MAX17623ATA+

Click here for production status of specific part numbers. MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs General Description Benefits and Features The Himalaya series of voltage regulator ICs, power modules, and chargers enable cooler, smaller, and simpler power supply solutions.  MAX17623 and MAX17624 are high-frequency synchronous Himalaya step-down DC-DC converters with integrated MOSFETs and internal compensation. MAX17623 and MAX17624 have an input-voltage range of 2.9V to 5.5V, supports up to 1A, and output voltage can be adjusted from 0.8V to 3.3V. ● Easy to Use • 2.9V to 5.5V Input • Adjustable 0.8V to 3.3V Output • ±1% Feedback Accuracy • Up to 1A Output Current • Fixed 2MHz or 4MHz Operation • 100% Duty-Cycle Operation • Internally Compensated • All Ceramic Capacitors ● High Efficiency • Selectable PWM- or PFM-Mode of Operation • Shutdown Current as Low as 0.1μA (typ) ● Flexible Design • Internal Soft-Start and Prebias Startup • Open-Drain Power Good Output (PGOOD Pin) ● Robust Operation • Overtemperature Protection • Overcurrent Protection • -40°C to +125°C Ambient Operating Temperature/ -40°C to +150°C Junction Temperature The MAX17623 and MAX17624 employ peak-currentmode control architecture under steady-state operation.  To reduce input-inrush current, the devices offer a fixed 1ms soft-start time. Both devices feature selectable PWM for fixed frequency operation, or PFM mode for better efficiency at light loads. When PWM mode is selected, MAX17623 operates at a fixed 2MHz switching frequency and MAX17624 operates at a fixed 4MHz switching frequency. MAX17623 offers output voltages from 0.8V to 1.5V, and MAX17624 offers output voltages from 1.5V to 3.3V. The MAX17623 and MAX17624 devices are available in a compact 8-pin, 2mm × 2mm TDFN package. Applications • • • • • Point-of-Load Power Supply Standard 5V Rail Supplies Battery-Powered Applications Distributed Power Systems Industrial Sensors and Process Control Ordering Information at end of data sheet. Typical Application Circuit VIN 3.6V TO 5.5V CIN 2.2µF IN MAX17624 EN PGOOD MODE 19-100976; Rev 0; 10/20 LX OUTSNS L1 1µH 3.3V, 1A COUT 10µF R1 118kΩ FB GND R2 37.4kΩ MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Absolute Maximum Ratings IN, EN, PGOOD, FB, OUTSNS to GND ................. -0.3V to 6V Operating Temperature .................................. -40°C to +125°C MODE, LX to GND .................................... -0.3V to (IN + 0.3V) Junction Temperature (Note1) ..................................... +150°C Output Short-Circuit Duration ................................. Continuous Storage Temperature Range ......................... -65°C to +150°C Continuous Power Dissipation (up to TA = +70°C) (derate 11.7mW/°C above TA = +70°C) ................................ 937.9mW Lead Temperature (soldering,10s) ............................... +260ºC Soldering Temperature (reflow)................................... +260°C Note 1: Junction temperature greater than +125°C degrades operating lifetimes. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Information PACKAGE TYPE: 8- PIN TDFN Package Code Outline Number Land Pattern THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient (θJA) Junction to Case (θJC) T822+3C 21-0168 90-0065 85.3°C/W 8.9°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermaltutorial. Electrical Characteristics (VIN = VEN = 3.6V, VGND = VMODE = VFB = 0V, LX = OUTSNS = PGOOD= OPEN. TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 5.5 V INPUT SUPPLY (VIN) Input-Voltage Range VIN IIN-SHDN Input-Supply Current IQ-PFM IQ-PWM Undervoltage-Lockout Threshold (UVLO) UVLO Hysteresis VIN_UVLO 2.9 VEN = 0, shutdown mode 0.1 PFM mode, No Load 40 PWM mode, MAX17623 4.5 PWM mode, MAX17624 6 VIN Rising 2.72 VIN_UVLO_HY 2.8 µA mA 2.88 200 V mV S ENABLE(EN) EN LOW Threshold VEN_LOW EN falling EN HIGH Threshold VEN_HIGH EN rising www.maximintegrated.com 0.8 2 V V Maxim Integrated | 2 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs (VIN = VEN = 3.6V, VGND = VMODE = VFB = 0V, LX = OUTSNS = PGOOD= OPEN. TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2) PARAMETER EN Input Leakage SYMBOL IEN CONDITIONS TYP MAX UNITS 10 50 nA VIN = 3.6V, IOUT = 190mA 120 200 VIN = 5V, IOUT = 190mA 100 160 VIN = 3.6V, IOUT = 190mA 80 145 VIN = 5V, IOUT = 190mA 70 130 LX = GND or IN, TA = +25oC 0.1 1 EN = 5.5V, TA = TJ = MIN +25ºC POWER MOSFETS High-Side pMOS OnResistance RDS_ONH Low-Side nMOS OnResistance RDS_ONL LX Leakage Current ILX_LKG mΩ mΩ µA TIMING Switching Frequency Minimum On Time Maximum Duty Cycle fSW MAX17623 1.92 2.00 2.08 MAX17624 3.84 4.00 4.16 tON_MIN 40 DMAX Soft-Start Time ns 100 LX Dead Time MHz % 3 ns tSS 1 ms VFB-REG 0.8 V FEEDBACK (FB) FB Regulation Voltage FB Voltage Accuracy VFB PWM Mode FB Input-Bias Current IFB FB = 0.6V, TA = TJ = +25ºC OUTSNS Input Bias Current IOUTSNS-BIAS -1 MAX17623 VOUTSNS = 5.5V MAX17624 VOUTSNS = 5.5V +1 % 50 nA 20 nA 10 µA CURRENT LIMIT Peak Current-Limit Threshold Valley Current-Limit Threshold Negative Current-Limit Threshold ILIM-PEAK 1.4 2 2.5 A ILIM-VALLEY 1.2 1.5 1.8 A ILIM-NEG Current entering LX pin -1.09 A POWER GOOD (PGOOD) PGOOD Rising Threshold PGOOD Falling Threshold PGOOD Output Low PGOOD Output Leakage Current Delay in PGOOD Assertion after SoftStart VPGOOD_RISE FB Rising 91.5 93.5 95.5 % VPGOOD_FALL FB Falling 88 90 92 % IPGOOD = 5mA 200 mV PGOOD = 5.5V, TA = TJ = +25ºC 100 nA VOL_PGOOD ILEAK_PGOOD 184 μs 5 μA MODE MODE Pullup Current www.maximintegrated.com VMODE = GND Maxim Integrated | 3 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs (VIN = VEN = 3.6V, VGND = VMODE = VFB = 0V, LX = OUTSNS = PGOOD= OPEN. TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to GND, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS THERMAL SHUTDOWN Thermal-Shutdown Rising Threshold Thermal-Shutdown Hysteresis 165 °C 10 °C Note 2: Electrical specifications are production tested at TA = +25ºC. Specifications over the entire operating temperature range are guaranteed by design and characterization. Typical Operating Characteristics (VIN = VEN = 5V, VGND = VMODE = VFB = VOUTSNS = 0V, LX = PGOOD = OPEN, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C. All voltages are referenced to GND, unless otherwise noted.) www.maximintegrated.com Maxim Integrated | 4 MAX17623 MAX17624 www.maximintegrated.com 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Maxim Integrated | 5 MAX17623 MAX17624 www.maximintegrated.com 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Maxim Integrated | 6 MAX17623 MAX17624 www.maximintegrated.com 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Maxim Integrated | 7 MAX17623 MAX17624 www.maximintegrated.com 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Maxim Integrated | 8 MAX17623 MAX17624 www.maximintegrated.com 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Maxim Integrated | 9 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Pin Configurations TOP VIEW LX OUTSNS FB PGOOD 8 7 6 5 MAX17623/ MAX17624 *EP + 1 2 3 4 IN GND EN MODE TDFN 2mm x 2mm Pin Descriptions PIN NAME FUNCTION Power Supply Input. Decouple the IN pin to GND with a capacitor. Place the capacitor close to the IN and GND pins. Ground Pin of the converter. Connect externally to the power ground plane. Refer to the MAX17623/MAX17624 evaluation kit data sheet for a layout example. Active High Enable Input Pin. Connect to IN for always ON operation. Connect to GND to disable the output. PWM or PFM Mode Selection Input. Connect the MODE pin to GND to enable PWM mode operation. Leave the MODE pin unconnected to enable PFM mode of operation. Open- Drain Output Power Good Status Pin. Pullup PGOOD to an external logic supply using a pullup resistor to generate a “high” level if the output voltage is above 93.5% of the target regulated voltage. If not used, leave this pin unconnected. The PGOOD is driven low if the output voltage is below 90% of the target regulated voltage Feedback Input. Connect FB to the center of the external resistor-divider from the output-voltage node (VOUT) to GND to set the output voltage. Sense Pin for Output Voltage. Connect to the positive terminal of the output capacitor COUT through a Kelvin connection. 1 IN 2 GND 3 EN 4 MODE 5 PGOOD 6 FB 7 OUTSNS 8 LX Switching Node. Connect the LX pin to the switching node of the inductor. — EP Exposed Pad. Connect the exposed pad to the GND pin of the device. Also, connect EP to a large GND plane with several thermal vias for the best thermal performance. Refer to the MAX17623/MAX17624 evaluation kit data sheet for an example of the correct method of EP connection and thermal vias. www.maximintegrated.com Maxim Integrated | 10 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Functional Diagram MAX17623/ MAX17624 IN HIGH-SIDE DRIVER + EN 2V/0.8V - OSCILLATOR LX CONTROLLER SOFT-START LOW-SIDE DRIVER OUTSNS CONTROLLERMODE LOGIC MODE MODESELECTION LOGIC FB www.maximintegrated.com GND SLOPE COMPENSATION PGOOD LOGIC PGOOD Maxim Integrated | 11 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Detailed Description MAX17623 and MAX17624 are high-frequency synchronous step-down DC-DC converters, with integrated MOSFETs and compensation components, that operate over a 2.9V to 5.5V input-voltage range. MAX17623 and MAX17624 support up to 1A load current and allows use of small, low-cost input and output capacitors. The output voltage can be adjusted from 0.8V to 3.3V. When the EN pin is asserted, an internal power-up sequence ramps up the error-amplifier reference, resulting in outputvoltage soft-start. The FB pin monitors the output voltage through a resistor-divider. The devices select either PFM or forced-PWM mode depending on the state of the MODE pin at power-up. By pulling the EN pin to low, the devices enter shutdown mode and consume only 0.1μA (typ) of standby current. The devices use an internally compensated, fixed-frequency, peak-current mode control scheme. On the falling edge of an internal clock, the high-side pMOSFET turns on, and continues to be on during normal operation until at least the rising edge of the clock (for 40ns). An internal error amplifier compares the feedback voltage to a fixed internal reference voltage and generates an error voltage. The error voltage is compared to a sum of the current-sense voltage and a slopecompensation voltage by a PWM comparator to set the on-time. During the on-time of the pMOSFET, the inductor current ramps up. For the remainder of the switching period (off-time), the pMOSFET is kept off and the low-side nMOSFET turns on. During the off-time, the inductor releases the stored energy as the inductor current ramps down, providing current to the output. Under overload conditions, the cycle-by-cycle current-limit feature limits the inductor peak current by turning off the high-side pMOSFET and turning on the low-side nMOSFET. Mode Selection (MODE) The logic state of the MODE pin is latched after the EN pin goes above its rising threshold and all internal voltages are ready to allow LX switching. If the MODE pin is unconnected at power-up, the part operates in PFM mode at light loads. If the MODE pin is grounded at power-up, the part operates in constant-frequency PWM mode at all loads. State changes on the MODE pin are ignored during normal operation. PWM Operation In PWM mode, the device output current is allowed to go negative. PWM operation is useful in frequency sensitive applications and provides fixed switching frequency operation at all loads. However, PWM-mode of operation gives lower efficiency at light loads compared to PFM-mode of operation. PFM Operation PFM mode of operation disables negative output current from the device and skips pulses at light loads for better efficiency. At low-load currents, if the peak value of the inductor current is less than 350mA for 64 consecutive cycles, and the inductor current reaches zero, the part enters PFM mode. In PFM mode, When the FB pin voltage is below 0.8V, the high-side switch is turned on until the inductor current reaches 500mA. After the high-side switch is turned OFF, the low-side switch is turned ON until the inductor current comes down to zero and LX enters a high-impedance state. If the FB pin voltage is greater than 0.8V for 3 consecutive CLK falling edges after LX enters a high-impedance state, the device continues to operate in PFM mode. In PFM mode, the part hibernates when the FB pin voltage is above 0.8V for 5 consecutive switching cycles after LX enters a high-impedance state. If the FB pin voltage drops below 0.8V within 3 consecutive CLK falling edges after LX enters a high-impedance state, the part comes out of PFM mode. EN Input (EN), Soft-Start When the EN pin voltage is above 2V (min), the internal error-amplifier reference voltage starts to ramp up. The duration of the soft-start ramp is 1ms (typ), allowing a smooth increase of the output voltage. Driving EN low disables both power MOSFETs, as well as other internal circuitry, and reduces IN quiescent current to below 0.1μA. Power Good (PGOOD) The devices include an open-drain power good output that indicates the output voltage status. PGOOD goes high when the output voltage is above 93.5% of the target value and goes low when the output voltage is below 90% of the target value. During startup, the PGOOD pin goes high after 184μs of soft-start completion. www.maximintegrated.com Maxim Integrated | 12 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Startup into a Prebiased Output The devices are capable of soft-start into a prebiased output, without discharging the output capacitor in both the PFM and forced-PWM modes. Such a feature is useful in applications where digital integrated circuits with multiple rails are powered. 100% Duty Cycle Operation The device can provide 100% duty-cycle operation. In this mode, the high-side switch is constantly turned on, while the low-side switch is turned off. This is particularly useful in battery-powered applications to achieve the longest operation time by taking full advantage of the whole battery-voltage range. The minimum input voltage to maintain the output-voltage regulation can be calculated as: VIN_MIN = VOUT +(IOUT × RON ) where, VIN = Minimum input voltage VOUT = Target output voltage RON = Sum of the high-side FET on-resistance and the output inductor DCR Undervoltage Lockout The device features an integrated input undervoltage lockout (UVLO) feature that turns the device on/off based on the voltage at the IN pin. The device turns on if the IN pin voltage is higher than the UVLO threshold (V IN_UVLO) of 2.8V (typ) (assuming EN is at logic-high) and turns off when the IN pin voltage is 200mV (VIN_UVLO_HYS) below the VIN_UVLO. Overcurrent Protection The MAX17623/MAX17624 are provided with a robust overcurrent protection (OCP) scheme that protects the devices under overload and output short-circuit conditions. When overcurrent is detected in the inductor, the switches are controlled by a mechanism, which detects both the high-side MOSFET and low-side MOSFET currents and compares them with the respective limits. Whenever the inductor current exceeds the internal peak current limit of 2A (typ), the highside MOSFET is turned off and the low-side MOSFET is turned ON. The low-side MOSFET is kept on until the subsequent CLK rising edge after the inductor current drops below 1.5A (typ). The high-side MOSFET is turned on after the low-side MOSFET is turned off and the cyclic operation continues. When the overload condition is removed, the part regulates output to the set voltage. Thermal Overload Protection Thermal overload protection limits the total power dissipation in the device. When the junction temperature exceeds +165°C, an on-chip thermal sensor shuts down the device, turns off the internal power MOSFETs, allowing the device to cool down. The thermal sensor turns the device on after the junction temperature cools by 10°C. www.maximintegrated.com Maxim Integrated | 13 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Applications Information Selection of Inductor Three key inductor parameters must be specified to select the output inductor: 1) Inductor value 2) Inductor saturation current 3) DC-resistance of the inductor The device internal slope compensation and current limit are optimized with output inductors of 1.5µH for MAX17623 and 1µH for MAX17624. For MAX17623, select a 1.5µH inductor and for MAX17624, select a 1µH inductor. The saturation current rating (ISAT) of the inductor must be high enough to ensure that saturation can occur only above the peak currentlimit value of 2A (typ). Select a low-loss inductor with acceptable dimensions and having the lowest possible DCresistance to improve the efficiency. Selection of Input Capacitor The input filter capacitor reduces peak currents drawn from the power source and reduces noise and voltage ripple on the input caused by the circuit switching. The input capacitor RMS current requirement (I RMS) is defined by the following equation: IRMS = IOUT(MAX) × √VOUT × (VIN - VOUT ) VIN where, IOUT(MAX) is the maximum load current. IRMS has the maximum value when the input voltage equals twice the output voltage (VIN = 2 x VOUT), so IRMS(MAX) = IOUT(MAX)/2. Choose an input capacitor that exhibits less than +10°C temperature rise at the RMS input current for optimal long-term reliability. Use low-ESR ceramic capacitors with high-ripple-current capability at the input. X7R capacitors are recommended in industrial applications for their temperature stability. Calculate the input capacitance using the following equation: CIN = IOUT(MAX) × D × (1 - D) fSW × η × ∆VIN where, D = Duty ratio of the converter fSW = Switching frequency ΔVIN = Allowable input-voltage ripple η = Efficiency Selection of Output Capacitor Small ceramic X7R-grade capacitors are sufficient and recommended for the device. The output capacitor has two functions. It filters the square wave generated by the device along with the inductor. It stores sufficient energy to support the output voltage under load transient conditions and stabilizes the device’s internal control loop. The device’s internal loop-compensation parameters are optimized for 22µF and 10µF output capacitors for MAX17623 and MAX17624, respectively. MAX17623 requires a minimum of 22µF (typ) and MAX17623 requires a minimum of 10µF (typ) capacitance for stability. Derating of ceramic capacitors with DC-voltage must be considered while selecting the output capacitor. www.maximintegrated.com Maxim Integrated | 14 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Adjusting the Output Voltage The MAX17623/MAX17624 output voltage can be programmed from 0.8V to 3.3V. MAX17623 offers output voltages from 0.8V to 1.5V and MAX17624 offers output voltages from 1.5V to 3.3V. Set the output voltage by connecting a resistordivider from output to FB to GND (see Figure 1). Choose R2 to be less than 37.4kΩ and calculate R1 with the following equation: R1 = R2 × [ VOUT - 1] 0.8 VOUT MAX17623/ MAX17624 R1 FB R2 Figure 1. Setting the Output Voltage Power Dissipation At a particular operating condition, the power losses that lead to a temperature rise of the part are estimated as follows: 1 PLOSS = POUT × ( - 1) - (IOUT 2 × RDCR ) η POUT = VOUT × IOUT where, POUT = Output Power RDCR = DC-resistance of the inductor η = Efficiency of the power supply at the desired operating conditions. See the Typical Operating Characteristics section for efficiency or measure the efficiency to determine total power dissipation. An EE-Sim model is available for the MAX17623/MAX17624 to simulate efficiency and power loss. The junction temperature TJ can be estimated at any given maximum ambient temperature TA from the following equation: TJ = TA + (θJA × PLOSS ) Where θJA is the junction-to-ambient thermal resistance of the package (85.3°C/W for a four-layer board measured using JEDEC specification JESD51-7) If the application has a thermal-management system that ensures the exposed pad of the device is maintained at a given temperature (TEP), the junction temperature can be estimated using the following formula TJ = TEP + (θJC × PLOSS ) where θJC is the junction-to-case thermal resistance of the device (8.9°C/W) Note: Operating the device at junction temperatures greater than +125°C degrades operating lifetimes. www.maximintegrated.com Maxim Integrated | 15 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs PCB Layout Guidelines Careful PCB layout is critical to achieve clean and stable operation. In particular, the traces that carry pulsating current should be short and wide so that the parasitic inductance formed by these traces can be minimized. Follow the following guidelines for good PCB layout: • Keep the input capacitors as close as possible to the IN and GND pins. • Keep the output capacitors as close as possible to the OUT and GND pins. • Keep the resistive feedback divider as close as possible to the FB pin. • Connect all the GND connections to a copper plane area as large as as possible on the top and bottom layers. • Use multiple vias to connect internal GND planes to the top layer GND plane. • Keep the power traces and load connections short. This practice is essential for high efficiency. Using thick copper PCBs (2oz vs. 1oz) can enhance full load efficiency. • Refer to the MAX17623/MAX17624 evaluation kit layout for first pass success. R2 R1 LX PLANE VIN PLANE L MAX17623/ MAX17624 10 LX 2 7 OUTSNS EN 3 6 FB MODE 4 5 PGOOD IN 1 GND CIN VOUT PLANE GND PLANE Figure 2. Layout Guidelines www.maximintegrated.com Maxim Integrated | 16 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Typical Application Circuits Typical Application Circuit (0.8V, 1A) VIN 2.9V TO 5.5V CIN 2.2µF IN MAX17623 LX L1 1.5µH COUT 22µF OUTSNS EN PGOOD 0.8V, 1A fSW: 2MHz FB R2 37.4kΩ GND MODE CIN: 2.2µF/10V/X7R/0603 (GRM188R71A225KE15) L1: 1.5µH (DFE252012F-1R5M) COUT: 22µF/6.3V/X7R/0805 (GRM21BZ70J226ME44) Typical Application Circuit (1.5V, 1A) VIN 2.9V TO 5.5V CIN 2.2µF IN MAX17623 LX L1 1.5µH COUT 22µF OUTSNS EN 1.5V, 1A R1 33.2kΩ fSW: 2MHz PGOOD FB R2 37.4kΩ GND MODE CIN: 2.2µF/10V/X7R/0603 (GRM188R71A225KE15) L1: 1.5µH (DFE252012F-1R5M) COUT: 22µF/6.3V/X7R/0805 (GRM21BZ70J226ME44) Typical Application Circuit (1.5V, 1A) VIN 2.9V TO 5.5V CIN 2.2µF IN MAX17624 LX L1 1µH COUT 10µF OUTSNS EN 1.5V, 1A R1 33.2kΩ fSW: 4MHz PGOOD FB R2 37.4kΩ GND MODE CIN: 2.2µF/10V/X7R/0603 (GRM188R71A225KE15) L1: 1µH (DFE252012F-1R0M) COUT: 10µF/6.3V/X7R/0805 (GRM21BR70J106K) Typical Application Circuit (3.3V, 1A) VIN 3.6V TO 5.5V CIN 2.2µF IN MAX17624 EN LX OUTSNS L1 1µH 3.3V, 1A COUT 10µF R1 118kΩ fSW: 4MHz PGOOD MODE www.maximintegrated.com FB GND R2 37.4kΩ CIN: 2.2µF/10V/X7R/0603 (GRM188R71A225KE15) L1: 1µH (DFE252012F-1R0M) COUT: 10µF/6.3V/X7R/0805 (GRM21BR70J106K) Maxim Integrated | 17 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Ordering Information PART NUMBER MAX17623ATA+ MAX17623ATA+T MAX17624ATA+ MAX17624ATA+T TEMP RANGE -40ºC to +125ºC -40ºC to +125ºC -40ºC to +125ºC -40ºC to +125ºC PIN-PACKAGE 8 TDFN 8 TDFN 8 TDFN 8 TDFN fSW (MHz) 2 2 4 4 VOUT (V) 0.8 to 1.5 0.8 to 1.5 1.5 to 3.3 1.5 to 3.3 + Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape-and-reel. www.maximintegrated.com Maxim Integrated | 18 MAX17623 MAX17624 2.9V to 5.5V,1A, Synchronous Step-Down Converter with Integrated MOSFETs Revision History REVISION NUMBER 0 REVISION DATE 10/20 DESCRIPTION Initial release PAGES CHANGED — For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. 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