 33
4.4.11 LCD Drivers .............................................................................................................. 33
4.4.12 ADC Converter, V3P3A Referenced .......................................................................... 34
4.4.13 UART1 Interface........................................................................................................ 34
4.4.14 Temperature Sensor.................................................................................................. 34
Timing Specifications ............................................................................................................ 35
4.5.1 RAM and Flash Memory ............................................................................................ 35
4.5.2 Flash Memory Timing ................................................................................................ 35
4.5.3 EEPROM Interface .................................................................................................... 35
4.5.4 RESET and V1 .......................................................................................................... 35
4.5.5 RTC .......................................................................................................................... 35
5
Packaging .................................................................................................................................... 36
5.1 64-Pin LQFP Package .......................................................................................................... 36
5.1.1 Pinout........................................................................................................................ 36
5.1.2 Package Outline (LQFP 64)....................................................................................... 37
5.1.3 Recommended PCB Land Pattern for the LQFP-64 Package..................................... 38
5.2 68-Pin QFN Package ............................................................................................................ 39
5.2.1 Pinout........................................................................................................................ 39
5.2.2 Package Outline ........................................................................................................ 40
5.2.3 Recommended PCB Land Pattern for the QFN-68 Package ...................................... 41
6
Pin Descriptions .......................................................................................................................... 42
6.1 Power/Ground Pins ............................................................................................................... 42
6.2 Analog Pins........................................................................................................................... 42
6.3 Digital Pins............................................................................................................................ 43
7
I/O Equivalent Circuits................................................................................................................. 44
8
Ordering Information ................................................................................................................... 45
9
Contact Information ..................................................................................................................... 45
Revision History .................................................................................................................................. 46
Rev 2
3
78M6612 Data Sheet
DS_6612_001
Figures
Figure 1: IC Functional Block Diagram ..................................................................................................... 6
Figure 2: AFE Block Diagram ................................................................................................................... 8
Figure 3: Connecting an External Load to DIO Pins ............................................................................... 15
Figure 4: Functions Defined by V1 ......................................................................................................... 17
Figure 5: Voltage, Current, Momentary and Accumulated Energy........................................................... 18
Figure 6: MPU/CE Data Flow ................................................................................................................. 19
Figure 7: MPU/CE Communication ........................................................................................................ 20
Figure 8: Resistive Voltage Divider ........................................................................................................ 21
Figure 9: Resistive Current Shunt .......................................................................................................... 21
Figure 10: Current Transformer.............................................................................................................. 21
Figure 11: Connecting LCDs .................................................................................................................. 23
Figure 12: I2C EEPROM Connection ...................................................................................................... 23
Figure 13: Three-Wire EEPROM Connection ......................................................................................... 24
Figure 14: Connections for the RX0 Pin ................................................................................................. 24
Figure 15: Voltage Divider for V1 ........................................................................................................... 25
Figure 16: External Components for RESET: Development Circuit (Left), Production Circuit (Right) ....... 25
Figure 17: External Components for the Emulator Interface.................................................................... 26
Figure 18: 64-Pin LQFP Pinout .............................................................................................................. 36
Figure 19: 68-Pin QFN Pinout ................................................................................................................ 39
4
Rev 2
DS_6612_001
78M6612 Data Sheet
Tables
Table 1: Inputs Selected in Regular and Alternate Multiplexer Cycles....................................................... 8
Table 2: Data/Direction Registers and Internal Resources for DIO Pin Groups ....................................... 14
Table 3: DIO_DIR Control Bit ................................................................................................................. 15
Table 4: Selectable Controls using the DIO_DIR Bits ............................................................................. 16
Table 5: Absolute Maximum Ratings ...................................................................................................... 28
Table 6: Recommended External Components ...................................................................................... 29
Table 7: Recommended Operation Conditions ....................................................................................... 29
Table 8: Input Logic Levels .................................................................................................................... 30
Table 9: Output Logic Levels ................................................................................................................. 30
Table 10: Power-Fault Comparator Performance Specifications ............................................................. 30
Table 11: Power-Fault Comparator Performance Specifications (BME=1) .............................................. 31
Table 12: Supply Current Performance Specifications ............................................................................ 31
Table 13: V3P3D Switch Performance Specifications ............................................................................. 31
Table 14: 2.5 V Voltage Regulator Performance Specifications .............................................................. 32
Table 15: Low-Power Voltage Regulator Performance Specifications ..................................................... 32
Table 16: Crystal Oscillator Performance Specifications......................................................................... 32
Table 17: VREF, VBIAS Performance Specifications.............................................................................. 33
Table 18: LCD Drivers Performance Specifications ................................................................................ 33
Table 19: ADC Converter Performance Specifications ........................................................................... 34
Table 20: UART1 Interface Performance Specifications ......................................................................... 34
Table 21: Temperature Sensor Performance Specifications ................................................................... 34
Table 22: RAM and Flash Memory Specifications .................................................................................. 35
Table 23: Flash Memory Timing Specifications ...................................................................................... 35
Table 24: EEPROM Interface Timing ..................................................................................................... 35
Table 25: RESET and V1 Timing ........................................................................................................... 35
Table 26: RTC Range ............................................................................................................................ 35
Table 27: Power/Ground Pins ................................................................................................................ 42
Table 28: Analog Pins............................................................................................................................ 42
Rev 2
5
78M6612 Data Sheet
DS_6612_001
IA
VA
IB
VB
∆Σ ADC
CONVERTER
VBAT
VREF
MUX
CTRL
EQU
MUX_ALT
CHOP_E
MUX_DIV
MCK
PLL
RTCLK (32KHz)
DIV
ADC
CK32
32KHz
CKOUT_E
CKADC
4.9MHz
CK_GEN
V2P5
V3P3D
CK_2X
MUX_SYNC
CKCE
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