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MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
General Description
The MAX22195 translates eight 24V industrial digital inputs
to eight CMOS-compatible, parallel outputs. Propagation
delay from input-to-output is less than 300ns for all channels.
Current-limiters on each digital input greatly reduce power
dissipation compared to traditional resistive inputs. The
accuracy of these current-limiters minimizes power
dissipation while ensuring compliance with the IEC
61131-2 standard. A current-setting resistor allows the
MAX22195 to be configured for Type 1, Type 2, or Type
3 inputs. Additionally, the MAX22195 has energyless fieldside LED drivers to meet the indicator light requirement of
IEC 61131-2 with no additional power dissipation.
The MAX22195 provides a 3.3V integrated voltage
regulator. The internal LDO accepts the field supply
VDD24 from 7V to 65V. The internal LDO output can
supply up to 25mA of current in addition to powering the
basic MAX22195 requirements. This MAX22195 LDO
current can be used to power digital isolators and other
field-side circuits. Alternatively, the MAX22195 can be powered
from a 3.0V to 5.5V supply connected to VDD3 pin.
The MAX22195 includes an open-drain READY output
that asserts high to indicate the MAX22195 is functional.
If the VDD24 field-side supply voltage is too low, or a fault
in the current-setting resistor is detected, or the device
reaches an over-temperature condition, the READY signal is set to high-impedance.
Applications
●●
●●
●●
●●
Programmable Logic Controllers
Industrial Automation
Process Automation
Building Automation
19-100330; Rev 6; 3/21
Benefits and Features
●● High-Speed, Industrial Digital Inputs
• 300ns Maximum Propagation Delay
• ±10ns Maximum Channel-to-Channel Skew
• Parallel Output for Simultaneous Signal Delivery
●● High Integration Reduces BOM Count and Board Space
• Operates Directly from Field Supply (7V to 65V)
• Compatible with 3.3V or 5V Logic
• 5mm x 5mm, 32-TQFN Package
●● Low Power and Low Heat Dissipation
• Low Quiescent Current (1.2mA Maximum)
• Accurate Input Current-Limiters
• Energyless Field-Side LED Drivers
●● Fault Tolerant with Built-In Diagnostics
• Integrated Field-Side Supply Monitor
• Integrated Over-Temperature Monitor
• Current-Setting Resistor Monitor
●● Configurability Enables Wide Range of Applications
• Configurable IEC 61131-2 Types 1, 2, 3 Inputs
• Configurable Input Current Limiting from 0.56mA to
3.97mA
●● Robust Design
• ±1kV Surge Tolerant using Minimum 1kΩ Resistor
• ±8kV Contact ESD and ±15kV Air Gap ESD Using
Minimum 1kΩ Resistor
• -40°C to +125°C Ambient Operating Temperature
Ordering Information appears at end of data sheet.
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Octal Digital Input with Parallel Output
24V
3.3V
1µF
0.1µF
EXTVM
8.6kΩ
0.1µF
VDD24
VDD3
1µF
VDD
RDYEN
REFDI
1.5kΩ
IN1
GPI
READY
LED1
4.7kΩ
1.5kΩ
IN2
LED2
INF (INPUT FIELD)
1.5kΩ
INP (INPUT PIN)
IN8
LED8
GND
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MICROCONTROLLER
MAX22195
OP1
GPI1
OP2
GPI2
OP3
GPI3
OP4
GPI4
OP5
GPI5
OP6
GPI6
OP7
GPI7
OP8
GPI8
GND
Maxim Integrated │ 2
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Absolute Maximum Ratings
VDD3 to GND ..........................................................-0.3V to +6V
VDD24 to GND........................................................-0.3V to +70V
OP1–OP8...................................................-0.3V to VDD3 + 0.3V
IN1–IN8 to GND......................................................-40V to +40V
REFDI to GND............................................-0.3V to VDD3 + 0.3V
READY, RDYEN to GND..........................................-0.3V to +6V
EXTVM to GND........................................................-0.3V to +6V
LED1–LED8 to GND................................................-0.3V to +6V
Continuous Power Dissipation
Multilayer Board TA = +70°C......................................2222mW
Derate above +70°C.............................................27.80mW/°C
Operating Temperature Range.........................................+125°C
Maximum Junction Temperature......................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering(reflow)..............................................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
PACKAGE TYPE: 32 TQFN
Package Code
T3255+6
Outline Number
21-0140
Land Pattern Number
90-0603
THERMAL RESISTANCE, MULTILAYER BOARD
Junction to Ambient (θJA)
36°C/W
Junction to Case (θJC)
3°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated │ 3
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
DC Electrical Characteristics
VDD3 to GND = +3.0V to +5.5V, TA = -40°C to +125°C, unless otherwise noted. CL on OP1-OP8 = 15pF. Typical values are at VDD3
to GND = +3.3V, VDD24 to GND = +24V, Field Inputs IN1-IN8 = +24V, and TA = +25°C. (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
7
65
V
3.0
5.5
V
POWER SUPPLIES
VDD24
Normal operation
VDD3
Powered from an external power supply
Supply Current Powered
from VDD24
IDD24
VDD24 = 24V, IN1-IN8 = 0V,
LED_ = GND, no load on OP1-OP8
0.6
1.2
mA
Supply Current Powered
from VDD3
IDD3
VDD3 = 3.3V, IN1-IN8 = 0V, LED_ = GND,
no load on OP1-OP8, VDD24 floating
0.6
1.2
mA
2.9
V
Supply Voltage
VDD3 Undervoltage-Lockout
Threshold
VUVLO3
VDD3 Undervoltage-Lockout
Threshold Hysteresis
VUVHYST3
VDD24 READY Threshold
2.4
0.07
V
VREADY_24VR
VDD24 rising, EXTVM = GND
13.8
14.6
15.4
V
VREADY_24VF
VDD24 falling, EXTVM = GND
13.3
14.1
15.0
V
VDD24 rising
6.0
6.8
V
VDD24 Undervoltage-Lockout
Threshold
VUVLO24
VDD24 Undervoltage-Lockout
Threshold Hysteresis
VUVHYST24
Regulator Output Voltage
Powered from VDD3, VDD3 rising
VDD24 floating
VDD3
0.45
ILOAD = 1mA, VDD24 = 7V to 65V
3.0
3.3
V
3.6
V
Line Regulation
dVDDLINE
ILOAD = 1mA, VDD24 = 12V to 24V
0
mV
Load Regulation
dVDDLOAD
ILOAD = 1mA to 10mA, VDD24 = 12V
1
mV
Short-Circuit Current Limit
IDD24_SC
VDD24 current when VDD3 short to
GND, VDD24 = 12V
28
37.5
50
mA
0.77
0.81
0.84
V
0.74
0.79
0.82
V
VDD24 MONITOR
EXTVM Glitch Filter
EXTVM Threshold Off to On
EXTVM Threshold On to Off
3
V24TH_OFF_ON VDD24 rising
V24TH_ON_OFF VDD24 falling
µs
External EXTVM Selection
Threshold
EXTVM_SEL
External EXTVM Selectable
VDD24 Threshold
EXTVM_VDD24
10
30
V
IEXTVM_L
-1
1
µA
EXTVM Leakage Current
0.3
V
THERMAL SHUTDOWN
Thermal-Shutdown Threshold
TSHDN
Thermal-Shutdown Hysteresis
TSHDN_HYS
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VDD3 internal regulator off
165
°C
10
°C
Maxim Integrated │ 4
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
DC Electrical Characteristics (continued)
VDD3 to GND = +3.0V to +5.5V, TA = -40°C to +125°C, unless otherwise noted. CL on OP1-OP8 = 15pF. Typical values are at VDD3
to GND = +3.3V, VDD24 to GND = +24V, Field Inputs IN1-IN8 = +24V, and TA = +25°C. (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
CURRENT LIMITING SETTING
REFDI Voltage
VREFDI
Current-Limit Setting Resistor
RREFDI
REFDI Pin Short
REFDI_S
REFDI Pin Open
REFDI_O
0.61
5.2
8.6
V
36
kΩ
Increasing current at pin REFDI
550
µA
Decreasing current at pin REFDI
548
µA
Increasing current at pin REFDI
4.46
µA
Decreasing current at pin REFDI
7.21
µA
-40V < VIN_ < 0V, VIN_ at IN1 - IN8 pins
100
µA
IC INPUTS (TYPE 1, 2, 3)
Input Current Limit
LED On-State Current
ILED_ON
RREFDI = 8.6kΩ, VLED = 3V
1.5
IN1 – IN8 = 28V
40
58
80
IN1 – IN8 = 6V
8
11.4
16
5.6
6
DI Leakage, Current Sources
Disabled
IDI_LEAK
Input Threshold Low-to-High
VTHP+
IN1 – IN8
Input Threshold High-to-Low
VTHP_
IN1 – IN8
VINPHYST
IN1 – IN8
Input Threshold Hysteresis
4.4
mA
µA
V
4.7
V
0.9
V
FIELD INPUTS TYPE 1, 3: (EXTERNAL SERIES RESISTOR R IN = 1.5KΩ, R REFDI = 8.6KΩ)
Field-Input Current Limit
IINLIM
6V (VTHP+ MAX) ≤ VIN_ at the pin ≤ 28V,
LED on, RREFDI = 8.6kΩ (Note 2)
Field Input Threshold
Low-to-High
VINF+
RREFDI = 8.6kΩ, 1.5kΩ external series
resistor
Field Input Threshold
High-to-Low
VINF-
RREFDI = 8.6kΩ, 1.5kΩ external series
resistor
2.15
2.40
2.65
mA
10
V
8
V
FIELD INPUTS TYPE 2: (EXTERNAL SERIES RESISTOR R IN = 1KΩ , R REFDI = 5.2KΩ)
Field-Input Current Limit
IINLIM
6V (VTHP+ MAX) ≤ VIN_ at the pin ≤ 28V,
LED on, RREFDI = 5.2kΩ (Note 2)
Field Input Threshold
Low-to-High
VINF+
RREFDI = 5.2kΩ, 1kΩ external series
resistor
Field Input Threshold
High-to-Low
VINF-
RREFDI = 5.2kΩ, 1kΩ external series
resistor
3.55
3.97
4.39
mA
10
V
8
V
0.7 x
VDD3
V
LOGIC INPUT (RDYEN)
Input Logic-High Voltage
VIH
Input Logic-Low Voltage
VIL
Input Pulldown Resistance
RPD
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0.3 x
VDD3
199
V
kΩ
Maxim Integrated │ 5
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
DC Electrical Characteristics (continued)
VDD3 to GND = +3.0V to +5.5V, TA = -40°C to +125°C, unless otherwise noted. CL on OP1-OP8 = 15pF. Typical values are at VDD3
to GND = +3.3V, VDD24 to GND = +24V, Field Inputs IN1-IN8 = +24V, and TA = +25°C. (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
LOGIC OUTPUT (OP1-OP8, READY)
VDD3 0.4
Output Logic-High Voltage
VOH
Sourcing 4mA
Output Logic-Low Voltage
VOL
Sinking 4mA
0.4
V
V
DYNAMIC CHARACTERISTICS (OP1-OP8)
Propagation Delay
Low-to-High (Figure 1)
tPDLH
IN_ to OP_, RIN = 1.5kΩ,
IN_ = 11V and 36V
300
ns
Propagation Delay
High-to-Low (Figure 1)
tPDHL
IN_ to OP_, RIN = 1.5kΩ,
IN_ = 11V and 36V
300
ns
Propagation Delay Skew
Channel-to-Channel (Figure 1)
tPDSKEW_CH
IN_ to OP_, RIN = 1.5kΩ,
IN_ = 11V and 36V
-10
10
ns
Propagation Delay Skew
Part-to-Part (Figure 1)
tPDSKEW_PART
IN_ to OP_, RIN = 1.5kΩ, IN_ = 11V and 36V,
All conditions are the same between parts
-200
+200
ns
tPDJ_R
Output Rising, VDD3 = 3.3V, IN_ = 24V
40
ps
tPDJ_F
Output Falling, VDD3 = 3.3V, IN_ = 24V
50
ps
Propagation Delay Jitter
Detectable Pulse Width
(Figure 1)
tPW
Pulse Width Distortion
PWD
IN_ to OP_, RIN = 1.5kΩ,
IN_ = 11V and 36V
|tPDLH - tPDHL|
220
0
ns
180
ns
Note 1: All units are production tested at TA = +25°C. Specifications over temperature are guaranteed by design.
Note 2: External resistor REFDI is selected to set any desired current limit between 0.56mA to 3.97mA (typical values). The current
limit accuracy of ±10.6% is guaranteed for values greater or equal to 2mA.
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Maxim Integrated │ 6
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
tPULSEMIN
FIELD INPUT
IN1, IN2
VDD24
0.1µF
1µF
VDD24
8.6kΩ
VDD3
50%
GND
1µF
0.1µF
50%
tPDLH
tPDHL
VDD3
REFDI
OP1
MAX22195
1.5kΩ
CL
FIELD INPUT
GND
50%
GND
OP_
IN_
50%
tPDSKEW_CH
tPDSKEW_CH
RL
VDD3
50%
OP2
50%
GND
(A)
(B)
Figure 1. Test Circuit (A) and Timing Diagram (B)
ESD and EMC Characteristics
PARAMETER
SYMBOL
VALUE
Line-to-Line
IEC 61000-4-5, 1.2/50µs pulse, minimum 1kΩ resistor in
series with IN1–IN8
±2
Line-to-Ground
IEC 61000-4-5, 1.2/50µs pulse, minimum 1kΩ resistor in
series with IN1–IN8
±1
Human Body Model
All Pins
±2
Contact Discharge
IEC 61000-4-2, minimum 1kΩ resistor in series with IN1–IN8
±8
Air-Gap Discharge
IEC 61000-4-2, minimum 1kΩ resistor in series with IN1–IN8
±15
Surge
ESD
CONDITIONS
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UNITS
kV
Maxim Integrated │ 7
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Operating Characteristics
(VDD24 = 24V, VDD3 = 3.3V, TA = +25°C, RREFDI = 8.6kΩ or 5.2kΩ, RIN = 1.5kΩ or 1kΩ, unless otherwise noted.)
VDD24 SUPPLY CURRENT
vs. VDD24 SUPPLY VOLTAGE
1.20
0.80
0.70
1.00
0.90
0.80
15
25
35
45
55
0.70
65
3
3.5
0.85
0
25
50
75
100
-50
-25
0
50
75
100
VDD3 SUPPLY CURRENT
vs. VIN_ INPUT VOLTAGE
0.91
0.90
VDD24 = 24V, READY RPULLDOWN = 10kΩ
ALL VIN_ SHORTED TOGETHER,
ALL VIN_ MEASURED AT THE PIN,
EXTVM = GND
0.86
0
8
16
24
32
0.82
0.79
0.73
40
VDD3 = 3.3V, VDD24 FLOATING,
ALL VIN_ SHORTED TOGETHER,
ALL VIN_ MEASURED AT THE PIN,
EXTVM = VDD3, READY RPULLDOWN = 10kΩ
0.76
0
8
16
24
32
INPUT VOLTAGE (V)
INPUT CURRENT LIMIT IINLIM
vs. RREFDI
INPUT CURRENT LIMIT IINLIM
vs. TEMPERATURE
INPUT CURRENT LIMIT IINLIM
vs. VDD3 SUPPLY VOLTAGE
2.8
VIN_ = 40V
toc08
2.348
VDD24 = 24V, VIN_ = 24V,
RREFDI = 8.6kΩ
2.7
3.5
toc06
0.85
INPUT VOLTAGE (V)
toc07
125
0.88
0.94
0.82
125
25
TEMPERATURE (⁰C)
4.5
4.0
0.80
TEMPERATURE (⁰C)
toc05
1.02
SUPPLY CURRENT (mA)
0.88
-25
0.90
0.70
5.5
0.98
0.91
-50
5
VDD24 SUPPLY CURRENT
vs. VIN_ INPUT VOLTAGE
VDD3 = 3.3V, VDD24 FLOATING,
EXTVM = VDD3, ALL VIN_ = 24V,
READY RPULLDOWN = 10kΩ
0.94
4.5
1.00
VDD3 SUPPLY VOLTAGE (V)
toc04
0.97
4
SUPPLY CURRENT (mA)
5
VDD3 SUPPLY CURRENT
vs. TEMPERATURE
40
toc09
VDD3 = 3.3V, VDD24 FLOATING,
VIN_ = 24V, RREFDI = 8.6kΩ
2.346
2.6
INPUT CURRENT LIMIT (mA)
3.0
2.5
2.0
1.5
1.0
0.5
5
10
15
20
25
RREFDI (kΩ)
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30
35
INPUT CURRENT LIMIT (mA)
SUPPLY CURRENT (mA)
VDD24 = 24V, EXTVM = GND,
ALL VIN_ = 24V, READY RPULLDOWN = 10kΩ
1.10
1.10
VDD24 SUPPLY VOLTAGE (V)
INPUT CURRENT LIMIT (mA)
toc03
1.20
SUPPLY CURRENT (mA)
0.90
0.0
toc02
1.20
1.00
0.82
VDD24 SUPPLY CURRENT
vs. TEMPERATURE
VDD24 FLOATING, EXTVM = VDD3,
ALL VIN_ = 24V, READY RPULLDOWN = 10kΩ
1.30
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
1.40
EXTVM = GND, ALL VIN_ = 24V
READY RPULLDOWN = 10kΩ
1.10
0.60
VDD3 SUPPLY CURRENT
vs. VDD3 SUPPLY VOLTAGE
toc01
2.5
2.4
2.3
2.2
2.1
2.0
-50
-25
0
25
50
75
TEMPERATURE (⁰C)
100
125
2.344
2.342
2.340
2.338
2.336
3
3.5
4
4.5
5
5.5
VDD3 SUPPLY VOLTAGE (V)
Maxim Integrated │ 8
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Operating Characteristics (continued)
(VDD24 = 24V, VDD3 = 3.3V, TA = +25°C, RREFDI = 8.6kΩ or 5.2kΩ, RIN = 1.5kΩ or 1kΩ, unless otherwise noted.)
INPUT CURRENT LIMIT IINLIM
vs. VIN_ INPUT VOLTAGE
INPUT CURRENT LIMIT IINLIM
vs. VIN_ INPUT VOLTAGE
toc10
4.8
INPUT VOLTAGE THRESHOLD
vs. TEMPERATURE
toc11
3.0
11
toc12
2.5
3.2
2.0
2.4
1.6
0.8
VDD24 = 24V, RREFDI = 5.2kΩ
VIN_ AT THE PIN
0
5
10
15
20
25
30
35
1.5
1.0
0.5
0.0
40
VDD24 = 24V, RREFDI = 8.6kΩ
VIN_ AT THE PIN
0
5
10
15
INPUT VOLTAGE (V)
10
INPUT VOLTAGE THRESHOLD (V)
INPUT VOLTAGE THRESHOLD (V)
6
-50
-25
0
25
50
75
100
1.00
LOW-TO-HIGH
HIGH-TO-LOW
0
HIGH-TO-LOW
7
INPUT VOLTAGE HYSTERESIS
vs. TEMPERATURE
toc14
125
toc15
25
50
0.95
6
7
-25
40
8
TEMPERATURE (⁰C)
7
LOW-TO-HIGH
-50
35
9
VDD24 = 24V, RIN = 0Ω
8
5
30
INPUT VOLTAGE THRESHOLD
vs. TEMPERATURE
toc13
VDD24 = 24V, RIN = 1kΩ
6
25
LOW-TO-HIGH
INPUT VOLTAGE (V)
INPUT VOLTAGE THRESHOLD
vs. TEMPERATURE
9
20
75
100
125
INPUT VOLTAGE HYSTERESIS (V)
0.0
10
INPUT VOLTAGE THRESHOLD (V)
4.0
INPUT CURRENT LIMIT (mA)
INPUT CURRENT LIMIT (mA)
VDD24 = 24V, RIN = 1.5kΩ
5
HIGH-TO-LOW
4
3
-50
-25
0
25
50
75
100
125
RIN = 1.5kΩ
RIN = 1kΩ
0.90
0.85
RIN = 0Ω
0.80
0.75
-50
-25
0
25
50
75
TEMPERATURE (⁰C)
TEMPERATURE (⁰C)
TEMPERATURE (⁰C)
LDO LOAD REGULATION
LDO LINE REGULATION
LDO OUTPUT VOLTAGE
vs. TEMPERATURE
toc16
3.35
toc17
3.35
100
125
toc18
3.40
IVDD3 = 5mA
3.29
3.26
3.23
3.20
0
5
10
15
20
25
VDD3 OUTPUT CURRENT (mA)
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30
3.36
VDD3 OUTPUT VOLTAGE (V)
3.32
VDD3 OUTPUT VOLTAGE (V)
VDD3 OUTPUT VOLTAGE (V)
3.32
3.29
3.26
3.23
3.20
5
15
25
35
45
55
VDD24 SUPPLY VOLTAGE (V)
65
3.32
IVDD3 = 5mA
3.28
3.24
3.20
IVDD3 = 20mA
-50
-25
0
25
50
75
100
125
TEMPERATURE (⁰C)
Maxim Integrated │ 9
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Operating Characteristics (continued)
(VDD24 = 24V, VDD3 = 3.3V, TA = +25°C, RREFDI = 8.6kΩ or 5.2kΩ, RIN = 1.5kΩ or 1kΩ, unless otherwise noted.)
40
LDO SHORT-CIRCUIT CURRENT
vs. TEMPERATURE
toc19
40
toc20
35
2.5
30
30
2
25
20
15
5
15
25
35
45
55
65
INPUT CURRENT LIMIT (mA)
35
10
25
20
15
10
-50
-25
0
25
50
75
100
SUPPLY VOLTAGE (V)
TEMPERATURE (⁰C)
INPUT CURRENT LIMIT IINLIM
AND OUTPUT VOLTAGE
vs. VIN_ INPUT VOLTAGE
EXTVM THRESHOLD VOLTAGE
vs. TEMPERATURE
toc22
3
INPUT CURRENT
2.4
1.5
1.6
OUTPUT VOLTAGE
0
0.8
INPUT HIGH-TO-LOW,
VDD24 = 24V, RREFDI = 8.6kΩ,
VIN_ MEASURED AT THE PIN
0
8
16
24
32
2.4
OUTPUT VOLTAGE
1.6
1
0
0.8
INPUT LOW-TO-HIGH,
VDD24 = 24V, RREFDI = 8.6kΩ,
VIN_ MEASURED AT THE PIN
0.5
0
8
16
24
32
40
0
toc23
toc24
LED PRESENT
10V/div
LOW-TO-HIGH
10.5
FIELD INPUT VIN_
10
9.5
2V/div
9
HIGH-TO-LOW
OP_
8.5
40
0
8
-50
INPUT VOLTAGE (V)
PROPAGATION DEALY
HIGH-TO-LOW
INPUT CURRENT
1.5
11
EXTVM THRESHOLD (V)
2
OUTPUT VOLTAGE (V)
INPUT CURRENT LIMIT (mA)
3.2
3.2
PROPAGATION DEALY
LOW-TO-HIGH
11.5
2.5
0.5
4
INPUT VOLTAGE (V)
12
4
125
EXTVM EXTERNAL RESISTORS = 11kΩ/1kΩ
1
toc21
3
THERMAL SHUTDOWM IS NOT TRIGGERED
SHORT-CIRCUIT CURRENT (mA)
SHORT-CIRCUIT CURRENT (mA)
THERMAL SHUTDOWM IS NOT TRIGGERED
INPUT CURRENT LIMIT IINLIM
AND OUTPUT VOLTAGE
vs. VIN_ INPUT VOLTAGE
OUTPUT VOLTAGE (V)
LDO SHORT-CIRCUIT CURRENT
vs. VDD24 SUPPLY VOLTAGE
-25
0
25
50
75
100
125
40ns/div
TEMPERATURE (⁰C)
PROPAGATION DEALY
LOW-TO-HIGH
toc25
LED PRESENT
PROPAGATION DEALY
HIGH-TO-LOW
toc26
LED SHORTED TO GND
toc27
LED SHORTED TO GND
FIELD INPUT VIN_
FIELD INPUT VIN_
10V/div
10V/div
FIELD INPUT VIN_
10V/div
OP_
OP_
2V/div
2V/div
40ns/div
www.maximintegrated.com
OP_
2V/div
40ns/div
40ns/div
Maxim Integrated │ 10
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
LED8
IN7
LED7
IN6
LED6
IN5
LED5
TOP VIEW
IN8
Pin Configuration
24
23
22
21
20
19
18
17
GND
25
16
OP8
REFDI
26
15
OP7
EXTVM
27
14
OP6
RDYEN
28
13
OP5
READY
29
VDD24
30
VDD3
31
GND
32
MAX22195
12 OP4
11 OP3
10 OP2
+
1
2
3
4
5
6
7
8
IN1
LED1
IN2
LED2
IN3
LED3
IN4
LED4
9
OP1
TQFN
5mm x 5mm
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Maxim Integrated │ 11
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Pin Description
PIN
NAME
FUNCTION
POWER SUPPLY
30
VDD24
24V Field Supply. Bypass to GND with 0.1μF capacitor in parallel with 1μF capacitor.
31
VDD3
3.3V output from integrated LDO when powered from VDD24, or 3.0 - 5.5V supply input when
VDD24 not driven. Bypass to GND with 0.1μF capacitor in parallel with 1μF capacitor. If powering
VDD3 from an external supply, leave VDD24 floating. VDD3 output is turned off during thermal shutdown.
25, 32
GND
Ground Return for All Signals and the Power Supplies
EP
-
Exposed Pad. Connect to GND. Solder entire exposed pad area to ground plane with multiple vias
for best thermal performance. EP = exposed pad on the back of the package
27
EXTVM
Connect EXTVM to GND to use internal thresholds (14V, typical) for VDD24 voltage monitoring.
Connect EXTVM to external resistive divider to set external thresholds for VDD24 voltage monitoring.
Connect EXTVM to VDD3 to disable VDD24 voltage monitoring at READY pin if the device is powered
by VDD3.
26
REFDI
Digital Input Current-Limit Reference Resistor. For 24V Type 1 and Type 3 inputs, place a 8.6kΩ
resistor from REFDI to GND. For Type 2 inputs, place a 5.2kΩ resistor from REFDI to GND.
ANALOG PINS
INPUT PINS
1,3,5,7,18,
20,22,24
IN1-IN8
respectively
Field Inputs. For 24V Type 1 and Type 3 inputs, place a 1.5kΩ resistor between the field input and
IN_ pin. For Type 2 inputs, place a 1kΩ resistor between the field input and IN_ pin. Capacitors for
filtering should not be connected to the IN_ pins. See the Surge Protection of Field Inputs section
for further information.
2,4,6,8,17,
19,21,23
LED1-LED8
respectively
Energyless LED Driver Outputs. Connect to GND if LEDs are not used.
OP1-OP8
respectively
Logic Outputs. Indicate the state (high or low) of IN1-IN8. High level is VDD3. Low level is GND. If
thermal shutdown is triggered, OP1-OP8 are high-impedance.
RDYEN
Ready Enable. Has a weak internal pulldown. Assert high to enable the READY output. Cascade
the READY signal of multiple devices through a single isolator or a microcontroller input pin by
connecting the READY output of each device to the RDYEN input of the next device in the chain.
READY from the last device in the chain drives the isolator input, or the microcontrol GPI.
READY
Open-drain output. Connect a pulldown resistor between READY and GND pin. Assert high to
indicate the device is functional and the outputs are valid. The following conditions must be met for
READY to assert high:
1. VDD3 is above the UVLO threshold.
2. REFDI is not open or shorted to GND.
3. MAX22195 is not in Thermal Shutdown.
4. RDYEN is high.
5. VDD24 is valid if the device is powered by VDD24 and EXTVM is not connected to VDD3.
LOGIC PINS
9,10,11,12,
13,14,15,16
28
29
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Maxim Integrated │ 12
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Functional/Block Diagram
VDD24
VDD3
3.3V
REGULATOR
3.3V
3.3V
MONITOR
24V
MONITOR
EXTVM
READY
TEMP
MONITOR
OPEN/SHORT DE TECTION
REFDI
REFERENCE
GENERATORS
IREF
VREF
RDYEN
VREF
CMOS
OUTPUT
IN1
OP1
LED1
INPUT CHANNEL 1,
TYPICAL OF 8
IN8
LED8
INPUT CHANNEL 8
OP8
GND
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Maxim Integrated │ 13
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Detailed Description
RDYEN and READY Monitor
The current-setting resistor RREFDI can be calculated
using this equation:
Ready Enable RDYEN is used to cascade other READY
signals through to a single digital isolation channel or a
microcontroller GPI pin. Connect the READY output of
one device to the RDYEN input of the next device in the
chain. Connect the final READY output to a digital isolator
or a microcontroller GPI pin. All READY signals must be
high for the final READY signal to go high. READY is an
open-drain PMOS output, driven to VDD3 for a high output
and set at high-impedance for a low output. Refer to
Typical Application Circuits for details.
The READY output is used to signal a logic-side controller
that the field-side circuit is working. This allows the controller to
distinguish from a valid reading of eight low inputs or an
invalid reading caused by a field-side fault such as loss of
power. The READY output is asserted high when the
following five conditions are met: the UVLO voltage
threshold for VDD3 is exceeded; the VDD24 field supply
requirement is met as set by internal thresholds or EXTVM
external thresholds if enabled; the device is not in thermal
shutdown; current through the REFDI pin is in a reasonable
range (7.21µA to 550µA); and the RDYEN is high.
The MAX22195 senses the state (on, high or off, low) of
each input (IN1-IN8). The voltages at the IN1–IN8 input
pins are compared against internal references to determine
whether the sensor is on (logic 1) or off (logic 0). Placing a
8.6kΩ current-setting resistor between REFDI and GND,
and a 1.5kΩ resistor in series with each input ensures
that the current at the on and off trip points as well as
the voltage at the trip points satisfy the requirements of
IEC 61131-2 for Type 1 and Type 3 inputs (Figure 2). The
current sunk by each input pin rises linearly with input
voltage until the level set by the current-limiter is reached;
any voltage increase beyond this point does not increase
the input current. Limiting the input current ensures
compliance with IEC 61131-2 while significantly reducing
power dissipation compared to traditional resistive inputs.
IINLIM [mA] = VIN / 517 [V/kΩ] + 20.5 / RREFDI [V/kΩ]
where VIN is 5.6V at the input pin during production test
for the typical value of Type 1 and 3, and Type 2 current
limits.
VIN (V)
Outputs OP1 - OP8 are high-impedance only when thermal
shutdown is triggered.
STANDARD OPERATING RANGE FOR 24V DC DIGITAL INPUTS (CURRENT SINKI NG)
VHMAX
IHMIN
IHMAX
ON REGION
VHMIN OR VTMAX
VLMAX
ITMAX
TRANSITION REGION
ITMI N
VLMAX OR VTMI N
ILMIN
OFF REGION
ILMAX
0
IIN (mA)
VLMIN
Type
of
Limit
Type 1 Limits
Off Region
VL
IL
(V)
(mA)
Transition
VT
IT
(V) (mA)
Type 3 Limits
Type 2 Limits
On Region
VH
IH
(V)
(mA)
Off Region
VL
IL
(V)
(mA)
Transition
IT
VT
(V) (mA)
On Region
VH
IH
(V)
(mA)
Off Region
VL
IL
(V)
(mA)
Transition
VT
IT
(V) (mA)
On Region
VH
IH
(V)
(mA)
Max
15/5
15
15
15
30
15
11/5
30
11
30
30
30
11/5
15
11
15
30
15
Min
-3
ND
5
0.5
15
2
-3
ND
5
2
11
6
-3
ND
5
1.5
11
2
ND = NOT DEFINED
Figure 2. Switching Characteristics for IEC 61131-2 Type 1, 2, and 3 24VDC Digital Inputs
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Maxim Integrated │ 14
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
External VDD24 Voltage Monitor
The EXTVM input controls how the VDD24 field supply
affects the READY output. When EXTVM is connected
to VDD3, the status of the VDD24 field supply becomes a
don’t-care in the decision to assert READY. This is
useful when the MAX22195 is being powered directly
from a 3.3V supply on VDD3 and VDD24 is not in use.
When EXTVM is connected to GND, the voltage on
VDD24 must be above the nominal 14V threshold before
READY asserted high. To use an user-defined VDD24
supply voltage threshold, use an external resistive divider
to apply an analog voltage directly to EXTVM. The
voltage at EXTVM must be greater than the threshold,
0.81V (VREF) nominal, before READY asserted high.
Figure 3 shows an example of the VDD24 being monitored
with the use of external resistive divider to set a nominal
threshold before READY asserted high.
VDD24 = VREF (1 + (R2/R1))
Short/Open Detection at REFDI Pin
Short or open detection at REFDI pin is implemented by
monitoring the current set by REFDI pin.When more than
550µA current is detected, meaning a short at REFDI, the
2mA minimum input current is not guaranteed, and field
input low-to-high and high-to-low thresholds are changed.
When less than 7.21µA current is detected, meaning an
open at REFDI, the 2mA minimum input current is not
guaranteed. When open or short at REFDI pin is detected, the READY pin is not asserted.
24V
0.1µF
0.1µF
1µF
R2
EXTVM
VDD24
VDD3
RDYEN
R1
MAX22195
8.6kΩ
REFDI
READY
When IN_ is determined to be on, its input current is
diverted to the LED_ pin and flows from that pin to GND.
Placing an LED between LED_ and GND provides an
indication of the input state without increasing overall
power dissipation. If the indicator LEDs are not used,
connect LED_ to GND.
Type 2 Sensor Inputs
The additional input current (6mA min) and associated
power dissipation of Type 2 input require the use of two
MAX22195 inputs in parallel. The current of each channel
is set to a nominal 3.97mA (7.9mA total) by placing a 5.2kΩ
resistor from REFDI to GND. The proper voltage drop
across the input resistor is maintained by reducing the
resistance from 1.5kΩ to 1kΩ for each MAX22195
input channel. If lower input current is desired, the
REFDI resistor can be increased to 5.76kΩ or higher
as long as the 6mA minimum input current for Type 2
is met. For proper surge protection, it is important that
each MAX22195 input has its own resistor. Any two
MAX22195 channels may be used; they need not be
continuous (Figure 4). Either channel may be read to
determine the input state. The additional power dissipation
from this Type 2 configuration reduces the maximum
ambient operating temperature to 120°C, when all inputs
are at 30V, and the MAX22195s are powered from a 30V
field supply and there is no additional load on VDD3.
Thermal Considerations
The MAX22195 will operate at an ambient temperature
of 125°C on a properly designed multilayer PC board.
Operating at higher voltages, or with heavy output loads
such as optical isolators will increase power dissipation
and reduce the maximum allowable operating temperature.
See Package Information section and Absolute Maximum
Ratings section for safety operation temperature and maximum power dissipation.
3.3V
1µF
Energyless LED Drivers
4.7kΩ
GND
The MAX22195 is in thermal shutdown when the thermal
shutdown temperature threshold is exceeded. During
thermal shutdown, the internal voltage regulator, input
channels, REFDI circuitry are all turned off, and outputs
OP1-OP8 are high-impedance.
Figure 3. User-Defined VDD24 Threshold Set by EXTVM and
External Resistive Divider
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Maxim Integrated │ 15
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
3.3V
24V
1µF
0.1µF
0.1µF
VDD3
VDD24
1µF
RDYEN
EXTVM
5.2kΩ
VDD
REFDI
GPI
READY
CH1
1kΩ
IN1
4.7kΩ
LED1
1kΩ
LED2
CH4
1kΩ
OP1
IN2
GPI1
MCU
MAX22195
OP3
GPI2
OP5
GPI3
OP7
GPI4
IN7
LED7
1kΩ
GND
IN8
LED8
GND
MAX22195 IMPLEMENTING 4-CHANNEL TYPE 2 DIGITAL INPUT
Figure 4. Implementing Type 2 Digital Inputs with MAX22195
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Maxim Integrated │ 16
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Applications Information
Power Supply Decoupling
To reduce ripple and the chance of introducing data
errors, bypass VDD24 and VDD3 with a 0.1µF low-ESR
ceramic capacitor in parallel with 1µF ceramic capacitor to
GND, respectively. Place the bypass capacitors as close
as possible to the power supply input pins.
Powering MAX22195 with VDD3
The MAX22195 can alternatively be powered using a 3.0
– 5.5V supply connected to the VDD3 pin. In this case, a
24V supply is no longer needed, the VDD24 pin must be left
unconnected and EXTVM pin is connected to VDD3 to disable the VDD24 voltage monitoring, see Typical Application
Circuits for details. This configuration has lower power
consumption and heat dissipation since the on-chip LDO
voltage regulator is disabled (the VDD24 undervoltage
lockout is below threshold and automatically disables the
LDO).
PCB Layout Recommendations
The PCB designer should follow some critical
recommendations in order to get the best performance
from the design.
●● Keep the input/output traces as short as possible.
Avoid using vias on the signals to make lowinductance paths.
●● Have a solid ground plane underneath the entire
exposed pad (EP) area with multiple thermal vias for
best thermal performance.
●● In order to achieve the highest EFT performance, it
is recommended to have the GND plane around the
REFDI traces, and isolate the REFDI traces from all
input traces, especially IN8, as much as possible. For
example, route input traces and REFDI traces on two
different layers and have a GND plane on the inner
layers in between.
IEC 61131-2 EMC Requirement
The MAX22195 is required to operate reliably in harsh
industrial environments. The device can meet the transient immunity requirements as specified in IEC 61131-2,
including Electrostatic Discharge (ESD) per IEC 610004-2, Electrical Fast Transient/Burst (EFT) per IEC 610004-4, and Surge Immunity per IEC 61000-4-5. Maxim’s
proprietary process technology provides robust input
channels and field supply with internal ESD structures
and high Absolute Maximum Ratings (see the Absolute
Maximum Ratings section), but external components are
also required to absorb excessive energy from ESD and
surge transients. The circuit with external components
shown in Figure 5 allows the device to meet and exceed
the transient immunity requirements as specified in IEC
61131-2 and related IEC 61000-4-x standards. The system shown in Figure 5, using the components shown in
Table 1, is designed to be robust against ESD, EFT, and
Surge specifications as listed in Table 2. In all these tests,
the part or DUT is soldered onto a properly designed
application board (e.g., the MAX22195EVKIT#) with necessary external components.
Table 1. Recommended Components for EMC compliance
COMPONENT
DESCRIPTION
REQUIRED/RECOMMENDED
C1
1μF, 100V ceramic capacitor
Required
C2
0.1μF, 100V low-ESR ceramic capacitor
Required
C3
1μF, 10V ceramic capacitor
Required
C4
0.1μF, 10V low-ESR ceramic capacitor
Required
C5
3.3nF, safety rated Y capacitor (2220)
Recommended
D1
Unidirectional TVS diode SMBJ33A (42Ω) or SM30T39AY (2Ω)
Recommended
R1
1.5kΩ or 1kΩ, 1W pulse withstanding resistor (CMB0207 or similar)
Required
0603, 0.1W resistors
Required
All other Resistors
All LEDs
LEDs for visual input status indication
www.maximintegrated.com
Recommended
Maxim Integrated │ 17
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
24V
3.3V
D1
C2
C1
GND
C4
GND
GND
8.6kΩ
REFDI
GND
VDD24
VDD3
GND
VDD
RDYEN
EXTVM
GND
GND
R1
C3
READY
GPI
4.7kΩ
IN1
GND
LED1
MAX22195
GND
R1
IN8
LED8
GND
OP1
GPI1
OP2
GPI2
OP3
GPI3
OP4
GPI4
OP5
GPI5
OP6
GPI6
OP7
GPI7
OP8
GPI8
MICROCONTROLLER
GND
GND
GND
C5
EARTH
GND
Figure 5. Typical EMC Protection Circuit for the MAX22195
www.maximintegrated.com
Maxim Integrated │ 18
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
ESD Protection of Field Inputs
The input resistor limits the energy into the MAX22195
IN_ pins and protects the internal ESD structure from
excessive transient energy. An input series resistor is
required and should be rated to withstand such ESD
levels. The MAX22195 input channels can withstand up
to ±8kV ESD contact discharge and ±15kV ESD air-gap
discharge with an input series resistor of 1kΩ or larger.
The input resistor value shifts the field voltage switching
threshold scaled by the input current; thus, it determines
the input characteristics of the application. The package
of the resistor should be large enough to prevent the arcing across the two resistor pads. Arcing depends on the
ESD level applied to the field input and the application
pollution degree.
EFT Protection of Field Inputs
The input channels can withstand up to ±2kV, 5kHz, or
100kHz fast transients (Figure 7) with performance criterion A, normal operation within specification limits. The
MAX22195 outputs OP1–OP8 and READY signal operate
as normal without any loss of function or performance.
With EFT levels up to ±4kV, outputs OP1–OP8 still operate as normal, but the READY signal is corrupted; thus,
giving a criterion B performance with temporary degradation of the READY function.
A capacitive coupling clamp is used to couple the fast
transients (burst) from the EFT generator to the field
inputs of the MAX22195 without any galvanic connection
to the MAX22195 input pins.
Surge Protection of Field Inputs
In order to protect the IN_ pins against 1kV/42Ω, 1.2/50µs
surges (Figure 8 and Figure 9), two options exist. The
first option is to use a series pulse-withstanding resistor
as shown in the various application diagrams in the data
sheet. A pulse resistor greater or equal to 1kΩ should be
used for safe operation. The pulse resistor should support dissipation of the surge energy. Examples of suitable
resistors are CMB0207 MELF or CRCW-IF thick film as
well as others. The resistor value is defined by the Type 1,
2, 3, or other input characteristics. Capacitors for filtering
should not be connected to the IN_ pins.
The second option, which can result in a smaller overall
footprint, is to use a bidirectional TVS to GND at the field
input with a low-power series resistor, greater or equal to
1kΩ. The TVS must be able to absorb the surge energy
and has the function of limiting the peak voltage so that
the resistor only sees a low differential voltage. Suitable
TVS with a small footprint are SPT02-236 or PDFN3-32,
offering protection against 1kV/42Ω surge.
Surge Protection of 24V Supply
In order to protect the VDD24 pin against 500V/42Ω,
1.2/50µs surges (Figure 8), a SMBJ33A TVS can be
applied to the VDD24 pin.
Table 2. Transient Immunity Test Results
TEST
IEC 61000-4-2 Electrostatic Discharge (ESD)
IEC 61000-4-4 Electrical Fast Transient / Burst (EFT)
RESULT
Contact ESD
±8kV
Air-Gap ESD
±15kV
Line-to-Line
Power Supply
www.maximintegrated.com
READY and OP1-OP8 operate without degradation of performance
±4kV
OP1-OP8 operate without degradation of
performance; READY signal is corrupted
Line-to-Ground
Line-to-Ground
IEC 61000-4-5 Surge Immunity
±2kV
±1kV
±2kV
±500V
Maxim Integrated │ 19
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
150pF
I
100%
90%
RD
330Ω
DISCHARGE
RESISTANCE
DEVICE
UNDER
TEST
STORAGE
CAPACITOR
IPEAK
RC
50MΩ TO 100MΩ
10%
tr = 0.7ns TO 1ns
t
30ns
60ns
Figure 6a. Test Circuit
Figure 6b. Test Waveform
V
EFT PULSE
EFT VOLTAGE
200µs AT 5kHz
10µs AT 100kHz
t
REPETITION FREQUENCY
V
EFT/BURST
EFT VOLTAGE
...
BURST
DURATION
...
15ms AT 5kHz
0.75ms AT 100kHz
t
BURST PERIOD 300ms
Figure 7. Electrical Fast Transient/Burst Waveform
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Maxim Integrated │ 20
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
V
100%
90%
50%
t2
t
0
30% MAX
t1
FRONT TIME: t1 = 1.2µs ± 30%
TIME TO HALF VALUE: t2 = 50µs ± 20%
Figure 8. 1.2/50µs Surge Voltage Waveform
COUPLING/DECOUPLING NETWORK
2Ω
40Ω
0.5μF
1kΩ
IN1
1kΩ
MAX22195
IN2
GENERATOR
A
B
GND
A = LINE-TO-LINE
B = LINE-TO-GND
Figure 9. Surge Testing Method
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Maxim Integrated │ 21
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Application Circuits
VDD24
24V FIELD SUPPLY
3.3V
0.1µF
1µF
1µF
2.5V
0.1µF
0.1µF
0.1µF
VDD3
VDD24
VDDA
IN1
READY
EXTVM
8.6kΩ
1.5kΩ
0.1µF
LED1
1.5kΩ
GNDL
GND
3.3V
IN1
MAX22195
#1
IN2
LED2
INP (INPUT-PIN)
1.5kΩ
IN8
LED8
2.5V
VDDA
VDDB
GPI1
OUT2
GPI2
IN3
OUT3
GPI3
IN4
OUT4
GPI4
IN1
OP2
IN2
OP3
OP4
MAX14430
GNDL
0.1µF
2.5V
3.3V
VDDA
VDDB
OUT1
GPI5
OUT2
GPI6
IN3
OUT3
GPI7
IN4
OUT4
GPI8
OP5
IN1
OP6
IN2
OP7
OP8
MAX14430
RDYEN
GND
GNDL
GND
MICRO
CONTROLLER
VDD24
1µF
0.1µF
0.1µF
EXTVM
VDD3
VDD24
1µF
RDYEN
READY
8.6kΩ
1.5kΩ
4.7kΩ
REFDI
IN1
0.1µF
LED1
1.5kΩ
IN2
LED2
MAX22195
#2
INP (INPUT-PIN)
1.5kΩ
IN8
LED8
GND
3.3V
VDDA
VDDB
0.1µF
2.5V
OUT1
GPI9
OUT2
GPI10
IN3
OUT3
GPI11
IN4
OUT4
GPI12
OP1
IN1
OP2
IN2
OP3
OP4
0.1µF
INF (INPUT-FIELD)
VDD
0.1µF
GND
INF (INPUT-FIELD)
GPI
OUT1
OP1
0.1µF
OUT1
MAX12930
IN2
4.7kΩ
REFDI
VDDB
MAX14430
GNDL
GND
3.3V
VDDA
VDDB
0.1µF
2.5V
OUT1
GPI13
OUT2
GPI14
IN3
OUT3
GPI15
IN4
OUT4
GPI16
OP5
IN1
OP6
IN2
OP7
OP8
GND
MAX14430
GNDL
GNDL
ISOLATED 16–CHANNEL TYPE 1/3 DIGITAL INPUT
www.maximintegrated.com
Maxim Integrated │ 22
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Typical Application Circuits (continued)
3.3V
0.1µF
VDD24
UNCONNECTED
3.3V
EXTVM
8.6kΩ
VDD24
VDD3
1µF
VDD
RDYEN
REFDI
1.5kΩ
IN1
GPI
READY
LED1
4.7kΩ
1.5kΩ
IN2
LED2
INF (INPUT FIELD)
1.5kΩ
MICROCONTROLLER
MAX22195
INP (INPUT PIN)
IN8
LED8
OP1
GPI1
OP2
GPI2
OP3
GPI3
OP4
GPI4
OP5
GPI5
OP6
GPI6
OP7
GPI7
OP8
GPI8
GND
GND
MAX22195 POWERED BY VDD3, VDD24 UNCONNECTED
Ordering Information
Chip Information
PART
TEMP RANGE
PIN-PACKAGE
MAX22195ATJ+
-40°C to +125°C
32-TQFN
PROCESS: BiCMOS
+Denotes a lead(Pb)-free/RoHS-compliant package.
www.maximintegrated.com
Maxim Integrated │ 23
MAX22195
High-Speed, Octal, Industrial Digital Input
with Parallel Output
Revision History
REVISION
NUMBER
REVISION
DATE
0
5/18
Initial release
1
7/18
Updated Benefits and Features section, Electrical Characteristics table, Pin Description
table, Detailed Description section, and Figure 5
2
9/18
Updated the ESD and EMC Characteristics table and the Detailed Description section
7, 14
1/19
Updated ESD and EMC Characteristics table, and PCB Layout Recommendations,
and IEC61000-4-4 Electrical Fast Transient/Burst (EFT) sections; corrected typos
7, 17,
19–20
4/19
Updated the General Description, Electrical Characteristics, Pin Description, RDYEN
and READY Monitor, Short/Open Detection at REFDI Pin, Energyless LED Drivers,
Thermal Considerations, IEC 61000-4-4 Electrical Fast Transient/Burst (EFT) and IEC
61000-4-5 Surge Immunity sections, and Table 1; replaced Table 3.
1, 6, 12, 14
15, 17, 19–21
5
9/20
Updated the Pin Description and Power Supply Decoupling sections, Table 1 and new
Table 2; updated the Octal Digital Input with Parallel Output, Figures 4–5, 7–9, and the
Typical Application Circuits; removed the Surge Protection, EMC Standard Compliance, Test Levels and Methodology, IEC 61000-4-2 Electrostatic Discharge (ESD),
Contact discharge Method, Air Gap Discharge Method, IEC 61000-4-4 Electrical Fast
Transient/Burst (EFT) and IEC 61000-4-5 Surge Immunity sections; removed the
existing Table 2 and renumbered subsequent tables; renamed the Typical Operating
Circuits Typical Application Circuits; added the IEC61131-2 EMC Requirement, ESD
Protection of Field Inputs; EFT Protection of Field Inputs, Surge Protection of Field
Inputs, and Surge Protection of 24V Supply sections
2, 12,
15–23
6
3/21
Updated the Powering MAX22195 with VDD3 Section, Table 1, and
MAX22195 Typical Application Circuit (Powered by VDD3).
17, 23
3
4
PAGES
CHANGED
DESCRIPTION
—
1, 4, 5,
11, 14
For pricing, delivery, and ordering information, please visit Maxim Integrated’s online storefront at https://www.maximintegrated.com/en/storefront/storefront.html.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
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