19-5348; Rev 2; 1/12
LE
AVAILAB
78M6613
Single-Phase
AC Power Measurement IC
DATA SHEET
DS_6613_018
DESCRIPTION
FEATURES
The Teridian™ 78M6613 is a highly integrated IC for
simplified implementation of single-phase AC power
measurement into power supplies, smart appliances, and
other applications with embedded AC load monitoring and
control. It is packaged in a small, 5mm x 5mm, 32-pin QFN
package for optimal space savings.
• < 0.5% Wh Accuracy Over Wide 2000:1
Current Range and Over Temperature
• Voltage Reference < 40ppm/°C
• Four Sensor Inputs—V3P3A Referenced
• 22-Bit Delta-Sigma ADC with Independent
32-Bit Compute Engine (CE)
• 8-Bit MPU (80515), One Clock Cycle per
Instruction with 2KB MPU XRAM
• 32KB Flash with Security
• Integrated In-Circuit Emulator (ICE) Interface
for MPU Debug
• 32kHz Time Base with Hardware Watchdog
Timer
• UART Interface and Up to 10 GeneralPurpose 5V Tolerant I/O Pins
• Packaged in a RoHS-Compliant (6/6)
Lead(Pb)-Free, 32-Pin QFN (5mm x 5mm)
• Complete Application Firmware Provides:
o True RMS Calculations for Current,
Voltage, Line Frequency, Real Power,
Reactive Power, Apparent Power, and
Power Factor
o Accumulated Watt-Hours, Kilowatt-Hours
o Intelligent Switch Control at Zero
Crossings
o Digital Temperature Compensation
o Phase Compensation (±15°)
o Quick Calibration Routines
o 46–64Hz Line Frequency Range with
Same Calibration
At the measurement interface, the device provides four
analog inputs for interfacing to voltage and current sensors.
Voltages from the sensors are fed to our Single Converter
Technology® that uses a 22-bit delta-sigma ADC,
independent 32-bit compute engine (CE), digital
temperature compensation, and precision voltage
references to provide better than 0.5% power measurement
accuracy over a wide 2000:1 dynamic range.
The integrated MPU core and 32 KB of flash memory
provides a flexible means of configuration, post-processing,
data formatting, and interfacing to any host processor
through the UART interface and/or DIO pins. Complete
application firmware is available and can be preloaded into
the IC during manufacturing test. Alternatively, a complete
array of ICE, development tools, and programming libraries
are available to allow customization for each application.
Functional Diagrams
LIVE
Earth Ground
Isolated Supply
NEUT
CONVERTER
A0
A1
TERIDIAN
78M6613
A2
A3
GND
V3P3
REGULATOR
VOLTAGE REF
VREF
TEMP
SENSOR
OSC/PLL
32 kHz
XIN
DIO, PULSE
2KB RAM
32KB
FLASH
DIO 4-8
DIO 14-17, 19
SERIAL PORT
32-bit
COMPUTE
ENGINE
80515
MPU
TX
RX
ICE
ICE_E
XOUT
Pin Configurations appear at
end of dataTIMERS
sheet.
Functional Diagrams continued at end of data sheet.
Teridian
is trademark
a trademark
and Single
Converter
Technology
UCSP
is a
of Maxim
Integrated
Products,
Inc. is a
V3P3
GND
registered trademark of Maxim Integrated Products, Inc.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
78M6613 Data Sheet
DS_6613_018
Table of Contents
1
Hardware Description.................................................................................................................... 5
1.1 Hardware Overview ................................................................................................................ 5
1.2 Analog Front End (AFE) .......................................................................................................... 6
1.2.1 Input Multiplexer.......................................................................................................... 6
1.2.2 A/D Converter (ADC) .................................................................................................. 6
1.2.3 FIR Filter ..................................................................................................................... 6
1.2.4 Voltage References ..................................................................................................... 6
1.2.5 Temperature Sensor ................................................................................................... 7
1.2.6 Functional Description ................................................................................................. 7
1.3 Digital Computation Engine (CE) ............................................................................................ 8
1.4 80515 MPU Core .................................................................................................................... 8
1.4.1 UART .......................................................................................................................... 8
1.4.2 Timers and Counters ................................................................................................... 9
1.5 On-Chip Resources................................................................................................................. 9
1.5.1 Oscillator ..................................................................................................................... 9
1.5.2 PLL and Internal Clocks .............................................................................................. 9
1.5.3 Temperature Sensor ................................................................................................... 9
1.5.4 Flash Memory ............................................................................................................. 9
1.5.5 Digital I/O .................................................................................................................. 10
1.5.6 Hardware Watchdog Timer........................................................................................ 10
1.5.7 Program Security ...................................................................................................... 10
1.5.8 Test Ports.................................................................................................................. 10
2
Functional Description ................................................................................................................ 11
2.1 Theory of Operation .............................................................................................................. 11
2.2 Reset Behavior ..................................................................................................................... 12
2.3 Data Flow ............................................................................................................................. 12
2.4 CE/MPU Communication ...................................................................................................... 13
3
Application Information .............................................................................................................. 14
3.1 Connection of Sensors (CT, Resistive Shunt)........................................................................ 14
3.2 Temperature Measurement ................................................................................................... 15
3.3 Temperature Compensation.................................................................................................. 15
3.4 Connecting 5V Devices......................................................................................................... 16
3.5 UART (TX/RX) ...................................................................................................................... 16
3.6 Reset Function and Reset Pin Connections........................................................................... 16
3.7 Connecting the Emulator Port Pins ....................................................................................... 18
3.8 Crystal Oscillator................................................................................................................... 19
3.9 Flash Programming .............................................................................................................. 19
3.10 MPU Firmware Library .......................................................................................................... 19
3.11 Measurement Calibration ...................................................................................................... 19
4
Electrical Specifications ............................................................................................................. 20
4.1 Absolute Maximum Ratings .................................................................................................. 20
4.2 Recommended External Components ................................................................................... 21
4.3 Recommended Operating Conditions.................................................................................... 21
4.4 Performance Specifications .................................................................................................. 21
4.4.1 Input Logic Levels ..................................................................................................... 21
4.4.2 Output Logic Levels .................................................................................................. 21
4.4.3 Supply Current .......................................................................................................... 22
4.4.4 Crystal Oscillator ....................................................................................................... 22
4.4.5 VREF ........................................................................................................................ 22
4.4.6 ADC Converter, V3P3 Referenced ............................................................................ 23
4.4.7 Temperature Sensor ................................................................................................. 23
DS_6613_018
4.5
78M6613 Data Sheet
Timing Specifications............................................................................................................ 24
4.5.1 RAM and Flash Memory ............................................................................................ 24
4.5.2 RESET ...................................................................................................................... 24
4.5.3 Typical Performance Data ......................................................................................... 25
5
Packaging .................................................................................................................................... 26
5.1 Pinout ................................................................................................................................... 26
5.2 Package Outline (QFN 32) .................................................................................................... 27
5.3 Recommended PCB Land Pattern for the QFN-32 Package ................................................. 28
6
Pin Descriptions .......................................................................................................................... 29
6.1 Power/Ground Pins ............................................................................................................... 29
6.2 Analog Pins .......................................................................................................................... 29
6.3 Digital Pins ........................................................................................................................... 30
7
I/O Equivalent Circuits ................................................................................................................ 31
8
Ordering Information................................................................................................................... 32
9
Contact Information .................................................................................................................... 32
Revision History .................................................................................................................................. 33
Figures
Figure 1: IC Functional Block Diagram .................................................................................................... 4
Figure 2: AFE Block Diagram .................................................................................................................. 7
Figure 3: Connecting an External Load to DIO Pins ............................................................................... 10
Figure 4: Voltage. Current, Momentary and Accumulated Energy .......................................................... 11
Figure 5: MPU/CE Data Flow ................................................................................................................ 12
Figure 6: MPU/CE Communication ........................................................................................................ 13
Figure 7: Resistive Voltage Divider........................................................................................................ 14
Figure 8: Resistive Current Shunt .......................................................................................................... 14
Figure 9: Current Transformer ............................................................................................................... 14
Figure 10: Connections for the RX Pin ................................................................................................... 16
Figure 11: 78M6613 External Reset Behavior........................................................................................ 17
Figure 12: MAX810S Connections to the 78M6613 ................................................................................ 17
Figure 13: Reset Generator Based On TL431 Shunt Regulator .............................................................. 18
Figure 14: External Components for the Emulator Interface .................................................................. 18
Figure 15: Wh Accuracy, 10 mA to 20 A at 120 V/60 Hz and Room Temperature Using a 4 mΩ
Current Shunt ....................................................................................................................... 25
Figure 16: Typical Measurement Accuracy over Temperature Relative to 25°C..................................... 25
Figure 17: 32-Pin QFN Pinout ............................................................................................................... 26
Figure 18: Package Outline (QFN 32).................................................................................................... 27
Figure 19: Recommended PCB Land Pattern Dimensions ..................................................................... 28
Figure 20: I/O Equivalent Circuits .......................................................................................................... 31
Table
Table 1: Inputs Selected in Regular and Alternate Multiplexer Cycles...................................................... 6
78M6613 Data Sheet
DS_6613_018
VREF
V3P3A
GNDA
V3P3D
GNDD
∆Σ ADC
CONVERTER
A0
A1
A2
A3
VBIAS
VBIAS
MUX
V3P3
FIR
+
TEMP
VREF
VREF
MUX
CROSS
MUX
CTRL
OSC
(32KHz)
XIN
CK32
RTCLK (32KHz)
MCK
PLL
32KHz
XOUT
VOLT
REG
DIV
ADC
CK32
CKADC
4.9152MHz
CKTEST
CKFIR
4.9152MHz
4.9152MHz
CK_2X
CK_GEN
MUX_SYNC
CE RAM
(0.5KB)
STRT
CKCE
1 µs
Max
Typ
3.3V Supply Voltage (V3P3D/V3P3A)
Min
0.0V
Time
V3P3
RESET
Figure 11: 78M6613 External Reset Behavior
The RESET signal can be generated in a number of different ways. For example, a voltage supervisory
device such as Maxim’s MAX810S can be used to implement the reset/supply voltage supervisory
function as shown in Figure 12.
V3P3
MAX810S
Vcc
RST
RESET
GND
78M6613
GND
Figure 12: MAX810S Connections to the 78M6613
78M6613 Data Sheet
DS_6613_018
An alternate solution using discrete components can be used. Figure 13 shows an implementation using
a shunt regulator and two transistors.
Figure 13: Reset Generator Based On TL431 Shunt Regulator
As long as V3P3 is below the 2.79V threshold set by the voltage divider of R1 and R2, U1 will not
conduct current, the base of Q2 will be at the same potential as its emitter, so Q1 will be turned off. With
no current flowing in the collector of Q2, the base of Q1 will be low, Q1 will be turned off, and RESET will
track V3P3. When the V3P3 rises above 2.79V, the TL431 starts to conduct, the base of Q2 is be pulled
low, turning on Q2. This drives the base of Q1 high, turning Q1 on and pulling RESET low. The inherent
turn-on and turn-off delays of the TL4313 provide the ~1µs delay required to ensure proper resetting of
the 78M6613.
3.7
Connecting the Emulator Port Pins
It is important to bring out the ICE_E pin to the programming interface in order to create a way
for reprogramming parts that have the Flash SECURE bit (SFR 0xB2[6]) set. Providing access to
ICE_E ensures that the part can be reset between erase and program cycles, which will enable
programming devices to reprogram the part. The reset required is implemented with a watchdog timer
reset (i.e. the hardware WDT must be enabled).
78M6613
V3P3
ICE_E
62 Ω
E_RST
62 Ω
E_RXTX
E_TCLK
62 Ω
1000pF
300 Ω
Figure 14: External Components for the Emulator Interface
DS_6613_018
3.8
78M6613 Data Sheet
Crystal Oscillator
The oscillator of the 78M6613 drives a standard 32.768 kHz watch crystal. The oscillator has been
designed specifically to handle these crystals and is compatible with their high impedance and limited
power handling capability. Good layouts will have XIN and XOUT shielded from each other.
Since the oscillator is self-biasing, an external resistor must not be connected across the crystal.
3.9
Flash Programming
Operational or test code can be programmed into the Flash memory using either an in-circuit emulator or
the Flash Programmer Module (TFP-2) available from Maxim. The Flash programming procedure uses
the E_RST, E_RXTX, and E_TCLK pins.
3.10 MPU Firmware Library
Any application-specific MPU functions mentioned above are available from Maxim as a standard ANSI
C library and as ANSI “C” source code. The code is pre-programmed in Demonstration and Evaluation
Kits for the 78M6613 IC and can be pre-programmed into engineering IC samples for system evaluation.
The application code allows for quick and efficient evaluation of the IC without having to write firmware
or having to purchase an in-circuit emulator (ICE). A Software Licensing Agreement (SLA) can be
signed to receive either the source Flash HEX file for use in a production environment or (partial) source
code and SDK documentation for modification.
3.11 Measurement Calibration
Once the 78M6613 Power and Energy Measurement device has been installed in a measurement
system, it is typically calibrated for tolerances of the current sensors, voltage dividers and signal
conditioning components. The device can be calibrated using a single gain and a single phase
adjustment factors accessible to the CE. The gain adjustment is used to compensate for tolerances of
components used for signal conditioning, especially the resistive components. Phase adjustment is
provided to compensate for phase shifts introduced by certain types of current sensors.
Due to the flexibility of the MPU firmware, any calibration method, such as calibration based on energy,
or current and voltage can be implemented. It is also possible to implement segment-wise calibration
(depending on current range). Maxim software supports a “quick cal” method.
78M6613 Data Sheet
4
4.1
DS_6613_018
Electrical Specifications
Absolute Maximum Ratings
Supplies and Ground Pins:
V3P3
-0.5 V to 4.6 V
GNDD, GNDA
-0.5 V to +0.5 V
Analog Output Pins:
VREF
-10 mA to +10 mA,
-0.5 V to V3P3+0.5 V
Analog Input Pins:
A0, A1, A2, A3
-10 mA to +10 mA
-0.5 V to V3P3+0.5 V
XIN, XOUT
-10 mA to +10 mA
-0.5 V to 3.0 V
All Other Pins:
Configured as Digital Inputs
-10 mA to +10 mA,
-0.5 to 6 V
Configured as Digital Outputs
-15 mA to +15 mA,
-0.5 V to V3P3D+0.5 V
All other pins
-0.5 V to V3P3D+0.5 V
Operating junction temperature (peak, 100 ms)
+140 °C
Operating junction temperature (continuous)
+125 °C
Storage temperature
-45 °C to +165 °C
Soldering temperature (10 second duration)
+250 °C
ESD stress on all pins
±4 kV
Stresses beyond Absolute Maximum Ratings may cause permanent damage to the device. These are
stress ratings only and functional operation at these or any other conditions beyond those indicated
under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability. All voltages are with respect to GND.
DS_6613_018
4.2
78M6613 Data Sheet
Recommended External Components
Name
From
To
C1
V3P3A
GNDA
CSYS
V3P3D
XTAL
†
CXS
CXL †
Function
Value
Unit
Bypass capacitor for 3.3V supply.
≥0.1±10%
µF
GNDD
Bypass capacitor for V3P3D.
≥0.1±10%
µF
XIN
XOUT
32.768 kHz crystal – electrically similar to
ECS .327-12.5-17X or Vishay XT26T, load
capacitance 12.5 pF.
32.768
kHz
XIN
GND
27±10%
pF
XOUT
GND
27±10%
pF
Load capacitor for crystal (exact value
depends on crystal specifications and
parasitic capacitance of board).
†
Depending on trace capacitance, higher or lower values for CXS and CXL must be used. Capacitance from
XIN to GND and XOUT to GND (combining pin, trace and crystal capacitance) should be 35 pF to 37 pF.
4.3
Recommended Operating Conditions
Parameter
Condition
Min
Typ
Max
Unit
3.3V Supply Voltage (V3P3)
Normal Operation
3.0
3.3
3.6
V
+85
ºC
Operating Temperature
4.4
4.4.1
-40
Performance Specifications
Input Logic Levels
Parameter
Condition
Digital high-level input voltage, VIH
Min
Typ
2
Input pull-up current, IIL
E_RXTX,
E_RST, CKTEST
Other digital inputs
VIN=0V, ICE_E=1
Input pull down current, IIH
ICE_E
Other digital inputs
VIN=V3P3
0.8
V
µA
µA
µA
10
10
-1
0
100
100
1
10
-1
0
100
1
µA
µA
Min
Typ
Max
Unit
Output Logic Levels
Parameter
Digital high-level output voltage VOH
Digital low-level output voltage VOL
1
Unit
V
Digital low-level input voltage, VIL
4.4.2
Max
Condition
ILOAD = 1 mA
V3P3
–0.4
V
ILOAD = 15 mA
V3P31
0.6
V
ILOAD = 1 mA
0
ILOAD = 15 mA
Guaranteed by design; not production tested.
0.4
V
1
V
0.8
78M6613 Data Sheet
4.4.3
DS_6613_018
Supply Current
Parameter
Condition
Typ
Max
Unit
V3P3A + V3P3D current
Normal Operation,
V3P3=3.3V,
ICE Disabled
8.1
10.3
mA
V3P3A + V3P3D current vs.
MPU clock frequency
Same conditions as above
0.5
Normal Operation as above,
except write Flash at maximum
rate, ADC & CE Disabled
9.1
10
mA
Typ
Max
Unit
1
µW
V3P3A + V3PD current,
Write Flash
4.4.4
Min
mA/
MHz
Crystal Oscillator
Parameter
Condition
Maximum Output Power to Crystal
Min
Crystal connected
XIN to XOUT Capacitance
3
pF
Capacitance to GND
XIN
XOUT
5
5
pF
pF
4.4.5
VREF
Unless otherwise specified, VREF_DIS=0
Parameter
Condition
VREF output voltage, VNOM(25)
Ta = 22ºC
Min
Typ
Max
Unit
1.193
1.195
1.197
V
50
mV
2.5
kΩ
VREF chop step
VREF output impedance
*
VNOM definition
VREF_CAL =1,
ILOAD = 10 µA, -10 µA
VNOM (T ) = VREF (22) + (T − 22)TC1 + (T − 22) 2 TC 2
VREF temperature coefficients
TC1
TC2
124.4 - 2.435*TRIMT
-0.265 + 0.00106*TRIMT
µV/ºC
2
µV/°C
±25
ppm/
year
VREF aging
VREF(T) deviation from VNOM(T)
VREF (T ) − VNOM (T ) 10 6
VNOM
62
*
Ta = -40ºC to +85ºC
V
-401
This relationship describes the nominal behavior of VREF at different temperatures.
1
+40
ppm/º
C
DS_6613_018
4.4.6
78M6613 Data Sheet
ADC Converter, V3P3 Referenced
VREF_DIS=0, LSB values do not include the 9-bit left shift at CE input.
Parameter
Condition
Recommended Input Range
(Vin-V3P3A)
Voltage to Current Crosstalk:
Typ
Max
Unit
-250
250
mV
peak
-101
101
μV/V
Vin = 200 mV peak,
65 Hz, on A0
10 6 *Vcrosstalk
cos(∠Vin − ∠Vcrosstalk ) Vcrosstalk = largest
Vin
measurement on A1 or
A3
THD (First 10 harmonics)
250 mV-pk
20 mV-pk
Min
Vin=65 Hz,
64 kpts FFT, BlackmanHarris window
dB
dB
-75
-90
Input Impedance
Vin=65 Hz
Temperature coefficient of Input
Impedance
Vin=65 Hz
1.7
Ω/°C
LSB size
FIR_LEN=0
FIR_LEN=1
357
151
nV/LSB
Digital Full Scale
FIR_LEN=0
FIR_LEN=1
+884736
+2097152
LSB
ADC Gain Error vs
%Power Supply Variation
10 6 ∆Nout PK 357 nV / VIN
100 ∆V 3P3 A / 3.3
Vin=200 mV pk, 65 Hz
V3P3=3.0V, 3.6V
Input Offset (Vin-V3P3A)
4.4.7
40
90
-10
kΩ
50
ppm/%
10
mV
Max
Unit
Temperature Sensor
Parameter
Condition
Nominal Sensitivity (Sn)
Nominal (Nn)
†
Temperature Error
( N (T ) − N n )
ERR = T −
+ Tn
Sn
Min
Typ
FIR_LEN=0
FIR_LEN=1
-669
-1585
LSB/ºC
FIR_LEN=0
FIR_LEN=1
+429301
+1017558
LSB
TA = -40ºC to +85ºC
Tn = 25°C
1
-10
+101
ºC
†
Nn is measured at Tn during calibration and is stored in MPU or CE for use in temperature calculations.
1
Guaranteed by design; not production tested.
78M6613 Data Sheet
4.5
4.5.1
DS_6613_018
Timing Specifications
RAM and Flash Memory
Parameter
CE DRAM wait states
Condition
Min
Typ
Max
Unit
CKMPU = 4.9152 MHz
5
Cycles
CKMPU = 1.25 MHz
2
Cycles
CKMPU = 614 kHz
1
Cycles
20,000
Cycles
Flash write cycles
-40 °C to +85 °C
Flash data retention
25 °C
100
Years
Flash data retention
85 °C
10
Years
Flash byte writes between page or
mass erase operations
4.5.2
2
Cycles
Max
Unit
1
µs
RESET
Parameter
Condition
Min
Reset pulse fall time
Reset pulse width
5
Typ
µs
DS_6613_018
4.5.3
78M6613 Data Sheet
Typical Performance Data
Wh Accuracy (%)
0.5
0.4
0.3
0.2
Accuracy (%)
0.1
0
Wh Accuracy (%)
-0.1
-0.2
-0.3
-0.4
-0.5
0.01
0.1
1
10
Current (A)
Figure 15: Wh Accuracy, 10 mA to 20 A at 120 V/60 Hz and Room Temperature Using a 4 mΩ
Current Shunt
Relative Accuracy over Temperature
Accuracy [PPM/°C]
40
30
20
10
0
-10
-20
-30
-60
-40
-20
0
20
40
60
80
100
Temperature [°C]
Figure 16: Typical Measurement Accuracy over Temperature Relative to 25°C
78M6613 Data Sheet
DIO5
DIO6
DIO7
DIO8
RX
RESET
GNDA
Pinout
V3P3A
32 31 30 29 28 27 26 25
A1 1
24 ICE_E
23 GNDD
A3 2
A2 3
22 DIO4
21 DIO19
A0 4
VREF 5
20 DIO16
19 DIO15
XIN 6
TEST 7
18 DIO14
17 DIO17
XOUT 8
V3P3D
CKTEST
TX
TMUXOUT
E_RXTX
E_RST
9 10 11 12 13 14 15 16
E_TCLK
5.1
Packaging
N/C
5
DS_6613_018
Figure 17: 32-Pin QFN Pinout
DS_6613_018
5.2
78M6613 Data Sheet
Package Outline (QFN 32)
0.85 NOM./ 0.9MAX.
5
0.00 / 0.005
2.5
0.20 REF.
1
2.5
2
3
5
SEATING
PLANE
TOP VIEW
SIDE VIEW
0.35 / 0.45
3.0 / 3.2
0.18 / 0.3
CHAMFERED
0.30
1.5 / 1.6
1
2
3
3.0 / 3.2
1.5 / 1.6
0.5
0.2 MIN.
0.35 / 0.45
0.5
NOTE:
Controlling
BOTTOM VIEW
dimensions are in mm.
Figure 18: Package Outline (QFN 32)
78M6613 Data Sheet
5.3
DS_6613_018
Recommended PCB Land Pattern for the QFN-32 Package
x
y
e
d
A G
x
y
e
d
A
G
Symbol
Description
e
Lead pitch
Min
Typ
0.50
mm
x
0.28 mm
y
0.69 mm
d
See Note 1
0.28 mm
3.00 mm
A
G
Max
3.78 mm
3.93 mm
Note 1: Do not place unmasked vias in region denoted by dimension “d”.
Note 2: Soldering of bottom internal pad not required for proper operation of either commercial or
industrial temperature rated versions.
Figure 19: Recommended PCB Land Pattern Dimensions
DS_6613_018
6
78M6613 Data Sheet
Pin Descriptions
6.1
Power/Ground Pins
Name
GNDA
GNDD
V3P3A
V3P3D
6.2
Type
Circuit
Description
P
–
These pins should be connected directly to the ground plane.
P
–
A 3.3V power supply should be connected to these pins.
Analog Pins
Name
A0, A1,
A2, A3
VREF
XIN
XOUT
Type
I
Circuit
5
Description
Sense Inputs: These pins are voltage inputs to the internal A/D
converter. Typically, they are connected to either the outputs of
current sensors or the outputs of resistor dividers (voltage sensors).
Unused pins must be connected to V3P3.
O
I
8
Voltage Reference for the ADC. This pin is left unconnected. Never
use as an external reference.
7
Crystal Inputs. A 32 kHz crystal should be connected across these
pins. Typically, a 27 pF capacitor is also connected from each pin to
GND. It is important to minimize the capacitance between these
pins. See the crystal manufacturer datasheet for details.
Pin types: P = Power, O = Output, I = Input, I/O = Input/Output
The circuit number denotes the equivalent circuit, as specified under “I/O Equivalent Circuits”.
78M6613 Data Sheet
6.3
DS_6613_018
Digital Pins
Name
DIO4
DIO5
DIO6
DIO7
DIO8
DIO14
DIO15
DIO16
DIO17
DIO19
E_RXTX,
E_RST
E_TCLK
Type
Circuit
I/O
3, 4
I/O
1, 4
O
4
Description
DIO pins. If unused, these pins must be configured as DIOs and
set to outputs by the firmware.
Emulator port pins (when ICE_E pulled high) .
ICE_E
I
2
ICE enable. When zero, E_RST, E_TCLK, and E_RXTX are disabled.
For production units, this pin should be pulled to GND to disable the
emulator port. This pin should be brought out to the programming
interface in order to create a way for reprogramming parts that have
the SECURE bit set.
CKTEST
O
4
Clock PLL output.
TMUXOUT
O
4
Digital output test multiplexer.
RESET
I
3
This input pin resets the chip into a known state. For normal operation,
this pin should be pulled low. To force the device into reset state, it should be
pulled high. Refer to Section 3.6 for RESET pin connections, use, and
relevant external circuitry.
RX
I
3
UART input. If unused, this pin must be terminated to V3P3 or
GND.
TX
O
4
UART output.
TEST
I
7
Enables Production Test. Must be grounded in normal operation.
Pin types: P = Power, O = Output, I = Input, I/O = Input/Output
The circuit number denotes the equivalent circuit, as specified on the following page.
DS_6613_018
7
78M6613 Data Sheet
I/O Equivalent Circuits
V3P3
V3P3
V3P3
V3P3
110K
Digital
Input
Pin
CMOS
Input
GND
Digital
Input
Pin
110K
GND
Digital Input Equivalent Circuit
Type 1:
Standard Digital Input or
pin configured as DIO Input
with Internal Pull-Up
Digital
Input
Pin
CMOS
Input
CMOS
Input
GND
GND
Digital Input Type 3:
Standard Digital Input or
pin configured as DIO Input
Digital Input
Type 2:
Pin configured as DIO Input
with Internal Pull-Down
V3P3
V3P3
V3P3
V3P3
Digital
Output
Pin
CMOS
Output
GND
GND
Analog
Input
Pin
To
MUX
Comparator
Input
Pin
GND
GND
Digital Output Equivalent Circuit
Type 4:
Standard Digital Output or
pin configured as DIO Output
To
Comparator
Comparator Input Equivalent Circuit
Type 6:
Comparator Input
Analog Input Equivalent Circuit
Type 5:
ADC Input
V3P3
To
Oscillator
Oscillator
Pin
from
internal
reference
VREF
Pin
GND
GND
Oscillator Equivalent Circuit
Type 7:
Oscillator I/O
VREF Equivalent Circuit
Type 8:
VREF
Figure 20: I/O Equivalent Circuits
78M6613 Data Sheet
8
DS_6613_018
Ordering Information
Part
78M6613
Package
32-pin QFN
(Lead(Pb)-Free)
Option
Ordering Number
Bulk
78M6613-IM/F
Tape & Reel
78M6613-IMR/F
*Programmed, Bulk
78M6613-IM/F/P
*Programmed, Tape & Reel
78M6613-IMR/F/P
IC Marking
78M6613-IM
*Contact the factory for more information on programmed part options.
9
Contact Information
For more information about Maxim products or to check the availability of the 78M6613, contact
technical support at www.maxim-ic.com/support.
DS_6613_018
78M6613 Data Sheet
Revision History
REVISION
NUMBER
REVISION
DATE
1.0
11/10
First publication.
1.1
3/11
In Section 6.3, corrected the description of the RESET
pin.
30
2
1/12
Added Maxim logo.
1
DESCRIPTION
PAGES
CHANGED
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
© Maxim Integrated
33
The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.
工商网监
湘ICP备2023018690号
