19-1458; Rev 0; 1/00
SIM/Smart Card Level Translators
in µMAX
Features
♦ SIM/Smart Card Level Shifting
♦ ±10kV ESD Card Socket Protection
♦ Allows Level Translation with DVCC ≥ VCC or
DVCC ≤ VCC
♦ Automatically Shuts Down When Either Supply Is
Removed
♦ Card Contacts Actively Pulled Low During
Shutdown
♦ +1.425V to +5.5V Controller Voltage Range
♦ +2.25V to +5.5V Card Voltage Range
♦ 2.5µA (max) Total Quiescent Supply Current
♦ 0.01µA Total Shutdown Supply Current
♦ Ultra-Small 10-Pin µMAX Package
♦ Compliant with GSM Test Specifications 11.11
and 11.12
Applications
SIM Interface in GSM Cellular Telephones
Ordering Information
PART
TEMP. RANGE
PIN-PACKAGE
Smart Card Readers
MAX1740EUB
-40°C to +85°C
10 µMAX
Logic Level Translation
MAX1741EUB
-40°C to +85°C
10 µMAX
SPI™/QSPI™/MICROWIRE™ Level Translation
Typical Operating Circuit
DVCC
DVCC
SYSTEM
CONTROLLER
Pin Configuration
VCC
TOP VIEW
DVCC
VCC
VCC
RIN
RST
RST
MAX1740
MAX1741
CIN
CLK
CLK
SIM OR
SMART
CARD
DATA
1
DVCC
2
CIN
3
RIN
4
SHDN (DDRV)
5
DATA
OPTIONAL
OPTIONAL
10 IO
9
MAX1740
MAX1741
VCC
8
CLK
7
RST
6
GND
µMAX
SHDN*
IO
DDRV*
GND
GND
* SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
IO
( ) ARE FOR MAX1741.
GND
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.
________________________________________________________________ Maxim Integrated Products
1
For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
MAX1740/MAX1741
General Description
The MAX1740/MAX1741 subscriber identity module
(SIM)/smart card level translators provide level shifting
and electrostatic discharge (ESD) protection for SIM and
smart card ports. These devices integrate two unidirectional level shifters for the reset and clock signals, a bidirectional level shifter for the serial data stream, and
±10kV ESD protection on all card contacts.
The MAX1740 includes a SHDN control input to aid
insertion and removal of SIM and smart cards, while the
MAX1741 includes a system-side data driver to support
system controllers without open-drain outputs. The logic
supply voltage range is +1.425V to +5.5V for the “controller side” and +2.25V to +5.5V for the “card side.”
Total supply current is 2.5µA max. Both devices automatically shut down when either power supply is removed.
For a complete SIM-card interface, combine the
MAX1740/MAX1741 with the MAX1686H 0V/3V/5V regulated charge pump.
The MAX1740/MAX1741 are available in ultra-small 10pin µMAX packages that are only 1.09mm high and half
the area of an 8-pin SO.
The MAX1740/MAX1741 are compliant with GSM test
specifications 11.11 and 11.12.
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
ABSOLUTE MAXIMUM RATINGS
DVCC, VCC to GND................................................-0.3V to +6.0V
RIN, CIN, DATA, DDRV,
SHDN to GND ......................................-0.3V to (DVCC + 0.3V)
RST, CLK, IO to GND ................................-0.3V to (VCC + 0.3V)
Continuous Power Dissipation (TA = +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW
Operating Temperature Range ..........................-40°C to +85°C
Storage Temperature Range ............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) ................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Figure 1, DVCC = +1.8V, VCC = +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO = CCLK = CRST = CDATA = 30pF, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
1.425
5.5
V
2.25
5.5
V
POWER SUPPLIES
DVCC Operating Range
VCC Operating Range
DVCC
VCC
1
CIN static
DVCC Operating Current
IDVCC
CIN clocked at 1.625MHz from GND to DVCC
with 50% duty cycle
8
CIN clocked at 3.25MHz from GND to DVCC
with 50% duty cycle
16
µA
1.5
CIN static
VCC Operating Current
Total Shutdown Current
IVCC
ISHDN
CIN clocked at 1.625MHz from GND to DVCC
with 50% duty cycle
0.5
CIN clocked at 3.25MHz from GND to DVCC
with 50% duty cycle
1
µA
mA
IOFF = IVCC + IDVCC, SHDN = GND
(MAX1740 only), or DVCC = GND
or VCC = GND
0.01
2
µA
CIN, RIN, SHDN, DDRV LOGIC INPUTS
Digital Input Low Threshold
VIL
Digital Input High Threshold
VIH
0.2 · DVCC
V
0.7 · DVCC
V
1
µA
0.4
V
0.01
Input Leakage Current
CLK, RST OUTPUTS
Digital Output Low Level
VOL
Digital Output High Level
VOH
ISINK = 200µA
ISOURCE = 20µA
0.9 · VCC
ISOURCE = 200µA
0.8 · VCC
V
DATA INPUT/OUTPUT
Between DATA and DVCC
13
Input Low Threshold
VIL(DATA)
(Note 1)
0.3
Input High Threshold
VIH(DATA)
(Note 2)
DATA Pull-Up Resistance
RDATA
Input Low Current
IIL
Input High Current
IIH
2
20
28
kΩ
V
DVCC - 0.6
V
1
mA
2
µA
VCC = 5.0V
_______________________________________________________________________________________
SIM/Smart Card Level Translators
in µMAX
(Figure 1, DVCC = +1.8V, VCC = +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO = CCLK = CRST = CDATA = 30pF, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
Output Low Level
SYMBOL
VOL(DATA)
Output High Level
VOH(DATA)
CONDITIONS
MIN
TYP
IO = GND, ISINK = 100µA
DVCC = 3.0V, IO = GND, ISINK = 200µA
MAX
UNITS
0.4
V
0.4
V
ISOURCE = 10µA
0.7 · DVCC
V
DVCC = 3.0V, ISOURCE = 20µA
0.7 · DVCC
V
IO INPUT/OUTPUT
Between IO and VCC
6.5
Input Low Threshold
VIL(IO)
IIL(MAX) = 1mA (Note 1)
0.3
Input High Threshold
VIH(IO)
IIH(MAX) = ±20µA (Note 2)
IO Pull-Up Resistance
RIO
10
14
kΩ
V
0.7 · VCC
V
Input Low Current
IIL
1
mA
Input High Current
IIH
20
µA
Output Low Level
VOL(IO)
DATA = GND or DDRV = GND,
ISINK = 200µA
0.4
V
Output High Level
VOH(IO)
ISOURCE = 20µA
0.8 · VCC
V
SHUTDOWN OUTPUT LEVELS
Shutdown Output Levels
(IO, CLK, RST)
ISINK = 200µA, SHDN = GND, DATA = CIN =
RIN = DVCC (MAX1740 only)
0.4
V
ISINK = 200µA, DVCC = GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DVCC
0.4
V
ISINK = 200µA, VCC = GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DVCC
0.4
V
TIMING
VCC = 2.7V to 5.5V
Maximum CLK Frequency
(Notes 3, 4)
fCLK
VCC = 2.25V to 3.6V
DVCC = 2.7V
5
DVCC = 2.25V
5
DVCC = 1.7V
5
DVCC = 1.425V
3.5
DVCC = 2.25V
4
DVCC = 1.7V
4
DVCC = 1.425V
MHz
3.5
_______________________________________________________________________________________
3
MAX1740/MAX1741
ELECTRICAL CHARACTERISTICS (continued)
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
ELECTRICAL CHARACTERISTICS
(Figure 1, DVCC = +1.8V, VCC = +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
PARAMETER
SYMBOL
CONDITIONS
MIN
MAX
UNITS
V
POWER SUPPLIES
DVCC Operating Range
VCC Operating Range
DVCC Operating Current
VCC Operating Current
Total Shutdown Current
DVCC
1.425
5.5
VCC
2.25
5.5
V
IDVCC
CIN static
1
µA
IVCC
CIN static
1.5
µA
IOFF
IOFF = IVCC + IDVCC, SHDN = GND
(MAX1740 only), or DVCC = GND
or VCC = GND
2
µA
CIN, RIN, SHDN, DDRV LOGIC INPUTS
Digital Input Low Threshold
VIL
Digital Input High Threshold
VIH
0.2 · DVCC
V
0.75 · DVCC
Input Leakage Current
V
1
µA
0.4
V
CLK, RST OUTPUTS
Digital Output Low Level
Digital Output High Level
VOL
VOH
ISINK = 200µA
ISOURCE = 20µA
0.9 · VCC
ISOURCE = 200µA
0.8 · VCC
V
DATA INPUT/OUTPUT
Between DATA and DVCC
13
Input Low Threshold
VIL(DATA)
(Note 1)
0.3
Input High Threshold
Input Low Current
Input High Current
VIH(DATA)
IIL
IIH
(Note 2)
VCC = 5.0V
Output Low Level
VOL(DATA)
Output High Level
VOH(DATA)
DATA Pull-Up Resistance
RDATA
28
kΩ
V
DVCC - 0.6
1
2
V
mA
µA
IO = GND, ISINK = 100µA
0.4
V
DVCC = 3.0V, IO = GND, ISINK = 200µA
0.4
V
ISOURCE = 10µA
0.7 · DVCC
V
DVCC = 3.0V, ISOURCE = 20µA
0.7 · DVCC
V
IO INPUT/OUTPUT
IO Pull-Up Resistance
4
RIO
Between IO and VCC
6.5
0.3
Input Low Threshold
VIL(IO)
IIL(MAX) = 1mA (Note 1)
Input High Threshold
VIH(IO)
IIH(MAX) = ±20µA (Note 2)
Input Low Current
IIL
Input High Current
IIH
Output Low Level
VOL(IO)
DATA = GND or DDRV = GND, ISINK = 200µA
Output High Level
VOH(IO)
ISOURCE = 20µA
14
V
0.7 · VCC
1
0.8 · VCC
_______________________________________________________________________________________
kΩ
V
mA
20
µA
0.4
V
V
SIM/Smart Card Level Translators
in µMAX
(Figure 1, DVCC = +1.8V, VCC = +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
CIO = CCLK = CRST = CDATA = 30pF, TA = -40°C to +85°C, unless otherwise noted.) (Note 5)
PARAMETER
SYMBOL
CONDITIONS
MIN
MAX
UNITS
ISINK = 200µA, SHDN = GND, DATA =
CIN = RIN = DVCC (MAX1740 only)
0.4
V
ISINK = 200µA, DVCC = GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DVCC
0.4
V
ISINK = 200µA, VCC = GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DVCC
0.4
V
SHUTDOWN OUTPUT LEVELS
Shutdown Output Levels
(IO, CLK, RST)
TIMING
VCC = 2.7V to 5.5V
Maximum CLK Frequency
(Notes 3, 4)
DVCC = 2.7V
5
DVCC = 2.25V
5
5
DVCC = 1.7V
fCLK
VCC = 2.25V to 3.6V
DVCC = 1.425V
3.5
DVCC = 2.25V
4
MHz
4
DVCC = 1.7V
3.5
DVCC = 1.425V
VIL is defined as the voltage at which the output (DATA/IO) voltage equals 0.5V.
VIH is defined as the voltage at which the output (DATA/IO) voltage exceeds the input (IO/DATA) voltage by 100mV.
Timing specifications are guaranteed by design, not production tested.
The maximum CLK frequency is defined as the output duty cycle remaining in the 40% to 60% range when the 50% CIN is
applied. CIN has 5ns rise and fall times; levels are GND to DVCC. Input and output levels are measured at 50% of the waveform.
Note 5: Specifications to -40°C are guaranteed by design, not production tested.
Note 1:
Note 2:
Note 3:
Note 4:
Typical Operating Characteristics
(Circuit of Figure 1, DVCC = 3.0V, VCC = 5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA = +25°C, unless otherwise noted.)
1.2
1.0
DATA OR DDRV = DVCC
fCIN = 3.25MHz
0.8
0.6
0.4
0.2
fDATA = fCIN/372
fCIN = 1.625MHz
DATA OR DDRV = DVCC
fCIN = 1.625MHz
0
2.0
2.5
3.0
3.5
DATA OR DDRV = DVCC
VVCC = 5.0V
1.5
fDATA OR fCIN/372
VVCC = 5.0V
1.0
0.5
0
4.0
VCC (V)
4.5
5.0
5.5
DATA OR DDRV = DVCC
VVCC = 5.0V
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
fCIN (MHz)
1.7
MAX1740toc03
2.0
fDATA OR fCIN/372
VVCC = 5.0V
SUPPLY CURRENT, IVCC + IDVCC (mA)
1.4
VDVCC = 3.0V
CIN CLOCKED WITH A
0 TO 3V SQUARE WAVE
MAX1740toc02
1.6
2.5
SUPPLY CURRENT, IVCC + IDVCC (mA)
fDATA = fCIN/372
VDVCC = 3.0V
CIN CLOCKED WITH A fCIN = 3.25MHz
0 TO 3V SQUARE WAVE
MAX1740/1toc01
SUPPLY CURRENT, IVCC + IDVCC (mA)
1.8
TOTAL OPERATING SUPPLY
CURRENT vs. TEMPERATURE
TOTAL OPERATING SUPPLY
CURRENT vs. CLOCK FREQUENCY
TOTAL OPERATING SUPPLY CURRENT
vs. SUPPLY VOLTAGE (VCC)
VDVCC = 3.0V, fIN = 3.25MHz, CIN CLOCKED
WITH A 0 TO 3V SQUARE WAVE
1.5
fDATA = fCIN/372
VVCC = 5.0V
1.3
1.1
DATA OR DDRV = DVCC
VVCC = 5.0V
0.9
0.7
0.5
fDATA = fCIN/372
VVCC = 3.0V
DATA OR DDRV = DVCC
VVCC = 3.0V
-40
-15
10
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
5
MAX1740/MAX1741
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics (continued)
(Circuit of Figure 1, DVCC = 3.0V, VCC = 5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA = +25°C, unless otherwise noted.)
CIN TO CLK WAVEFORM
3V
MAX1740/1toc05
MAX1740/1toc04
RIN TO RST WAVEFORM
3V
CIN
1V/div
0
5V
RST
2V/div
CLK
2V/div
0
0
fCIN = 3.25MHz
fRIN = 3.25MHz
40ns/div
UNDERVOLTAGE
SHUTDOWN WAVEFORM
DDRV TO IO AND DATA WAVEFORM
(MAX1741 ONLY)
VCC
0.5V/div
MAX1740/1toc09
40ns/div
1.5V
3V
0
3V
0
DDRV
2V/div
DATA
2V/div
0
5V
1V
CLK, RST, OR IO
0.5V/div
0
IO
2V/div
0
1ms/div
6
RIN
1V/div
0
5V
MAX1740/1toc08
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
1µs/div
_______________________________________________________________________________________
SIM/Smart Card Level Translators
in µMAX
PIN
NAME
FUNCTION
1
DATA
System Controller Data Input/Output. An open-drain input/output with a 20kΩ pull-up
resistor to DVCC. For bidirectional data transfer, connect to an open-drain controller output
capable of sinking 1mA while pulling DATA low. If the controller is not open drain, use
DDRV to send data and DATA to receive data.
2
2
DVCC
Supply Voltage for System Controller Digital Pins. Set at +1.425V to +5.5V.
3
3
CIN
System Controller Clock Input
4
4
RIN
System Controller Reset Input
—
5
DDRV
Optional System Controller Data Input. Connect to controllers without an open-drain output. When not used, connect DDRV to DVCC.
5
—
SHDN
Shutdown Mode Input. Driving SHDN low reduces the total supply current to less than
2µA. In shutdown mode, RST, CLK, and IO are actively pulled low and the transfer gate
between DATA and IO is disabled. When not used, connect SHDN to DVCC.
6
6
GND
System Controller and Card Ground
7
7
RST
Reset Output to Card. Actively pulled low during shutdown.
8
8
CLK
Clock Output to Card. Actively pulled low during shutdown.
9
9
VCC
Supply Voltage for Card-Side Digital Pins. Set at +2.25V to +5.5V. Proper supply bypassing is required to meet ±10kV ESD specifications.
10
10
IO
Card-Side Bidirectional Input/Output. An open-drain output with a 10kΩ pull-up resistor to
VCC. For bidirectional data transfer, connect to an open-drain card output capable of sinking 1mA while pulling IO low. Actively pulled low during shutdown.
MAX1740
MAX1741
1
Detailed Description
The MAX1740/MAX1741 provide the necessary level
translation for interfacing with subscriber identity modules (SIMs) and smart cards in multivoltage systems.
These devices operate with logic supply voltages
between +1.425V and +5.5V on the controller side
(DVCC) and between +2.25V and +5.5V on the card side
(VCC). The total supply current (IDVCC + IVCC) is 2.5µA
(max) while operating in an idle state (see Electrical
Characteristics). Figure 2 shows a typical application circuit and functional diagram.
Level Translation
The MAX1740/MAX1741 provide level translators for a
clock input, a reset input, and a bidirectional data
input/output. The clock and reset inputs (CIN and RIN)
are level shifted from the controller-side supply rails
(DVCC to GND) to the card-side supply rails (VCC to
GND). When connected to an open-drain controller output, DATA and IO provide bidirectional level translation.
MAX1740
MAX1741
+1.8V
DVCC
VCC
SHDN*
RST
RIN
CIN
DDRV*
DATA
CLK
+3.0V OR
+5.0V
IO
30pF
30pF
30pF 30pF
GND
* SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
NOTE: ALL CAPACITANCES INCLUDE CAPACITIVE LOADS OF
TEST PROBES AND BOARD LAYOUT.
Figure 1. MAX1740/MAX1741 Test Circuit
_______________________________________________________________________________________
7
MAX1740/MAX1741
Pin Description
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
All level translation is valid for DVCC ≥ VCC or DVCC ≤
VCC. The MAX1740/MAX1741 contain internal pull-up
resistors from DATA to the controller-side supply
(DVCC) and from IO to the card-side supply (VCC). For
push-pull controller outputs, see the Data Driver section
for bidirectional data translation.
est way to achieve this is by shutting down the
MAX1686H or by driving SHDN (MAX1740 only) low. If
specific sequencing is desired, pull IO low by driving
either DATA or DDRV (MAX1741 only) low, and pull
CLK and RST low by driving CIN and RIN low, respectively.
Data Driver (MAX1741 only)
ESD Protection
When using a microcontroller (µC) without an open-drain
output, use the data driver (DDRV) input to send data to
the SIM/smart card, while DATA provides the controllerside output for bidirectional data transfer. When not
used, connect DDRV to DVCC to reduce total supply current.
As with all Maxim devices, ESD-protection structures
on all pins protect against electrostatic discharges
(ESDs) encountered during handling and assembly.
For further protection during card insertion and
removal, the pins that connect to the card socket (CLK,
RST, IO, VCC, and GND) provide protection against
±10kV of ESD, according to the Human Body Model.
The ESD structures withstand high ESD in all states:
normal operation, shutdown, and power-down. After an
ESD event, the MAX1740/MAX1741 continue working
without latchup.
Shutdown Mode
For the MAX1740, drive SHDN low to activate shutdown. Connect SHDN to DVCC or drive high for normal
operation. To allow for card insertion and removal, shutdown mode actively pulls CLK, RST, and IO low; it also
disconnects the internal 10kΩ pull-up resistor from VCC
to prevent excessive current draw. Shutdown mode
reduces the total supply current (I DVCC + I VCC ) to
0.01µA.
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report documenting test
setup, test methodology, and test results.
SIM/Smart Card Insertion/Removal
Human Body Model
The SIM/smart card specifications require that the
card-side pins (V CC , CLK, RST, IO) be at ground
potential prior to inserting the SIM/smart card. For
applications using the MAX1686H (Figure 4), the easi-
Figure 3a shows the Human Body Model, and Figure
3b shows the current waveform it generates when discharged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
VCC
DVCC
DVCC
DVCC
VCC
RIN
RST
1µF
VCC
RST
1µF
CLK
CIN
SYSTEM
CONTROLLER
20k
OPTIONAL
SHDN*
OPTIONAL
DDRV*
SIM OR
SMART CARD
10k
IO
DATA
CLK
IO
SHUTDOWN
CONTROL
GND
GND
MAX1740
MAX1741
GND
* SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
Figure 2. Typical Application Circuit and Functional Diagram
8
_______________________________________________________________________________________
SIM/Smart Card Level Translators
in µMAX
MAX1740/MAX1741
RC
1M
RD
1500Ω
IP 100%
90%
DISCHARGE
RESISTANCE
CHARGE-CURRENT
LIMIT RESISTOR
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Ir
AMPERES
HIGHVOLTAGE
DC
SOURCE
Cs
100pF
DEVICE
UNDER
TEST
STORAGE
CAPACITOR
36.8%
10%
0
0
Figure 3a. Human Body ESD Test Model
tDL
CURRENT WAVEFORM
Figure 3b. Human Body Model Current Waveform
+3.0V
+5.0V
CXN
CXP
3.0V OR 5.0V
DVCC
IN MAX1686 OUT
MAX1686H
3/5
SHDN
SYSTEM
CONTROLLER
OPTIONAL
SHDN
SIM OR
SMART
CARD
VCC
RIN
RST
RST
CIN
CLK
CLK
IO
SYSTEM
CONTROLLER
IO
OPTIONAL
GND
* SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
Figure 4. Using MAX1740/MAX1741 and MAX1686/MAX1686H
Charge Pump for SIM Card Applications
est, which is then discharged into the test device
through a 1.5kΩ resistor.
Applications Information
SIM/Smart Card Interface
To provide 5V when interfacing with a 5V SIM/smart
card, 3V systems require a DC-DC converter. The
MAX1686H +5V regulating charge pump for SIM cards
provides 0V/3V/5V for full compatibility with SIM/smart
card specifications. Figure 4 shows the charge pump
for SIM card applications. Alternatively, the MAX619
generates a regulated 5V from input voltages as low as
2V.
PGND
SPI/QSPI/
MICROWIRE
SYSTEM
VCC
VCC
RIN
RST
CS
CIN
CLK
SCLK
IO
DOUT
DATA
OPTIONAL
GND
SET
MAX1740
MAX1741
DVCC
SHDN*
GND
OUT
MAX8867
MAX8860
PGND
VCC
DDRV*
IN
GND
DVCC
DATA
+3.3V
DVCC
MAX1740
MAX1741
OPTIONAL
GND
TIME
tRL
SHDN*
DDRV*
DIN
GND
GND
* SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY
Figure 5. MAX1740/MAX1741 with SPI/QSPI/MICROWIRE
Interfaces
SPI/QSPI/MICROWIRE Interface
The MAX1740/MAX1741 are also useful as 3V/5V level
shifters in SPI, QSPI, and MICROWIRE applications
(Figure 5). On the slave side, connect CLK to SCLK,
RST to CS, and IO to DOUT and DIN. The unidirectional
level shifters transfer chip select and clock signals to
the slave device(s), while the bidirectional level shifter
transfers data.
___________________Chip Information
TRANSISTOR COUNT: 114
_______________________________________________________________________________________
9
________________________________________________________Package Information
10LUMAX.EPS
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
Note: The MAX1740/MAX1741 do not have an exposed pad.
10
______________________________________________________________________________________
SIM/Smart Card Level Translators
in µMAX
MAX1740/MAX1741
NOTES
______________________________________________________________________________________
11
MAX1740/MAX1741
SIM/Smart Card Level Translators
in µMAX
NOTES
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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is a registered trademark of Maxim Integrated Products.
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