EVALUATION KIT AVAILABLE
The MAX2022 low-noise, high-linearity, direct conversion
quadrature modulator/demodulator is designed for single
and multicarrier 1500MHz to 3000MHz UMTS/WCDMA,
LTE/TD-LTE, cdma2000®, and DCS/PCS base-station
applications. Direct conversion architectures are advantageous since they significantly reduce transmitter or receiver cost, part count, and power consumption as compared
to traditional IF-based double conversion systems.
In addition to offering excellent linearity and noise performance, the MAX2022 also yields a high level of component
integration. This device includes two matched passive mixers for modulating or demodulating in-phase and quadrature signals, three LO mixer amplifier drivers, and an LO
quadrature splitter. On-chip baluns are also integrated
to allow for single-ended RF and LO connections. As an
added feature, the baseband inputs have been matched
to allow for direct interfacing to the transmit DAC, thereby
eliminating the need for costly I/Q buffer amplifiers.
The MAX2022 operates from a single +5V supply. It is
available in a compact 36-pin TQFN package (6mm x
6mm) with an exposed paddle. Electrical performance is
guaranteed over the extended -40°C to +85°C temperature range.
Applications
● S
ingle and Multicarrier WCDMA/UMTS and
LTE/TD-LTE Base Stations
● Single and Multicarrier cdmaOne™ and cdma2000
Base Stations
● Single and Multicarrier DCS 1800/PCS 1900 EDGE
Base Stations
● PHS/PAS Base Stations
● Predistortion Transmitters
● Fixed Broadband Wireless Access
● Wireless Local Loop
● Private Mobile Radio
● Military Systems
● Microwave Links
● Digital and Spread-Spectrum Communication Systems
cdma2000 is a registered trademark of Telecommunications
Industry Association.
cdmaOne is a trademark of CDMA Development Group.
19-3572; Rev 3; 7/13
Benefits and Features
● 1500MHz to 3000MHz RF Frequency Range
● 1500MHz to 3000MHz LO Frequency Range
● Scalable Power: External Current-Setting Resistors
Provide Option for Operating Device in ReducedPower/Reduced-Performance Mode
● 36-Pin, 6mm x 6mm TQFN Provides High Isolation in
a Small Package
Modulator Operation (2140MHz):
● Meets Four-Carrier WCDMA 65dBc ACLR
● 23.3dBm Typical OIP3
● 51.5dBm Typical OIP2
● 45.7dBc Typical Sideband Suppression
● -40dBm Typical LO Leakage
● -173.2dBm/Hz Typical Output Noise, Eliminating the
Need for an RF Output Filter
● Broadband Baseband Input
● DC-Coupled Input Provides for Direct Launch DAC
Interface, Eliminating the Need for Costly I/Q
Buffer Amplifiers
Demodulator Operation (1890MHz):
● 39dBm Typical IIP3
● 58dBm Typical IIP2
● 9.2dB Typical Conversion Loss
● 9.4dB Typical NF
Ordering Information appears at end of data sheet.
For related parts and recommended products to use with this part, refer
to www.maximintegrated.com/MAX2022.related.
WCDMA, ACLR, ALTCLR and Noise vs. RF Output
Power at 2140MHz for Single, Two, and Four Carriers
-60
-125
4C ADJ
-62
4C ALT
-64
-135
-66
-145
-68
2C ADJ
-70
1C ADJ
-155
-72
-74
1C ALT
-76
-78
-80
NOISE FLOOR
-50
2C ALT
4C 2C
1C
0
-40
-30
-20
-10
RF OUTPUT POWER PER CARRIER (dBm)
-165
-175
NOISE FLOOR (dBm/Hz)
General Description
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
ACLR AND ALT CLR (dBc)
MAX2022
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Absolute Maximum Ratings
VCC_ to GND........................................................-0.3V to +5.5V
BBIP, BBIN, BBQP, BBQN to GND........... -2.5V to (VCC + 0.3V)
LO, RF to GND Maximum Current......................................50mA
RF Input Power...............................................................+20dBm
Baseband Differential I/Q Input Power............................+20dBm
LO Input Power...............................................................+10dBm
RBIASLO1 Maximum Current.............................................10mA
RBIASLO2 Maximum Current.............................................10mA
RBIASLO3 Maximum Current.............................................10mA
Continuous Power Dissipation (Note 1)...............................7.6W
Operating Case Temperature Range (Note 2).... -40°C to +85°C
Maximum Junction Temperature......................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
TQFN
Junction-to-Ambient
Thermal Resistance (θJA) (Notes 3, 4)......................+34°C/W
Junction-to-Case
Thermal Resistance (θJC) (Notes 1, 4).....................+8.5°C/W
Note 3: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
DC Electrical Characteristics
(MAX2022 Typical Application Circuit, VCC = 4.75V to 5.25V, VGND = 0V, I/Q ports terminated into 50Ω to GND, LO and RF ports
terminated into 50Ω to GND, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C, unless otherwise noted. Typical values are at
VCC = 5V, TC = +25°C, unless otherwise noted.)
PARAMETER
Supply Voltage
Total Supply Current
SYMBOL
CONDITIONS
VCC
ITOTAL
MIN
TYP
MAX
4.75
5.00
5.25
V
292
342
mA
1460
1796
mW
TYP
MAX
UNITS
Pins 3, 13, 15, 31, 33 all connected to VCC
Total Power Dissipation
UNITS
Recommended AC Operating Conditions
PARAMETER
SYMBOL
CONDITIONS
MIN
RF Frequency
fRF
(Note 5)
1500
3000
MHz
LO Frequency
fLO
(Note 5)
1500
3000
MHz
fIF
(Note 5)
IF Frequency
LO Power Range
www.maximintegrated.com
PLO
-3
1000
MHz
+3
dBm
Maxim Integrated │ 2
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Modulator)
(MAX2022 Typical Application Circuit, VCC = 4.75V to 5.25V, VGND = 0V, I/Q differential inputs driven from a 100Ω differential
DC-coupled source, 0V common-mode input, PLO = 0dBm, fLO = 1900MHz to 2200MHz, 50Ω LO and RF system impedance, R1 =
432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P
differential, fIQ = 1MHz, TC = +25°C, unless otherwise noted.) (Notes 6, 7)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
BASEBAND INPUT
Baseband Input Differential
Impedance
43
BB Common-Mode Input Voltage
Range
(Note 8)
-2.5
Output Power
TC = +25°C
-24
0
Ω
+1.5
V
dBm
RF OUTPUTS (fLO = 1960MHz)
Output IP3
VBBI, VBBQ = 547mVP-P differential per
tone into 50Ω, fBB1 = 1.8MHz,
fBB2 = 1.9MHz
21.8
dBm
Output IP2
VBBI, VBBQ = 547mVP-P differential per
tone into 50Ω, fBB1 = 1.8MHz,
fBB2 = 1.9MHz
48.9
dBm
-20.5
dBm
-0.004
dB/°C
Output Power
Output Power Variation Over
Temperature
TC = -40°C to +85°C
Output-Power Flatness
fLO = 1960MHz, sweep fBB,
PRF flatness for fBB from 1MHz to 50MHz
0.6
dB
ACLR (1st Adjacent Channel
5MHz Offset)
Single-carrier WCDMA (Note 9),
RFOUT = -16dBm
70
dBc
LO Leakage
No external calibration, with each baseband
input terminated in 50Ω to GND
-46.7
dBm
Sideband Suppression
No external calibration
RF Return Loss
Output Noise Density
fmeas = 2060MHz (Note 10)
LO Input Return Loss
47.3
dBc
15.3
dB
-173.4
dBm/Hz
10.1
dB
RF OUTPUTS (fLO = 2140MHz)
Output IP3
VBBI, VBBQ = 547mVP-P differential per
tone into 50Ω, fBB1 = 1.8MHz,
fBB2 = 1.9MHz
23.3
dBm
Output IP2
VBBI, VBBQ = 547mVP-P differential per
tone into 50Ω, fBB1 = 1.8MHz,
fBB2 = 1.9MHZ
51.5
dBm
-20.8
dBm
-0.005
dB/°C
0.32
dB
Output Power
Output Power Variation Over
Temperature
TC = -40°C to +85°C
Output-Power Flatness
fLO = 2140MHz, sweep fBB,
PRF flatness for fBB from 1MHz to 50MHz
www.maximintegrated.com
Maxim Integrated │ 3
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Modulator) (continued)
(MAX2022 Typical Application Circuit, VCC = 4.75V to 5.25V, VGND = 0V, I/Q differential inputs driven from a 100Ω differential
DC-coupled source, 0V common-mode input, PLO = 0dBm, fLO = 1900MHz to 2200MHz, 50Ω LO and RF system impedance, R1 =
432Ω, R2 = 562Ω, R3 = 301Ω, TC = -40°C to +85°C. Typical values are at VCC = 5V, VBBI = 109mVP-P differential, VBBQ = 109mVP-P
differential, fIQ = 1MHz, TC = +25°C, unless otherwise noted.) (Notes 6, 7)
PARAMETER
SYMBOL
CONDITIONS
ACLR (1st Adjacent Channel
5MHz Offset)
Single-carrier WCDMA (Note 9),
RFOUT = -16dBm, fLO = 2GHz
LO Leakage
No external calibration, with each baseband
input terminated in 50Ω to GND
Sideband Suppression
No external calibration
MIN
RF Return Loss
Output Noise Density
fmeas = 2240MHz (Note 10)
LO Input Return Loss
TYP
MAX
UNITS
70
dBc
-40.4
dBm
45.7
dBc
13.5
dB
-173.2
dBm/Hz
18.1
dB
AC Electrical Characteristics (Demodulator, fLO = 1880MHz)
(MAX2022 Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses
of combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for VCC = 5V, I/Q
DC returns = 160Ω resistors to GND, PRF = 0dBm, PLO = 0dBm, fRF = 1890MHz, fLO = 1880MHz, fIF = 10MHz, TC = +25°C, unless
otherwise noted.) (Notes 6, 11)
PARAMETER
Conversion Loss
Noise Figure
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
LC
9.2
dB
NFSSB
9.4
dB
Input Third-Order
Intercept Point
IIP3
fRF1 = 1890MHz, fRF2 = 1891MHz,
PRF1 = PRF2 = 0dBm, fIF1 = 10MHz,
fIF2 = 11MHz
39
dBm
Input Second-Order
Intercept Point
IIP2
fRF1 = 1890MHz, fRF2 = 1891MHz,
PRF1 = PRF2 = 0dBm, fIF1 = 10MHz,
fIF2 = 11MHz, fIM2nd = 21MHz
58
dBm
LO Leakage at RF Port
Unnulled
-40
dBm
Gain Compression
PRF = 20dBm
0.10
dB
35
dB
17
dB
Image Rejection
RF Port Return Loss
C9 = 1.2pF
LO Port Return Loss
C3 = 22pF
9
dB
43
Ω
Minimum Demodulation 3dB
Bandwidth
>500
MHz
Minimum 1dB Gain Flatness
>450
MHz
IF Port Differential Impedance
www.maximintegrated.com
Maxim Integrated │ 4
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
AC Electrical Characteristics (Demodulator, fLO = 2855MHz)
(MAX2022 Typical Application Circuit when operated as a demodulator. I/Q outputs are recombined using network shown in Figure 5. Losses
of combining network not included in measurements. RF and LO ports are driven from 50Ω sources. Typical values are for VCC = 5V, I/Q
DC returns = 160Ω resistors to GND, PRF = 0dBm, PLO = 0dBm, fRF = 2655MHz, fLO = 2855MHz, fIF = 200MHz, TC = +25°C, unless
otherwise noted.) (Notes 6, 11)
PARAMETER
Conversion Loss
Noise Figure
SYMBOL
CONDITIONS
MAX
UNITS
LC
11.2
dB
11.4
dB
34.5
dBm
60
dBm
-31.3
dBm
IIP3
fRF1 = 2655MHz, fRF2 = 2656.2MHz,
PRF1 = PRF2 = 0dBm, fIF1 = 200MHz,
fIF2 = 198.8MHz
Input Second-Order Intercept
Point
IIP2
fRF1 = 2655MHz, fRF2 = 2656.2MHz,
PRF1 = PRF2 = 0dBm, fIF1 = 200MHz,
fIF2 = 198.8MHz, fIM2nd = 398.8MHz
LO Leakage at RF Port
Gain Compression
TYP
NFSSB
Input Third-Order Intercept Point
LO Leakage at IF Port
MIN
I+
-25.2
I-
-23.5
Q+
-26
Q-
-22.3
PRF = 20dBm
0.10
dBm
dB
I/Q Gain Mismatch
0.3
dB
I/Q Phase Mismatch
0.5
deg
RF Port Return Loss
C9 = 22pF, L1 = 4.7nH, C14 = 0.7pF
22.5
dB
LO Port Return Loss
C3 = 6.8pF
14.2
dB
43
Ω
Minimum Demodulation 3dB
Bandwidth
>500
MHz
Minimum 1dB Gain Flatness
>450
MHz
IF Port Differential Impedance
Note 5: Recommended functional range, not production tested. Operation outside this range is possible, but with degraded performance of some parameters.
Note 6: All limits include external component losses of components, PCB, and connectors.
Note 7: It is advisable not to operate the I and Q inputs continuously above 2.5VP-P differential.
Note 8: Guaranteed by design and characterization.
Note 9: Single-carrier WCDMA peak-to-average ratio of 10.5dB for 0.1% complementary cumulative distribution function.
Note 10: No baseband drive input. Measured with the baseband inputs terminated in 50Ω to GND. At low-output power levels, the
output noise density is equal to the thermal noise floor.
Note 11: It is advisable not to operate the RF input continuously above +17dBm.
www.maximintegrated.com
Maxim Integrated │ 5
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics
(MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz,
VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode
input from 0V, TC = +25°C, unless otherwise noted.)
MODULATOR
ALTERNATE CHANNEL
-66
-68
ADJACENT CHANNEL
-70
-72
-74
-74
ALTERNATE CHANNEL
-78
-78
-78
-80
-80
-80
-10
0
-40
-30
OUTPUT POWER vs. LO FREQUENCY
VI = VQ = 0.611VP-P DIFFERENTIAL
-2
-4
PLO = -3dBm, 0dBm, +3dBm
-6
-7
1.7
1.9
2.1
2.3
TC = +25°C
-5
TC = -40°C
-6
TC = +85°C
1.5
1.7
-30
-20
-2
VI = VQ = 0.611VP-P DIFFERENTIAL
-3
-4
VCC = 4.75V, 5.0V, 5.25V
-5
-6
-7
1.9
2.1
2.3
-8
2.5
1.5
1.7
1.9
2.1
2.3
LO FREQUENCY (GHz)
LO LEAKAGE vs. LO FREQUENCY
LO LEAKAGE vs. LO FREQUENCY
LO LEAKAGE vs. LO FREQUENCY
-70
1.9
2.1
LO FREQUENCY (GHz)
www.maximintegrated.com
2.3
-50
-70
PLO = 0dBm
1.7
TC = -40°C, +85°C
-30
2.5
-90
1.7
1.9
2.1
LO FREQUENCY (GHz)
2.3
-30
VCC = 4.75V, 5.0V
-50
-70
TC = +25°C
1.5
2.5
BASEBAND INPUTS TERMINATED IN 50Ω
-10
LO LEAKAGE (dBm)
LO LEAKAGE (dBm)
-50
BASEBAND INPUTS TERMINATED IN 50Ω
-10
-10
OUTPUT POWER vs. LO FREQUENCY
LO FREQUENCY (GHz)
PLO = -3dBm, +3dBm
1.5
-40
LO FREQUENCY (GHz)
-30
-90
VI = VQ = 0.611VP-P DIFFERENTIAL
-4
-8
2.5
BASEBAND INPUTS TERMINATED IN 50Ω
-10
-50
OUTPUT POWER (dBm)
MAX2022 toc08
1.5
0
OUTPUT POWER vs. LO FREQUENCY
-7
MAX2022 toc07
-8
-10
-3
OUTPUT POWER (dBm)
-3
-5
-20
FOUR CARRIER
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
-20
-76
MAX2022 toc05
-30
MAX2022 toc04
-2
OUTPUT POWER (dBm)
-72
-76
-40
ALTERNATE CHANNEL
-70
-76
OUTPUT POWER (dBm)
LO LEAKAGE (dBm)
-68
MAX2022 toc06
-72
-74
-64
MAX2022 toc09
ACLR (dB)
-70
ADJACENT CHANNEL
-62
-66
-68
MAX2022 toc03
-64
ADJACENT CHANNEL
-66
TWO CARRIER
-62
ACLR vs. OUTPUT POWER
-60
ACLR (dB)
-64
ACLR (dB)
MAX2022 toc01
SINGLE CARRIER
-62
ACLR vs. OUTPUT POWER
-60
MAX2022 toc02
ACLR vs. OUTPUT POWER
-60
VCC = 5.25V
2.5
-90
1.5
1.7
1.9
2.1
2.3
2.5
LO FREQUENCY (GHz)
Maxim Integrated │ 6
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz,
VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode
input from 0V, TC = +25°C, unless otherwise noted.)
MODULATOR
30
20
10
1.5
1.9
2.1
2.3
30
20
PLO = +3dBm
0
2.5
MAX2022 toc12
VCC = 4.75, 5.0V, 5.25V
30
20
10
1.5
1.7
1.9
2.1
2.3
0
2.5
1.5
1.7
1.9
2.1
2.3
OUTPUT NOISE vs. OUTPUT POWER
IF FLATNESS
vs. BASEBAND FREQUENCY
TC = +85°C
-170
-164
-180
-180
-15
-10
-5
0
5
10
TC = +25°C
-172
-176
-20
TC = +85°C
-168
-14
AMX2022 toc14
-160
-175
-15
-16
fLO - fIQ
-17
-18
-19
-20
fLO + fIQ
-21
-22
-23
TC = -40°C
-25
-20
-15
-10
-5
0
5
-24
10
fLO = 1960MHz, PBB = -12dBm/PORT INTO 50Ω
0
20
40
60
80
100
BASEBAND DIFFERENTIAL INPUT
RESISTANCE vs. BASEBAND FREQUENCY
BASEBAND DIFFERENTIAL INPUT
RESISTANCE vs. BASEBAND FREQUENCY
-15
-16
-17
fLO - fIQ
-18
-19
-20
-21
fLO + fIQ
-22
fLO = 2140MHz, PBB = -12dBm/PORT INTO 50Ω
20
40
60
80
BASEBAND FREQUENCY (MHz)
www.maximintegrated.com
100
45.0
44.5
VCC = 4.75V
44.0
43.5
43.0
42.5
VCC = 5.25V
VCC = 5.0V
42.0
41.5
41.0
fLO = 2GHz, PLO = 0dBm
0
20
40
60
80
BASEBAND FREQUENCY (MHz)
100
44.5
MAX2022 toc18
IF FLATNESS
vs. BASEBAND FREQUENCY
BASEBAND DIFFERENTIAL INPUT RESISTANCE (Ω)
BASEBAND FREQUENCY (MHz)
MAX2022 toc17
OUTPUT POWER (dBm)
MAX2022 toc16
OUTPUT POWER (dBm)
BASEBAND DIFFERENTIAL INPUT RESISTANCE (Ω)
-25
PLO = 0dBm, fLO = 2140MHz
IF POWER (dBm)
TC = +25°C
-165
-156
2.5
MAX2022 toc15
OUTPUT NOISE vs. OUTPUT POWER
-160
0
40
LO FREQUENCY (GHz)
TC = -40°C
-23
fBB = 1MHz, VI = VQ = 112mVP-P
50
LO FREQUENCY (GHz)
PLO = 0dBm, fLO = 1960MHz
-14
IF POWER (dBm)
PLO = 0dBm
IMAGE REJECTION vs. LO FREQUENCY
LO FREQUENCY (GHz)
-155
OUTPUT NOISE (dBm/Hz)
1.7
OUTPUT NOISE (dBm/Hz)
-150
-24
PLO = -3dBm
40
60
10
AMX2022 toc13
0
fBB = 1MHz, VI = VQ = 112mVP-P
50
IMAGE REJECTION (dB)
IMAGE REJECTION (dB)
TC = -40°C, +25°C, +85°C
IMAGE REJECTION vs. LO FREQUENCY
IMAGE REJECTION (dB)
fBB = 1MHz, VI = VQ = 112mVP-P
50
40
60
MAX2022 toc11
IMAGE REJECTION vs. LO FREQUENCY
MAX2022 toc10
60
44.0
PLO = +3dBm
43.5
43.0
42.5
PLO = 0dBm
PLO = -3dBm
fLO = 2GHz, VCC = 5.0V
0
20
40
60
80
100
BASEBAND FREQUENCY (MHz)
Maxim Integrated │ 7
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz,
VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode
input from 0V, TC = +25°C, unless otherwise noted.)
MODULATOR
VCC = 4.75V
5
1.9
2.1
2.3
0
2.5
2.1
2.3
0
2.5
1.5
1.7
1.9
2.1
OUTPUT IP3
vs. COMMON-MODE BASEBAND VOLTAGE
OUTPUT IP2
vs. LO FREQUENCY
OUTPUT IP2
vs. LO FREQUENCY
70
TC = +25°C
60
TC = +85°C
50
OIP2 (dBm)
fLO = 2140MHz
40
-1
0
1
2
30
0
3
VBB = 0.61VP-P DIFFERENTIAL PER TONE,
fBB1 = 1.8MHz, fBB2 = 1.9MHz
1.5
1.7
1.9
2.1
2.3
OUTPUT IP2
vs. COMMON-MODE BASEBAND VOLTAGE
MAX2022 toc25
OIP2 (dBm)
40
PLO = 0dBm
PLO = -3dBm
30
fLO = 1960MHz
50
50
fLO = 2140MHz
40
30
20
20
10
VBB = 0.61VP-P DIFFERENTIAL PER TONE,
fBB1 = 1.8MHz, fBB2 = 1.9MHz
10
1.5
1.7
1.9
2.1
LO FREQUENCY (GHz)
www.maximintegrated.com
2.3
2.5
0
-2
-1
0
1
1.5
1.7
1.9
2.1
2.3
2.5
0
-20
2
COMMMON-MODE BASEBAND VOLTAGE (V)
LO LEAKAGE vs. LO FREQUENCY
NULLED AT fLO = 1960MHz AT
PRF = -18dBm
-40
-60
-80
VBB = 0.61VP-P DIFFERENTIAL PER TONE,
fBB1 = 1.8MHz, fBB2 = 1.9MHz
-3
VBB = 0.61VP-P DIFFERENTIAL PER TONE,
fBB1 = 1.8MHz, fBB2 = 1.9MHz
LO FREQUENCY (GHz)
LO LEAKAGE (dBm)
PLO = +3dBm
30
0
2.5
OUTPUT IP2
vs. LO FREQUENCY
60
VCC = 5.25V
10
LO FREQUENCY (GHz)
60
40
20
COMMMON-MODE BASEBAND VOLTAGE (V)
70
2.5
50
TC = -40°C
10
-2
2.3
VCC = 4.75V, 5.0V
60
20
fLO = 1960MHz
10
-3
70
OIP2 (dBm)
VBB = 0.61VP-P DIFFERENTIAL PER TONE,
fBB1 = 1.8MHz, fBB2 = 1.9MHz
20
OIP2 (dBm)
1.9
LO FREQUENCY (GHz)
30
0
1.7
VBB = 0.61VP-P DIFFERENTIAL PER TONE,
fBB1 = 1.8MHz, fBB2 = 1.9MHz
LO FREQUENCY (GHz)
40
0
1.5
10
LO FREQUENCY (GHz)
50
OIP3 (dBm)
1.7
15
5
VBB = 0.61VP-P DIFFERENTIAL PER TONE,
fBB1 = 1.8MHz, fBB2 = 1.9MHz
MAX2022 toc23
60
5
VBB = 0.61VP-P DIFFERENTIAL PER TONE,
fBB1 = 1.8MHz, fBB2 = 1.9MHz
1.5
10
MAX2022 toc26
0
15
PLO = -3dBm
PLO = 0dBm, +3dBm
MAX2022 toc27
OIP3 (dBm)
10
MAX2022 toc22
OIP3 (dBm)
15
VCC = 5.0V, 5.25V
20
MAX2022 toc21
20
TC = -40°C, +25°C, +85°C
25
OIP3 (dBm)
20
OUTPUT IP3
vs. LO FREQUENCY
MAX2022 toc24
25
MAX2022 toc19
25
OUTPUT IP3
vs. LO FREQUENCY
MAX2022 toc20
OUTPUT IP3
vs. LO FREQUENCY
3
-100
1.945 1.950 1.955 1.960 1.965 1.970 1.975
LO FREQUENCY (GHz)
Maxim Integrated │ 8
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz,
VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode
input from 0V, TC = +25°C, unless otherwise noted.)
-76
LO LEAKAGE (dBm)
NULLED AT -10dBm
-78
-80
NULLED AT -14dBm,
-18dBm, -22dBm
-82
-84
-86
NULLED AT -10dBm
-78
-80
NULLED AT -14dBm,
-18dBm, -22dBm
-82
-84
-10
-20
fLO = 1960MHz
-40
-35
-30
-25
-20
-15
-10
-40
-35
OUTPUT POWER PRF (dBm)
-25
-20
-50
-60
-15
-90
-10
fLO = 1960MHz, NULLED AT -10dBm PRF
1.90
1.85
OUTPUT POWER PRF (dBm)
LO LEAKAGE vs. fLO WITH
LO LEAKAGE NULLED AT SPECIFIC PRF
fLO = 2140MHz, NULLED AT -10dBm PRF
-10
-30
-40
-50
-60
1.95
2.00
2.05
2.10
LO FREQUENCY (GHz)
LO LEAKAGE vs. DIFFERENTIAL
DC OFFSET ON Q-SIDE
-40
PRF = -18dBm, I-SIDE NULLED
LO LEAKAGE (dBm)
-20
LO LEAKAGE (dBm)
-30
MAX2022 toc31
0
-40
-80
-88
-90
-30
-70
-86
-88
-90
-74
-76
0
MAX2022 toc30
-72
LO LEAKAGE vs. fLO WITH
LO LEAKAGE NULLED AT SPECIFIC PRF
MAX2022 toc32
-74
fLO = 2140Hz
-70
LO LEAKAGE (dBm)
-72
LO LEAKAGE vs. PRF WITH
LO LEAKAGE NULLED AT SPECIFIC PRF
MAX2022 toc29
-70
LO LEAKAGE (dBm)
-68
MAX2022 toc28
-68
MODULATOR
LO LEAKAGE vs. PRF WITH
LO LEAKAGE NULLED AT SPECIFIC PRF
fLO = 2140MHz fLO = 1960MHz
-50
-60
-70
-70
-80
2.00
2.05
2.10
2.15
2.20
-80
2.25
LO FREQUENCY (GHz)
1.8MHz
50
40
30
9MHz
20
10
0
fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 1960MHz,
1.8MHz BASEBAND TONE NULLED AT
PRF = -20dBm
-30
-25
-20
-15
MODULATOR POUT (dBm)
www.maximintegrated.com
-13
-12
-11
-10
-9
-8
-10
SIDEBAND SUPRESSION vs. PRF
70
SIDEBAND SUPPRESSION (dB)
MAX2022 toc33
SIDEBAND SUPPRESSION (dB)
60
-14
DC DIFFERENTIAL OFFSET ON Q-SIDE (mV)
SIDEBAND SUPRESSION vs. PRF
70
-15
MAX2022 toc34
-90
60
50
40
9MHz
1.8MHz
30
20
10
0
fBB1 = 1.8MHz, fBB2 = 9MHz, fLO = 2140MHz,
1.8MHz BASEBAND TONE NULLED AT
PRF = -20dBm
-30
-25
-20
-15
-10
MODULATOR POUT (dBm)
Maxim Integrated │ 9
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz,
VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode
input from 0V, TC = +25°C, unless otherwise noted.)
-10
VCC = 4.75V, 5.0V, 5.25V
-15
MAX2022 toc36
-5
LO PORT MATCH (dB)
-5
LO PORT MATCH
vs. LO FREQUENCY
0
MAX2022 toc35
0
RF PORT MATCH (dB)
MODULATOR
RF PORT MATCH
vs. LO FREQUENCY
VCC = 4.75V, 5.0V, 5.25V
-10
-15
-20
-25
1.5
1.7
1.9
2.1
2.3
-30
2.5
1.5
1.7
LO PORT MATCH
vs. LO FREQUENCY
10
-5
LO PORT MATCH (dB)
-10
-15
PLO = -3dBm
-20
PLO = 0dBm
-25
-30
-35
6
4
2
0
-2
-4
TC = -40°C, +25°C, +85°C
-10
1.5
1.7
1.9
2.1
2.3
2.5
4
2
0
-2
-4
TC = -40°C, +25°C, +85°C
-6
-8
-10
18
MAX2022 toc40
6
13
TOTAL SUPPLY CURRENT
vs. TEMPERATURE (TC)
340
TOTAL SUPPLY CURRENT (mA)
OUTPUT POWER (dBm)
MAX2022 toc39
PLO = 2140MHz
*PIN IS THE AVAILABLE
POWER FROM ONE OF
THE FOUR 50Ω
BASEBAND SOURCES
8
INPUT POWER (PIN*) (dBm)
OUTPUT POWER vs. INPUT POWER (PIN*)
8
3
-2
LO FREQUENCY (GHz)
10
2.5
-8
-45
-50
2.3
fLO = 1960MHz
*PIN IS THE AVAILABLE
POWER FROM ONE OF
THE FOUR 50Ω
BASEBAND SOURCES
-6
PLO = +3dBm
-40
2.1
OUTPUT POWER vs. INPUT POWER (PIN*)
8
OUTPUT POWER (dBm)
MAX2022 toc37
0
1.9
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
MAX2022 toc38
-20
320
VCC = 5.25V
300
280
VCC = 5.0V
260
VCC = 4.75V
3
-2
8
13
INPUT POWER (PIN*) (dBm)
www.maximintegrated.com
18
240
-40
-15
10
35
60
85
TEMPERATURE (°C)
Maxim Integrated │ 10
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, 50Ω LO input, R1 = 432Ω, R2 = 562Ω, R3 = 301Ω, VCC = 5V, PLO = 0dBm, fLO = 2140MHz,
VI = VQ = 109mVP-P differential, fIQ = 1MHz, I/Q differential inputs driven from a 100Ω differential DC-coupled source, common-mode
input from 0V, TC = +25°C, unless otherwise noted.)
80
75
VCC = 5.0V
VCC = 4.75V
65
-40
70
-15
10
35
60
30
-40
-15
10
35
60
TEMPERATURE (°C)
VCCLOI2 SUPPLY CURRENT
vs. TEMPERATURE (TC)
VCCLOQ1 SUPPLY CURRENT
vs. TEMPERATURE (TC)
VCC = 5.25V
55
55
VCC = 5.0V
VCC = 4.75V
45
-40
VCC = 4.75V
35
85
60
40
VCC = 5.0V
40
TEMPERATURE (°C)
65
50
45
VCCLOQ1 SUPPLY CURRENT (mA)
60
VCC = 5.25V
-15
10
35
60
50
VCC = 5.25V
45
VCC = 5.0V
40
VCC = 4.75V
35
30
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
MAX2022 toc45
VCCLOQ2 SUPPLY CURRENT
vs. TEMPERATURE (TC)
70
VCCLOQ2 SUPPLY CURRENT (mA)
85
MAX2022 toc44
70
50
MAX2022 toc42
VCCLOI1 SUPPLY CURRENT (mA)
MAX2022 toc41
VCC = 5.25V
85
VCCLOI1 SUPPLY CURRENT
vs. TEMPERATURE (TC)
55
MAX2022 toc43
VCCLOA SUPPLY CURRENT (mA)
90
VCCLOI2 SUPPLY CURRENT (mA)
MODULATOR
VCCLOA SUPPLY CURRENT
vs. TEMPERATURE (TC)
VCC = 5.25V
65
60
55
VCC = 5.0V
VCC = 4.75V
50
45
40
-40
-15
10
35
60
85
TEMPERATURE (°C)
www.maximintegrated.com
Maxim Integrated │ 11
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics
(MAX2022 Typical Application Circuit, RF and LO ports tuned for 1500MHz to 2400MHz as noted in Table 1. I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. VCC = 5.0V, GND = 0V, PRF = 0dBm,
PLO = 0dBm, fIF = 20MHz, fLO > fRF, intermodulation delta frequency = 1.2MHz, 50Ω LO and RF system impedance, TC = +25°C unless otherwise noted.)
DEMODULATOR LOW BAND TUNING (VARIABLE LO)
9
7
10
9
8
TC = -40°C
1480
PLO = -3dBm, 0dBm, +3dBm
1780
2080
7
2380
1480
RF FREQUENCY (MHz)
2080
MAX2022 toc48
9
7
2380
1480
35
TC = +25°C
30
1780
2080
2380
RF FREQUENCY (MHz)
40
PRF = 0dBm/TONE
PLO = 0dBm, +3dBm
INPUT IP3 (dBm)
INPUT IP3 (dBm)
1780
INPUT IP3 vs. RF FREQUENCY
40
MAX2022 toc49
PRF = 0dBm/TONE
TC = +85°C
VCC = 4.75V, 5.0V, 5.25V
10
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
40
11
8
35
PLO = -3dBm
30
INPUT IP3 vs. RF FREQUENCY
PRF = 0dBm/TONE
VCC = 5.0V
VCC = 5.25V
INPUT IP3 (dBm)
8
11
MAX2022 toc51
TC = +25°C
12
MAX2022 toc50
TC = +85°C
CONVERSION LOSS
vs. RF FREQUENCY
MAX2022 toc47
MAX2022 toc46
11
10
12
CONVERSION LOSS (dB)
CONVERSION LOSS (dB)
12
CONVERSION LOSS
vs. RF FREQUENCY
CONVERSION LOSS (dB)
CONVERSION LOSS
vs. RF FREQUENCY
35
VCC = 4.75V
30
TC = -40°C
25
1480
1780
2080
RF FREQUENCY (MHz)
www.maximintegrated.com
2380
25
25
1480
1780
2080
RF FREQUENCY (MHz)
2380
1480
1780
2080
2380
RF FREQUENCY (MHz)
Maxim Integrated │ 12
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, RF and LO ports tuned for 1500MHz to 2400MHz as noted in Table 1. I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. VCC = 5.0V, GND = 0V, PRF = 0dBm,
PLO = 0dBm, fIF = 20MHz, fLO > fRF, intermodulation delta frequency = 1.2MHz, 50Ω LO and RF system impedance, TC = +25°C unless otherwise noted.)
DEMODULATOR LOW BAND TUNING (VARIABLE LO)
IMAGE REJECTION (dB)
60
50
40
30
20
TC = -40°C
2080
1800
2100
20
25
30
2400
MAX2022 toc54
15
1500
2000
2500
LO FREQUENCY (MHz)
RF FREQUENCY (MHz)
RF PORT RETURN LOSS
vs. RF FREQUENCY
LO PORT RETURN LOSS
vs. LO FREQUENCY
LO PORT RETURN LOSS
vs. LO FREQUENCY
15
20
25
2000
2500
RF FREQUENCY (MHz)
www.maximintegrated.com
3000
0
PLO = 0dBm
10
20
30
40
PLO = -3dBm
1500
2000
PLO = +3dBm
2500
LO FREQUENCY (MHz)
3000
0
LO PORT RETURN LOSS (dB)
VCC = 4.75V, 5.0V, 5.25V
10
1500
1500
PLO = -3dBm, 0dBm, +3dBm
10
RF FREQUENCY (MHz)
5
30
10
2380
MAX2022 toc55
RF PORT RETURN LOSS (dB)
0
1780
MAX2022 toc56
1480
LO PORT RETURN LOSS (dB)
40
5
VCC = 4.75V, 5.0V, 5.25V
3000
MAX2022 toc57
TC = +25°C
RF PORT RETURN LOSS
vs. RF FREQUENCY
0
RF PORT RETURN LOSS (dB)
TC = +85°C
70
50
MAX2022 toc53
PRF = 0dBm/TONE
MAX2022 toc52
80
INPUT IP2 (dBm)
IMAGE REJECTION
vs. LO FREQUENCY
INPUT IP2 vs. RF FREQUENCY
10
20
30
40
1500
2000
2500
3000
LO FREQUENCY (MHz)
Maxim Integrated │ 13
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics
(MAX2022 Typical Application Circuit, RF and LO ports tuned for 2400MHz to 3000MHz as noted in Table 1. I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. VCC = 5.0V, GND = 0V, PRF = 0dBm,
PLO = 0dBm, fIF = 20MHz, fLO > fRF, intermodulation delta frequency = 1.2MHz, 50Ω LO and RF system impedance, TC = +25°C, unless otherwise noted.)
DEMODULATOR HIGH BAND TUNING (VARIABLE LO)
11
9
TC = -40°C
2380
2580
2780
11
10
9
2980
PLO = -3dBm, 0dBm, +3dBm
2380
RF FREQUENCY (MHz)
34
PLO = +3dBm
36
34
PLO = -3dBm
30
2580
2780
RF FREQUENCY (MHz)
www.maximintegrated.com
PLO = 0dBm
2980
30
2580
2780
RF FREQUENCY (MHz)
MAX2022 toc60
2780
2980
INPUT IP3 vs. RF FREQUENCY
PRF = 0dBm/TONE
38
VCC = 5.25V
VCC = 5.0V
36
34
30
2380
2580
VCC = 4.75V
32
32
TC = -40°C
2380
2380
40
INPUT IP3 (dBm)
36
32
10
RF FREQUENCY (MHz)
PRF = 0dBm/TONE
38
INPUT IP3 (dBm)
TC = +25°C
VCC = 4.75V, 5.0V, 5.25V
11
9
2980
INPUT IP3 vs. RF FREQUENCY
40
MAX2022 toc61
38
INPUT IP3 (dBm)
PRF = 0dBm/TONE
TC = +85°C
2780
12
RF FREQUENCY (MHz)
INPUT IP3 vs. RF FREQUENCY
40
2580
MAX2022 toc62
10
12
MAX2022 toc63
TC = +85°C
CONVERSION LOSS
vs. RF FREQUENCY
13
MAX2022 toc59
MAX2022 toc58
TC = +25°C
12
13
CONVERSION LOSS (dB)
CONVERSION LOSS (dB)
13
CONVERSION LOSS
vs. RF FREQUENCY
CONVERSION LOSS (dB)
CONVERSION LOSS
vs. RF FREQUENCY
2980
2380
2580
2780
2980
RF FREQUENCY (MHz)
Maxim Integrated │ 14
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Operating Characteristics, RF and LO ports tuned for 2400MHz to 3000MHz as noted in Table 1. I/Q outputs are
recombined using network shown in Figure 5. Losses of combining network not included in measurements. VCC = 5.0V, GND = 0V,
PRF = 0dBm, PLO = 0dBm, fIF = 20MHz, fLO > fRF, intermodulation delta frequency = 1.2MHz, 50Ω LO and RF system impedance, TC
= +25°C, unless otherwise noted.)
DEMODULATOR HIGH BAND TUNING (VARIABLE LO)
50
2580
2780
10
2980
RF FREQUENCY (MHz)
RF PORT RETURN LOSS
vs. RF FREQUENCY
5
10
VCC = 4.75V, 5.0V, 5.25V
15
20
25
1500
2000
2500
RF FREQUENCY (MHz)
www.maximintegrated.com
3000
2400
0
LO PORT RETURN LOSS (dB)
MAX2022 toc67
RF PORT RETURN LOSS (dB)
0
2600
2800
PLO = -3dBm, 0dBm, +3dBm
20
1500
2000
2500
RF FREQUENCY (MHz)
LO PORT RETURN LOSS
vs. LO FREQUENCY
LO PORT RETURN LOSS
vs. LO FREQUENCY
PLO = 0dBm
10
15
20
PLO = -3dBm
25
PLO = +3dBm
1500
15
LO FREQUENCY (MHz)
5
30
10
25
3000
MAX2022 toc66
MAX2022 toc65
20
5
2000
2500
LO FREQUENCY (MHz)
3000
0
3000
MAX2022 toc69
TC = -40°C
RF PORT RETURN LOSS (dB)
60
30
RF PORT RETURN LOSS
vs. RF FREQUENCY
0
LO PORT RETURN LOSS (dB)
70
40
MAX2022 toc68
TC = +25°C
2380
50
IMAGE REJECTION (dB)
INPUT IP2 (dBm)
TC = +85°C
MAX2022 toc64
PRF = 0dBm/TONE
80
40
IMAGE REJECTION
vs. LO FREQUENCY
INPUT IP2 vs. RF FREQUENCY
90
5
VCC = 4.75V, 5.0V, 5.25V
10
15
20
25
30
1500
2000
2500
3000
LO FREQUENCY (MHz)
Maxim Integrated │ 15
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Operating Characteristics (continued)
(MAX2022 Typical Application Circuit, RF and LO ports tuned for 2400MHz to 3000MHz as noted in Table 1. I/Q outputs are recombined
using network shown in Figure 5. Losses of combining network not included in measurements. VCC = 5.0V, GND = 0V, PRF = 0dBm, PLO
= 0dBm, fLO = 2855MHz, fIF = fLO - fRF, intermodulation delta frequency = 1.2MHz, 50Ω LO and RF system impedance, TC = +25°C,
unless otherwise noted.)
DEMODULATOR HIGH BAND TUNING (FIXED LO)
2200
2360
2520
2680
0
-0.05
-0.10
2840
170
10
INPUT IP3 vs. RF FREQUENCY
1
0
-1
-2
650
10
170
PRF = 0dBm/TONE
fLO = 2855MHz
38
330
490
650
IF FREQUENCY (MHz)
80
MAX2022 toc73
40
INPUT IP2 vs. RF FREQUENCY
IF1+IF2 TERM
PRF = 0dBm/TONE
fLO = 2855MHz
70
INPUT IP2 (dBm)
INPUT IP3 (dBm)
490
fLO = 2855MHz
IF FREQUENCY (MHz)
RF FREQUENCY (MHz)
36
34
60
50
32
30
330
2
MAX2022 toc72
0.05
I/Q PHASE MISMATCH
vs. IF FREQUENCY
MAX2022 toc74
10
fLO = 2855MHz
I/Q PHASE MISMATCH (DEG)
11
9
0.10
MAX2022 toc70
fLO = 2855MHz
I/Q GAIN MISMATCH (dB)
CONVERSION LOSS (dB)
12
I/Q GAIN MISMATCH
vs. IF FREQUENCY
MAX2022 toc71
CONVERSION LOSS
vs. RF FREQUENCY
2200
2400
2600
RF FREQUENCY (MHz)
www.maximintegrated.com
2800
40
2200
2400
2600
2800
RF FREQUENCY (MHz)
Maxim Integrated │ 16
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Pin Configuration/Functional Diagram
GND
VCCLOQ1
GND
VCCLOQ2
GND
GND
GND
36
35
34
33
32
31
30
29
28
1
RBIASLO1
6
N.C.
7
RBIASLO2
8
GND
9
∑
BIAS
LO1
BIAS
LO2
10
11
12
27
GND
26
BBQP
25
BBQN
24
GND
23
RF
22
GND
21
BBIN
20
BBIP
19 GND
EP
13
14
15
16
17
GND
5
GND
GND
90°
0°
VCCLOI2
4
GND
LO
VCCLOI1
3
GND
VCCLOA
GND
2
GND
RBIASLO3
MAX2022
BIAS
LO3
18
GND
GND
GND
+
GND
TOP VIEW
TQFN
(6mm x 6mm)
Pin Description
PIN
NAME
1, 5, 9–12, 14, 16–19, 22, 24,
27–30, 32, 34, 35, 36
GND
2
RBIASLO3
3
VCCLOA
4
LO
6
RBIASLO1
7
N.C.
8
RBIASLO2
13
VCCLOI1
15
VCCLOI2
20
BBIP
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FUNCTION
Ground
3rd LO Amplifier Bias. Connect a 301Ω resistor to ground.
LO Input Buffer Amplifier Supply Voltage
Local Oscillator Input. 50Ω input impedance.
1st LO Input Buffer Amplifier Bias. Connect a 432Ω resistor to ground.
No internal connection and can be connected to ground or left open.
2nd LO Amplifier Bias. Connect a 562Ω resistor to ground.
I-Channel 1st LO Amplifier Supply Voltage
I-Channel 2nd LO Amplifier Supply Voltage
Baseband In-Phase Positive Input
Maxim Integrated │ 17
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Pin Description (continued)
PIN
NAME
21
BBIN
FUNCTION
23
RF
25
BBQN
Baseband Quadrature Negative Input
26
BBQP
Baseband Quadrature Positive Input
Baseband In-Phase Negative Input
RF Port
31
VCCLOQ2
Q-Channel 2nd LO Amplifier Supply Voltage
33
VCCLOQ1
Q-Channel 1st LO Amplifier Supply Voltage
—
EP
Exposed Ground Paddle. The exposed paddle MUST be soldered to the
ground plane using multiple vias.
Detailed Description
The MAX2022 is designed for upconverting differential
in-phase (I) and quadrature (Q) inputs from baseband to
a 1500MHz to 3000MHz RF frequency range. The device
can also be used as a demodulator, downconverting an
RF input signal directly to baseband or an IF frequency.
Applications include single and multicarrier 1500MHz
to 3000MHz UMTS/WCDMA, LTE/TD-LTE, cdma2000,
and DCS/PCS base stations. Direct conversion architectures are advantageous since they significantly reduce
transmitter or receiver cost, part count, and power consumption as compared to traditional IF-based doubleconversion systems.
The MAX2022 integrates internal baluns, an LO buffer, a
phase splitter, two LO driver amplifiers, two matched double-balanced passive mixers, and a wideband quadrature
combiner. Precision matching between the in-phase and
quadrature channels, and highly linear mixers achieves
excellent dynamic range, ACLR, 1dB compression point,
and LO and sideband suppression, making it ideal for
four-carrier WCDMA/UMTS operation.
LO Input Balun, LO Buffer, and Phase Splitter
The MAX2022 requires a single-ended LO input, with a
nominal power of 0dBm. An internal low-loss balun at
the LO input converts the single-ended LO signal to a
differential signal at the LO buffer input. In addition, the
internal balun matches the buffer’s input impedance to
50Ω over the entire band of operation.
The output of the LO buffer goes through a phase splitter,
which generates a second LO signal that is shifted by 90°
with respect to the original. The 0° and 90° LO signals
drive the I and Q mixers, respectively.
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LO Driver
Following the phase splitter, the 0° and 90° LO signals are
each amplified by a two-stage amplifier to drive the I and
Q mixers. The amplifier boosts the level of the LO signals
to compensate for any changes in LO drive levels. The
two-stage LO amplifier allows a wide input power range
for the LO drive. While a nominal LO power of 0dBm is
specified, the MAX2022 can tolerate LO level swings from
-3dBm to +3dBm.
I/Q Modulator
The MAX2022 modulator is composed of a pair of
matched double-balanced passive mixers and a balun.
The I and Q differential baseband inputs accept signals
from DC to beyond 500MHz with differential amplitudes
up to 2VP-P differential (common-mode input equals 0V).
The wide input bandwidth allows for direct interface with
the baseband DACs. No active buffer circuitry between
the baseband DAC and the MAX2022 is required.
The I and Q signals directly modulate the 0° and 90° LO
signals and are upconverted to the RF frequency. The
outputs of the I and Q mixers are combined through a
balun to a singled-ended RF output.
Applications Information
LO Input Drive
The LO input of the MAX2022 requires a single-ended
drive at a 1500MHz to 3000MHz frequency. It is internally
matched to 50Ω. An integrated balun converts the singleended input signal to a differential signal at the LO buffer
differential input. An external DC-blocking capacitor is the
only external part required at this interface. The LO input
power should be within the -3dBm to +3dBm range.
Maxim Integrated │ 18
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Modulator Baseband I/Q Input Drive
The MAX2022 I and Q baseband inputs should be driven
differentially for best performance. The baseband inputs
have a 50Ω differential input impedance. The optimum
source impedance for the I and Q inputs is 100Ω differential. This source impedance will achieve the optimal signal
transfer to the I and Q inputs, and the optimum output RF
impedance match. The MAX2022 can accept input power
levels of up to +12dBm on the I and Q inputs. Operation
with complex waveforms, such as CDMA or WCDMA
carriers, utilize input power levels that are far lower. This
lower power operation is made necessary by the high
peak-to-average ratios of these complex waveforms. The
peak signals must be kept below the compression level of
the MAX2022. The input common-mode voltage should
be confined to the -2V to +1.5V DC range.
The MAX2022 is designed to interface directly with Maxim
high-speed DACs. This generates an ideal total transmitter lineup, with minimal ancillary circuit elements. Such
DACs include the MAX5875 series of dual DACs, and
the MAX5895 dual interpolating DAC. These DACs have
ground-referenced differential current outputs. Typical
termination of each DAC output into a 50Ω load resistor
to ground, and a 10mA nominal DC output current results
in a 0.5V common-mode DC level into the modulator I/Q
inputs. The nominal signal level provided by the DACs will
MAX5895
DUAL 16-BIT INTERP DAC
be in the -12dBm range for a single CDMA or WCDMA
carrier, reducing to -18dBm per carrier for a four-carrier
application.
The I/Q input bandwidth is greater than 50MHz at -0.1dB
response. The direct connection of the DAC to the
MAX2022 insures the maximum signal fidelity, with no
performance-limiting baseband amplifiers required. The
DAC output can be passed through a lowpass filter to
remove the image frequencies from the DAC’s output
response. The MAX5895 dual interpolating DAC can be
operated at interpolation rates up to x8. This has the benefit of moving the DAC image frequencies to a very high,
remote frequency, easing the design of the baseband
filters. The DAC’s output noise floor and interpolation
filter stopband attenuation are sufficiently good to insure
that the 3GPP noise floor requirement is met for large
frequency offsets, 60MHz for example, with no filtering
required on the RF output of the modulator.
Figure 1 illustrates the ease and efficiency of interfacing the MAX2022 with a Maxim DAC, in this case the
MAX5895 dual 16-bit interpolating-modulating DAC.
The MAX5895 DAC has programmable gain and differential offset controls built in. These can be used to
optimize the LO leakage and sideband suppression of the
MAX2022 quadrature modulator.
50Ω
MAX2022
RF MODULATOR
BBI
50Ω
FREQ
50Ω
0°
LO
I/Q GAIN AND
OFFSET ADJUST
90°
∑
RF
50Ω
FREQ
50Ω
BBQ
50Ω
Figure 1. MAX5895 DAC Interfaced with MAX2022
www.maximintegrated.com
Maxim Integrated │ 19
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
RF Output
illustrates a complete transmitter lineup for a multicarrier
WCDMA transmitter in the UMTS band.
The MAX2022 utilizes an internal passive mixer architecture. This enables a very low noise floor of -173.2dBm/Hz
for low-level signals, below about -20dBm output power
level. For higher output level signals, the noise floor will
be determined by the internal LO noise level at approximately -162dBc/Hz.
The MAX5895 dual interpolating-modulating DAC is
operated as a baseband signal generator. For generation of four carriers of WCDMA modulation, and digital
predistortion, an input data rate of 61.44 or 122.88Mbps
can be used. The DAC can then be programmed to
operate in x8 or x4 interpolation mode, resulting in a
491.52Msps output sample rate. The DAC will generate four carriers of WCDMA modulation with an ACLR
typically greater than 77dB under these conditions. The
output power will be approximately -18dBm per carrier,
with a noise floor typically less than -144dBc/Hz.
The I/Q input power levels and the insertion loss of the
device will determine the RF output power level. The input
power is the function of the delivered input I and Q voltages to the internal 50Ω termination. For simple sinusoidal
baseband signals, a level of 89mVP-P differential on the I
and the Q inputs results in an input power level of -17dBm
delivered to the I and Q internal 50Ω terminations. This
results in a -23.5dBm RF output power.
The MAX5895 DAC has built-in gain and offset fine
adjustments. These are programmable by a 3-wire serial
logic interface. The gain adjustment can be used to adjust
the relative gains of the I and Q DAC outputs. This feature
can be used to improve the native sideband suppression
of the MAX2022 quadrature modulator. The gain adjustment resolution of 0.01dB allows sideband nulling down
to approximately -60dB. The offset adjustment can similarly be used to adjust the offset DC output of each I and
Q DAC. These offsets can then be used to improve the
native LO leakage of the MAX2022. The DAC resolution
of 4 LSBs will yield nulled LO leakage of typically less
than -50dBc relative to four-carrier output levels.
Generation of WCDMA Carriers
The MAX2022 quadrature modulator makes an ideal signal source for the generation of multiple WCDMA carriers.
The combination of high OIP3 and exceptionally low output noise floor gives an unprecedented output dynamic
range. The output dynamic range allows the generation of
four WCDMA carriers in the UMTS band with a noise floor
sufficiently low to meet the 3GPP specification requirements with no additional RF filtering. This promotes an
extremely simple and efficient transmitter lineup. Figure 2
MAX5895
I
L-C FILTER
MAX2022
RF-MODULATOR
MAX2057
+12dB
I
I/Q GAIN AND
OFFSET ADJUST
∑
TX
OUTPUT
Q
Q
SYNTH
CLOCK
Figure 2. Complete Transmitter Lineup for a Multicarrier WCDMA in the UMTS Band
www.maximintegrated.com
Maxim Integrated │ 20
MAX2022
The DAC outputs must be filtered by baseband filters to
remove the image frequency signal components. The
baseband signals for four-carrier operation cover DC
to 10MHz. The image frequency appears at 481MHz to
491MHz. This very large frequency spread allows the
use of very low-complexity lowpass filters, with excellent
in-band gain and phase performance. The low DAC noise
floor allows for the use of a very wideband filter, since
the filter is not necessary to meet the 3GPP noise floor
specification.
The MAX2022 quadrature modulator then upconverts the
baseband signals to the RF output frequency. The output
power of the MAX2022 will be approximately -28dBm
per carrier. The noise floor will be less than -169dBm/Hz,
with an ACLR typically greater than 65dBc. This performance meets the 3GPP specification requirements with
substantial margins. The noise floor performance will be
maintained for large offset frequencies, eliminating the
need for subsequent RF filtering in the transmitter lineup.
The RF output from the MAX2022 is then amplified by
a combination of a low-noise amplifier followed by a
MAX2057 RF-VGA. This VGA can be used for lineup
compensation for gain variance of transmitter and power
amplifier elements. No significant degradation of the
signal or noise levels will be incurred by this additional
amplification. The MAX2057 will deliver an output power
of -6dBm per carrier, 0dBm total at an ACLR of 65dB and
noise floor of -142dBc/Hz.
External Diplexer
LO leakage at the RF port can be nulled to a level less
than -80dBm by introducing DC offsets at the I and Q
ports. However, this null at the RF port can be compromised by an improperly terminated I/Q interface. Care
must be taken to match the I/Q ports to the external
circuitry. Without matching, the LO’s second-order term
(2fLO) it may reflect back into the modulator’s I/Q ports
where it can remix with the internal LO signal to produce
additional LO leakage at the RF output. This reflection
effectively counteracts against the LO nulling. In addition, the LO signal reflected at the I/Q IF port produces
a residual DC term that can disturb the nulling condition.
www.maximintegrated.com
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
C = 2.2pF
50Ω
I
MAX2022
RF MODULATOR
L = 11nH
50Ω
C = 2.2pF LO
0°
90°
∑
RF
50Ω
Q
L = 11nH
C = 2.2pF
50Ω
Figure 3. Diplexer Network Recommended for UMTS
Transmitter Applications
As demonstrated in Figure 3, providing an RC termination
on each of the I+, I-, Q+, Q- ports reduces the amount of
LO leakage present at the RF port under varying temperature, LO frequency, and baseband termination conditions.
See the Typical Operating Characteristics for details. Note
that the resistor value is chosen to be 50Ω with a corner
frequency 1 / (2�RC) selected to adequately filter the fLO
and 2fLO leakage, yet not affecting the flatness of the
baseband response at the highest baseband frequency.
The common-mode fLO and 2fLO signals at I+/I- and
Q+/Q- effectively see the RC networks and thus become
terminated in 25Ω (R/2). The RC network provides a path
for absorbing the 2fLO and fLO leakage, while the inductor provides high impedance at fLO and 2fLO to help the
diplexing process.
Maxim Integrated │ 21
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
RF Demodulator
The MAX2022 can also be used as an RF demodulator
(see Figure 4), downconverting an RF input signal directly
to baseband. The single-ended RF input accepts signals
from 1500MHz to 3000MHz. The passive mixer architecture produces a conversion loss of typically 9.2dB and a
noise figure of 9.4dB. The downconverter is optimized
for high linearity of typically +39dBm IIP3. A wide I/Q port
bandwidth allows the port to be used as an image-reject
mixer for downconversion to a quadrature IF frequency.
The RF and LO inputs are internally matched to 50Ω.
Thus, no matching components are required, and only
DC-blocking capacitors are needed for interfacing.
Demodulator Output Port Considerations
Much like in the modulator case, the four baseband ports
require some form of DC return to establish a common
mode that the on-chip circuitry drives. This is achieved
by directly DC-coupling to the baseband ports (staying
MAX2022
The network Ca, Ra, La, and Cb form a highpass/lowpass
network to terminate the high frequencies into a load
while passing the desired lower IF frequencies. Elements
La, Cb, Lb, Cc, Lc, and Cd provide a possible impedance
transformer. Depending on the impedance being transformed and the desired bandwidth, a fewer number of elements can be used. It is suggested that La and Cb always
be used since they are part of the high-frequency diplexer.
If power matching is not a concern, then this reduces the
elements to just the diplexer.
DIPLEXER/
DC RETURN
90
RF
within the -2.5V to +1.5V common-mode range), through
an inductor to ground, or through a low-value resistor to
ground. Figure 6 shows a typical network that would be
used to connect to each baseband port for demodulator
operation. This network provides a common-mode DC
return, implements a high-frequency diplexer to terminate
unwanted RF terms, and also provides an impedance
transformation to a possible higher impedance baseband
amplifier.
MATCHING
ADC
MATCHING
ADC
LO
0
DIPLEXER/
DC RETURN
Figure 4. MAX2022 Demodulator Configuration
I+
3dB PAD
DC BLOCK
0°
MINI-CIRCUITS
ZFSCJ-2-1
I-
3dB PAD
DC BLOCK
180°
3dB PADS LOOK LIKE 160Ω TO GROUND
AND PROVIDES THE COMMON-MODE
DC RETURN FOR THE ON-CHIP CIRCUITRY.
Q+
3dB PAD
DC BLOCK
0°
MINI-CIRCUITS
ZFSCJ-2-1
Q-
3dB PAD
DC BLOCK
MINI-CIRCUITS
ZFSC-2-1W-S+
0° COMBINER
90°
180°
Figure 5. Demodulator Combining Diagram
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Maxim Integrated │ 22
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Ld
Ra
Ca
MAX2022
I/Q OUTPUTS
Rb
La
Lb
Cb
Lc
Cc
Cd
Ce
EXTERNAL
STAGE
Figure 6. Baseband Port Typical Filtering and DC Return Network
Resistor Rb provides a DC return to set the commonmode voltage. In this case, due to the on-chip circuitry,
the voltage is approximately 0V DC. It can also be used
to reduce the load impedance of the next stage. Inductor
Ld can provide a bit of high-frequency gain peaking for
wideband IF systems. Capacitor Ce is a DC block.
Typical values for Ca, Ra, La, and Cb would be 1.5pF,
50Ω, 11nH, and 4.7pF, respectively. These values can
change depending on the LO, RF, and IF frequencies
used. Resistor Rb is in the 50Ω to 200Ω range.
The circuitry presented in Figure 6 does not allow for
LO leakage at RF port nulling. Depending on the LO at
RF leakage requirement, a trim voltage may need to be
introduced on the baseband ports to null the LO leakage.
Power Scaling with Changes to the Bias
Resistors
Bias currents for the LO buffers are optimized by fine tuning resistors R1, R2, and R3. Maxim recommends using
±1%-tolerance resistors; however, standard ±5% values
can be used if the ±1% components are not readily available. The resistor values shown in the Typical Application
Circuit were chosen to provide peak performance for the
entire 1500MHz to 3000MHz band. If desired, the current
can be backed off from this nominal value by choosing
different values for R1, R2, and R3. Contact the factory
for additional details.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin
traces directly to the exposed pad under the package. The PCB exposed paddle MUST be connected
to the ground plane of the PCB. It is suggested that
www.maximintegrated.com
multiple vias be used to connect this pad to the lowerlevel ground planes. This method provides a good RF/
thermal conduction path for the device. Solder the
exposed pad on the bottom of the device package to
the PCB. The MAX2022 evaluation kit can be used as
a reference for board layout. Gerber files are available
upon request at www.maximintegrated.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass all VCC pins with 22pF
and 0.1µF capacitors placed as close to the pins as possible. The smallest capacitor should be placed closest to
the device.
To achieve optimum performance, use good voltagesupply layout techniques. The MAX2022 has several RF
processing stages that use the various VCC pins, and
while they have on-chip decoupling, off-chip interaction
between them may degrade gain, linearity, carrier suppression, and output power-control range. Excessive
coupling between stages may degrade stability.
Exposed Pad RF/Thermal Considerations
The EP of the MAX2022’s 36-pin thin QFN-EP package
provides a low thermal-resistance path to the die. It is
important that the PCB on which the IC is mounted be
designed to conduct heat from this contact. In addition,
the EP provides a low-inductance RF ground path for the
device.
The exposed paddle (EP) MUST be soldered to a ground
plane on the PCB either directly or through an array of
plated via holes. An array of 9 vias, in a 3 x 3 array, is
suggested. Soldering the pad to ground is critical for
efficient heat transfer. Use a solid ground plane wherever
possible.
Maxim Integrated │ 23
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Table 1. Component List Referring to the Typical Application Circuit
COMPONENT
VALUE
C1, C6, C7, C10, C13
22pF
22pF ±5%, 50V C0G ceramic capacitors (0402)
C2, C5, C8, C11, C12
0.1µF
0.1µF ±10%, 16V X7R ceramic capacitors (0603)
C3
C9
C16
22pF
22pF ±5%, 50V C0G ceramic capacitor (0402), fLO = 1500MHz to 2400MHz
6.8pF
6.8pF ±5%, 50V C0G ceramic capacitor (0402), fLO = 2400MHz to 3000MHz
1.2pF
1.2pF ±0.1pF, 50V C0G ceramic capacitor (0402), fRF = 1500MHz to 2400MHz
22pF
22pF ±5%, 50V C0G ceramic capacitor (0402), fRF = 2400MHz to 3000MHz
Short
Replace with a short circuit or 0Ω resistor (0402), fRF = 1500MHz to 2400MHz
0.7pF
0.7pF ±0.1pF, 50V C0G ceramic capacitor (0402), fRF = 2400MHz to 3000MHz
Not Used
L1
DESCRIPTION
Not installed for fRF = 1500MHz to 2400MHz
4.7nH
4.7nH ±0.3nH inductor (0402) for fRF = 2400MHz to 3000MHz
R1
432Ω
432Ω ±1% resistor (0402)
R2
562Ω
562Ω ±1% resistor (0402)
R3
301Ω
301Ω ±1% resistor (0402)
Ordering Information
PART
TEMP RANGE
Chip Information
PIN-PACKAGE
MAX2022ETX+
-40°C to +85°C
36 TQFN-EP*
MAX2022ETX+T
-40°C to +85°C
36 TQFN-EP*
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
*EP = Exposed pad.
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PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
TQFN-EP
(6mm x 6mm)
T3666+2
21-0141
90-0049
Maxim Integrated │ 24
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Typical Application Circuit
36
C1
22pF VCCLOA
C2
0.1µF
C3
LO
LO
GND
RBIASLO1
R1
432Ω
N.C.
RBIASLO2
R2
562Ω
GND
32
31
1
2
GND
30
GND
29
GND
28
27
MAX2022
BIAS
LO3
26
3
25
90°
0°
4
24
5
22
7
21
BIAS
LO2
8
20
9
VCC
19
EP
10
C5
0.1µF
11
GND
12
GND
C6
22pF
13
14
GND
15
16
17
GND GND
C7
22pF
GND
BBQP
BBQN
GND
Q+
Q-
C9
C16
RF
23 RF
∑
BIAS
LO1
6
GND
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33
34
GND
VCCLOI2
VCC
RBIASLO3
35
VCCLOI1
GND
GND
VCCLOQ2
GND GND
R3
301Ω
C11
0.1µF
VCC
C10
22pF
C13
22pF
VCCLOQ1
VCC
C12
0.1µF
L1
GND
BBIN
BBIP
II+
GND
18
GND
C8
0.1µF
VCC
Maxim Integrated │ 25
MAX2022
High-Dynamic-Range, Direct Up/
Downconversion 1500MHz to 3000MHz
Quadrature Modulator/Demodulator
Revision History
REVISION
NUMBER
REVISION
DATE
PAGES
CHANGED
0
4/05
Initial release
1
9/12
Updated the Benefits and Features, Applications, Absolute Maximum Ratings, and
Ordering Information; added new electrical characteristics tables, figures, and sections
1–19
2
3/13
Corrected pin 15 name from VCCLOI1 to VCCLOI2 in the Pin Configuration/Functional
Diagram and Pin Description
11, 12
3
7/13
Added new TOCs 46–74
12–16
DESCRIPTION
—
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
© 2013 Maxim Integrated Products, Inc. │ 26
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