EVALUATION KIT AVAILABLE
MAX20733
Integrated, Step-Down Switching Regulator
General Description
The MAX20733 is a fully integrated, highly efficient
switching regulator for applications operating from 4.5V to
16V and requiring up to 35A maximum load. This singlechip regulator provides extremely compact, high-efficiency power-delivery solutions with high-precision output
voltages and excellent transient response for networking,
datacom, and telecom equipment.
The IC offers a broad range of programmable features
through capacitors and resistors connected to dedicated
programming pins. Using this feature, the operation can
be optimized for a specific application, reducing the
component count- and/or setting-appropriate trade-offs
between the regulator's performance and system cost.
Ease of programming enables using the same design for
multiple applications.
The MAX20733 includes protection capabilities. Positive
and negative cycle-by-cycle overcurrent protection and
overtemperature protection ensure a rugged design. Input
undervoltage lockout shuts down the device to prevent
operation when the input voltage is out of specification. A
status pin provides an output signal to show that the output voltage is within range and the system is regulating.
Benefits and Features
●●
High Power Density and Low Component Count
• Overall Solution Size: 509mm2 Including Inductor
and Output Capacitors
• 90.8% Peak Efficiency: VDDH = 12V and
VOUT = 1V
• Fast Transient Response: Supports Up to 300A/μs
Load Step Transients
●●
Optimized Component Performance and Efficiency
with Reduced Design-In Time
●●
Increased Power-Supply Reliability with System and
IC Self-Protection Features
• Differential Remote Sense with Open-Circuit
Detection
• Hiccup Overcurrent Protection
• Programmable Thermal Shutdown
Typical System Efficiency vs.
Load Current (VDDH = 12V)
100
95
●●
Communications Equipment
90
●●
Networking Equipment
85
●●
Servers and Storage Equipment
●●
Point-of-Load Voltage Regulators
●●
μP Chipsets
●●
Memory VDDQ
●●
I/O
DESCRIPTION
EFFICIENCY (%)
Applications
75
VOUT
Vout
= 5V= 5V
70
VOUT
= 3.3V
Vout
= 3.3V
VOUT
= 1.8V
Vout
= 1.8V
65
Vout
= 1.2V
VOUT
= 1.2V
Vout
= 1V= 1V
VOUT
60
CURRENT
RATING*
INPUT
VOLTAGE
OUTPUT
VOLTAGE
Electrical rating
35A
4.5V to 16V
0.6484V
to 5.5V
Thermal rating,
TA = 55°C, 200LFM
34A
12V
1V
Thermal rating,
TA = 85°C, 0LFM
22A
12V
1V
*For specific operating conditions, refer to the SOA curves in
the Typical Operating Characteristics section.
19-8604; Rev 0; 10/16
80
Vout
= 0.8V
VOUT
= 0.8V
Vout
= 0.65V
VOUT
= 0.65V
55
50
0
5
10
15
20
IOUT (A)
25
30
Ordering Information appears at end of data sheet.
35
MAX20733
Integrated, Step-Down Switching Regulator
Absolute Maximum Ratings
Input Pin Voltage (VDDH) (Note 1).........................-0.3V to +18V
VCC...........................................................................-0.3V to +2V
STAT and OE Pin Voltages......................................-0.3V to +4V
PGM1, PGM2, PGM3, VSENSE+ and VSENSEPin Voltages..........................................................-0.3V to +2V
Switching Node Voltage (VX) DC...........................-0.3V to +18V
Switching Node Voltage (VX) 25ns (Note 2)...........-10V to +23V
(BST - VX) Pin Differential...................................... -0.3 to +2.5V
Junction Temperature (TJ)................................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Peak Reflow Temperature Lead-Free.............................. +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any
other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Operating Ratings
Input Voltage (VDDH)................................................. 4.5V to 16V
Junction Temperature (TJ)................................ -40°C to +125°C
Maximum Average Input Current (IVDDH) (Note 3)..................6A
Maximum Average Output Current (IOUT).............................35A
Peak Output Current (IPK)......................................................60A
Package Information
PACKAGE CODE
P154A8F+
Outline Number
21-100031
Land Pattern Number
90-100022
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction to Ambient (θJA)
(Still Air, No Heatsink; Note 4)
13°C/W
Junction to Case (θJC)
0.47°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Note 1: As measured at the VDDH pin referenced to GND pin immediately adjacent using a high frequency scope probe with ILOAD
at IMAX. A high-frequency input bypass capacitor must be located less than 60 mils from the VDDH pin per our design
guidelines.
Note 2: The 25ns rating is the allowable voltage on the VX node in excess of the -0.3V to +18V DC ratings. The VX voltage can
exceed the DC rating in either the positive or negative direction for up to 25ns per cycle.
Note 3: See the Average Input Current Limit section.
Note 4: Data taken using Maxim’s evaluation kit, MAX20733EVKIT#. The PCB has four layers of 2oz copper.
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Maxim Integrated │ 2
MAX20733
Integrated, Step-Down Switching Regulator
Electrical Characteristics
(Circuit of Figure 6, VDDH = 4.5V to 16V, unless otherwise specified. Typical values are at TA = +32°C. All devices 100% tested at room
temperature. Limits over temperature guaranteed by design.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SUPPLY VOLTAGE
Supply Voltage Range
VDDH
(Note 5)
4.5
16
V
VOUT
(Note 5)
0.65
5.5
V
OUTPUT VOLTAGE (NOTE 6)
Output Voltage Range
VREF
0.6484
VREF Values
VREF
Selected by C_SEL1 (Note 7)
0.8984
V
1.0
Referred to VSENSE
pins (Notes 5, 8)
VREF Tolerance
0.6484V VREF
-1.2
+1.2
0.8984V VREF
-1.0
+1.0
1V VREF
-1.0
+1.0
%
FEEDBACK LOOP
Integrator Recovery Time
Constant
Gain (see Control Loop section
for details)
tREC
RGAIN
20
Selected by R_SEL3 (Notes 5, 7, 8, 9)
µs
0.72
0.9
1.1
1.4
1.8
2.2
2.9
3.6
4.4
mV/A
SWITCHING FREQUENCY
400
500
Switching Frequency
fSW
600
Selected by C_SEL2 and C_SEL3
(see Tables 5, 6) (Note 7)
kHz
700
800
900
Switching Frequency Accuracy
(Notes 5, 8, 9)
-20
+20
%
INPUT PROTECTION
Rising VDDH UVLO Threshold
(Note 5)
Falling VDDH UVLO Threshold
VDDH_UVLO (Note 5)
4.25
3.7
Hysteresis
4.47
3.9
350
V
mV
OUTPUT VOLTAGE PROTECTION (OVP)
Overvoltage Protection Rising
Threshold
OVP
Relative to programmed VOUT
9.5
OVP Deglitch Filter Time
Power Good Deglitch Filter Time
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16.5
8
Power Good Protection Falling
Threshold
Power Good Protection Rising
Threshold
13
Relative to programmed VOUT
PWRGD
%
µs
6
9
12
%
3
6
9
%
8
µs
Maxim Integrated │ 3
MAX20733
Integrated, Step-Down Switching Regulator
Electrical Characteristics (continued)
(Circuit of Figure 6, VDDH = 4.5V to 16V, unless otherwise specified. Typical values are at TA = +32°C. All devices 100% tested at room
temperature. Limits over temperature guaranteed by design.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
Setting 0
11.8
18.9
26.0
Setting 1
16.0
24.1
32.2
Setting 2
19.8
29.2
38.6
Setting 3
24.5
34.1
43.8
UNITS
OVERCURRENT PROTECTION (OCP)
Positive OCP Inception
Threshold (Inductor Valley
Current)
OCP
Selected by R_
SEL3
(Notes 5, 7, 8, 9)
Hysteresis of Positive OCP
20
Negative OCP Inception
Threshold (Inductor Valley
Current)
Selected by
R_SEL3
Setting 0
-26.4
Setting 1
-31.3
Setting 2
-36.0
Setting 3
-40.8
Hysteresis of Negative OCP
A
%
A
0
%
OVERTEMPERATURE PROTECTION (OTP)
OTP Inception Threshold
OTP
Selected by R_SEL2 (Notes 7, 8, 9)
120
130
140
140
150
160
Hysteresis
10
°C
°C
OE MAXIMUM VOLTAGE
OE Max Voltage
Rising Threshold
Hysteresis
3.6
OE
Measured at OE pin (Note 5)
OE Pin Input Resistance
0.83
(Note 9)
0.97
0.2
200
OE Deglitch Filter Time
0.9
275
0.9
V
V
350
kΩ
2.2
µs
STARTUP TIMING
Enable Time from OE Rise to
Start of BST Charge
tOE
After tINIT
Soft-Start Ramp Time
tSS
Set by R_SEL1 (Note 7)
BST Charging Time
tBST
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16
µs
1.5
ms
3
ms
8
µs
Maxim Integrated │ 4
MAX20733
Integrated, Step-Down Switching Regulator
Electrical Characteristics (continued)
(Circuit of Figure 6, VDDH = 4.5V to 16V, unless otherwise specified. Typical values are at TA = +32°C. All devices 100% tested at room
temperature. Limits over temperature guaranteed by design.)
PARAMETER
SYMBOL
Allowable Pullup Voltage
VOHSTAT
CONDITIONS
MIN
TYP
MAX
UNITS
3.6
V
STAT PIN
Status Output Low
VOLSTAT
Status Output High Leakage
Current
Time from VOUT Ramp
Completion to STAT Pin Released
ISTAT = 2.5mA
0.4
ISTAT = 0.2mA, 0V < VCC < UVLO and
0V < VDDH < UVLO (Note 5)
0.65
ISTAT = 1.3mA, 0V < VCC < UVLO and
0V < VDDH < UVLO (Note 5)
0.75
STAT pulled up to 3.3V through 20kΩ
tSTAT
7
125
STAT output low to high, set by R_SEL2
(Note 7)
V
µA
µs
2000
PGM1–PGM3 PINS (ALSO SEE TABLES 2–7)
Allowable R_SEL Resistor Range
12 resistor values detected
R_SEL Resistor Required
Accuracy
EIA standard resistor values only
Allowable C_SEL Capacitor
Range
Three options (0, 220, or 1000pF)
C_SEL Capacitor Required
Accuracy
Use X7R or better
Allowable External Capacitance
Load and stray capacitance in addition
to C_SEL1/2/3
1.78
162
±1
0
kΩ
%
1000
±20
pF
%
20
pF
SYSTEM SPECIFICATIONS (NOTE 10)
Line Regulation
Load Regulation (Static)
Efficiency (VDDH = 12V,
VOUT = 1V)
VOUT
η
±0.2
IOUT = 0 - IMAX
±0.7
Peak
90.8
Full load (35A)
84
%
%
Note 5: Specification applies over the temperature range of TJ = -40° to +125°C.
Note 6: For proper regulation, it is required that VDDH > (VOUT + 2V). If VOUT is set greater than (UVLO - 2V), the IC can come out
of UVLO, but regulation is not guaranteed while VDDH is below (VOUT + 2V). To avoid this condition, OE can be held low
until VDDH is greater than (VOUT + 2V).
Note 7: Parameters that are programmable.
Note 8: Min/max limits are ≥ 4σ about the mean.
Note 9: Guaranteed by design; not production tested.
Note 10: These specifications refer to the operation of the system and are based on the circuit shown in the reference schematic.
Tolerance of external components can affect these parameters. System performance numbers are measured using the
Maxim evaluation board for this product with BOM as shown on the MAX20733 EV kit data sheet. If a different PCB layout
and different external components are used, these values can change.
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Maxim Integrated │ 5
MAX20733
Integrated, Step-Down Switching Regulator
Typical Operating Characteristics
(Unless otherwise noted: Tested on the MAX20733EVKIT# with component values per Table 8; VDDH = 12V, VOUT = 1V, fSW = 400kHz,
TA = 25°C, Still Air, No Heatsink.)
STARTUP RESPONSE
TRANSIENT RESPONSE
toc01
toc02
IOUT (10A/div)
VX (20V/div)
VOUT (20mV/div)
STAT(2V/div)
VX (10V/div)
OE (2V/div)
VOUT (200mV/div)
TIME: 100µs/div
CONDITIONS: IOUT = 20A to 30A STEP at 1A/µs
TIME: 500µs/div
TYPICAL VOUT RIPPLE
toc03
VOUT (20mV/div)
VX (10V/div)
TIME: 2µs/div
CONDITIONS: IOUT = 35A
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Maxim Integrated │ 6
MAX20733
Integrated, Step-Down Switching Regulator
Typical Operating Characteristics (continued)
(Unless otherwise noted: Tested on the MAX20733EVKIT# with component values per Table 8; VDDH = 12V, VOUT = 1V, fSW = 400kHz,
TA = 25°C, Still Air, No Heatsink.)
SYSTEM EFFICIENCY vs. OUTPUT LOAD
100
LOAD REGULATION
toc04
0.4
95
75
VOUT
Vout
= 5V= 5V
Vout
= 3.3V
VOUT
= 3.3V
70
60
5
10
15
20
IOUT (A)
25
30
JUNCTION TEMPERATURE
vs. SYSTEM POWER DISSIPATION
120
VOUT = 0.65V
.65V
0.1
0.0
-0.3
Vout
= 0.65V
= 0.65V
VOUT
0
1VVOUT = 1V
-0.2
Vout
= 1V= 1V
VOUT
Vout
= 0.8V
VOUT
= 0.8V
55
VOUT = 1.8V
1.8V
-0.1
VOUT
= 1.8V
Vout
= 1.8V
Vout
= 1.2V
VOUT
= 1.2V
65
-0.4
35
0
5
80
60
40
20
15
20
25
30
SYSTEM POWER DISSIPATION
toc06
SLOPE = 13°C/W
10
35
IOUT (A)
toc07
9
8
100
JUNCTION TEMPERATURE (°C)
LOAD REGULATION (%)
80
0
VOUT = 3.3V
3.3V
0.2
SYSTEM POWER DISSIPATION (W)
EFFICIENCY (%)
85
50
VOUT = 5.5V
5.5V
0.3
90
toc05
VOUT
Vout
= 5V= 5V
Vout
= 3.3V
VOUT
= 3.3V
7
Vout
= 1.8V
VOUT
= 1.8V
Vout
= 1.2V
VOUT
= 1.2V
6
Vout
= 1V= 1V
VOUT
Vout
= 0.8V
VOUT
= 0.8V
5
Vout
= 0.65V
VOUT
= 0.65V
4
3
2
1
0
1
2
3
4
5
SYSTEM POWER DISSIPATION (W)
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6
0
0
5
10
15
20
25
30
35
IOUT (A)
Maxim Integrated │ 7
MAX20733
Integrated, Step-Down Switching Regulator
Typical Operating Characteristics (continued)
(Unless otherwise noted: Tested on the MAX20733EVKIT# with component values per Table 8; VDDH = 12V, VOUT = 1V, fSW = 400kHz,
TA = 25°C, Still Air, No Heatsink.)
SAFE OPERATING AREA (SOA)
35
35
30
30
25
25
20
15
Vout=0.8V
VOUT = 0.8V
Vout=1.2V
VOUT = 1.2V
5
VOUT = 5.0V
Vout=5.0V
30
40
0
50
60
70
80
90
100
TA (°C)
CONDITIONS: 400LFM
CURVE INDICATES TJ = 125°C, IOUT = IMAX, or IVDDH = IVDDH_MAX,
WHICHEVER HAPPENS FIRST
SAFE OPERATING AREA (SOA)
40
VOUT = 5.0V
Vout=5.0V
60
70
80
90
100
TA (°C)
CONDITIONS: 200LFM
CURVE INDICATES TJ = 125°C, IOUT = IMAX, or IVDDH = IVDDH_MAX,
WHICHEVER HAPPENS FIRST
toc10
30
40
50
SYSTEM EFFICIENCY
vs. OUTPUT LOAD (VDDH = 5V)
100
toc11
95
35
90
30
85
EFFICIENCY (%)
25
IOUT (A)
Vout=0.8V
VOUT = 0.8V
Vout=1.2V
VOUT = 1.2V
Vout=3.3V
VOUT = 3.3V
10
VOUT = 3.3V
Vout=3.3V
5
20
15
Vout=0.8V
VOUT = 0.8V
Vout=1.2V
VOUT = 1.2V
Vout=3.3V
VOUT = 3.3V
10
5
0
20
15
10
0
toc09
40
IOUT (A)
IOUT (A)
40
SAFE OPERATING AREA (SOA)
toc08
Vout=5.0V
VOUT = 5.0V
30
40
50
60
70
80
90
100
TA (°C)
CONDITIONS: STILL AIR / NO HEATSINK
CURVE INDICATES TJ = 125°C, IOUT = IMAX, or IVDDH = IVDDH_MAX,
WHICHEVER HAPPENS FIRST
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80
75
70
Vout
= 1.8V
VOUT
= 1.8V
Vout
= 1.2V
VOUT
= 1.2V
Vout
= 1V= 1V
VOUT
Vout
= 0.8V
VOUT
= 0.8V
Vout
= 0.65V
VOUT
= 0.65V
65
60
55
50
0
5
10
15
20
IOUT (A)
25
30
35
Maxim Integrated │ 8
MAX20733
Integrated, Step-Down Switching Regulator
Typical Operating Characteristics (continued)
(Unless otherwise noted: Tested on the MAX20733EVKIT# with component values per Table 8; VDDH = 12V, VOUT = 1V, fSW = 400kHz,
TA = 25°C, Still Air, No Heatsink.)
SYSTEM POWER DISSIPATION (VDDH = 5V)
7
40
5
30
Vout
= 0.8V
VOUT
= 0.8V
Vout
= 0.65V
VOUT
= 0.65V
4
20
15
2
10
0
0
5
10
15
20
25
30
SAFE OPERATING AREA (SOA) (VDDH = 5V)
40
60
70
80
90
100
TA (°C)
CONDITIONS: 400LFM
CURVE INDICATES TJ = 125°C, IOUT = IMAX, or IVDDH = IVDDH_MAX,
WHICHEVER HAPPENS FIRST
35
30
25
25
IOUT (A)
30
15
Vout=0.8V
VOUT = 0.8V
Vout=1.0V
VOUT = 1.0V
VOUT = 1.2V
Vout=1.2V
10
5
30
40
50
60
70
80
90
100
TA (°C)
CONDITIONS: 200LFM
CURVE INDICATES TJ = 125°C, IOUT = IMAX, or IVDDH = IVDDH_MAX,
WHICHEVER HAPPENS FIRST
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40
50
40
35
20
30
SAFE OPERATING AREA (SOA) (VDDH = 5V)
toc14
35
0
Vout=0.8V
VOUT = 0.8V
Vout=1.0V
VOUT = 1.0V
VOUT = 1.2V
Vout=1.2V
5
1
IOUT (A)
IOUT (A)
25
3
0
toc13
35
Vout
= 1.8V
VOUT
= 1.8V
Vout
= 1.2V
VOUT
= 1.2V
Vout
= 1V
VOUT
= 1V
IOUT (A)
SYSTEM POWER DISSIPATION (W)
6
SAFE OPERATING AREA (SOA) (VDDH = 5V)
toc12
toc15
20
15
Vout=0.8V
VOUT = 0.8V
Vout=1.0V
VOUT = 1.0V
VOUT = 1.2V
Vout=1.2V
10
5
0
30
40
50
60
70
80
90
100
TA (°C)
CONDITIONS: STILL AIR / NO HEATSINK
CURVE INDICATES TJ = 125°C, IOUT = IMAX, or IVDDH = IVDDH_MAX,
WHICHEVER HAPPENS FIRST
Maxim Integrated │ 9
MAX20733
Integrated, Step-Down Switching Regulator
PGM3
VCC3
STAT
Pin Configuration
15
14
13
VSENSE+
1
12
VCC2
VSENSE-
2
11
AGND
PGM2
3
10
VCC
PGM1
4
9
OE
VDDH
5
8
BST
7
VX
GND
6
(TOP VIEW)
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Maxim Integrated │ 10
MAX20733
Integrated, Step-Down Switching Regulator
Pin Description
PIN
NAME
FUNCTION
1
VSENSE+
Remote-Sense Positive Node. Connect this node to VOUT at the load. A resistive voltage-divider
can be used to regulate the output above the reference voltage.
Remote-Sense Negative Node. Connect this node to ground at the load using a Kelvin connection.
2
VSENSE-
3, 4
PGM2, PGM1
Program Node. Connect this node to ground through a programming resistor and capacitor.
5
VDDH
Power Input Voltage. The high-side MOSFET switch is connected to this node. See the Input
Capacitor section for decoupling requirements.
6
GND
Power Ground Node. The low-side MOSFET switch is connected to this node.
7
VX
Power-Switching Node. Connect this node to the inductor.
8
BST
Bootstrap for High-Side Switch. Connect a 0.22μF ceramic capacitor between BST and VX.
9
OE
Output-Enable Node. This node is used to enable the regulator and has a precise threshold to allow
sequencing of multiple regulators. There is an internal 275kΩ (typ) pulldown on this pin.
10
VCC
Analog/Gate-Drive Supply for the IC from Internal 1.85V (typ) LDO. This node MUST be connected
to three 10µF X5R or better decoupling capacitors with a very short, wide trace. VCC can be
connected to 20kΩ pullups for STAT and OE as shown in Figure 6. Do not connect VCC to other
external loads. Do not overdrive VCC from an external source.
11
AGND
12, 14
VCC2, VCC3
13
STAT
Open-Drain Power-Good/Fault-Status Indication. Connect a pullup resistor to 1.8V or 3.3V.
15
PGM3
Program Node. Connect this node to ground through a programming resistor and capacitor.
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Analog/Signal Ground. See the PCB Layout section for layout information.
Connect to VCC. Digital factory test input. Must be connected high for normal operation.
Maxim Integrated │ 11
MAX20733
Integrated, Step-Down Switching Regulator
Block Diagram
VCC
tON
TIMER
STAT
VDDH
LDO
R
S
BST
Q
POWER
SWITCHING
DIGITAL
CONTROL
OE
CURRENT
SENSE
OCP
PGM1
VX
GND
MUX
PGM2
PGM3
VCC
VCC
TELEMETRY
PWM
VSENSE+
ERROR
AMPLIFIER
VCC2
VCC3
VCC
CURRENT
DAC
AGND
VSENSEREFERENCE VOLTAGE AND SOFT START
Operation
Control Architecture
The MAX20733 provides an extremely compact, highefficiency regulator solution with minimal external components and circuit design required. The monolithic solution
includes the top and bottom power switches, gate drives,
precision DAC reference, PWM controller, and fault protections (see the Block Diagram). An external bootstrap
capacitor is used to provide the drive voltage for the top
switch. Other external components include the input and
output filter capacitors, buck inductor, and a few Rs and
Cs to set the operating mode.
technology. Once the PWM modulator forces a low-tohigh transition, the high-side switch is enabled for a fixed
time after which the low-side switch is turned on again. An
error amplifier with an integrator is used to maintain zerodroop operation. The integrator has a transient recovery
time constant of 20µs (typ).
During regulation, the differential voltage between the
VSENSE+ and VSENSE- pins tracks the reference voltage
which can be set to 0.6484V, 0.8984V or 1V via C_SEL1.
The sense pins can be connected to the output voltage
through a voltage-divider so VOUT can be higher than the
reference voltage.
The IC implements an advanced valley current-mode
control algorithm that supports all multilayer ceramic chip
(MLCC) output capacitors and fast transient response. In
steady-state, it operates at a fixed switching frequency.
During loading transients, the switching frequency speeds
up to minimize the output-voltage undershoot. Likewise,
during unloading transients, the switching frequency
slows down to minimize the output-voltage overshoot.
The switching frequency is determined by the high-side
ontime as shown in Equation 1.
The switching frequency can be set to 400kHz, 500kHz,
600kHz, 700kHz, 800kHz, or 900kHz using C_SEL2 and
C_SEL3.
fSW = Switching frequency (MHz)
Voltage regulation is achieved by modulating the low-side
on-time, comparing the difference between the feedback
and reference voltages with the low-side current-sense
signal using Maxim's proprietary integrated current-sense
www.maximintegrated.com
Equation 1:
=
f SW
V
1
× OUT
t H_ON VDDH
where:
tH_ON = On period for high-side switch (μs)
VOUT = Output voltage (V)
VDDH = Input voltage (V)
Maxim Integrated │ 12
MAX20733
Integrated, Step-Down Switching Regulator
The tH_ON high-side on-time is controlled by the IC to be
proportional to the duty cycle so that the resulting switching
frequency is independent of supply voltage and output voltage.
Equation 2:
t H_ON α
VOUT
VDDH
The tH_ON pulse width is clamped to a minimum of 50ns
(after tSS) and a maximum of 2µs to prevent any unexpected operation during extreme VOUT conditions.
Voltage Regulator Enable and
Turn-On Sequencing
The startup timing is shown in Figure 1. After VDDH is
applied, the IC goes through an initialization time (tINIT)
that takes up to 308μs. After initialization, OE is read.
Once OE is high for more than the 16μs OE filter time
(tOE), BST charging starts and is performed for 8μs
(tBST), and then the soft-start ramp begins. The soft-start
ramp time (tSS) is 3ms or 1.5ms, depending on the user’s
programmed value. VOUT ramps up linearly during the
soft-start ramp time. If there are no faults, the STAT pin is
released from being held low after the completion of the
soft-start ramp time plus the user-programmable STAT
blanking time (tSTAT) of 125μs or 2ms. If OE is pulled low,
the IC shuts down.
Soft-Start Control
The initial output-voltage behavior is determined by a
linear ramp of the internal reference voltage from zero
to the final value (tSS in Figure 1). The ramp time tSS is
programmable from to 1.5ms or 3ms.
If the regulator is enabled when the output voltage has
a residual voltage, the system will not regulate until the
reference voltage ramps above this residual value. In this
case, the tOE (OE valid to onset of regulation) specification is extended by the time required for the desired voltage startup ramp to reach the actual residual output voltage, but the time to reach the steady-state output voltage
is unchanged.
If the residual voltage is higher than the set output voltage, neither the high-side nor the low-side switch turns
on by the end of tSS. Under these conditions, switching
begins after tSS.
The IC exhibits a nonlinearity during startup. This behavior is normal and does not have an adverse effect
on system operation. With the circuit of Figure 6, the
typical nonlinearity is < 50mV with RGAIN = 0.9mV/A,
160mV with RGAIN = 1.8mV/A, and 320mV with RGAIN =
3.6mV/A. The nonlinearity gets proportionately smaller as
COUT increases.
Remote Output-Voltage Sensing
To ensure the most accurate sensing of the output voltage, a differential voltage-sense topology is used, with a
negative remote-sense pin provided. Point-of-load sensing compensates for voltage drops between the output
of the regulator and its load and provides the highest
regulation accuracy. The voltage-sensing circuit features
excellent common-mode rejection to further improve loadvoltage regulation.
tINIT
VCC
tOE
SHUTDOWN
OE or OPERATE
tBST
VOUT
tSS
STAT
tSTAT
tINIT : Initialization, 308µs.
tOE : OE enable filter time, 16µs. If OE enabled earlier than tINIT completion, it is ignored until tINIT completes.
tBST : BST charging time, 8µs.
tSS : Soft-start time per user selection, 0.75ms to 6ms.
tSTAT : STAT blanking time, 2ms or 125µs through user selection.
Figure 1. Startup Timing
www.maximintegrated.com
Maxim Integrated │ 13
MAX20733
Integrated, Step-Down Switching Regulator
Protection and Status Operation
Output-Voltage Protection
The feedback voltage is continuously monitored for both
undervoltage and overvoltage conditions. The typical
fault-detection threshold is 13% above and 9% below the
reference voltage (see Electrical Characteristics table). If
the output voltage falls below the power-good protection
(PWRGD) threshold beyond the filter time, the regulator
status (STAT) output goes low but the system continues
to operate, attempting to maintain regulation.
If the output voltage rises above the overvoltage-protection (OVP) threshold beyond the filter time, the STAT pin
is lower and the system shuts down until the output voltage falls within the valid range.
Current Limiting and Short-Circuit Protection
The regulator’s valley current-mode control architecture
provides inherent current limiting and short-circuit protection. The bottom switch’s instantaneous current is monitored using integrated current sensing and controlled on a
cycle-by-cycle basis within the control block.
Current clamping occurs when the minimum instantaneous (“valley”) low-side switch-current level exceeds the
OCP threshold current, as shown in Figure 2. In this situation, turn-on of the high-side switch is prevented until the
current falls below the threshold level. Since the inductor valley current is the controlled parameter, the average current delivered during positive current clamping
remains a function of several system-level parameters.
Note that IOCP has hysteresis and the value drops down
to IOCP2 once it has been triggered as shown in Figure 2.
Undervoltage Lockout (UVLO)
The regulator internally monitors VDDH with an undervoltage-lockout (UVLO) circuit. When the input supply voltage
is below the UVLO threshold, the regulator stops switching, and the STAT pin is driven low. For UVLO levels, refer
to the Electrical Characteristics table.
Overtemperature Protection (OTP)
The overtemperature-protection level can be set to 150°C
or 130°C through R_SEL2. If the die temperature reaches
the OTP level during operation, the regulator is disabled
and the STAT pin is driven low. Overtemperature is a nonlatching fault, with the hysteresis shown in the Electrical
Characteristics table.
Regulator Status
The regulator status (STAT) signal provides an open-drain
output, consistent with CMOS logic levels, that indicates
whether the regulator is functioning properly. An external
pullup resistor is required for connecting STAT to VCC or
another 1.8V or 3.3V supply.
Table 1. Summary of Fault Actions
FAULT
ACTION
Power Good
(Output Undervoltage)
STAT LOW
Output OVP
STAT LOW, Shutdown and Restart
Overtemperature
STAT LOW, Shutdown and Restart
Supply Fault (VDDH_UVLO;
STAT LOW, Shutdown and Restart
VCC_UVLO)
BST Fault
STAT LOW, Shutdown and Restart
IOCP(AVG)
IOCP
IOCP2
IOCP(AVG) = IOCP2 +
I
L
1
2
( VDDH − VOUT ) x
tH_ON
LOUT
where:
IOCP2 = IOCP - Hysteresis
Figure 2. Inductor Current During Current Limiting
www.maximintegrated.com
Maxim Integrated │ 14
MAX20733
Integrated, Step-Down Switching Regulator
The STAT pin is low while the regulator is disabled. The
STAT pin goes high after the startup ramp is completed
plus the programmed tSTAT blanking interval, if the output
voltage is within the PWRGD/OVP regulation window.
The STAT pin is an open-drain output and is 3.3V tolerant.
The pin will remain low when VDDH is not present.
PGM1, 2 and 3 Pin Functionality
The STAT pin is driven low when one or more of the following conditions exists:
The parasitic loading on the PGM1:PGM3 pins must be
limited to less than 20pF and greater than 20MΩ to avoid
interfering with the R_SEL and C_SEL decoding.
●●
A PWRGD fault (see the Output-Voltage Protection
section).
●●
The VSENSE- pin is left unconnected or shorted to
VDDH.
●●
The die temperature has exceeded the temperatureshutdown threshold shown in the Electrical Characteristics
table.
●●
The OVP circuit has detected that the output voltage
is above the tolerance limit.
●●
The supply voltage has dropped below the UVLO
threshold.
●●
A fault is detected on the BST node such as shorted
or open bootstrap capacitor.
The ensuing startup follows the same timing as shown in
Figure 1.
Table 2. PGM1 Pin R_SEL1 Values
R(kΩ) ±1%
SOFT-START TIME (ms)
1.78
3
46.4
1.5
Table 3. PGM1 Pin C_SEL1 Values
C (pF) ±20%
VREF (V)
Open
0.6484
220
0.8984
1000
1
Table 4. PGM2 Pin R_SEL2 Values
R(kΩ) ±1%
OTP (°C)
tSTAT (µs)
1.78
150
2000
2.67
150
125
4.02
130
2000
6.04
130
125
www.maximintegrated.com
The PGM1:PGM3 pins are used to set up some of the
key programmable features of the regulator IC. A resistor
and capacitor are connected to the PGM_ pins and their
values are read during power-up initialization (e.g., power
must be cycled to re-read the values).
Table 5. PGM2 Pin C_SEL2 Values
C(pF) ±20%
fSW FREQUENCY BAND
Open
Even
220
Odd
Table 6. PGM3 Pin C_SEL3 Values
C(pF) ±20%
EVEN BAND fSW
FREQUENCY (kHz)
ODD BAND fSW
FREQUENCY (kHz)
Open
400
500
220
600
700
1000
800
900
Table 7. PGM3 Pin R_SEL3 Values
R (kΩ) ±1%
RGAIN (mΩ)
OCP *
1.78
3.6
Setting 0
2.67
3.6
Setting 1
4.02
3.6
Setting 2
6.04
3.6
Setting 3
9.09
1.8
Setting 0
13.3
1.8
Setting 1
20
1.8
Setting 2
30.9
1.8
Setting 3
46.4
0.9
Setting 0
71.5
0.9
Setting 1
107
0.9
Setting 2
162
0.9
Setting 3
* See Electrical Characteristics table for values
Maxim Integrated │ 15
MAX20733
Integrated, Step-Down Switching Regulator
Reference Design
The typical application schematic is shown in Figure 3 and Table 8 shows optimum component values for common output
voltages.
VDDH
CVCC
1.8V or 3.3V
1.8V or 3.3V
COMPLIANT I/O
RSTAT
STAT
OE
U1
VCC
VCC2
VCC3
CIN
VDDH
CBST
BST
STAT
OE
LOUT
VOUT
VX
MAX20733
C_SEL1
PGM1
PGM2
PGM3
R_SEL1
RFB2
R_SEL2
C_SEL3
R_SEL3
COUT
GND
AGND
C_SEL2
RFB1
VSENSE+
VSENSE-
Figure 3. Typical Application Circuit
Table 8. Reference Design Component Values
VOUT RFB1 RFB2 R_SEL1 C_SEL1 R_SEL2
(V)
(kΩ) (kΩ)
(kΩ)
(pF)
(kΩ)
C_SEL2 R_SEL3 C_SEL3 RGAIN
(pF)
(kΩ)
(pF)
(mΩ)
VREF
(V)
fSW
(kHz)
LOUT
(nH)
COUT
0.6484
1
Open
1.78
Open
2.67
Open
162
Open
0.9
0.6484
400
170
6 x 100μF + 2
x 470μF
0.8
1.37
5.9
1.78
Open
2.67
Open
162
Open
0.9
0.6484
400
170
6 x 100μF + 2
x 470μF
1
1.87
3.48
1.78
Open
2.67
Open
162
Open
0.9
0.6484
400
170
6 x 100μF + 2
x 470μF
1.2
1.74
2.05
1.78
Open
2.67
Open
162
Open
0.9
0.6484
400
170
6 x 100μF + 2
x 470μF
1.8
3.09
1.74
1.78
Open
2.67
Open
162
220
0.9
0.6484
600
170
6 x 100μF + 2
x 470μF
3.3
5.62
1.37
1.78
Open
2.67
Open
107
220
0.9
0.6484
600
210
6 x 100μF + 2
x 470μF
5.0
7.15
1.07
1.78
Open
2.67
Open
107
220
0.9
0.6484
600
210
6 x 100μF + 2
x 470μF
Note: For input caps, see the Input Capacitor Selection section.
www.maximintegrated.com
Maxim Integrated │ 16
MAX20733
Integrated, Step-Down Switching Regulator
Average Input Current Limit
The input current of VDDH is given by Equation 3. VOUT,
IOUT, and VDDH should be properly chosen so that the
average input current does not exceed 6A (IVDDH_MAX).
Equation 3:
I VDDH =
VOUT × I OUT
VDDH × η
where:
VOUT = Output voltage
IOUT = Output current
VDDH = Input voltage
η = Efficiency (refer to the Typical Operating
Characteristics section)
Output-Voltage Setting
If an output voltage not listed in Table 8 is required, calculate new values for RFB1 and RFB2 (as discussed below)
and use the other circuit values of the closest output voltage in Table 8, or calculate them as shown below.
The output voltage is set by the VREF DAC and divider
ratio of resistors RFB1 and RFB1 per Equation 4. The
IC regulates the VSENSE+ pin to the reference voltage
(VREF), which is set by the DAC. Upon power-up, the DAC
voltage initializes to one of the user-selectable VREF voltages. The divider resistors are chosen to give the correct
output voltage and to have an approximate parallel resistance of RPAR = 1kΩ for best common-mode rejection
of the error amplifier. In applications requiring less than
10mV peak-to-peak output-voltage ripple, setting a lower
DAC reference voltage such as 0.6484V is recommended
because the part will have less DAC voltage noise.
where:
RFB1 = Top divider resistor
RFB2 = Bottom divider resistor
RPAR = Desired parallel resistance of RFB1 and RFB2
VOUT = Output voltage
VREF = 0.6484V, 0.8984V, or 1.0V (set by C_SEL1)
Control-Loop Stability
The IC uses valley current-mode control that is stabilized
by selecting appropriate values of COUT and RGAIN. No
compensation network is required. For stability, the loop
bandwidth (BW) should be 100kHz or less. Consider the
case of using MLCC output capacitors that have nearly
ideal impedance characteristics in the frequency range of
interest with negligible ESR and ESL. The loop bandwidth
can be approximated by breaking the loop into gain terms
as outlined below.
1) The IC’s valley current-mode control scheme has an
effective transconductance gain of 1/RGAIN.
2) For MLCC capacitors, the output capacitors contribute an impedance gain of 1/(2 x π x COUT x f).
3) The feedback-divider contributes an attenuation of
KDIV = RFB2/(RFB1 + RFB2).
4) An inherent high-frequency pole located at 150kHz.
When the BW is 100kHz or less, the high-frequency pole
can be ignored and the approximate loop gain and BW
are given by Equation 6.
Equation 6:
LOOP_GAIN (f) =
Equation 4:
BW =
R
VOUT
= VREF × 1 + FB1
R FB2
OR
BW =
where:
VREF = 0.6484V, 0.8984V, or 1.0V (set by C_SEL1).
The divider resistors are then given by Equation 5.
Equation 5:
R PAR
R
=
FB1 VOUT ×
VREF
R PAR
R=
FB2 R FB1 ×
−
R
R
PAR
FB1
www.maximintegrated.com
K DIV
2 × π × R GAIN × C OUT × f
K DIV
2 × π × R GAIN × C OUT
1
2 × π × R GAIN_EFF × C OUT
where:
RGAIN_EFF = RGAIN/KDIV
For stability, RGAIN and COUT should be chosen so that
BW < 100kHz.
The available RGAIN settings are shown in Table 7. When
choosing which RGAIN setting to use, one should consider
that while higher RGAIN allows the loop to be stabilized with
less COUT, less COUT generally results in higher ripple and
larger transient overshoot and undershoot, so there needs
to be a balance.
Maxim Integrated │ 17
MAX20733
Integrated, Step-Down Switching Regulator
Integrator
The IC has an integrator included in its error amplifier that
was ignored in the above equations for simplicity. The
integrator only adds gain at low frequencies, so it does
not really effect the loop BW calculation. The purpose of
the integrator is to improve load regulation. The integrator
adds a factor of (1/tREC + s)/s to the loop gain.
net ESR of the COUT bank is not negligible compared
to RGAIN/KDIV, the inductor current ripple is effectively
sensed by the ESR and adds to the RGAIN_EFF as shown
in Equation 8.
Equation 8:
R GAIN_EFF
=
Step Response
RGAIN_EFF is important since it determines the smallsignal transient response of the regulator. When a
load step is applied that does not exceed the slew-rate
capability of the inductor current, the regulator responds
linearly and VOUT temporarily changes by the amount of
VOUT_ERROR (see Equation 7).
Equation 7:
VOUT_ERROR
=
I STEP × R GAIN_EFF
The capacitor’s ESR also introduces a zero into the loop
gain. The inherent high-frequency pole helps to compensate this zero. For a more in-depth view of the effect of
circuit values on regulator performance, the Maxim
Simplis model and evaluation kit can be used. It is recommended to simulate and/or test regulator performance
when using values other than the recommended component values.
The integrator causes VOUT to recover to the nominal
value with a time constant of tREC = 20μs. The regulator
can be modeled to a first-order by the averaged smallsignal equivalent circuit shown in Figure 4. Here, VEQ is
an ideal voltage source, REQ is an equivalent lossless
resistance created by the control-loop action, and LEQ is
an equivalent inductance. Note that LEQ is not the same
as the actual LOUT inductor which has been absorbed
into the model. COUT is the actual output capacitance.
tREC RGAIN_EFF
LEQ
RGAIN_EFF
VOUT
REQ
COUT
Output-Capacitor ESR
In the above control-loop discussion, the case of MLCC
output capacitors has been considered. Another case
worth mentioning is the use of output capacitors with
more significant ESR. This may be considered as long
as the capacitors are rated to handle the inductor current ripple and expected surge currents. Thus far, it has
been assumed that COUT is comprised of MLCCs and
the net ESR is negligible compared to RGAIN/KDIV. If the
R GAIN
+ ESR
K DIV
VOUT
VEQ
GND
Figure 4. Averaged Small-Signal Equivalent Circuit of Regulator
Note: The large-signal transient response is approximately
the larger between the VOUT_ERROR and the Unloading
Transient.
Table 9. Recommended Inductors
COMPANY
VALUE
(nH)
ISAT
(A)
RDC
(mΩ)
FOOTPRINT
(mm)
HEIGHT
(mm)
PART
NUMBER
WEBSITE
Cooper
170
60
0.29
10.4 x 8.0
7.5
FP1007R3-R17-R
www.cooperindustries.com
Pulse
210
64
0.32
13.5 x 13.0
8.0
PA0513.211NLT
www.pulseelectronics.com
Pulse
260
55
0.32
13.5 x 13.0
8.0
PA0513.261NLT
www.pulseelectronics.com
Pulse
320
45
0.32
13.5 x 13.0
8.0
PA0513.321NLT
www.pulseelectronics.com
Pulse
440
30
0.32
13.5 x 13.0
8.0
PA0513.441NLT
www.pulseelectronics.com
www.maximintegrated.com
Maxim Integrated │ 18
MAX20733
Integrated, Step-Down Switching Regulator
Table 10. MLCC Input Capacitors
CASE SIZE
VALUE
(µF)
TEMPERATURE
RATING
VOLTAGE
RATING
T
(NOTE 1)
COMPANY
0603
1
X7S
X7R
16V
0.8
(Note 2)
Murata
TDK
GRM188C71C105KA12D
C1608X7R1C105K
0805
2.2
X7R
25V
16V
16V
1.25
1.25
1.25
Murata
TDK AVX
GRM21BR71E225KA73L
C2012X7R1C225M
0805YC225MAT
0805
4.7
X7R
16V
1.25
Murata
GRM21BR71C475K
1206
4.7
X7R
16V
1.65
AVX
Murata
1206YC475MAT
GRM31CR71C475KA01L
1206
10
X7R
16V
1.65
Murata
TDK AVX
GRM31CR71C106KAC7L
C3216X7R1C106M
1206YC106MAT
1210
10
X7R
16V
25V
2.0
2.5
Murata
TDK
GRM32DR71C106KA01L
C3225X7R1E106M
1210
22
X7R
16V
2.45
2.5
2.5
AVX
Murata
TDK
1210YC226MAT
GRM32ER71A476K
C3225X7R1C226M
PART NUMBER
Note 1: T indicates nominal thickness in mm.
Note 2: Indicates capacitors with nominal thickness smaller than the minimum FCQFN package thickness.
Table 11. Recommended Output Capacitors
COMPANY
VALUE
(µF)
TEMP.
RATING
VOLT.
RATING
CASE
SIZE
T
(NOTE)
AVX
22
22
08054D226MAT2A
12066D226MAT2A
X5R
X5R
4V
6.3V
0805
1206
1.3
1.65
www.avxcorp.com
Murata
22
22
22
GRM21BR60J226ME39L
GRM31CR60J226KE19L
GRM32DR60J226KA01L
X5R
X5R
X5R
6.3V
6.3V
6.3V
0805
1206
1210
1.25
1.6
2.0
www.murata.co.jp
Panasonic
22
22
22
ECJ3YB0J226M
ECJHVB0J226M
ECJ3Y70J226M
X5R
X5R
X7R
6.3V
6.3V
6.3V
1206
1206
1206
1.6
0.85
1.65
www.panasonic.com
Taiyo Yuden
22
22
22
AMK212BJ226MG
JMK316BJ226ML
JMK325BJ226MY
X5R
X5R
X5R
4V
6.3V
6.3V
0805
1206
1210
1.25
1.6
1.9
www.taiyo-yuden.com
TDK
22
22
22
22
C2012X5R0J226M
C3216X5R0J226M
C3225X5R0J226M
C3216X6S0J226M
X5R
X5R
X5R
X6S
6.3V
6.3V
6.3V
6.3V
0805
1206
1210
1206
1.25
1.6
1.6
1.6
www.component.tdk.com
PART NUMBER
WEBSITE
Note: T indicates nominal thickness in mm.
www.maximintegrated.com
Maxim Integrated │ 19
MAX20733
Integrated, Step-Down Switching Regulator
The performance data shown in the Typical Operating
Characteristics section was taken using the Maxim EV kit
and component values in Table 8. For most applications,
these are the optimum values to use. Table 9 through
Table 11 show suitable part numbers for input and output
capacitors and the inductor.
Inductor Selection
The output inductor has an important influence on the
overall size, cost, and efficiency of the voltage regulator.
Since the inductor is typically one of the larger components in the system, a minimum inductor value is particularly important in space-constrained applications. Smaller
inductor values also permit faster transient response,
reducing the amount of output capacitors needed to maintain transient tolerances.
LOUT = Output inductance
VDDH = Input voltage
VOUT = Output voltage
From Equation 10, for the same switching frequency,
ripple current increases as L decreases. This increased
ripple current results in increased AC losses, larger peak
current, and for the same output capacitance, results in
increased output-voltage ripple.
IOUTRIPPLE should be set to 25% to 50% of the IC’s
rated output current. A suitable inductor value can then
be found by solving Equation 10 for inductance as in
Equation 11 and Equation 12.
Equation 11:
For any buck regulator, the maximum current slew rate
through the output inductor is given by Equation 9.
Equation 9:
SlewRate
=
dIL
VL
=
dt L OUT
L OUT =
And assuming IOUTRIPPLE = 0.25 x IOUT for a typical
inductor value, see Equation 12.
Equation 12:
where:
OUT
IL = Inductor current
LOUT = Output inductance
VL = VDDH - VOUT during high-side FET conduction and
-VOUT during low-side FET conduction
Equation 9 shows that larger inductor values limit the
regulator’s ability to slew current through the output inductor in response to step-load transients. Consequently,
more output capacitors are required to supply (or store)
sufficient charge to maintain regulation while the inductor
current ramps up to supply the load.
In contrast, smaller inductor values increase the regulator’s maximum achievable slew rate and decrease
the necessary capacitance, at the expense of higher
ripple current. The peak-to-peak ripple current is given by
Equation 10.
I OUTRIPPLE =
L OUT
where:
tH_ON = High-side switch on-time (based on nominal
VOUT) (see Equation 1)
www.maximintegrated.com
VOUT (VDDH
VOUT )
VDDH × (0.25 × I OUT ) × f SW
So, for a 35A regulator running at 400kHz with VDDH =
12V and VOUT = 1V, Equation 13 shows the target value
for the inductor.
Equation 13:
L OUT =
1× (12 − 1)
12 × 0.25 × 35 × 400,000
= 262nH
The saturation current rating of the inductor is another
important consideration. At current limit, the peak inductor
current is given Equation 14.
Equation 14:
Equation 10:
t H_ON × (VDDH − VOUT )
VOUT (VDDH − VOUT )
VDDH × I OUTRIPPLE × f SW
IPK = I OCP + I OUTRIPPLE
where:
IOCP = Overcurrent-protection trip point (see Electrical
Characteristics and Current Limiting and Short-Circuit
Protection sections)
IOUTRIPPLE = Peak-to-peak inductor current ripple,
defined above
Maxim Integrated │ 20
MAX20733
Integrated, Step-Down Switching Regulator
For proper OCP operation of the regulator, it is important
that IPK never exceeds the saturation current rating of
the inductor (ISAT). It is recommended that a margin of at
least 20% is included between IPK and ISAT as shown in
Equation 15.
Equation 15:
I SAT > 1.2 × IPK
Also, note that during a hard VOUT short circuit,
IOUTRIPPLE increases because VOUT went to zero in
Equation 10.
Finally, the power dissipation of the inductor influences
the regulation efficiency. Losses in the inductor include
core loss, DC resistance loss and AC resistance loss.
For the best efficiency, use inductors with core material
exhibiting low loss in the range of 0.5MHz to 2MHz and
low-winding resistance.
Table 9 provides a summary of recommended inductor
suppliers and part numbers.
Output Capacitor Selection
Output voltage ripple is another important consideration
in the selection of output capacitors. For a buck regulator operating in CCM, the total voltage ripple across the
output capacitor bank can be approximated as the sum of
three voltage waveforms: 1) the triangle wave that results
from multiplying the AC ripple current by the ESR, 2) the
square wave that results from multiplying the ripple current slew rate by the ESL and 3) the piece wise quadratic
waveform that results from charging and discharging the
output capacitor. Although the phasing of these three
components does impact the total output ripple, a common approximation is to ignore the phasing and to find
the upper bound of the peak-to-peak ripple by summing
all three components, as shown in Equation 17.
Equation 17:
VDDH I OUTRIPPLE
V=
+
PP ESR(I OUTRIPPLE ) + ESL
L OUT 8 × f SW × C OUT
where:
ESR = Equivalent series resistance at the output
The minimum recommended output capacitance for stability is given in the Control-Loop Stability section and is
normally implemented using several 100µF 1206 (or similar) MLCCs. For low slew rate transient loads, RGAIN_EFF
determines the VOUT_ERROR for a given load step per
the small-signal model as discussed above. In this case,
COUT has no effect on the VOUT_ERROR.
IOUTRIPPLE = Peak-to-peak inductor current ripple
However, in the event that the slew rate of the load transient greatly exceeds the slew rate of the inductor current,
the transient VOUT error may be larger than predicted by
the small-signal model. In this case, the VOUT loading
and unloading transients can be approximated by taking
the larger result between Equation 7 and Equation 16.
COUT = Output capacitance
Equation 16:
I
LOUT × ISTEP + OUTRIPPLE
2
LOADINGTRANSIENT(V) =
2 × COUT × ( VDDH − VOUT )
2
2
I
LOUT × ISTEP + OUTRIPPLE
tH _ ON
2
+I
UNLOADINGTRANSIENT(V)
=
STEP ×
2 × COUT × VOUT
COUT
In order to meet an aggressive transient specification,
COUT may have to be increased and/or LOUT may
have to be decreased. However, note that decreasing
LOUT results in larger inductor ripple current and thus
decreased efficiency and increased output ripple.
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ESL = High-frequency equivalent series inductance at
output
VDDH = Input voltage
LOUT = Output inductance
fSW = Switching frequency
In a typical MAX20733 application with a bank of 0805,
X5R, 6.3V, and 22µF output capacitors, these three components are roughly equal.
The ESL effect of an output capacitor on output-voltage
ripple cannot be easily estimated from the resonant frequency; the high-frequency (10MHz or above) impedance
of that capacitor should be used. PCB traces and vias in the
VOUT/GND loop contribute additional parasitic inductance.
The final considerations in the selection of output capacitors are ripple-current rating and power dissipation. Using
a conservative design approach, the output capacitors
should be designed to handle the maximum peak-to-peak
AC ripple current experienced in the worst-case scenario. Because the recommended output capacitors have
extremely low-ESR values, they are typically rated well
above the current and power stresses seen here. For the
triangular AC ripple current at the output, the total RMS current and power is given by Equation 18 and Equation 19.
Maxim Integrated │ 21
MAX20733
Integrated, Step-Down Switching Regulator
Equation 18:
current that the input capacitor must withstand can be
approximated using Equation 21.
I
IRMS_COUT = OUTRIPPLE
12
Equation 21:
where:
IOUTRIPPLE = Peak-to peak ripple current value.
Equation 19:
=
PCOUT IRMS_COUT 2 × ESR
where ESR is the equivalent series resistance of the
entire output capacitor bank
IRMS_CIN =
It is recommended to choose the main MLCC input
capacitance to control the peak-to-peak input-voltage
ripple to 2% to 3% of its DC value in accordance with
Equation 20.
Equation 20:
I
× VOUT × (VDDH − VOUT )
C IN = MAX
f SW × VDDH 2 × VINPP
(
With an equivalent series resistance of the bulk input
capacitor bank (ESRCIN), the total power dissipation in
the input capacitors is given by Equation 22.
Equation 22:
=
PCIN IRMS_CIN 2 × ESR CIN
Resistor Selection and its Effect
on DC Output Voltage Accuracy
RFB1 and RFB2 set the output voltage as described in
Equation 4. The tolerance of these resistors affects the
accuracy of the set output voltage. Due to the form of
Equation 4, the effect is higher at higher output voltages.
Figure 5 shows the effect of 0.1% tolerance resistors over
a range of output voltages. For different tolerance resistors, multiply the output-voltage error by the resistors’ tolerances divided by 0.1%. For example, for 0.5% tolerance
resistors, multiply the output error shown by 5. To obtain
accuracy overtemperature, for a worst case, the temperature coefficients multiplied by the temperature range
should be added to the tolerance (i.e., for 25ppm/°C
resistors over a 50°C excursion, add 0.125% to the 25°C
tolerance).The error due to the voltage feedback resistors’ tolerance, RFB1 and RFB2 should be added to the
output-voltage tolerance due to the IC’s feedback-voltage
accuracy shown in the Electrical Characteristics table.
)
0.180%
0.160%
where:
0.140%
CIN = Input capacitance (MLCC)
VDDH = DC input voltage
VOUT = DC output voltage
fSW = Switching frequency (CCM)
VINPP = Target peak-to-peak input-voltage ripple
Because the bulk input capacitors must source the pulsed
DC input current of the regulator, the power dissipation
and ripple current rating for these capacitors are far more
important than that for the output capacitors. The RMS
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0.120%
ERROR (%)
IMAX = Maximum load current
VDDH
where ILOAD is the output DC load current.
Input Capacitor Selection
The selection and placement of input capacitors are
important considerations. High-frequency input capacitors
serve to control switching noise. Bulk input capacitors
are designed to filter the pulsed DC current drawn by
the regulator. For the best performance, lowest cost and
smallest size of the MAX20733 systems, MLCC capacitors with 1210 or smaller case sizes, capacitance values
of 47µF or smaller, 16V or 25V voltage ratings and X5R or
better temperature characteristics are recommended as
bulk. The minimum recommended value of capacitance
are 2 x 47µF (bulk) and 1.0µF + 0.1µF (high frequency).
Smaller values of bulk capacitance can be used in direct
proportion to the maximum load current.
ILOAD VOUT (VDDH − VOUT )
0.100%
εVOUT = 2εR(VOUT - VREF)/VOUT
0.080%
0.060%
0.040%
0.020%
0.000%
1
1.5
2
2.5
3
3.5
4
4.5
5
VOUT/VREF RATIO
Figure 5. DC Accuracy Impact Showing Effect of 0.1%
Tolerance for RFB1 and RFB2
Maxim Integrated │ 22
MAX20733
Integrated, Step-Down Switching Regulator
PCB Layout
PCB layout can dramatically affect the performance of the
regulator. A poorly designed board can degrade efficiency,
noise performance, and even control-loop stability. At
higher switching frequencies, layout issues are especially
critical.
As a general guideline, the input capacitors and the
output inductor should be placed in close proximity to
the regulator IC, while the output capacitors should be
lumped together as close as possible to the load. Traces
to these components should be kept as short and wide
as possible in order to minimize parasitic inductance and
resistance. Traces connecting the input capacitors and
VDDH (power input node) on the IC require particular
attention since they carry currents with the largest RMS
values and fastest slew rates. According to best practice,
the input capacitors should be placed as close as possible to the input supply pins with the smallest package
high-frequency capacitor being the closest to the IC and
no more than 60 mils from the IC pins. Preferably, there
should be an uninterrupted ground plane located immediately underneath these high-frequency current paths, with
the ground plane located no more than 8 mils below the
top layer. By keeping the flow of this high-frequency AC
current localized to a tight loop at the regulator, electromagnetic interference (EMI) can be minimized.
Voltage-sense lines should be routed differentially directly
from the load points. The ground plane can be used as a
shield for these or other sensitive signals to protect them
from capacitive or magnetic coupling of high-frequency
noise.
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For remote-sense applications where the load and regulator IC are separated by a significant distance or impedance, it is important to place the majority of the output
capacitors directly at the load. Ideally, for system stability,
all the output capacitors should be placed as close as
possible to the load. In remote-sense applications, common-mode filtering is necessary to filter high-frequency
noise in the sense lines.
The following layout recommendations should be used for
optimal performance:
●●
It is essential to have a low-impedance and uninterrupted ground plane under the IC and extended out
underneath the inductor and output capacitor bank.
●●
Multiple vias are recommended for all paths that
carry high currents (i.e., GND, VDDH, VX). Vias
should be placed close to the chip to create the
shortest possible current loops. Via placement must
not obstruct the flow of currents or mirror currents in
the ground plane.
●●
A single via in close proximity to the chip should
be used to connect the top layer AGND trace to the
second layer ground plane, it must not be connected
to the top power ground area.
●●
The feedback-divider and compensation network
should be close to the IC to minimize the noise on
the IC side of the divider.
Gerber files with layout information and complete reference designs can be obtained by contacting a Maxim
account representative.
Maxim Integrated │ 23
Soft Start = 3ms
Vref = 0.6484V
Fsw = 400kHz
Rgain = 0.9 milliohms
OTP = 150C
TSTAT = 125us
OCP = Setting 3
Freq Band = Even
R2
162K
0402
PGM3
PGM1
R1
1.78K
0402
PGM2
R12
2.67K
0402
OE
C32
1000pF
0402
C54
DNS
0402
20K
STAT
20K
R8 0402
C23
DNS
0402
C4
DNS
0402
C51
10uF
X5R
0603
PGM3
PGM2
PGM1
VCC3
VCC2
OE
STAT
C36
10uF
X5R
0603
VX
BST
U1
VSENSE-
VSENSE+
MAX20733
DNS = Do Not Stuff
AGND
R5 0402
C9
10uF
X5R
0603
VCC
VCC
VDDH
VDDH
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GND
C3
0.1uF
X7R
0402
SENSE-
SENSE+
VX
BST
C8
0.22uF
X7R
0402
C7
1uF
X7R
0603
Diff Pair
C5
47uF
X5R
1206
170nH
L1
C6
47uF
X5R
1206
C10
47uF
X5R
1206
VDDH
R9
3.48K
0402
R6
1.87K
0402
SENSE_VOUT
C11
47uF
X5R
1206
Diff Pair
INPUT SUPPLY
0 0402
R11
0
R4 0402
C24
0.01uF
0402
C12-17
6x100uf
1206
+
C28-29
2x470uF
5 m-ohms
VOUT = 1V
VOUT
MAX20733
Integrated, Step-Down Switching Regulator
Figure 6. Reference Schematic (VDDH = 4.5V to 16V, VOUT = 1V)
Maxim Integrated │ 24
MAX20733
Integrated, Step-Down Switching Regulator
Ordering Information
TEMP RANGE
PIN-PACKAGE
MAX20733EPL+
PART
-40°C to +125°C
15 FCQFN
MAX20733EPL+T
-40°C to +125°C
15 FCQFN
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
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Maxim Integrated │ 25
MAX20733
Integrated, Step-Down Switching Regulator
Revision History
REVISION
NUMBER
REVISION
DATE
0
10/16
DESCRIPTION
Initial release
PAGES
CHANGED
—
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
© 2016 Maxim Integrated Products, Inc. │ 26
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