DS32KHZ/DIP

as DS32kHz 32.768kHz Temperature-Compensated Crystal Oscillator www.maxim-ic.com GENERAL DESCRIPTION The DS32kHz is a temperature-compensated crystal oscillator (TCXO) with an output frequency of 32.768kHz. This device addresses applications requiring better timekeeping accuracy, and can be used to drive the X1 input of most Dallas Semiconductor real-time clocks (RTCs), chipsets, and other ICs containing RTCs. This device is available in commercial (DS32kHz) and industrial (DS32kHz-N) temperature versions. APPLICATIONS GPS Receivers Telematics Network Timing and Synchronization in Servers, Routers, Hubs, and Switches Automatic Power Meters FEATURES           Accurate to ±4 Minutes/Year (-40°C to +85°C) Accurate to ±1 Minute/Year (0°C to +40°C) Battery Backup for Continuous Timekeeping VBAT Operating Voltage: 2.7V to 5.5V with VCC Grounded VCC Operating Voltage: 4.5V to 5.5V Operating Temperature Range: 0°C to +70°C (Commercial) -40°C to +85°C (Industrial) No Calibration Required Low-Power Consumption Surface Mountable Using BGA Package UL Recognized ORDERING INFORMATION PART DS32KHZ/DIP DS32KHZN/DIP DS32KHZS DS32KHZS# DS32KHZSN DS32KHZSN# DS32KHZ/WBGA+ DS32KHZN/WBGA+ TEMP RANGE 0ºC to +70ºC -40ºC to +85ºC 0ºC to +70ºC 0ºC to +70ºC -40ºC to +85ºC -40ºC to +85ºC 0ºC to +70ºC -40ºC to +85ºC PINPACKAGE 14 DIP 14 DIP 16 SO (0.300”) 16 SO (0.300”) 16 SO (0.300”) 16 SO (0.300”) 36 BGA 36 BGA TOP MARK* DS32KHZ DS32KHZ-N DS32KHZS DS32KHZS DS32KHZSN DS32KHZSN DS32KHZ DS32KHZ-N #Denotes a RoHS-compliant device that may include lead that is exempt under the RoHS requirements. The lead finish is JESD97 category e3, and is compatible with both lead-based and lead-free soldering processes. *A “#” anywhere on the top mark denotes a RoHS-compliant device. An “N” denotes an industrial device. PIN CONFIGURATIONS 1 of 8 REV: 071521 DS32kHz ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground………………………………………………………………-3.0V to +7.0V Operating Temperature Range (Noncondensing) Commercial:…………………………………………………………………………………………………..0°C to +70°C Industrial:……………………………………………………………………………………………………-40°C to +85°C Storage Temperature Range………………………………………………………………………………….-40°C to +85°C Soldering Temperature (BGA, SO)……………………….See the Handling, PC Board Layout, and Assembly section. Soldering Temperature, Leads (DIP)……………………………………………………..+260°C for 10 seconds (Note 1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED DC OPERATING CONDITIONS (TA = -40°C to +85°C) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 5.5 3.5, 5.5 V Power-Supply Voltage VCC (Note 2) 4.5 5.0 Battery Voltage VBAT (Notes 2, 3) 2.7 3.0 MIN TYP MAX UNITS 150 220 µA +50 nA V DC ELECTRICAL CHARACTERISTICS (Over the operating range, unless otherwise specified.) (Note 1) PARAMETER SYMBOL Active Supply Current Battery Input-Leakage Current ICC IBATLKG CONDITIONS VBAT = 0V or 2.7V ≤ VBAT ≤ 3.5V (Notes 3, 4) VCC MIN ≤ VCC ≤ VCC MAX -50 2.4 High Output Voltage (VCC) VOH IOH = -1.0mA (Note 2) Low Output Voltage VOL IOL = 2.1mA (Note 2) High Output Voltage (VBAT) VOH IOH = -0.1mA (Note 2) Battery Switch Voltage VSW (Note 2) V 0.4 2.4 V V VBAT V (VCC = 0V, TA = -40°C to +85°C.) (Note 1) PARAMETER SYMBOL Active Battery Current Battery Current During Temperature Measurement CONDITIONS MIN TYP MAX UNITS 4 µA IBAT VBAT = 3.3V (Notes 4, 5, 6) 1 IBATCNV VBAT = 3.3V (Notes 4, 5, 7) 450 Note 1: Limits at -40°C are guaranteed by design and are not production tested. Note 2: All voltages are referenced to ground. Note 3: VBAT must be no greater than 3.5V when the device is used in the dual-supply operating modes. Note 4: Typical values are at +25°C and 5.0V VCC, 3.0 VBAT, unless otherwise indicated. Note 5: These parameters are measured under no output load conditions. Note 6: This current is the active-mode current sourced from the backup supply/battery. Note 7: A temperature conversion lasts 122ms (typ) and occurs on power-up and then once every 64 seconds. 2 of 8 µA DS32kHz AC TIMING CHARACTERISTICS (Over the operating range, unless otherwise specified.) PARAMETER Output Frequency SYMBOL CONDITIONS MIN fOUT TYP MAX 32.768 0°C to +40°C Industrial Device (N): -40°C to +85°C Commercial Device: 0°C to +70°C UNITS kHz -2.0 +2.0 -7.5 +7.5 Frequency Stability vs. Temperature ∆f/fO Duty Cycle tW/t Cycle Time tCYC (Note 8) 30.518 µs High/Low Time tH/tL (Note 8) 15.06 µs Rise Time tR (Note 8) 200 ns Fall Time tF (Note 8) 60 ns (Note 8) VCC = 5.0V or VBAT = 3.0V, VCC = 0V (Notes 4, 9) 1 seconds +2.5 ppm/V ±1.0 ppm Oscillator Startup Time tOSC Frequency Stability vs. Operating Voltage ∆f/V Crystal Aging (First Year) ∆f/fO 45 (Notes 4, 10) Note 8: These parameters are measured using a 15pF load. Note 9: Error is measured from the nominal supply voltage of whichever supply is powering the device. Note 10: After reflow. Figure 1. DS32kHz Output Waveform 3 of 8 50 55 ppm % DS32kHz TYPICAL OPERATING CHARACTERISTICS (VCC = 3.3V, TA = +25°C, unless otherwise noted.) IBAT versus VBAT ICC versus VCC 4.5 145 135 SUPPLY CURRENT (uA SUPPLY CURRENT (uA 4 3.5 3 2.5 125 115 105 95 2 85 1.5 2.7 3.2 3.7 4.2 VBAT (V) 4.7 75 5.2 5.00 VCC (V) 5.25 7 6 12.5 47pF V BAT 5 10.0 7.5 22pF 5.0 Deviation in ppm SUPPLY CURRENT (uA 5.50 Frequency Deviation Versus Supply Voltage IBAT vs. VBAT vs. output load 15.0 4.75 4.50 4 3 2 V CC 10pF 1 2.5 0pF 0 -1 0.0 2.7 3.2 3.7 4.2 VBAT 4.7 5.2 2.7 3.2 3.7 4.2 4.7 Supply Voltage (V) 4 of 8 5.2 DS32kHz PIN DESCRIPTION PIN NAME FUNCTION SO BGA DIP 1 C4, C5, D4, D5 12 32kHz 2 C2, C3, D2, D3 13 VCC Primary Power Supply 1, 6–11, 14 N.C. No Connection (Must be grounded) 4 GND Ground 5 VBAT +3V Nominal Supply Input. Used to operate the device when VCC is absent. 3–12, 15, 16 13 14 A7, A8, B7, B8, C7, C8, D7, D8 All remaining balls A4, A5, B4, B5 32.768kHz Push-Pull Output Figure 2. Delta Time and Frequency vs. Temperature 20 0 0 Crystal +20ppm Typical Crystal, Uncompensated -40 DS32kHz Accuracy Band -60 -20 -80 -40 -100 -120 -60 Crystal -20ppm -140 -160 Delta Time (Min/Year) Delta Frequency (ppm) -20 -80 -180 -200 -100 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature (°C) FUNCTIONAL DESCRIPTION The DS32kHz is a temperature-compensated crystal oscillator (TCXO) that outputs a 32,768Hz square wave. While the DS32kHz is powered by either supply input, the device measures the temperature every 64 seconds and adjusts the output frequency. The device requires four pins for operation: VCC, GND, VBAT, and 32kHz. (See Figure 4 for connection schemes.) Power is applied through VCC and GND, while VBAT is used to maintain the 32kHz output in the absence of power. Once every 64 seconds, the DS32kHz measures the temperature and adjusts the output frequency. The output is accurate to ±2ppm (±1 min/yr) from 0°C to +40°C and to ±7.5ppm (±4 min/year) from -40°C to 0°C and from +40°C to +85°C. 5 of 8 DS32kHz The DS32kHz is packaged in a 36-pin ball grid array (BGA). It also is available in a 16-pin 0.300” SO and a 14-pin encapsulated DIP (EDIP) module. The additional PC board space required to add the DS32kHz as an option for driving a RTC is negligible in many applications (see Figure 6) Therefore, adding the DS32kHz to new designs and future board revisions allows the use of the DS32kHz where applications require improved timekeeping accuracy. Figure 3. Block Diagram VCC Temperature Measurement VBAT Dallas Semiconductor DS32kHz Power Control Power Switching Circuit P 32.768kHz N GND OPERATION The DS32kHz module contains a quartz tuning-fork crystal and an IC. When power is first applied, and when the device switches between supplies, the DS32kHz measures the temperature and adjusts the crystal load to compensate the frequency. The power supply must remain at a valid level whenever a temperature measurement is made, including when VCC is first applied. While powered, the DS32kHz measures the temperature once every 64 seconds and adjusts the crystal load. The DS32kHz is designed to operate in two modes. In the dual-supply mode, a comparator circuit, powered by VCC, monitors the relationship between the VCC and VBAT input levels. When VCC drops below a certain level compared to VBAT, the device switches over to VBAT (Figure 4A). This mode uses VCC to conserve the battery connected to VBAT while VCC is applied. In the single-supply mode, VCC is grounded and the unit is powered by VBAT. Current consumption is less than VCC, because the comparator circuit is unpowered (Figure 4B). Figure 4A shows how the DS32kHz should be connected when using two power supplies. VCC should be between 4.5V and 5.5V, and VBAT should be between 2.7V and 3.5V. Figure 4B shows how the DS32kHz can be used when only a single-supply system is available. VCC should be grounded and VBAT should then be held between 2.7V and 5.5V. The VBAT pin should be connected directly to a battery. Figure 4C shows a single-supply mode where VCC is held at +5V. See the frequency stability vs. operating voltage for information about frequency error vs. supply voltage. 6 of 8 DS32kHz Figure 4. Power-Supply Connections 4.5V - 5.5V 4.5V - 5.5V 2.7V - 3.3V Vcc Vcc Vcc Vbat 32.768kHz out 2.7V - 5.5V Vbat 32.768kHz out Vbat 32.768kHz out GND GND GND A B C Figure 5 illustrates how a standard 32.768kHz crystal and the DS32kHz should be connected to address the interchangeable option. Using this connection scheme and the recommended layout provides a solution, which requires no hardware modifications. Only one device should be used at a time, and both layouts should be located very close together if the recommended layout is not used. The DS32kHz ICC and IBAT currents are specified with no output loads. Many RTC oscillator circuits use a quartz crystal or resonator. Driving the oscillator circuit with the rail-to-rail output of the DS32kHz can increase the ICC and IBAT currents significantly and increase the current consumption of the RTC as well. Figure 6 shows one circuit that can be used to reduce the current consumption of a DS32kHz and an RTC. The values of R1 and C1 may vary depending on the RTC used. However, values of 1.0MΩ and 100pF are recommended as a starting point. R2 is used to shift the input waveform to the proper level. The recommended value for R2 is 33kΩ. Figure 5. DS32kHz Connections VCC VBAT 32kHz out X1 or Xin 32.768 Hz DS32kHz RTC X2 or Xout VCC VBAT A PC board can be laid out so that the RTC can use either the DS32kHz or a crystal Figure 6. DS32kHz and RTC Connections VCC VBAT DS32kHz R1 1MΩ VCC C1 100pF R2 33kΩ X1 X2 RTC VBAT 7 of 8 DS32kHz RELATED APPLICATION NOTES (Go to www.maxim-ic.com/RTCapps to find these application notes and more.) Application Note 58: Crystal Considerations with Dallas Real-Time Clocks Application Note 701: Using the DS32kHz with Dallas RTCs HANDLING, PC BOARD LAYOUT, AND ASSEMBLY These packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent damage to the crystal. Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line. All N.C. (no connect) pins must be connected to ground. The BGA package may be reflowed as long as the peak temperature does not exceed +225°C. Peak reflow temperature (≥ 220°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed 40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that the internal crystal is not exposed to temperatures above +150°C. Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisturesensitive device (MSD) classifications. THERMAL INFORMATION PACKAGE TYPE 16-pin SO (300 mils) 36-pin BGA THETA-JA (°C/W) 73 43.9 THETA-JC (°C/W) 23 18.4 PACKAGE INFORMATION (For the latest package information, go to www.maxim-ic.com/DallasPackInfo.) PACKAGE TYPE DOCUMENT NO. 14-pin Encapsulated DIP 16-pin SO (300 mils) 36-pin BGA 56-G0001-002 56-G4009-001 56-G6023-001 8 of 8 Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product. No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2006 Maxim Integrated Products • Printed USA The Maxim log is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.