19-2957; Rev 0; 8/03
16-Bit, 135ksps, Single-Supply ADC
with 0 to 10V Input Range
The MAX1177 is available in a 20-pin TSSOP package
and is fully specified over the -40°C to +85°C extended
temperature range and the 0°C to +70°C commercial
temperature range.
Features
♦ Byte-Wide Parallel Interface
♦ Analog Input Voltage Range: 0 to +10V
♦ Single +4.75V to +5.25V Analog Supply Voltage
♦ Interfaces with +2.7V to +5.25V Digital Logic
♦ ±3 LSB INL
♦ ±1 LSB DNL
♦ Low Supply Current (max)
2.9mA (External Reference)
3.8mA (Internal Reference)
5µA AutoShutdown Mode
♦ Small Footprint
♦ 20-Pin TSSOP Package
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX1177ACUP
0°C to +70°C
20 TSSOP
MAX1177BCUP
0°C to +70°C
20 TSSOP
MAX1177CCUP
0°C to +70°C
20 TSSOP
MAX1177AEUP
-40°C to +85°C
20 TSSOP
MAX1177BEUP
-40°C to +85°C
20 TSSOP
MAX1177CEUP
-40°C to +85°C
20 TSSOP
Applications
Typical Operating Circuit
Temperature Sensing and Monitoring
Industrial Process Control
+5V ANALOG
I/O Modules
Data-Acquisition Systems
+5V DIGITAL
0.1µF
0.1µF
Precision Instrumentation
µP DATA
D0–D7 BUS
OR
D8–D15
DVDD
AVDD
ANALOG INPUT
AIN
MAX1177
EOC
R/C
REF
CS
REFADJ
HBEN
Pin Configuration and Functional Diagram appear at end of
data sheet.
HIGH
BYTE
AGND DGND
0.1µF
10µF
LOW
BYTE
AutoShutdown is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX1177
General Description
The MAX1177 is a 16-bit, low-power, successiveapproximation analog-to-digital converter (ADC) featuring automatic power-down, a factory-trimmed internal
clock, and a byte-wide parallel interface. The device
operates from a single +4.75V to +5.25V analog supply
and features a separate digital supply input for direct
interface with +2.7V to +5.25V digital logic.
The MAX1177 accepts an analog input voltage range
from 0 to +10V. It consumes no more than 26.5mW at a
sampling rate of 135ksps when using an external reference, and 31mW when using the internal +4.096V reference. AutoShutdown™ reduces supply current to
0.4mA at 10ksps.
The MAX1177 is ideal for high-performance, batterypowered, data-acquisition applications. Excellent AC
performance (THD = -100dB) and DC accuracy (±3
LSB INL) make this device ideal for industrial process
control, instrumentation, and medical applications.
MAX1177
16-Bit, 135ksps, Single-Supply ADC
with to 10V Input Range
ABSOLUTE MAXIMUM RATINGS
AVDD to AGND .........................................................-0.3V to +6V
DVDD to DGND.........................................................-0.3V to +6V
AGND to DGND.....................................................-0.3V to +0.3V
AIN to AGND .....................................................-16.5V to +16.5V
REF, REFADJ to AGND............................-0.3V to (AVDD + 0.3V)
CS, R/C, HBEN to DGND .........................................-0.3V to +6V
D_, EOC to DGND ...................................-0.3V to (DVDD + 0.3V)
Maximum Continuous Current into Any Pin ........................50mA
Continuous Power Dissipation (TA = +70°C)
TSSOP (derate 10.9mW/°C above +70°C) ..................879mW
Operating Temperature Ranges
MAX1177_CUP ...................................................0°C to +70°C
MAX1177_EUP ................................................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AVDD = DVDD = +5V ±5%, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD, TA = TMIN to TMAX,
unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
Differential Nonlinearity
RES
DNL
16
No missing codes
over temperature
-1
+1
MAX1177B
-1.0
+1.5
MAX1177C
Integral Nonlinearity
INL
Transition Noise
Bits
MAX1177A
-1
+2
MAX1177A
-3
+3
MAX1177B
-3
+3
MAX1177C
-4
+4
RMS noise, external reference
0.6
Internal reference
0.75
Offset Error
-10
Gain Error
LSB
LSB
LSBRMS
0
+10
mV
0
±0.2
%FSR
Offset Drift
16
µV/°C
Gain Drift
±1
ppm/°C
dB
AC ACCURACY (fIN = 1kHz, VAIN = full range, 135ksps)
Signal-to-Noise Plus Distortion
SINAD
85
90
Signal-to-Noise Ratio
SNR
86
91
Total Harmonic Distortion
THD
Spurious-Free Dynamic Range
SFDR
-100
92
dB
-92
103
dB
dB
ANALOG INPUT
Input Range
VAIN
Input Resistance
RAIN
Input Current
IAIN
Input Capacitance
CIN
2
0
Normal operation
5.3
Shutdown mode
5.3
0 ≤ VAIN ≤ +10V
-0.1
10
6.9
9.2
+2.0
10
_______________________________________________________________________________________
V
kΩ
mA
pF
16-Bit, 135ksps, Single-Supply ADC
with 0 to 10V Input Range
(AVDD = DVDD = +5V ±5%, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD, TA = TMIN to TMAX,
unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
4.056
4.096
4.136
UNITS
INTERNAL REFERENCE
REF Output Voltage
VREF
REF Output Tempco
REF Short-Circuit Current
IREF-SC
V
±35
ppm/°C
±10
mA
EXTERNAL REFERENCE
REF and REFADJ Input-Voltage
Range
REFADJ Buffer-Disable Threshold
REF Input Current
IREF
REFADJ Input Current
IREFADJ
3.8
4.2
V
AVDD 0.4
AVDD 0.1
V
Normal mode, fSAMPLE = 135ksps
Shutdown mode (Note 1)
REFADJ = AVDD
60
100
±0.1
±10
16
µA
µA
DIGITAL INPUTS/OUTPUTS
Output High Voltage
VOH
ISOURCE = 0.5mA, DVDD = +2.7V to +5.25V,
AVDD = +5.25V
Output Low Voltage
VOL
ISINK = 1.6mA, DVDD = +2.7V to +5.25V,
AVDD = +5.25V
Input High Voltage
VIH
Input Low Voltage
VIL
Input Leakage Current
Input Hysteresis
DVDD 0.4
V
0.4
0.7 ×
DVDD
Digital input = DVDD or 0V
V
V
-1
0.3 ×
DVDD
V
+1
µA
VHYST
0.2
V
Input Capacitance
CIN
15
pF
Tri-State Output Leakage
IOZ
Tri-State Output Capacitance
COZ
±10
15
µA
pF
POWER SUPPLIES
Analog Supply Voltage
AVDD
Digital Supply Voltage
DVDD
Analog Supply Current
IAVDD
Shutdown Supply Current
ISHDN
Digital Supply Current
IDVDD
Power-Supply Rejection
4.75
5.25
V
2.70
5.25
V
External reference, 135ksps
2.9
Internal reference, 135ksps
3.8
Shutdown mode (Note 1), digital input =
DVDD or 0V
0.5
Standby mode
3.7
5
3.5
µA
mA
0.75
AVDD = DVDD = 4.75V to 5.25V
mA
mA
LSB
_______________________________________________________________________________________
3
MAX1177
ELECTRICAL CHARACTERISTICS (continued)
TIMING CHARACTERISTICS (Figures 1 and 2)
(AVDD = +4.75V to +5.25V, DVDD = +2.7V to AVDD, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD,
CLOAD = 20pF, TA = TMIN to TMAX.)
PARAMETER
SYMBOL
Maximum Sampling Rate
CONDITIONS
MIN
TYP
fSAMPLE-MAX
Acquisition Time
tACQ
Conversion Time
tCONV
CS Pulse-Width High
tCSL
R/C to CS Fall Setup Time
tDS
R/C to CS Fall Hold Time
tDH
CS to Output Data Valid
tDO
EOC Fall to CS Fall
tDV
CS Rise to EOC Rise
tEOC
Bus Relinquish Time
tBR
HBEN Transition to Output Data
Valid
MAX
UNITS
135
ksps
2
µs
4.7
tCSH
CS Pulse-Width Low (Note 2)
(Note 2)
40
DVDD = 4.75V to 5.25V
40
DVDD = 2.7V to 5.25V
60
DVDD = 4.75V to 5.25V
40
DVDD = 2.7V to 5.25V
60
µs
ns
ns
0
ns
ns
DVDD = 4.75V to 5.25V
40
DVDD = 2.7V to 5.25V
80
ns
0
tDO1
ns
DVDD = 4.75V to 5.25V
40
DVDD = 2.7V to 5.25V
80
DVDD = 4.75V to 5.25V
40
DVDD = 2.7V to 5.25V
80
DVDD = 4.75V to 5.25V
40
DVDD = 2.7V to 5.25V
80
ns
ns
ns
Note 1: Maximum specification is limited by automated test equipment.
Note 2: To ensure best performance, finish reading the data and wait tBR before starting a new acquisition.
Typical Operating Characteristics
(Typical Operating Circuit, AVDD = DVDD = +5V, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD,
CLOAD = 20pF. Typical values are at TA = +25°C, unless otherwise noted.)
SUPPLY CURRENT (AVDD + DVDD)
vs. TEMPERATURE
DNL vs. CODE
2.5
MAX1177 toc01
2
2.25
5.25V
2.0
2.20
1.5
SUPPLY CURRENT (mA)
3
MAX1177 toc02
1.0
DNL (LSB)
1
0
-1
0.5
0
-0.5
-1.0
-1.5
-2
2.15
5.0V
2.10
2.05
2.00
-2.0
8192
24,576
40,960
CODE
4
4.75V
-2.5
-3
57,344
MAX1177 toc03
INL vs. CODE
INL (LSB)
MAX1177
16-Bit, 135ksps, Single-Supply ADC
with to 10V Input Range
0 10,000 20,000 30,000 40,000 50,000 60,000
CODE
fSAMPLE = 135ksps
SHUTDOWN MODE
BETWEEN CONVERSIONS
1.95
-40
-20
0
20
40
TEMPERATURE (°C)
_______________________________________________________________________________________
60
80
16-Bit, 135ksps, Single-Supply ADC
with 0 to 10V Input Range
SHUTDOWN CURRENT (AVDD + DVDD)
vs. TEMPERATURE
0.001
3.5
3.0
2.5
2.0
1.5
1
10
100
-40
20
40
60
-0.05
0
20
40
60
4.086
-60
-80
-100
-120
-160
-180
-40
-20
0
20
40
60
80
0
TEMPERATURE (°C)
SINAD vs. FREQUENCY
80
100
20
30
40
50
60
THD vs. FREQUENCY
0
MAX1177 toc11
MAX1177 toc10
120
10
FREQUENCY (kHz)
SFDR vs. FREQUENCY
90
80
-140
TEMPERATURE (°C)
100
60
fSAMPLE = 131ksps
-20
4.076
80
40
-40
4.096
4.056
20
FFT AT 1kHz
4.106
-0.20
0
0
4.116
4.066
-20
TEMPERATURE (°C)
4.126
-0.15
-20
-40
80
4.136
MAX1177 toc07
0
-0.10
-10
-20
-30
70
60
50
40
THD (dB)
80
SFDR (dB)
SINAD (dB)
0
INTERNAL REFERENCE
vs. TEMPERATURE
0.05
-40
-20
GAIN ERROR vs. TEMPERATURE
INTERNAL REFERENCE (V)
GAIN ERROR (%FSR)
-8
-10
TEMPERATURE (°C)
0.10
-4
0
1000
0.15
0
-2
-6
SAMPLE RATE (ksps)
0.20
2
MAX1177 toc12
0.1
4
0.5
MAGNITUDE (dB)
0.01
6
1.0
0.0001
MAX1177 toc06
4.0
8
MAX1177 toc09
SHUTDOWN MODE
0.01
NO CONVERSIONS
4.5
OFFSET ERROR (mV)
STANDBY MODE
0.1
OFFSET ERROR vs. TEMPERATURE
10
MAX1177 toc08
SUPPLY CURRENT (mA)
1
5.0
SHUTDOWN SUPPLY CURRENT (µA)
MAX1177 toc04
10
MAX1177 toc05
SUPPLY CURRENT (AVDD + DVDD)
vs. SAMPLE RATE
60
-50
-60
-70
40
30
-40
-80
20
-90
20
10
fSAMPLE = 131ksps
fSAMPLE = 131ksps
0
-100
0
1
10
FREQUENCY (kHz)
100
fSAMPLE = 131ksps
-110
1
10
FREQUENCY (kHz)
100
1
10
100
FREQUENCY (kHz)
_______________________________________________________________________________________
5
MAX1177
Typical Operating Characteristics (continued)
(Typical Operating Circuit, AVDD = DVDD = +5V, external reference = +4.096V, CREF = 10µF, CREFADJ = 0.1µF, VREFADJ = AVDD,
CLOAD = 20pF. Typical values are at TA = +25°C, unless otherwise noted.)
16-Bit, 135ksps, Single-Supply ADC
with to 10V Input Range
MAX1177
Pin Description
PIN
NAME
1
D4/D12
Tri-State Digital-Data Output
2
D5/D13
Tri-State Digital-Data Output
3
D6/D14
Tri-State Digital-Data Output
4
D7/D15
Tri-State Digital-Data Output. D15 is the MSB.
R/C
Read/Convert Input. Power up and put the device in acquisition mode by holding R/C low during the
first falling edge of CS. During the second falling edge of CS, the level on R/C determines whether the
reference and reference buffer power down or remain on after conversion. Set R/C high during the
second falling edge of CS to power down the reference and buffer, or set R/C low to leave the
reference and buffer powered up. Set R/C high during the third falling edge of CS to put valid data on
the bus.
6
EOC
End of Conversion. EOC drives low when conversion is complete.
7
AVDD
Analog Supply Input. Bypass with a 0.1µF capacitor to AGND.
8
AGND
Analog Ground. Primary analog ground (star ground).
5
6
FUNCTION
9
AIN
10
AGND
Analog Input
11
REFADJ
Reference Buffer Output. Bypass REFADJ with a 0.1µF capacitor to AGND for internal reference
mode. Connect REFADJ to AVDD to select external reference mode.
12
REF
Reference Input/Output. Bypass REF with a 10µF capacitor to AGND for internal reference mode.
External reference input when in external reference mode.
13
HBEN
14
CS
15
DGND
Digital Ground
16
DVDD
Digital Supply Voltage. Bypass with a 0.1µF capacitor to DGND.
17
D0/D8
Tri-State Digital-Data Output. D0 is the LSB.
Analog Ground. Connect pin 10 to pin 8.
High-Byte Enable Input. Used to multiplex the 16-bit conversion result.
1: MSB available on the data bus.
0: LSB available on the data bus.
Convert Start. The first falling edge of CS powers up the device and enables acquire mode when R/C
is low. The second falling edge of CS starts the conversion. The third falling edge of CS loads the
result onto the bus when R/C is high.
18
D1/D9
Tri-State Digital-Data Output
19
D2/D10
Tri-State Digital-Data Output
20
D3/D11
Tri-State Digital-Data Output
_______________________________________________________________________________________
16-Bit, 135ksps, Single-Supply ADC
with 0 to 10V Input Range
Converter Operation
The MAX1177 uses a successive-approximation (SAR)
conversion technique with an inherent track-and-hold
(T/H) stage to convert an analog input into a 16-bit digital
output. Parallel outputs provide a high-speed interface to
microprocessors (µPs). The Functional Diagram shows a
simplified internal architecture of the MAX1177. Figure 3
shows a typical operating circuit for the MAX1177.
1mA
DO–D15
CLOAD = 20pF
CLOAD = 20pF
1mA
DGND
DGND
a) HIGH-Z TO VOH,
VOL TO VOH, AND
VOH TO HIGH-Z
Input Scaler
The MAX1177 has an input scaler, which allows conversion of input voltages ranging from 0 to 10V, while operating from a single +5V analog supply. The input scaler
attenuates and shifts the analog input to match the input
range of the internal digital-to-analog converter (DAC).
Figure 4 shows the equivalent input circuit of the
MAX1177. This circuit limits the current going into AIN to
less than 2mA.
Track and Hold (T/H)
In track mode, the internal hold capacitor acquires the
analog signal (Figure 4). In hold mode, the T/H switches
open and the capacitive DAC samples the analog input.
During the acquisition, the analog input (AIN) charges
capacitor CHOLD. The acquisition ends on the second
falling edge of CS. At this instant, the T/H switches
open. The retained charge on CHOLD represents a sample of the input. In hold mode, the capacitive DAC
adjusts during the remainder of the conversion time to
restore node T/H OUT to zero within the limits of 16-bit
resolution. Force CS low to put valid data on the bus
after conversion is complete.
DVDD
DO–D15
Analog Input
b) HIGH-Z TO VOL,
VOH TO VOL, AND
VOL TO HIGH-Z
Figure 1. Load Circuits
tCSH
tCSL
CS
tACQ
REF POWERDOWN CONTROL
R/C
tDH
tDS
tEOC
tDV
EOC
tCONV
tDO
HBEN
HIGH-Z
tDO
tDO1
tBR
HIGH-Z
D7/D15–D0/D8
HIGH/LOW
BYTE VALID
HIGH/LOW
BYTE VALID
Figure 2. MAX1177 Timing Diagram
_______________________________________________________________________________________
7
MAX1177
Detailed Description
MAX1177
16-Bit, 135ksps, Single-Supply ADC
with to 10V Input Range
Power-Down Modes
Select standby mode or shutdown mode with the R/C
bit during the second falling edge of CS (see the
Selecting Standby or Shutdown Mode section). The
MAX1177 automatically enters either standby mode
(reference and buffer on) or shutdown (reference and
buffer off) after each conversion, depending on the status of R/C during the second falling edge of CS.
+5V ANALOG
0.1µF
0.1µF
DVDD
AVDD
Internal Clock
The MAX1177 generates an internal conversion clock to
free the µP from the burden of running the SAR conversion clock. Total conversion time (tCONV) after entering
hold mode (second falling edge of CS) to end-of-conversion (EOC) falling is 4.7µs (max).
+5V DIGITAL
ANALOG INPUT
µP DATA
D0–D7 BUS
OR
D8–D15
AIN
MAX1177
EOC
Applications Information
R/C
Starting a Conversion
CS and R/C control acquisition and conversion in the
MAX1177 (Figure 2). The first falling edge of CS powers
up the device and puts it in acquire mode if R/C is low.
The convert start is ignored if R/C is high. The device
needs at least 12ms for the internal reference to wake
up and settle before starting the conversion (CREFADJ
= 0.1µF, CREF = 10µF), if powering up from shutdown.
Selecting Standby or Shutdown Mode
The MAX1177 has a selectable standby or low-power
shutdown mode. In standby mode, the ADC’s internal
reference and reference buffer do not power down
between conversions, eliminating the need to wait for
the reference to power up before performing the next
conversion. Shutdown mode powers down the reference and reference buffer after completing a conversion. The reference and reference buffer require a
minimum of 12ms to power up and settle from shutdown (CREFADJ = 0.1µF, CREF = 10µF).
The state of R/C at the second falling edge of CS
selects which power-down mode the MAX1177 enters
upon conversion completion. Holding R/C low causes
the device to enter standby mode. The reference and
buffer are left on after the conversion completes. R/C
high causes the MAX1177 to enter shutdown mode and
power-down the reference and buffer after conversion
(Figures 5 and 6). Set the voltage at R/C high during
the second falling edge of CS to realize the lowest current operation.
8
REF
CS
REFADJ
HBEN
HIGH
BYTE
0.1µF
10µF
AGND DGND
LOW
BYTE
Figure 3. Typical Operating Circuit for the MAX1177
MAX1177
R2
3.92kΩ
R1
3.4kΩ
161Ω
AIN
TRACK
S1
CHOLD
30pF
T/H OUT
R3
17.79kΩ
HOLD
TRACK
HOLD
S2
S1, S2 = T/H SWITCH
R2 = 3.92kΩ
R3 = 17.79kΩ
Figure 4. Equivalent Input Circuit
_______________________________________________________________________________________
16-Bit, 135ksps, Single-Supply ADC
with 0 to 10V Input Range
CONVERSION
DATA
OUT
ACQUISITION
CS
CS
R/C
R/C
EOC
EOC
REF AND
BUFFER
POWER
REF AND
BUFFER
POWER
MAX1177
ACQUISITION
DATA
OUT
CONVERSION
Figure 6. Selecting Shutdown Mode
Figure 5. Selecting Standby Mode
Standby Mode
While in standby mode, the supply current is less than
3.7mA (typ). The next falling edge of CS with R/C low
causes the MAX1177 to exit standby mode and begin
acquisition. The reference and reference buffer remain
active to allow quick turn-on time.
Shutdown Mode
In shutdown mode, the reference and reference buffer
are shut down between conversions. Shutdown mode
reduces supply current to 0.5µA (typ) immediately after
the conversion. The next falling edge of CS with R/C
low causes the reference and buffer to wake up and
enter acquisition mode. To achieve 16-bit accuracy,
allow 12ms for the internal reference to wake up
(CREFADJ = 0.1µF, CREF = 10µF).
Internal and External Reference
Internal Reference
The internal reference of the MAX1177 is internally
buffered to provide +4.096V output at REF. Bypass
REF to AGND and REFADJ to AGND with 10µF and
0.1µF, respectively. Sink or source current at REFADJ
to make fine adjustments to the internal reference. The
input impedance of REFADJ is nominally 5kΩ. Use the
circuit in Figure 7 to adjust the internal reference to
±1.5%.
External Reference
An external reference can be placed at either the input
(REFADJ) or the output (REF) of the MAX1177’s internal
buffer amplifier. Using the buffered REFADJ input
+5V
MAX1177
68kΩ
100kΩ
REFADJ
150kΩ
0.1µF
Figure 7. MAX1177 Reference Adjust Circuit
makes buffering the external reference unnecessary.
The input impedance of REFADJ is typically 5kΩ. The
internal buffer output must be bypassed at REF with a
10µF capacitor.
Connect REFADJ to AVDD to disable the internal buffer.
Directly drive REF using an external 3.8V to 4.2V reference. During conversion, the external reference must
be able to drive 100µA of DC load current and have an
output impedance of 10Ω or less.
For optimal performance, buffer the reference through
an op amp and bypass REF with a 10µF capacitor.
Consider the MAX1177’s equivalent input noise (0.6
LSB) when choosing a reference.
_______________________________________________________________________________________
9
MAX1177
16-Bit, 135ksps, Single-Supply ADC
with to 10V Input Range
INPUT RANGE = 0V TO +10V
OUTPUT CODE
FULL-SCALE
TRANSITION
1111 1111 1111 1111
1111 1111 1111 1110
1111 1111 1111 1101
MAX1177
AIN
ANALOG
INPUT
FULL-SCALE RANGE (FSR) = +10V
0000 0000 0000 0011
1 LSB =
0000 0000 0000 0010
MAX427
FSR x VREF
65536 x 4.096
0000 0000 0000 0001
0000 0000 0000 0000
0
1
2
3
65,535
65,534 65,536
INPUT VOLTAGE (LSB)
Figure 8. MAX1177 Transfer Function
Figure 9. MAX1177 Fast-Settling Input Buffer
Reading the Conversion Result
EOC is provided to flag the µP when a conversion is
complete. The falling edge of EOC signals that the data is
valid and ready to be output to the bus. D0–D15 are the
parallel outputs of the MAX1177. These tri-state outputs
allow for direct connection to a microcontroller I/O bus.
The outputs remain high impedance during acquisition
and conversion. Data is loaded onto the output bus with
the third falling edge of CS with R/C high (after tDO).
Bringing CS high forces the output bus back to high
impedance. The MAX1177 then waits for the next falling
edge of CS to start the next conversion cycle (Figure 2).
HBEN toggles the output between the high/low byte. The
low byte is loaded onto the output bus when HBEN is
low, and the high byte is on the bus when HBEN is high.
Transfer Function
Figure 8 shows the MAX1177 output transfer function.
The output is coded in standard binary.
Input Buffer
Most applications require an input buffer amplifier to
achieve 16-bit accuracy and prevent loading the
source. When the input signal is multiplexed, switch the
channels immediately after acquisition, rather than near
the end of, or after, a conversion. This allows more time
for the input buffer amplifier to respond to a large step
10
change in input signal. The input amplifier must have a
high enough slew rate to complete the required output
voltage change before the beginning of the acquisition
time. Figure 9 shows an example of this circuit using
the MAX427.
Layout, Grounding, and Bypassing
For best performance, use printed circuit boards. Do
not run analog and digital lines parallel to each other,
and do not lay out digital signal paths underneath the
ADC package. Use separate analog and digital ground
planes with only one point connecting the two ground
systems (analog and digital) as close to the device as
possible.
Route digital signals far away from sensitive analog and
reference inputs. If digital lines must cross analog lines,
do so at right angles to minimize coupling digital noise
onto the analog lines. If the analog and digital sections
share the same supply, isolate the digital and analog
supply by connecting them with a low-value (10Ω)
resistor or ferrite bead.
The ADC is sensitive to high-frequency noise on the
AV DD supply. Bypass AV DD to AGND with a 0.1µF
capacitor in parallel with a 1µF to 10µF low-ESR capacitor with the smallest capacitor closest to the device.
Keep capacitor leads short to minimize stray inductance.
______________________________________________________________________________________
16-Bit, 135ksps, Single-Supply ADC
with 0 to 10V Input Range
Integral Nonlinearity
Integral nonlinearity (INL) is the deviation of the values
on an actual transfer function from a straight line. This
straight line can be either a best-straight-line fit or a line
drawn between the end points of the transfer function,
once offset and gain errors have been nullified. The
static linearity parameters for the MAX1177 are measured using the end-point method.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between
an actual step width and the ideal value of 1 LSB. A
DNL error specification of 1 LSB guarantees no missing
codes and a monotonic transfer function.
Signal-to-Noise Ratio
For a waveform perfectly reconstructed from digital
samples, signal-to-noise ratio (SNR) is the ratio of the
full-scale analog input (RMS value) to the RMS quantization error (residual error). The ideal, theoretical minimum analog-to-digital noise is caused by quantization
noise error only and results directly from the ADC’s resolution (N bits):
SNR = (6.02 × N + 1.76)dB
where N = 16 bits.
In reality, there are other noise sources besides quantization noise: thermal noise, reference noise, clock jitter,
etc. The SNR is computed by taking the ratio of the
RMS signal to the RMS noise, which includes all spectral components minus the fundamental, the first five
harmonics, and the DC offset.
Signal-to-Noise Plus Distortion
Signal-to-noise plus distortion (SINAD) is the ratio of the
fundamental input frequency’s RMS amplitude to the
RMS equivalent of all the other ADC output signals:
SignalRMS
SINAD(dB) = 20 × log
(Noise + Distortion)RMS
Effective Number of Bits
Effective number of bits (ENOB) indicates the global
accuracy of an ADC at a specific input frequency and
sampling rate. An ideal ADC error consists of quantization noise only. With an input range equal to the fullscale range of the ADC, calculate the ENOB as follows:
ENOB =
SINAD −1.76
6.02
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the RMS
sum of the first five harmonics of the input signal to the
fundamental itself. This is expressed as:
V22 + V32 + V4 2 + V52
THD = 20 × log
V1
where V1 is the fundamental amplitude and V2 through
V5 are the 2nd- through 5th-order harmonics.
Spurious-Free Dynamic Range
Spurious-free dynamic range (SFDR) is the ratio of the
RMS amplitude of the fundamental (maximum signal
component) to the RMS value of the next-largest frequency component.
______________________________________________________________________________________
11
MAX1177
Definitions
16-Bit, 135ksps, Single-Supply ADC
with to 10V Input Range
MAX1177
Functional Diagram
REFADJ
HBEN
AVDD AGND DVDD DGND
5kΩ
REFERENCE
OUTPUT
REGISTERS
8 BITS
D0–D7
OR
D8–D15
REF
AIN
INPUT
SCALER
8 BITS
CAPACITIVE
DAC
AGND
MAX1177
SUCCESSIVEAPPROXIMATION
REGISTER AND
CONTROL LOGIC
CLOCK
CS
EOC
R/C
Pin Configuration
Chip Information
TRANSISTOR COUNT: 15,383
PROCESS: BiCMOS
TOP VIEW
D4/D12 1
20 D3/D11
D5/D13 2
19 D2/D10
D6/D14 3
18 D1/D9
D7/D15 4
17 D0/D8
R/C 5
MAX1177
EOC 6
16 DVDD
15 DGND
AVDD 7
14 CS
AGND 8
13 HBEN
AIN 9
12 REF
AGND 10
11 REFADJ
TSSOP
12
______________________________________________________________________________________
16-Bit, 135ksps, Single-Supply ADC
with 0 to 10V Input Range
TSSOP4.40mm.EPS
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 13
© 2003 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
MAX1177
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)