78M6613-SOCKET32

19-5348; Rev 2; 1/12 LE AVAILAB 78M6613 Single-Phase AC Power Measurement IC DATA SHEET DS_6613_018 DESCRIPTION FEATURES The Teridian™ 78M6613 is a highly integrated IC for simplified implementation of single-phase AC power measurement into power supplies, smart appliances, and other applications with embedded AC load monitoring and control. It is packaged in a small, 5mm x 5mm, 32-pin QFN package for optimal space savings. • < 0.5% Wh Accuracy Over Wide 2000:1 Current Range and Over Temperature • Voltage Reference < 40ppm/°C • Four Sensor Inputs—V3P3A Referenced • 22-Bit Delta-Sigma ADC with Independent 32-Bit Compute Engine (CE) • 8-Bit MPU (80515), One Clock Cycle per Instruction with 2KB MPU XRAM • 32KB Flash with Security • Integrated In-Circuit Emulator (ICE) Interface for MPU Debug • 32kHz Time Base with Hardware Watchdog Timer • UART Interface and Up to 10 GeneralPurpose 5V Tolerant I/O Pins • Packaged in a RoHS-Compliant (6/6) Lead(Pb)-Free, 32-Pin QFN (5mm x 5mm) • Complete Application Firmware Provides: o True RMS Calculations for Current, Voltage, Line Frequency, Real Power, Reactive Power, Apparent Power, and Power Factor o Accumulated Watt-Hours, Kilowatt-Hours o Intelligent Switch Control at Zero Crossings o Digital Temperature Compensation o Phase Compensation (±15°) o Quick Calibration Routines o 46–64Hz Line Frequency Range with Same Calibration At the measurement interface, the device provides four analog inputs for interfacing to voltage and current sensors. Voltages from the sensors are fed to our Single Converter Technology® that uses a 22-bit delta-sigma ADC, independent 32-bit compute engine (CE), digital temperature compensation, and precision voltage references to provide better than 0.5% power measurement accuracy over a wide 2000:1 dynamic range. The integrated MPU core and 32 KB of flash memory provides a flexible means of configuration, post-processing, data formatting, and interfacing to any host processor through the UART interface and/or DIO pins. Complete application firmware is available and can be preloaded into the IC during manufacturing test. Alternatively, a complete array of ICE, development tools, and programming libraries are available to allow customization for each application. Functional Diagrams LIVE Earth Ground Isolated Supply NEUT CONVERTER A0 A1 TERIDIAN 78M6613 A2 A3 GND V3P3 REGULATOR VOLTAGE REF VREF TEMP SENSOR OSC/PLL 32 kHz XIN DIO, PULSE 2KB RAM 32KB FLASH DIO 4-8 DIO 14-17, 19 SERIAL PORT 32-bit COMPUTE ENGINE 80515 MPU TX RX ICE ICE_E XOUT Pin Configurations appear at end of dataTIMERS sheet. Functional Diagrams continued at end of data sheet. Teridian is trademark a trademark and Single Converter Technology UCSP is a of Maxim Integrated Products, Inc. is a V3P3 GND registered trademark of Maxim Integrated Products, Inc. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com. 78M6613 Data Sheet DS_6613_018 Table of Contents 1 Hardware Description.................................................................................................................... 5 1.1 Hardware Overview ................................................................................................................ 5 1.2 Analog Front End (AFE) .......................................................................................................... 6 1.2.1 Input Multiplexer.......................................................................................................... 6 1.2.2 A/D Converter (ADC) .................................................................................................. 6 1.2.3 FIR Filter ..................................................................................................................... 6 1.2.4 Voltage References ..................................................................................................... 6 1.2.5 Temperature Sensor ................................................................................................... 7 1.2.6 Functional Description ................................................................................................. 7 1.3 Digital Computation Engine (CE) ............................................................................................ 8 1.4 80515 MPU Core .................................................................................................................... 8 1.4.1 UART .......................................................................................................................... 8 1.4.2 Timers and Counters ................................................................................................... 9 1.5 On-Chip Resources................................................................................................................. 9 1.5.1 Oscillator ..................................................................................................................... 9 1.5.2 PLL and Internal Clocks .............................................................................................. 9 1.5.3 Temperature Sensor ................................................................................................... 9 1.5.4 Flash Memory ............................................................................................................. 9 1.5.5 Digital I/O .................................................................................................................. 10 1.5.6 Hardware Watchdog Timer........................................................................................ 10 1.5.7 Program Security ...................................................................................................... 10 1.5.8 Test Ports.................................................................................................................. 10 2 Functional Description ................................................................................................................ 11 2.1 Theory of Operation .............................................................................................................. 11 2.2 Reset Behavior ..................................................................................................................... 12 2.3 Data Flow ............................................................................................................................. 12 2.4 CE/MPU Communication ...................................................................................................... 13 3 Application Information .............................................................................................................. 14 3.1 Connection of Sensors (CT, Resistive Shunt)........................................................................ 14 3.2 Temperature Measurement ................................................................................................... 15 3.3 Temperature Compensation.................................................................................................. 15 3.4 Connecting 5V Devices......................................................................................................... 16 3.5 UART (TX/RX) ...................................................................................................................... 16 3.6 Reset Function and Reset Pin Connections........................................................................... 16 3.7 Connecting the Emulator Port Pins ....................................................................................... 18 3.8 Crystal Oscillator................................................................................................................... 19 3.9 Flash Programming .............................................................................................................. 19 3.10 MPU Firmware Library .......................................................................................................... 19 3.11 Measurement Calibration ...................................................................................................... 19 4 Electrical Specifications ............................................................................................................. 20 4.1 Absolute Maximum Ratings .................................................................................................. 20 4.2 Recommended External Components ................................................................................... 21 4.3 Recommended Operating Conditions.................................................................................... 21 4.4 Performance Specifications .................................................................................................. 21 4.4.1 Input Logic Levels ..................................................................................................... 21 4.4.2 Output Logic Levels .................................................................................................. 21 4.4.3 Supply Current .......................................................................................................... 22 4.4.4 Crystal Oscillator ....................................................................................................... 22 4.4.5 VREF ........................................................................................................................ 22 4.4.6 ADC Converter, V3P3 Referenced ............................................................................ 23 4.4.7 Temperature Sensor ................................................................................................. 23 DS_6613_018 4.5 78M6613 Data Sheet Timing Specifications............................................................................................................ 24 4.5.1 RAM and Flash Memory ............................................................................................ 24 4.5.2 RESET ...................................................................................................................... 24 4.5.3 Typical Performance Data ......................................................................................... 25 5 Packaging .................................................................................................................................... 26 5.1 Pinout ................................................................................................................................... 26 5.2 Package Outline (QFN 32) .................................................................................................... 27 5.3 Recommended PCB Land Pattern for the QFN-32 Package ................................................. 28 6 Pin Descriptions .......................................................................................................................... 29 6.1 Power/Ground Pins ............................................................................................................... 29 6.2 Analog Pins .......................................................................................................................... 29 6.3 Digital Pins ........................................................................................................................... 30 7 I/O Equivalent Circuits ................................................................................................................ 31 8 Ordering Information................................................................................................................... 32 9 Contact Information .................................................................................................................... 32 Revision History .................................................................................................................................. 33 Figures Figure 1: IC Functional Block Diagram .................................................................................................... 4 Figure 2: AFE Block Diagram .................................................................................................................. 7 Figure 3: Connecting an External Load to DIO Pins ............................................................................... 10 Figure 4: Voltage. Current, Momentary and Accumulated Energy .......................................................... 11 Figure 5: MPU/CE Data Flow ................................................................................................................ 12 Figure 6: MPU/CE Communication ........................................................................................................ 13 Figure 7: Resistive Voltage Divider........................................................................................................ 14 Figure 8: Resistive Current Shunt .......................................................................................................... 14 Figure 9: Current Transformer ............................................................................................................... 14 Figure 10: Connections for the RX Pin ................................................................................................... 16 Figure 11: 78M6613 External Reset Behavior........................................................................................ 17 Figure 12: MAX810S Connections to the 78M6613 ................................................................................ 17 Figure 13: Reset Generator Based On TL431 Shunt Regulator .............................................................. 18 Figure 14: External Components for the Emulator Interface .................................................................. 18 Figure 15: Wh Accuracy, 10 mA to 20 A at 120 V/60 Hz and Room Temperature Using a 4 mΩ Current Shunt ....................................................................................................................... 25 Figure 16: Typical Measurement Accuracy over Temperature Relative to 25°C..................................... 25 Figure 17: 32-Pin QFN Pinout ............................................................................................................... 26 Figure 18: Package Outline (QFN 32).................................................................................................... 27 Figure 19: Recommended PCB Land Pattern Dimensions ..................................................................... 28 Figure 20: I/O Equivalent Circuits .......................................................................................................... 31 Table Table 1: Inputs Selected in Regular and Alternate Multiplexer Cycles...................................................... 6 78M6613 Data Sheet DS_6613_018 VREF V3P3A GNDA V3P3D GNDD ∆Σ ADC CONVERTER A0 A1 A2 A3 VBIAS VBIAS MUX V3P3 FIR + TEMP VREF VREF MUX CROSS MUX CTRL OSC (32KHz) XIN CK32 RTCLK (32KHz) MCK PLL 32KHz XOUT VOLT REG DIV ADC CK32 CKADC 4.9152MHz CKTEST CKFIR 4.9152MHz 4.9152MHz CK_2X CK_GEN MUX_SYNC CE RAM (0.5KB) STRT CKCE 1 µs Max Typ 3.3V Supply Voltage (V3P3D/V3P3A) Min 0.0V Time V3P3 RESET Figure 11: 78M6613 External Reset Behavior The RESET signal can be generated in a number of different ways. For example, a voltage supervisory device such as Maxim’s MAX810S can be used to implement the reset/supply voltage supervisory function as shown in Figure 12. V3P3 MAX810S Vcc RST RESET GND 78M6613 GND Figure 12: MAX810S Connections to the 78M6613 78M6613 Data Sheet DS_6613_018 An alternate solution using discrete components can be used. Figure 13 shows an implementation using a shunt regulator and two transistors. Figure 13: Reset Generator Based On TL431 Shunt Regulator As long as V3P3 is below the 2.79V threshold set by the voltage divider of R1 and R2, U1 will not conduct current, the base of Q2 will be at the same potential as its emitter, so Q1 will be turned off. With no current flowing in the collector of Q2, the base of Q1 will be low, Q1 will be turned off, and RESET will track V3P3. When the V3P3 rises above 2.79V, the TL431 starts to conduct, the base of Q2 is be pulled low, turning on Q2. This drives the base of Q1 high, turning Q1 on and pulling RESET low. The inherent turn-on and turn-off delays of the TL4313 provide the ~1µs delay required to ensure proper resetting of the 78M6613. 3.7 Connecting the Emulator Port Pins It is important to bring out the ICE_E pin to the programming interface in order to create a way for reprogramming parts that have the Flash SECURE bit (SFR 0xB2[6]) set. Providing access to ICE_E ensures that the part can be reset between erase and program cycles, which will enable programming devices to reprogram the part. The reset required is implemented with a watchdog timer reset (i.e. the hardware WDT must be enabled). 78M6613 V3P3 ICE_E 62 Ω E_RST 62 Ω E_RXTX E_TCLK 62 Ω 1000pF 300 Ω Figure 14: External Components for the Emulator Interface DS_6613_018 3.8 78M6613 Data Sheet Crystal Oscillator The oscillator of the 78M6613 drives a standard 32.768 kHz watch crystal. The oscillator has been designed specifically to handle these crystals and is compatible with their high impedance and limited power handling capability. Good layouts will have XIN and XOUT shielded from each other. Since the oscillator is self-biasing, an external resistor must not be connected across the crystal. 3.9 Flash Programming Operational or test code can be programmed into the Flash memory using either an in-circuit emulator or the Flash Programmer Module (TFP-2) available from Maxim. The Flash programming procedure uses the E_RST, E_RXTX, and E_TCLK pins. 3.10 MPU Firmware Library Any application-specific MPU functions mentioned above are available from Maxim as a standard ANSI C library and as ANSI “C” source code. The code is pre-programmed in Demonstration and Evaluation Kits for the 78M6613 IC and can be pre-programmed into engineering IC samples for system evaluation. The application code allows for quick and efficient evaluation of the IC without having to write firmware or having to purchase an in-circuit emulator (ICE). A Software Licensing Agreement (SLA) can be signed to receive either the source Flash HEX file for use in a production environment or (partial) source code and SDK documentation for modification. 3.11 Measurement Calibration Once the 78M6613 Power and Energy Measurement device has been installed in a measurement system, it is typically calibrated for tolerances of the current sensors, voltage dividers and signal conditioning components. The device can be calibrated using a single gain and a single phase adjustment factors accessible to the CE. The gain adjustment is used to compensate for tolerances of components used for signal conditioning, especially the resistive components. Phase adjustment is provided to compensate for phase shifts introduced by certain types of current sensors. Due to the flexibility of the MPU firmware, any calibration method, such as calibration based on energy, or current and voltage can be implemented. It is also possible to implement segment-wise calibration (depending on current range). Maxim software supports a “quick cal” method. 78M6613 Data Sheet 4 4.1 DS_6613_018 Electrical Specifications Absolute Maximum Ratings Supplies and Ground Pins: V3P3 -0.5 V to 4.6 V GNDD, GNDA -0.5 V to +0.5 V Analog Output Pins: VREF -10 mA to +10 mA, -0.5 V to V3P3+0.5 V Analog Input Pins: A0, A1, A2, A3 -10 mA to +10 mA -0.5 V to V3P3+0.5 V XIN, XOUT -10 mA to +10 mA -0.5 V to 3.0 V All Other Pins: Configured as Digital Inputs -10 mA to +10 mA, -0.5 to 6 V Configured as Digital Outputs -15 mA to +15 mA, -0.5 V to V3P3D+0.5 V All other pins -0.5 V to V3P3D+0.5 V Operating junction temperature (peak, 100 ms) +140 °C Operating junction temperature (continuous) +125 °C Storage temperature -45 °C to +165 °C Soldering temperature (10 second duration) +250 °C ESD stress on all pins ±4 kV Stresses beyond Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. DS_6613_018 4.2 78M6613 Data Sheet Recommended External Components Name From To C1 V3P3A GNDA CSYS V3P3D XTAL † CXS CXL † Function Value Unit Bypass capacitor for 3.3V supply. ≥0.1±10% µF GNDD Bypass capacitor for V3P3D. ≥0.1±10% µF XIN XOUT 32.768 kHz crystal – electrically similar to ECS .327-12.5-17X or Vishay XT26T, load capacitance 12.5 pF. 32.768 kHz XIN GND 27±10% pF XOUT GND 27±10% pF Load capacitor for crystal (exact value depends on crystal specifications and parasitic capacitance of board). † Depending on trace capacitance, higher or lower values for CXS and CXL must be used. Capacitance from XIN to GND and XOUT to GND (combining pin, trace and crystal capacitance) should be 35 pF to 37 pF. 4.3 Recommended Operating Conditions Parameter Condition Min Typ Max Unit 3.3V Supply Voltage (V3P3) Normal Operation 3.0 3.3 3.6 V +85 ºC Operating Temperature 4.4 4.4.1 -40 Performance Specifications Input Logic Levels Parameter Condition Digital high-level input voltage, VIH Min Typ 2 Input pull-up current, IIL E_RXTX, E_RST, CKTEST Other digital inputs VIN=0V, ICE_E=1 Input pull down current, IIH ICE_E Other digital inputs VIN=V3P3 0.8 V µA µA µA 10 10 -1 0 100 100 1 10 -1 0 100 1 µA µA Min Typ Max Unit Output Logic Levels Parameter Digital high-level output voltage VOH Digital low-level output voltage VOL 1 Unit V Digital low-level input voltage, VIL 4.4.2 Max Condition ILOAD = 1 mA V3P3 –0.4 V ILOAD = 15 mA V3P31 0.6 V ILOAD = 1 mA 0 ILOAD = 15 mA Guaranteed by design; not production tested. 0.4 V 1 V 0.8 78M6613 Data Sheet 4.4.3 DS_6613_018 Supply Current Parameter Condition Typ Max Unit V3P3A + V3P3D current Normal Operation, V3P3=3.3V, ICE Disabled 8.1 10.3 mA V3P3A + V3P3D current vs. MPU clock frequency Same conditions as above 0.5 Normal Operation as above, except write Flash at maximum rate, ADC & CE Disabled 9.1 10 mA Typ Max Unit 1 µW V3P3A + V3PD current, Write Flash 4.4.4 Min mA/ MHz Crystal Oscillator Parameter Condition Maximum Output Power to Crystal Min Crystal connected XIN to XOUT Capacitance 3 pF Capacitance to GND XIN XOUT 5 5 pF pF 4.4.5 VREF Unless otherwise specified, VREF_DIS=0 Parameter Condition VREF output voltage, VNOM(25) Ta = 22ºC Min Typ Max Unit 1.193 1.195 1.197 V 50 mV 2.5 kΩ VREF chop step VREF output impedance * VNOM definition VREF_CAL =1, ILOAD = 10 µA, -10 µA VNOM (T ) = VREF (22) + (T − 22)TC1 + (T − 22) 2 TC 2 VREF temperature coefficients TC1 TC2 124.4 - 2.435*TRIMT -0.265 + 0.00106*TRIMT µV/ºC 2 µV/°C ±25 ppm/ year VREF aging VREF(T) deviation from VNOM(T) VREF (T ) − VNOM (T ) 10 6 VNOM 62 * Ta = -40ºC to +85ºC V -401 This relationship describes the nominal behavior of VREF at different temperatures. 1 +40 ppm/º C DS_6613_018 4.4.6 78M6613 Data Sheet ADC Converter, V3P3 Referenced VREF_DIS=0, LSB values do not include the 9-bit left shift at CE input. Parameter Condition Recommended Input Range (Vin-V3P3A) Voltage to Current Crosstalk: Typ Max Unit -250 250 mV peak -101 101 μV/V Vin = 200 mV peak, 65 Hz, on A0 10 6 *Vcrosstalk cos(∠Vin − ∠Vcrosstalk ) Vcrosstalk = largest Vin measurement on A1 or A3 THD (First 10 harmonics) 250 mV-pk 20 mV-pk Min Vin=65 Hz, 64 kpts FFT, BlackmanHarris window dB dB -75 -90 Input Impedance Vin=65 Hz Temperature coefficient of Input Impedance Vin=65 Hz 1.7 Ω/°C LSB size FIR_LEN=0 FIR_LEN=1 357 151 nV/LSB Digital Full Scale FIR_LEN=0 FIR_LEN=1 +884736 +2097152 LSB ADC Gain Error vs %Power Supply Variation 10 6 ∆Nout PK 357 nV / VIN 100 ∆V 3P3 A / 3.3 Vin=200 mV pk, 65 Hz V3P3=3.0V, 3.6V Input Offset (Vin-V3P3A) 4.4.7 40 90 -10 kΩ 50 ppm/% 10 mV Max Unit Temperature Sensor Parameter Condition Nominal Sensitivity (Sn) Nominal (Nn) † Temperature Error  ( N (T ) − N n )  ERR = T −  + Tn  Sn   Min Typ FIR_LEN=0 FIR_LEN=1 -669 -1585 LSB/ºC FIR_LEN=0 FIR_LEN=1 +429301 +1017558 LSB TA = -40ºC to +85ºC Tn = 25°C 1 -10 +101 ºC † Nn is measured at Tn during calibration and is stored in MPU or CE for use in temperature calculations. 1 Guaranteed by design; not production tested. 78M6613 Data Sheet 4.5 4.5.1 DS_6613_018 Timing Specifications RAM and Flash Memory Parameter CE DRAM wait states Condition Min Typ Max Unit CKMPU = 4.9152 MHz 5 Cycles CKMPU = 1.25 MHz 2 Cycles CKMPU = 614 kHz 1 Cycles 20,000 Cycles Flash write cycles -40 °C to +85 °C Flash data retention 25 °C 100 Years Flash data retention 85 °C 10 Years Flash byte writes between page or mass erase operations 4.5.2 2 Cycles Max Unit 1 µs RESET Parameter Condition Min Reset pulse fall time Reset pulse width 5 Typ µs DS_6613_018 4.5.3 78M6613 Data Sheet Typical Performance Data Wh Accuracy (%) 0.5 0.4 0.3 0.2 Accuracy (%) 0.1 0 Wh Accuracy (%) -0.1 -0.2 -0.3 -0.4 -0.5 0.01 0.1 1 10 Current (A) Figure 15: Wh Accuracy, 10 mA to 20 A at 120 V/60 Hz and Room Temperature Using a 4 mΩ Current Shunt Relative Accuracy over Temperature Accuracy [PPM/°C] 40 30 20 10 0 -10 -20 -30 -60 -40 -20 0 20 40 60 80 100 Temperature [°C] Figure 16: Typical Measurement Accuracy over Temperature Relative to 25°C 78M6613 Data Sheet DIO5 DIO6 DIO7 DIO8 RX RESET GNDA Pinout V3P3A 32 31 30 29 28 27 26 25 A1 1 24 ICE_E 23 GNDD A3 2 A2 3 22 DIO4 21 DIO19 A0 4 VREF 5 20 DIO16 19 DIO15 XIN 6 TEST 7 18 DIO14 17 DIO17 XOUT 8 V3P3D CKTEST TX TMUXOUT E_RXTX E_RST 9 10 11 12 13 14 15 16 E_TCLK 5.1 Packaging N/C 5 DS_6613_018 Figure 17: 32-Pin QFN Pinout DS_6613_018 5.2 78M6613 Data Sheet Package Outline (QFN 32) 0.85 NOM./ 0.9MAX. 5 0.00 / 0.005 2.5 0.20 REF. 1 2.5 2 3 5 SEATING PLANE TOP VIEW SIDE VIEW 0.35 / 0.45 3.0 / 3.2 0.18 / 0.3 CHAMFERED 0.30 1.5 / 1.6 1 2 3 3.0 / 3.2 1.5 / 1.6 0.5 0.2 MIN. 0.35 / 0.45 0.5 NOTE: Controlling BOTTOM VIEW dimensions are in mm. Figure 18: Package Outline (QFN 32) 78M6613 Data Sheet 5.3 DS_6613_018 Recommended PCB Land Pattern for the QFN-32 Package x y e d A G x y e d A G Symbol Description e Lead pitch Min Typ 0.50 mm x 0.28 mm y 0.69 mm d See Note 1 0.28 mm 3.00 mm A G Max 3.78 mm 3.93 mm Note 1: Do not place unmasked vias in region denoted by dimension “d”. Note 2: Soldering of bottom internal pad not required for proper operation of either commercial or industrial temperature rated versions. Figure 19: Recommended PCB Land Pattern Dimensions DS_6613_018 6 78M6613 Data Sheet Pin Descriptions 6.1 Power/Ground Pins Name GNDA GNDD V3P3A V3P3D 6.2 Type Circuit Description P – These pins should be connected directly to the ground plane. P – A 3.3V power supply should be connected to these pins. Analog Pins Name A0, A1, A2, A3 VREF XIN XOUT Type I Circuit 5 Description Sense Inputs: These pins are voltage inputs to the internal A/D converter. Typically, they are connected to either the outputs of current sensors or the outputs of resistor dividers (voltage sensors). Unused pins must be connected to V3P3. O I 8 Voltage Reference for the ADC. This pin is left unconnected. Never use as an external reference. 7 Crystal Inputs. A 32 kHz crystal should be connected across these pins. Typically, a 27 pF capacitor is also connected from each pin to GND. It is important to minimize the capacitance between these pins. See the crystal manufacturer datasheet for details. Pin types: P = Power, O = Output, I = Input, I/O = Input/Output The circuit number denotes the equivalent circuit, as specified under “I/O Equivalent Circuits”. 78M6613 Data Sheet 6.3 DS_6613_018 Digital Pins Name DIO4 DIO5 DIO6 DIO7 DIO8 DIO14 DIO15 DIO16 DIO17 DIO19 E_RXTX, E_RST E_TCLK Type Circuit I/O 3, 4 I/O 1, 4 O 4 Description DIO pins. If unused, these pins must be configured as DIOs and set to outputs by the firmware. Emulator port pins (when ICE_E pulled high) . ICE_E I 2 ICE enable. When zero, E_RST, E_TCLK, and E_RXTX are disabled. For production units, this pin should be pulled to GND to disable the emulator port. This pin should be brought out to the programming interface in order to create a way for reprogramming parts that have the SECURE bit set. CKTEST O 4 Clock PLL output. TMUXOUT O 4 Digital output test multiplexer. RESET I 3 This input pin resets the chip into a known state. For normal operation, this pin should be pulled low. To force the device into reset state, it should be pulled high. Refer to Section 3.6 for RESET pin connections, use, and relevant external circuitry. RX I 3 UART input. If unused, this pin must be terminated to V3P3 or GND. TX O 4 UART output. TEST I 7 Enables Production Test. Must be grounded in normal operation. Pin types: P = Power, O = Output, I = Input, I/O = Input/Output The circuit number denotes the equivalent circuit, as specified on the following page. DS_6613_018 7 78M6613 Data Sheet I/O Equivalent Circuits V3P3 V3P3 V3P3 V3P3 110K Digital Input Pin CMOS Input GND Digital Input Pin 110K GND Digital Input Equivalent Circuit Type 1: Standard Digital Input or pin configured as DIO Input with Internal Pull-Up Digital Input Pin CMOS Input CMOS Input GND GND Digital Input Type 3: Standard Digital Input or pin configured as DIO Input Digital Input Type 2: Pin configured as DIO Input with Internal Pull-Down V3P3 V3P3 V3P3 V3P3 Digital Output Pin CMOS Output GND GND Analog Input Pin To MUX Comparator Input Pin GND GND Digital Output Equivalent Circuit Type 4: Standard Digital Output or pin configured as DIO Output To Comparator Comparator Input Equivalent Circuit Type 6: Comparator Input Analog Input Equivalent Circuit Type 5: ADC Input V3P3 To Oscillator Oscillator Pin from internal reference VREF Pin GND GND Oscillator Equivalent Circuit Type 7: Oscillator I/O VREF Equivalent Circuit Type 8: VREF Figure 20: I/O Equivalent Circuits 78M6613 Data Sheet 8 DS_6613_018 Ordering Information Part 78M6613 Package 32-pin QFN (Lead(Pb)-Free) Option Ordering Number Bulk 78M6613-IM/F Tape & Reel 78M6613-IMR/F *Programmed, Bulk 78M6613-IM/F/P *Programmed, Tape & Reel 78M6613-IMR/F/P IC Marking 78M6613-IM *Contact the factory for more information on programmed part options. 9 Contact Information For more information about Maxim products or to check the availability of the 78M6613, contact technical support at www.maxim-ic.com/support. DS_6613_018 78M6613 Data Sheet Revision History REVISION NUMBER REVISION DATE 1.0 11/10 First publication.  1.1 3/11 In Section 6.3, corrected the description of the RESET pin. 30 2 1/12 Added Maxim logo. 1 DESCRIPTION PAGES CHANGED Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 ©  Maxim Integrated 33 The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.