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MAX1156BEUP+

MAX1156BEUP+

  • 厂商:

    AD(亚德诺)

  • 封装:

    TSSOP20

  • 描述:

    IC ADC 14BIT SAR 20TSSOP

  • 数据手册
  • 价格&库存
MAX1156BEUP+ 数据手册
19-2736; Rev 0; 1/03 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range The MAX1156/MAX1158/MAX1174 are ideal for highperformance, battery-powered, data-acquisition applications. Excellent AC performance (THD = -100dB) and DC accuracy (±1LSB INL) make the MAX1156/ MAX1158/MAX1174 ideal for industrial process control, instrumentation, and medical applications. The MAX1156/MAX1158/MAX1174 are available in a 20-pin TSSOP package and are fully specified over the -40°C to +85°C extended temperature range and the 0°C to +70°C commercial temperature range. Features ♦ Byte-Wide Parallel Interface ♦ Analog Input Voltage Range: ±10V, ±5V, 0 to 10V ♦ Single +4.75V to +5.25V Analog Supply Voltage ♦ Interface with +2.7V to +5.25V Digital Logic ♦ ±1LSB INL (max) ♦ ±1LSB DNL (max) ♦ Low Supply Current (max) 2.9mA (External Reference) 3.8mA (Internal Reference) 5µA AutoShutdown Mode ♦ Small Footprint ♦ 20-Pin TSSOP Package Ordering Information PART INPUT PINVOLTAGE PACKAGE RANGE TEMP RANGE 0°C to +70°C 20 TSSOP 0 to +10V MAX1156BCUP 0°C to +70°C 20 TSSOP 0 to +10V MAX1156AEUP -40°C to +85°C 20 TSSOP 0 to +10V MAX1156BEUP -40°C to +85°C 20 TSSOP 0 to +10V MAX1156ACUP Ordering Information continued at end of data sheet. Applications Typical Operating Circuit Temperature Sensing and Monitoring +5V ANALOG Industrial Process Control I/O Modules +5V DIGITAL 0.1µF 0.1µF Data-Acquisition Systems µP DATA D0–D7 BUS OR D8–D13 DVDD AVDD Precision Instrumentation ANALOG INPUT AIN R/C CS MAX1156 MAX1158 MAX1174 EOC REF REFADJ HBEN Pin Configuration appears at end of data sheet. AutoShutdown is a trademark of Maxim Integrated Products, Inc. HIGH BYTE AGND DGND 0.1µF 10µF LOW BYTE ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX1156/MAX1158/MAX1174 General Description The MAX1156/MAX1158/MAX1174 14-bit, low-power, successive-approximation analog-to-digital converters (ADCs) feature automatic power-down, a factorytrimmed internal clock, and a byte-wide parallel interface. The devices operate from a single +4.75V to +5.25V analog supply and feature a separate digital supply input for direct interface with +2.7V to +5.25V digital logic. The MAX1156 accepts a 0 to +10V analog input voltage range. The MAX1158 accepts a ±10V bipolar analog input voltage range, while the MAX1174 accepts a ±5V bipolar analog input voltage range. All devices consume no more than 26.5mW at a sampling rate of 135ksps when using an external reference, and 31mW when using the internal +4.096V reference. AutoShutdown™ reduces supply current to 0.4mA (typ) at 10ksps. MAX1156/MAX1158/MAX1174 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range ABSOLUTE MAXIMUM RATINGS AVDD to AGND .........................................................-0.3V to +6V DVDD to DGND.........................................................-0.3V to +6V AGND to DGND.....................................................-0.3V to +0.3V AIN to AGND .....................................................-16.5V to +16.5V REF, REFADJ to AGND............................-0.3V to (AVDD + 0.3V) CS, R/C, HBEN to DGND .........................................-0.3V to +6V D_, EOC to DGND ...................................-0.3V to (DVDD + 0.3V) Maximum Continuous Current into any Pin.........................50mA Continuous Power Dissipation (TA = +70°C) 20-Pin TSSOP (derate 10.9mW/°C above +70°C) .......879mW Operating Temperature Range MAX11_ _ _CUP..................................................0°C to +70°C MAX11_ _ _EUP ...............................................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Junction Temperature ......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (AVDD = DVDD = +5V ±5%, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS LSB DC ACCURACY Resolution RES Differential Nonlinearity DNL Integral Nonlinearity INL Transition Noise 14 Bits No missing codes over temperature -1 +1 MAX11_ _A -1 +1 MAX11_ _B -2 +2 RMS noise, external reference 0.32 Internal reference 0.34 Offset Error -10 LSB LSBRMS 0 +10 mV Gain Error 0 ±0.2 %FSR Offset Drift 16 µV/°C Gain Drift ±1 ppm/°C 85 dB AC ACCURACY (fIN = 1kHz, VAIN = full range, 135ksps) Signal-to-Noise Plus Distortion SINAD 81 Signal-to-Noise Ratio SNR 82 Total Harmonic Distortion THD Spurious-Free Dynamic Range SFDR 85 -100 87 dB -86 103 dB dB ANALOG INPUT Input Range VAIN MAX1156 0 +10 MAX1158 -10 +10 MAX1174 Input Resistance RAIN Normal operation 5.3 MAX1156 Shutdown mode 5.3 MAX1174 Shutdown mode 3.0 Normal operation 7.8 Shutdown mode 6.0 MAX1158 2 -5 MAX1156/MAX1174 V +5 6.9 9.2 10 13.0 kΩ _______________________________________________________________________________________ 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range (AVDD = DVDD = +5V ±5%, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MAX1156, 0 ≤ VAIN ≤ +10V Input Current IAIN Input Current Step at Power-Up Input Capacitance IPU MIN TYP MAX -0.1 +2.0 MAX1158, -10V ≤ VAIN ≤ +10V Normal operation -1.8 +1.2 Shutdown mode -1.8 +1.8 MAX1174, -5V ≤ VAIN ≤ +5V Normal operation -1.8 +0.4 Shutdown mode -1.8 +1.8 MAX1158, VAIN = +10V, shutdown mode to operating mode 0.5 0.7 MAX1174, VAIN = +5V, shutdown mode to operating mode 1 1.4 UNITS mA mA CIN 10 pF INTERNAL REFERENCE REF Output Voltage VREF 4.056 REF Output Tempco REF Short-Circuit Current IREF-SC 4.096 4.136 V ±35 ppm/°C ±10 mA EXTERNAL REFERENCE REF and REFADJ Input Voltage Range REFADJ Buffer Disable Threshold REF Input Current IREF REFADJ Input Current IREFADJ 3.8 4.2 V AVDD 0.4 AVDD 0.1 V Normal mode, fSAMPLE = 135ksps Shutdown mode (Note 1) REFADJ = AVDD 60 100 ±0.1 ±10 16 µA µA DIGITAL INPUTS/OUTPUTS Output High Voltage VOH ISOURCE = 0.5mA, DVDD = +2.7V to +5.25V, AVDD = +5.25V Output Low Voltage VOL ISINK = 1.6mA, DVDD = +2.7V to +5.25V, AVDD = +5.25V Input High Voltage VIH Input Low Voltage VIL Input Leakage Current Input Hysteresis DVDD 0.4 V 0.4 0.7 × DVDD Digital input = DVDD or 0V V V -1 0.3 × DVDD V +1 µA VHYST 0.2 V Input Capacitance CIN 15 pF Three-State Output Leakage IOZ Three-State Output Capacitance COZ ±10 15 µA pF _______________________________________________________________________________________ 3 MAX1156/MAX1158/MAX1174 ELECTRICAL CHARACTERISTICS (continued) MAX1156/MAX1158/MAX1174 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = +5V ±5%, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES Analog Supply Voltage AVDD 4.75 5.25 V Digital Supply Voltage DVDD 2.70 5.25 V External reference, 135ksps Analog Supply Current IAVDD Shutdown Supply Current ISHDN Digital Supply Current IDVDD Power-Supply Rejection Internal reference, 135ksps MAX1156 2.9 MAX1158/MAX1174 4 MAX1156 5.3 3.8 MAX1158/MAX1174 mA 5.2 6.2 Shutdown mode (Note 1), digital input = DVDD or 0V 0.5 5 µA Standby mode 3.7 0.75 mA AVDD = DVDD = +4.75V to +5.25V mA 1 LSB TIMING CHARACTERISTICS (Figures 1 and 2) (AVDD = +4.75V to +5.25V ±5%, DVDD = +2.7V to AVDD, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD, CLOAD = 20pF, TA = TMIN to TMAX.) PARAMETER Maximum Sampling Rate SYMBOL CONDITIONS Acquisition Time tACQ Conversion Time tCONV TYP tCSH (Note 2) CS Pulse Width Low tCSL (Note 2) R/C to CS Fall Setup Time tDS R/C to CS Fall Hold Time tDH CS to Output Data Valid tDO EOC Fall to CS Fall tDV CS Rise to EOC Rise tEOC Bus Relinquish Time tBR tDO1 UNITS 135 ksps 4.7 µs µs 40 DVDD = +4.75V to +5.25V 40 DVDD = +2.7V to +5.25V 60 ns ns 0 DVDD = +4.75V to +5.25V 40 DVDD = +2.7V to +5.25V 60 ns ns DVDD = +4.75V to +5.25V 40 DVDD = +2.7V to +5.25V 80 0 40 DVDD = +2.7V to +5.25V 80 DVDD = +4.75V to +5.25V 40 DVDD = +2.7V to +5.25V 80 DVDD = +4.75V to +5.25V 40 DVDD = +2.7V to +5.25V 80 _______________________________________________________________________________________ ns ns DVDD = +4.75V to +5.25V Note 1: Maximum specification is limited by automated test equipment. Note 2: To ensure best performance, finish reading the data and wait tBR before starting a new acquisition. 4 MAX 2 CS Pulse Width High HBEN Transition to Output Data Valid MIN fSAMPLE-MAX ns ns ns 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range MAX1156/58/74 toc02 1.0 1.5 0.6 1.0 0.4 0.5 0 -0.5 -1.0 0.2 0 -0.2 -1.5 -0.6 -2.0 -0.8 2000 4000 6000 8000 10000 12000 14000 16000 0 SHUTDOWN MODE 0.001 VAIN = 0V 0.0001 10 100 3.5 3.0 2.5 2.0 1.5 0 -0.05 -0.10 -0.15 -0.20 40 TEMPERATURE (°C) 60 80 MAX1174 2 0 -2 MAX1158 MAX1156 -4 -8 -10 -20 0 20 40 60 80 -40 -20 0 20 40 60 80 TEMPERATURE (°C) FFT AT 1kHz 0 MAX1156/58/74 toc08 4.136 4.126 4.116 4.106 4.096 4.086 fSAMPLE = 131ksps -20 -40 -60 -80 -100 -120 4.076 -140 4.066 -160 -180 4.056 20 4 0 MAGNITUDE (dB) 0.05 6 -6 -40 INTERNAL REFERENCE (V) MAX1156/58/74 toc07 0.10 80 60 8 0.5 INTERNAL REFERENCE vs. TEMPERATURE 0.15 40 10 1.0 1000 20 MAX1156/58/74 toc06 4.0 GAIN ERROR vs. TEMPERATURE 0 0 OFFSET ERROR vs. TEMPERATURE MAX1156/58/74 toc05 NO CONVERSIONS 4.5 TEMPERATURE (°C) -20 -20 TEMPERATURE (°C) SAMPLE RATE (ksps) 0.20 -40 fSAMPLE = 135ksps SHUTDOWN MODE BETWEEN CONVERSIONS -40 OFFSET ERROR (mV) 0.1 1 4.75V 4.40 2000 4000 6000 8000 10000 12000 14000 16000 5.0 SHUTDOWN SUPPLY CURRENT (µA) SUPPLY CURRENT (mA) MAX1156/58/74 toc04 STANDBY MODE 0.1 4.55 SHUTDOWN CURRENT (AVDD + DVDD) vs. TEMPERATURE 10 0.01 4.60 CODE SUPPLY CURRENT (AVDD + DVDD) vs. SAMPLE RATE 0.01 5.0V 4.65 4.45 CODE 1 4.70 4.50 -1.0 0 5.25V 4.75 -0.4 -2.5 GAIN ERROR (%FSR) 4.80 MAX1156/58/74 toc09 0.8 SUPPLY CURRENT (mA) 2.0 DNL (LSB) INL (LSB) 2.5 SUPPLY CURRENT (AVDD + DVDD) vs. TEMPERATURE DNL vs. CODE MAX1156/58/74 toc01 MAX1156/58/74 toc03 INL vs. CODE -40 -20 0 20 40 TEMPERATURE (°C) 60 80 0 10 20 30 40 50 60 FREQUENCY (kHz) _______________________________________________________________________________________ 5 MAX1156/MAX1158/MAX1174 Typical Operating Characteristics (AVDD = DVDD = +5V, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD, CLOAD = 20pF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Typical Application Circuit) Typical Operating Characteristics (continued) (AVDD = DVDD = +5V, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD, CLOAD = 20pF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Typical Application Circuit) SFDR vs. FREQUENCY 80 70 0 MAX1156/58/74 toc11 MAX1156/58/74 toc10 90 THD vs. FREQUENCY 120 100 -10 -20 -30 SFDR (dB) 50 40 THD (dB) 80 60 60 -40 -50 -60 -70 40 30 MAX1156/58/74 toc12 SINAD vs. FREQUENCY 100 SINAD (dB) MAX1156/MAX1158/MAX1174 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range -80 20 -90 20 10 fSAMPLE = 131ksps fSAMPLE = 131ksps 0 -100 0 1 10 100 fSAMPLE = 131ksps -110 1 FREQUENCY (kHz) 10 100 FREQUENCY (kHz) 10 1 100 FREQUENCY (kHz) Pin Description PIN NAME 1 D4/D12 2 D5/D13 3 D6/0 Three-State Digital Data Output 4 D7/0 Three-State Digital Data Output R/C Read/Convert Input. Power up and put the MAX1156/MAX1158/MAX1174 in acquisition mode by holding R/C low during the first falling edge of CS. During the second falling edge of CS, the level on R/C determines whether the reference and reference buffer power down or remain on after conversion. Set R/C high during the second falling edge of CS to power down the reference and buffer, or set R/C low to leave the reference and buffer powered up. Set R/C high during the third falling edge of CS to put valid data on the bus. 6 EOC End of Conversion. EOC drives low when conversion is complete. 7 AVDD Analog Supply Input. Bypass with a 0.1µF capacitor to AGND. 8 AGND Analog Ground. Primary analog ground (star ground). 5 6 FUNCTION Three-State Digital Data Output Three-State Digital Data Output. D13 is the MSB. 9 AIN 10 AGND Analog Input 11 REFADJ Reference Buffer Output. Bypass REFADJ with a 0.1µF capacitor to AGND for internal reference mode. Connect REFADJ to AVDD to select external reference mode. 12 REF Reference Input/Output. Bypass REF with a 10µF capacitor to AGND for internal reference mode. External reference input when in external reference mode. Analog Ground. Connect pin 10 to pin 8. _______________________________________________________________________________________ 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range PIN NAME FUNCTION 13 HBEN 14 CS 15 DGND Digital Ground 16 DVDD Digital Supply Voltage. Bypass with a 0.1µF capacitor to DGND. 17 D0/D8 Three-State Digital Data Output. D0 is the LSB. 18 D1/D9 Three-State Digital Data Output 19 D2/D10 Three-State Digital Data Output 20 D3/D11 Three-State Digital Data Output High-Byte Enable Input. Used to multiplex the 14-bit conversion result. 1: Most significant byte available on the data bus. 0: Least significant byte available on the data bus. Convert Start. The first falling edge of CS powers up the device and enables acquire mode when R/C is low. The second falling edge of CS starts conversion. The third falling edge of CS loads the result onto the bus when R/C is high. Analog Input DVDD 1mA DO–D13 DO–D13 CLOAD = 20pF CLOAD = 20pF 1mA DGND DGND a) HIGH-Z TO VOH, VOL TO VOH, AND VOH TO HIGH-Z b) HIGH-Z TO VOL, VOH TO VOL, AND VOL TO HIGH-Z Figure 1. Load Circuits Detailed Description Converter Operation The MAX1156/MAX1158/MAX1174 use a successiveapproximation (SAR) conversion technique with an inherent track-and-hold (T/H) stage to convert an analog input into a 14-bit digital output. Parallel outputs provide a high-speed interface to microprocessors (µPs). The Functional Diagram shows a simplified internal architecture of the MAX1156/MAX1158/MAX1174. Figure 3 shows a typical application circuit for the MAX1156/MAX1158/MAX1174. Input Scaler The MAX1156/MAX1158/MAX1174 have an input scaler, which allows conversion of true bipolar input voltages and input voltages greater than the power supply, while operating from a single +5V analog supply. The input scaler attenuates and shifts the analog input to match the input range of the internal DAC. The MAX1156 has a unipolar input voltage range of 0 to +10V. The MAX1158 input voltage range is ±10V while the MAX1174 input voltage range is ±5V. Figure 4 shows the equivalent input circuit of the MAX1156/ MAX1158/MAX1174. This circuit limits the current going into or out of AIN to less than 1.8mA. Track and Hold (T/H) In track mode, the internal hold capacitor acquires the analog signal (see Figure 4). In hold mode, the T/H switches open and the capacitive DAC samples the analog input. During the acquisition, the analog input (AIN) charges capacitor CHOLD. The acquisition ends on the second falling edge of CS. At this instant, the T/H switches open. The retained charge on CHOLD represents a sample of the input. In hold mode, the capacitive DAC adjusts during the remainder of the conversion time to restore node T/H OUT to zero within the limits of 14-bit resolution. Force CS low to put valid data on the bus after conversion is complete. _______________________________________________________________________________________ 7 MAX1156/MAX1158/MAX1174 Pin Description (continued) MAX1156/MAX1158/MAX1174 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range tCSH tCSL CS tACQ REF POWERDOWN CONTROL R/C tDH tDS tEOC tDV EOC tCONV tDO HBEN tBR tDO1 tDO HIGH-Z HIGH-Z D7/D15–D0/D8 HIGH/LOW BYTE VALID HIGH/LOW BYTE VALID Figure 2. MAX1156/MAX1158/MAX1174 Timing Diagram Power-Down Modes Select standby mode or shutdown mode with the R/C bit during the second falling edge of CS (see the Selecting Standby or Shutdown Mode section). The MAX1156/MAX1158/MAX1174 automatically enter either standby mode (reference and buffer on) or shutdown (reference and buffer off) after each conversion, depending on the status of R/C during the second falling edge of CS. Internal Clock The MAX1156/MAX1158/MAX1174 generate an internal conversion clock to free the microprocessor from the burden of running the SAR conversion clock. Total conversion time (tCONV) after entering hold mode (second falling edge of CS) to end of conversion (EOC) falling is 4.7µs (max). Applications Information Starting a Conversion CS and R/C control acquisition and conversion in the MAX1156/MAX1158/MAX1174 (see Figure 2). The first falling edge of CS powers up the device and puts it in acquire mode if R/C is low. The convert start is ignored if R/C is high. The MAX1156/MAX1158/MAX1174 need at least 12ms (CREFADJ = 0.1µF, CREF = 10µF) for the internal reference to wake up and settle before starting the conversion, if powering up from shutdown. 8 +5V ANALOG +5V DIGITAL 0.1µF 0.1µF DVDD AVDD ANALOG INPUT µP DATA D0–D7 BUS OR D8–D13 AIN R/C CS MAX1156 MAX1158 MAX1174 EOC REF REFADJ HBEN HIGH BYTE AGND DGND 0.1µF 10µF LOW BYTE Figure 3. Typical Application Circuit for the MAX1156/MAX1158/ MAX1174 _______________________________________________________________________________________ 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range MAX1156 R2 MAX1158/MAX1174 R1 3.4kΩ 161Ω AIN TRACK S1 CHOLD 30pF R2 R1 3.4kΩ 161Ω TRACK S1 AIN CHOLD 30pF T/H OUT R3 T/H OUT R3 HOLD TRACK HOLD S2 HOLD S3 POWERDOWN TRACK HOLD S2 R2 = 7.85kΩ (MAX1158) OR 3.92kΩ (MAX1156/MAX1174) S1, S2 = T/H SWITCH S3 = POWER-DOWN (MAX1158/MAX1174 ONLY) R3 = 5.45kΩ (MAX1158) OR 17.79kΩ (MAX1156/MAX1174) Figure 4. Equivalent Input Circuit Selecting Standby or Shutdown Mode The MAX1156/MAX1158/MAX1174 have a selectable standby or low-power shutdown mode. In standby mode, the ADC’s internal reference and reference buffer do not power down between conversions, eliminating the need to wait for the reference to power up before performing the next conversion. Shutdown mode powers down the reference and reference buffer after completing a conversion. The reference and reference buffer require a minimum of 12ms (CREFADJ = 0.1µF, CREF = 10µF) to power up and settle from shutdown. The state of R/C at the second falling edge of CS selects which power-down mode the MAX1156/ MAX1158/MAX1174 enter upon conversion completion. Holding R/C low causes the MAX1156/MAX1158/ MAX1174 to enter standby mode. The reference and buffer are left on after the conversion completes. R/C high causes the MAX1156/MAX1158/MAX1174 to enter shutdown mode and power down the reference and buffer after conversion (see Figures 5 and 6). Set the voltage at R/C high during the second falling edge of CS to realize the lowest current operation. Standby Mode While in standby mode, the supply current is less than 3.7mA (typ). The next falling edge of CS with R/C low causes the MAX1156/MAX1158/MAX1174 to exit standby mode and begin acquisition. The reference and reference buffer remain active to allow quick turn-on time. Shutdown Mode In shutdown mode, the reference and reference buffer are shut down between conversions. Shutdown mode reduces supply current to 0.5µA (typ) immediately after the conversion. The next falling edge of CS with R/C low causes the reference and buffer to wake up and enter acquisition mode. To achieve 14-bit accuracy, allow 12ms (CREFADJ = 0.1µF, CREF = 10µF) for the internal reference to wake up. Internal and External Reference Internal Reference The internal reference of the MAX1156/MAX1158/ MAX1174 is internally buffered to provide +4.096V output at REF. Bypass REF to AGND and REFADJ to AGND with 10µF and 0.1µF, respectively. Sink or source current at REFADJ to make fine adjustments to the internal reference. The input impedance of REFADJ is nominally 5kΩ. Use the circuit of Figure 7 to adjust the internal reference to ±1.5%. _______________________________________________________________________________________ 9 MAX1156/MAX1158/MAX1174 REF MAX1156/MAX1158/MAX1174 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range ACQUISITION CONVERSION DATA OUT ACQUISITION CS CS R/C R/C EOC EOC REF AND BUFFER POWER REF AND BUFFER POWER CONVERSION DATA OUT Figure 5. Selecting Standby Mode Figure 6. Selecting Shutdown Mode External Reference An external reference can be placed at either the input (REFADJ) or the output (REF) of the MAX1156/ MAX1158/MAX1174’s internal buffer amplifier. Using the buffered REFADJ input makes buffering the external reference unnecessary. The input impedance of REFADJ is typically 5kΩ. The internal buffer output must be bypassed at REF with a 10µF capacitor. Connect REFADJ to AVDD to disable the internal buffer. Directly drive REF using an external 3.8V to 4.2V reference. During conversion, the external reference must be able to drive 100µA of DC load current and have an output impedance of 10Ω or less. HBEN toggles the output between the high/low byte. The low byte is loaded onto the output bus when HBEN is low and the high byte is on the bus when HBEN is high. The two MSBs of the high byte are always zero. For optimal performance, buffer the reference through an op amp and bypass REF with a 10µF capacitor. Consider the MAX1156/MAX1158/MAX1174’s equivalent input noise (0.32LSB) when choosing a reference. Reading the Conversion Result EOC is provided to flag the microprocessor when a conversion is complete. The falling edge of EOC signals that the data is valid and ready to be output to the bus. D0–D13 are the parallel outputs of the MAX1156/MAX1158/MAX1174. These three-state outputs allow for direct connection to a microcontroller I/O bus. The outputs remain high-impedance during acquisition and conversion. Data is loaded onto the output bus with the third falling edge of CS with R/C high (after tDO). Bringing CS high forces the output bus back to high impedance. The MAX1156/MAX1158/MAX1174 then wait for the next falling edge of CS to start the next conversion cycle (see Figure 2). 10 Transfer Function Figures 8, 9, and 10 show the MAX1156/MAX1158/ MAX1174 output transfer functions. The MAX1158 and MAX1174 outputs are coded in offset binary, while the MAX1156 is coded in standard binary. Input Buffer Most applications require an input buffer amplifier to achieve 14-bit accuracy and prevent loading the source. Switch the channels immediately after acquisition, rather than near the end of or after a conversion, when the input signal is multiplexed. This allows more time for the input buffer amplifier to respond to a large step-change in input signal. The input amplifier must have a high enough slew rate to complete the required output voltage change before the beginning of the acquisition time. Figure 11 shows an example of this circuit using the MAX427. Figures 12a and 12b show how the MAX1158 and MAX1174 analog input current varies depending on whether the chip is operating or powered down. The part is fully powered down between conversions if the voltage at R/C is set high during the second falling edge of CS. The input current abruptly steps to the powered up value at the start of acquisition. This step in the input current can disrupt the ADC input, depending on the driving circuit’s output impedance at high frequencies. If the driving circuit cannot fully settle by ______________________________________________________________________________________ 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range FULL-SCALE TRANSITION 11 1111 1111 1111 MAX1156 MAX1158 MAX1174 +5V MAX1156/MAX1158/MAX1174 MAX1156 INPUT RANGE = 0 TO +10V OUTPUT CODE 11 1111 1111 1110 11 1111 1111 1101 68kΩ 100kΩ REFADJ FULL-SCALE RANGE (FSR) = +10V 0.1µF 150kΩ 1LSB = 00 0000 0000 0011 FSR x VREF 16384 x 4.096 00 0000 0000 0010 00 0000 0000 0001 00 0000 0000 0000 0 1 2 3 16383 16382 16384 INPUT VOLTAGE (LSB) Figure 7. MAX1156/MAX1158/MAX1174 Reference Adjust Circuit OUTPUT CODE 11 1111 1111 1111 MAX1158 INPUT RANGE = -10V TO +10V FULL-SCALE TRANSITION Figure 8. MAX1156 Transfer Function OUTPUT CODE 11 1111 1111 1111 11 1111 1111 1110 11 1111 1111 1110 11 1111 1111 1101 11 1111 1111 1101 10 0000 0000 0001 10 0000 0000 0000 FULL-SCALE RANGE (FSR) = +20V 01 1111 1111 1111 1LSB = 00 0000 0000 0011 00 0000 0000 0010 FSR x VREF 16384 x 4.096 MAX1174 INPUT RANGE = -5V TO +5V FULL-SCALE TRANSITION 10 0000 0000 0001 10 0000 0000 0000 01 1111 1111 1111 00 0000 0000 0011 00 0000 0000 0010 FULL-SCALE RANGE (FSR) = +10V 1LSB = FSR x VREF 16384 x 4.096 00 0000 0000 0001 00 0000 0000 0001 00 0000 0000 0000 0 +8190 +8192 -8192 -8190 -1 +1 -8191 -8189 +8191 INPUT VOLTAGE (LSB) 00 0000 0000 0000 0 +8190 +8192 -8192 -8190 -1 +1 -8191 -8189 +8191 INPUT VOLTAGE (LSB) Figure 9. MAX1158 Transfer Function Figure 10. MAX1174 Transfer Function the end of acquisition, the accuracy of the system can be compromised. To avoid this situation, increase the acquisition time, use a driving circuit that can settle within tACQ, or leave the MAX1158/MAX1174 powered up by setting the voltage at R/C low during the second falling edge of CS. ADC package. Use separate analog and digital ground planes with only one point connecting the two ground systems (analog and digital) as close to the device as possible. Route digital signals far away from sensitive analog and reference inputs. If digital lines must cross analog lines, do so at right angles to minimize coupling digital noise onto the analog lines. If the analog and digital sections share the same supply, isolate the digital and analog Layout, Grounding, and Bypassing For best performance, use printed circuit boards. Do not run analog and digital lines parallel to each other, and do not layout digital signal paths underneath the ______________________________________________________________________________________ 11 MAX1174 ANALOG INPUT CURRENT vs. ANALOG INPUT VOLTAGE REF 1.5 MAX1156 MAX1158 MAX1174 MAX427 * AIN ANALOG INPUT CURRENT (mA) ANALOG INPUT ** 1.0 0.5 SHUTDOWN MODE 0 -0.5 STANDBY MODE -1.0 *MAX1156 ONLY. **MAX1158/MAX1174 ONLY. -1.5 -5.0 -2.5 0 2.5 5.0 ANALOG INPUT VOLTAGE (V) Figure 11. MAX1156/MAX1158/MAX1174 Fast-Settling Input Buffer Figure 12a. MAX1174 Analog Input Current supply by connecting them with a low value (10Ω) resistor or ferrite bead. The ADC is sensitive to high-frequency noise on the AV DD supply. Bypass AV DD to AGND with a 0.1µF capacitor in parallel with a 1µF to 10µF low-ESR capacitor with the smallest capacitor closest to the device. Keep capacitor leads short to minimize stray inductance. Definitions Integral Nonlinearity Integral nonlinearity (INL) is the deviation of the values on an actual transfer function from a straight line. This straight line can be either a best-straight-line fit or a line drawn between the endpoints of the transfer function, once offset and gain errors have been nullified. The static linearity parameters for the MAX1156/MAX1158/ MAX1174 are measured using the endpoint method. Differential Nonlinearity Differential nonlinearity (DNL) is the difference between an actual step-width and the ideal value of 1LSB. A DNL error specification of 1LSB guarantees no missing codes and a monotonic transfer function. 12 MAX1158 ANALOG INPUT CURRENT vs. ANALOG INPUT VOLTAGE 1.5 ANALOG INPUT CURRENT (mA) MAX1156/MAX1158/MAX1174 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range 1.0 0.5 SHUTDOWN MODE 0 STANDBY MODE -0.5 -1.0 -1.5 -10 -5 0 5 ANALOG INPUT VOLTAGE (V) Figure 12b. MAX1158 Analog Input Current ______________________________________________________________________________________ 10 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range SNR = (6.02 × N + 1.76) dB where N = 14 bits. In reality, there are other noise sources besides quantization noise; thermal noise, reference noise, clock jitter, etc. SNR is computed by taking the ratio of the RMS signal to the RMS noise, which includes all spectral components minus the fundamental, the first five harmonics, and the DC offset. Signal-to-Noise Plus Distortion Signal-to-noise plus distortion (SINAD) is the ratio of the fundamental input frequency’s RMS amplitude to the RMS equivalent of all the other ADC output signals.   SignalRMS SINAD(dB) = 20 × log    (Noise + Distortion)RMS  zation noise only. With an input range equal to the fullscale range of the ADC, calculate the effective number of bits as follows: ENOB = SINAD −1.76 6.02 Total Harmonic Distortion Total harmonic distortion (THD) is the ratio of the RMS sum of the first five harmonics of the input signal to the fundamental itself. This is expressed as:  V22 + V32 + V4 2 + V52 THD = 20 × log  V1      where V1 is the fundamental amplitude and V2 through V5 are the 2nd- through 5th-order harmonics. Spurious-Free Dynamic Range Spurious-free dynamic range (SFDR) is the ratio of the RMS amplitude of the fundamental (maximum signal component) to the RMS value of the next largest frequency component. Effective Number of Bits Effective number of bits (ENOB) indicates the global accuracy of an ADC at a specific input frequency and sampling rate. An ideal ADC’s error consists of quanti- ______________________________________________________________________________________ 13 MAX1156/MAX1158/MAX1174 Signal-to-Noise Ratio For a waveform perfectly reconstructed from digital samples, signal-to-noise ratio (SNR) is the ratio of the full-scale analog input (RMS value) to the RMS quantization error (residual error). The ideal, theoretical minimum analog-to-digital noise is caused by quantization noise error only and results directly from the ADC’s resolution (N bits): 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range MAX1156/MAX1158/MAX1174 Functional Diagram REFADJ HBEN AVDD AGND DVDD DGND 5kΩ REFERENCE OUTPUT REGISTERS 8 BITS 8 BITS D0–D7 OR D8–D13 REF AIN INPUT SCALER CAPACITIVE DAC MAX1156 MAX1158 MAX1174 AGND SUCCESSIVEAPPROXIMATION REGISTER AND CONTROL LOGIC CLOCK CS EOC R/C Pin Configuration Ordering Information (continued) TOP VIEW D4/D12 1 20 D3/D11 D5/D13 2 19 D2/D10 D6/0 3 18 D1/D9 D7/0 4 R/C 5 EOC 6 17 D0/D8 MAX1156 MAX1158 MAX1174 16 DVDD 15 DGND AVDD 7 14 CS AGND 8 13 HBEN AIN 9 12 REF AGND 10 PART TEMP RANGE PINPACKAGE MAX1158ACUP 0°C to +70°C 20 TSSOP ±10V MAX1158BCUP 0°C to +70°C 20 TSSOP ±10V MAX1158AEUP -40°C to +85°C 20 TSSOP ±10V MAX1158BEUP -40°C to +85°C 20 TSSOP ±10V MAX1174ACUP 0°C to +70°C 20 TSSOP ±5V MAX1174BCUP 0°C to +70°C 20 TSSOP ±5V MAX1174AEUP -40°C to +85°C 20 TSSOP ±5V MAX1174BEUP -40°C to +85°C 20 TSSOP ±5V 11 REFADJ TSSOP Chip Information TRANSISTOR COUNT: 15,383 PROCESS: BiCMOS 14 INPUT VOLTAGE RANGE ______________________________________________________________________________________ 14-Bit, 135ksps, Single-Supply ADCs with Bipolar Analog Input Range TSSOP4.40mm.EPS Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 15 © 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products. MAX1156/MAX1158/MAX1174 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.)
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