19-2520; Rev 5; 1/09
KIT
ATION
EVALU
E
L
B
AVAILA
2.4GHz SiGe Linear Power Amplifier
Features
The MAX2247 low-voltage, three-stage linear power
amplifier (PA) is optimized for 802.11b/g wireless LAN
(WLAN) applications in the 2.4GHz ISM band. The
device is integrated with an adjustable bias control,
power detector, and shutdown mode. The MAX2247
features 29dB of power gain and delivers up to
+24dBm of linear output power at 24% efficiency from a
single +3.3V supply. It achieves less than -32dBc firstside lobe suppression and less than -55dBc secondside lobe suppression under 802.11b modulation. In
addition, the device can be matched for optimum efficiency and performance at output power levels from
+10dBm to +24dBm. Its high +28dBm saturated output
power also allows the device to meet the requirements
of 802.11g OFDM modulation.
♦ 2.4GHz to 2.5GHz Operating Range
The MAX2247 features an external bias-control pin that
allows the supply current of the device to be dynamically throttled back at lower output power levels, thus
improving efficiency while maintaining sufficient sidelobe suppression. Proprietary internal bias circuitry
maintains stable device performance over temperature
and voltage-supply variations. An additional power-saving feature is a logic-level shutdown pin that reduces
supply current to 0.5µA and eliminates the need for an
external supply switch. The integrated shutdown function also allows guaranteed device ramp-on and rampoff times.
♦ 0.5µA Shutdown Mode
The MAX2247 integrates a power detector with 20dB
dynamic range and ±0.8dB accuracy at the highest
output power level. The detector provides a buffered
DC voltage proportional to the output power of the
device, saving cost and space by eliminating a coupler
and op amp usually required to implement a power
detector function. The device is packaged in the tiny
3 ✕ 4 chip-scale package (UCSP™), measuring only
1.5mm ✕ 2mm, making it the ideal solution for radios built
in small form factors.
♦ Up to +24dBm Linear Output Power (ACPR of
Less than -32dBc First-Side Lobe and Less than
-55dBc Second-Side Lobe)
♦ 24% PAE at +24dBm Linear Output Power, 3.3V
24% PAE at +21dBm Linear Output Power, 3.0V
♦ 29dB Power Gain
♦ On-Chip Power Detector with Buffered Output
♦ Internal 50Ω Input Matching
♦ External Bias Control for Current Throttleback
♦ Integrated Bias Circuitry
♦ +2.7V to +4.2V Single-Supply Operation
♦ Tiny Chip-Scale Package (1.5mm ✕ 2mm)
Ordering Information
TEMP RANGE
PINPACKAGE
TOP
MARK
MAX2247EBC-T
-40°C to +85°C
4 x 3 UCSP*
AAW
MAX2247EWC+T
-40°C to +85°C
12 WLP
+AAX
PART
*Requires special solder temperature profile in the Absolute
Maximum Ratings Sections.
-Denotes a package containing lead(Pb).
+Denotes a lead(pB)-free/RoHS-compliant package.
T = Tape and reel.
Typical Operating Circuit appears at end of data sheet.
Pin Configuration
TOP VIEW
A1
A2
A3
A4
BIAS
VCC2
GND2
VCC1
B1
B3
B4
GND3
MAX2247
PD_
OUT
GND1
C1
C2
C3
C4
RF_
OUT
SHDN
VCCB
RF_IN
Applications
IEEE 802.11b DSSS WLAN
IEEE 802.11g OFDM WLAN
HomeRF™
2.4GHz Cordless Phones
2.4GHz ISM Radios
UCSP is a trademark of Maxim Integrated Products, Inc.
HomeRF is a trademark of HomeRF Working Group.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1
MAX2247
General Description
MAX2247
2.4GHz SiGe Linear Power Amplifier
ABSOLUTE MAXIMUM RATINGS
VCC1, VCC2, VCCB, RF_OUT to GND....................-0.3V to +4.5V
SHDN, BIAS, PD_OUT ................................-0.3V to VCC_ + 0.3V
RF Input Power (50Ω source)...........................................+5dBm
RF_IN Input Current............................................................±1mA
Maximum VSWR Without Damage ........................................10:1
Maximum VSWR for Stable Operation, POUT < +25dBm........5:1
Continuous Power Dissipation (TA = +70°C)
4 ✕ 3 UCSP, 12 WLP
(derate 28.5mW/°C above +70°C) ..................................1.3W
Thermal Resistance (Note 1)............................................35°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +125°C
UCSP Bump Temperature (soldering) (Note 2)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
WLP Bump Soldering Temperature .................................+250°C
Continuous Operating Lifetime.....................10yrs × 0.92(TA - 60°C)
(For Operating Temperature, TA ≥ +60°C)
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits the use of only the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not recommended.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION! ESD SENSITIVE DEVICE
DC ELECTRICAL CHARACTERISTICS
(MAX2247 EV kit, VCC_ = +2.7V to +4.2V, SHDN = VCC, RF_IN and RF_OUT terminated to 50Ω, TA = -40°C to +85°C. Typical values
are at +3V and TA = +25°C, unless otherwise noted.) (Note 3)
PARAMETER
CONDITIONS
Supply Voltage
Shutdown Supply Current
Digital Input Logic High
TYP
2.7
POUT = +24dBm, VCC_ = 3.3V
317
POUT = +25dBm, VCC_ = 4.2V
345
POUT = +23dBm, VCC_ = 3.0V
305
POUT = +21dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details.
175
POUT = +18dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details.
120
POUT = +15dBm with optimized output-matching circuit.
Refer to the MAX2247 EV kit for details.
85
SHDN = 0, no RF signal applied
0.5
Idle current = 250mA
with VCC = 3.3V
Supply Current (Notes 4, 5)
MIN
MAX
UNITS
4.2
V
350
mA
10
2
Digital Input Logic Low
µA
V
0.8
V
Digital Input Current High
-1
+5
µA
Digital Input Current Low
-1
+1
µA
2
_______________________________________________________________________________________
2.4GHz SiGe Linear Power Amplifier
MAX2247
AC ELECTRICAL CHARACTERISTICS
(MAX2247 EV kit, VCC_ = +3V, fRF = 2.45GHz, SHDN = VCC, 50Ω RF system impedance, TA = +25°C, unless otherwise noted.) (Note 6)
PARAMETER
CONDITIONS
MIN
RF Frequency Range
(Notes 5, 7)
TA = +25°C
26
TA = -40°C to +85°C
25
UNITS
VCC_ = 3.3V, POUT = +24dBm
29.5
VCC_ = 4.2V, POUT = +25dBm
30.5
VCC = 3.0V to 3.6V
±0.5
Output Power Over Temperature
(Notes 5, 9)
ACPR: First-side lobe < -32dBc,
second-side lobe < -55dBc
PIN = +5dBm
Harmonic Output (2f, 3f, 4f)
VCC_ = 3V
22
GHz
29.5
Gain Variation Over Supply
Voltage (Note 5)
Saturated Output Power
MAX
2.4 to 2.5
VCC_ = 3V, POUT = +23dBm
Power Gain (Notes 3, 5, 9)
TYP
dB
dB
23
VCC_ = 3.3V
24
VCC_ = 4.2V
25
dBm
27.8
dBm
-45
Input VSWR
Over full PIN range
Output VSWR
Over full POUT range
dBc
1.8:1
2.5:1
2:1
2.5:1
Power Ramp Turn-On Time
(Note 8)
0.8
1.5
µs
Power Ramp Turn-Off Time
(Note 10)
0.8
1.5
µs
RF Output Detector
Response Time
0.9
RF Output Detector Voltage
(Note 11)
POUT = +23dBm
1
POUT = +15dBm
0.6
POUT = +7dBm
0.47
µs
V
Note 3: Characteristics are production tested at TA = +25°C. DC specifications over temperature are guaranteed by design
and characterization.
Note 4: Idle current is controlled by external DAC for best efficiency over the entire output power range.
Note 5: Parameter is measured with RF modulation based on IEEE 802.11b standard.
Note 6: Minimum and maximum specifications are guaranteed by design and characterization.
Note 7: Operation outside this range is possible but not guaranteed.
Note 8: The total turn-on time required for PA output power to settle to within 0.5dB of the final value.
Note 9: Specification is corrected for PC board loss of approximately 0.3dB, on the output of the MAX2247 EV kit.
Note 10: Total turn-off time required for PA supply current to fall below 10µA.
Note 11: See the Typical Operating Characteristics for statistical variation.
_______________________________________________________________________________________
3
2.4GHz SiGe Linear Power Amplifier
MAX2247
Typical Operating Characteristics
(VCC_ = 3V, fRF = 2.45GHz, with MAX2247 EV kit optimized for POUT = +23dBm. TA = +25°C, unless otherwise noted.)
TA = +85°C
400
TA = -40°C
20
350
18
3.9
400
TA = -40°C
32
TA = +85°C
26
3.0
3.3
3.6
25
250
4.2
3.9
2.7
3.0
3.3
3.6
ADJ CPR
vs. SUPPLY VOLTAGE
ALT CPR
vs. SUPPLY VOLTAGE
POUT = +23dBm
-26
TA = +85°C
-46
-48
-30
TA = +25°C
-52
TA = +85°C
ALT CPR (dBc)
290
TA = +25°C
POUT = +23dBm
-50
-28
TA = +25°C
-32
-34
MAX2247 toc06
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
-24
4.2
3.9
SUPPLY VOLTAGE (V)
300
TA = +85°C
-54
-56
-58
-60
280
-36
TA = -40°C
-62
-38
260
250
TA = -40°C
-66
-40
3.0
3.3
3.6
3.9
4.2
2.7
3.0
SUPPLY VOLTAGE (V)
OUTPUT POWER vs. INPUT POWER
2.7
4.2
3.0
3.3
25
VCC = +3.3V
15
VCC = +3.0V
BIAS CURRENT ADJUSTED
TO KEEP ADJ/ALT CPR =
-32dBc/-55dBc
200
150
100
ADJ/ALT CPR vs. OUTPUT POWER
-25
-30
-35
ADJ CPR
-40
-45
-50
-55
-60
50
5
4.2
3.9
-20
ADJ/ALT CPR (dBc)
SUPPLY CURRENT (mA)
250
3.6
SUPPLY VOLTAGE (V)
300
MAX2247 toc07
30
10
3.9
SUPPLY CURRENT vs. OUTPUT POWER
VCC = +4.2V
20
3.6
SUPPLY VOLTAGE (V)
40
35
3.3
MAX2247 toc08
2.7
TA = -40°C
-64
MAX2247 toc09
270
POUT (dBm)
29
SUPPLY VOLTAGE (V)
310
ALT CPR
-65
0
-70
0
-20
-15
-10
-5
PIN (dBm)
4
30
27
300
2.7
TA = +25°C
31
28
ICC
14
250
4.2
POUT = +23dBm
320
20
TA = +85°C
TA = -40°C
SUPPLY VOLTAGE (V)
330
SUPPLY CURRENT (mA)
3.6
ADJ CPR (dBc)
340
3.3
TA = +25°C
16
MAX2247 toc04
350
3.0
22
18
300
2.7
450
350
ICC
16
POUT
24
POUT = +23dBm
33
GAIN (dB)
TA = +25°C
22
26
SUPPLY CURRENT (mA)
450
POUT
34
500
MAX2247 toc05
POUT (dBm)
24
35
550
INPUT POWER ADJUSTED TO
KEEP ADJ/ALT CPR = -32dBc/-55dBc
28
500
26
GAIN vs. SUPPLY VOLTAGE
MAX2247 toc02
550
POUT (dBm)
28
MAX2247 toc01
INPUT POWER ADJUSTED TO
KEEP ADJ/ALT CPR = -30dBc/-50dBc
SUPPLY CURRENT (mA)
30
OUTPUT POWER, SUPPLY CURRENT
vs. SUPPLY VOLTAGE
MAX2247 toc03
OUTPUT POWER, SUPPLY CURRENT
vs. SUPPLY VOLTAGE
0
5
10
12
14
16
18
20
22
10
12
14
POUT (dBm)
_______________________________________________________________________________________
16
18
POUT (dBm)
20
22
24
2.4GHz SiGe Linear Power Amplifier
TA = +85°C
POUT = +23dBm
-52
ALT CPR (dBc)
-31
-32
-33
TA = +25°C
-54
TA = +85°C
-56
-34
-35
-37
2420
2440
2460
2480
2500
2460
2480
2400
2500
2420
2440
2460
OUTPUT RETURN
LOSS
-20
-25
INPUT RETURN
LOSS
-30
TA = +25°C
-35
TA = +85°C
1.4
2440
2460
2480
1.0
0.8
0.6
0.4
VCC = +4.2V,
TA = -40°C
0
2400
2500
VCC = +2.7V,
TA = +85°C
1.2
0.2
-40
2420
MAX2247 toc15
-15
2500
2480
1.6
POWER DETECTOR VOLTAGE (V)
28
MAX2247 toc14
MAX2247 toc13
-10
RETURN LOSS (dB)
2420
2440
2460
2480
2500
0
5
10
15
25
20
FREQUENCY (MHz)
FREQUENCY (MHz)
POUT (dBm)
OUTPUT POWER HISTOGRAM AT FIXED
1V POWER DETECTOR VOLTAGE
OUTPUT POWER HISTOGRAM AT FIXED
0.6V POWER DETECTOR VOLTAGE
OUTPUT POWER HISTOGRAM AT FIXED
0.47V POWER DETECTOR VOLTAGE
SIGMA = 0.237dBm
BASED ON 50 PARTS
25
SIGMA = 0.38dBm
BASED ON 50 PARTS
20
8
6
4
OCCURRENCES
OCCURRENCES
15
10
10
MAX2247 toc18
20
MAX2247 toc16
SIGMA =
0.25dBm
BASED ON
50 PARTS
MAX2247 toc17
GAIN (dB)
2440
POWER DETECTOR VOLTAGE
vs. OUTPUT POWER
20
OCCURRENCES
2420
INPUT/OUTPUT RETURN LOSS
vs. FREQUENCY
32
12
260
2400
GAIN vs. FREQUENCY
TA = -40°C
14
TA = -40°C
FREQUENCY (MHz)
36
16
TA = +25°C
280
FREQUENCY (MHz)
POUT = +23dBm
2400
290
FREQUENCY (MHz)
40
24
300
270
-60
2400
TA = +85°C
310
TA = -40°C
-58
TA = -40°C
-36
POUT = +23dBm
SUPPLY CURRENT (mA)
TA = +25°C
-30
320
MAX2247 toc12
POUT = +23dBm
-29
ADJ CPR (dBc)
MAX2247 toc10
-28
SUPPLY CURRENT vs. FREQUENCY
ALT CPR vs. FREQUENCY
-50
MAX2247 toc11
ADJ CPR vs. FREQUENCY
-27
15
10
5
5
2
0
0
0
22.625
22.875
23.125
OUTPUT POWER (dBm)
23.375
14.408 14.645 14.882 15.119 15.356 15.593
OUTPUT POWER (dBm)
6.05
6.43
6.81
7.19
7.57
7.95
OUTPUT POWER (dBm)
_______________________________________________________________________________________
5
MAX2247
Typical Operating Characteristics (continued)
(VCC_ = 3V, fRF = 2.45GHz, with MAX2247 EV kit optimized for POUT = +23dBm. TA = +25°C, unless otherwise noted.)
2.4GHz SiGe Linear Power Amplifier
MAX2247
Pin Description
BUMP
NAME
A1
BIAS
Bias Control. The overall current is set by the current sourced through the bias pin. See the Bias Circuitry
section.
A2
VCC2
Second-Stage DC Supply Voltage. Sets the bias and external matching for the second amplifier stage.
Requires a small inductance. Bypass to ground using the configuration in the Typical Operating Circuit.
A3
GND2
Second-Stage Ground. See the Applications Information section for detailed layout information.
VCC1
First-Stage DC Supply Voltage. Sets the bias and external matching for the first amplifier stage. Requires a
small inductance. Bypass to ground using the configuration in the Typical Operating Circuit.
B1
GND3
Third-Stage Ground. See the Applications Information section for detailed layout information.
B3
PD_OUT
B4
GND1
C1
RF_OUT
A4
DESCRIPTION
Power-Detector Output. This output is a DC voltage indicating the PA output power.
First-Stage and Bias-Control Circuit Ground
RF Output. Open-collector output. Requires a pullup inductor, which is part of the matching network.
SHDN
Shutdown Input. Drive logic low to place the device in shutdown mode. Drive logic high for normal
operation.
C3
VCCB
Bias Circuit DC Supply Voltage. Bypass to ground using the configuration in the Typical Operating Circuit.
C4
RF_IN
RF Input. Internally matched to 50Ω. Requires an external DC-blocking cap.
C2
Functional Diagram/Typical Operating Circuit
VCC
10nF
SHUTDOWN
CONTROL
TRANSMISSION
LINE
DAC
SHDN
BIAS
POWER-DETECTOR
OUTPUT
C5
VCC2
PD_OUT
VCC
MAX2247
22pF
BIAS
CIRCUIT
10nF
DETECTOR
VCCB
VCC
3.9nH
10nF
VCC1
22pF
RF_OUT
VCC
C4
10nF
RF
INPUT
RF_IN
RF
OUTPUT
INPUT
MATCH
GND1
22pF
C3
GND2
GND3
C33*
*NOT REQUIRED FOR OUTPUT POWER
LESS THAN +23dBm.
REFER TO THE MAX2247 EV KIT FOR LAYOUT AND DESIGN DETAILS.
6
_______________________________________________________________________________________
2.4GHz SiGe Linear Power Amplifier
The MAX2247 linear power amplifier (PA) offers a wide
variety of features incorporated into a tiny UCSP package. The device includes internal bias circuitry, an integrated power detector with buffered output, low-power
shutdown mode, and internal input matching. The
MAX2247 output power can be optimized for +15dBm to
+24dBm by adjusting the output, first-stage, and secondstage matching network (see the Typical Operating
Circuit) while exceeding 802.11b ACPR requirements. In
addition, external bias control allows dynamic throttleback of the supply current to increase efficiency.
The MAX2247’s performance can be optimized for lower
output power levels. Go to the Maxim website,
www.maxim-ic.com, for MAX2247 application notes covering performance at +21dBm, +18dbm, and +15dBm.
Bias Circuitry
To improve efficiency at lower output levels, a bias pin
is offered to allow dynamic current control. An external
current DAC or resistor network can be used to throttleback current at lower output powers while still maintaining ACPR requirements. By including an internal voltage regulator along with the bias circuitry, no external
bias voltage is necessary. The internal voltage regulator maintains stable performance of the bias circuitry
over temperature and supply variations.
The overall current of the MAX2247 is set by the current
sourced through the bias pin. The overall current is 540
times the bias current. An internal bandgap reference provides +1.2V to each bias stage (see Figure 1). An external
resistor to ground can be placed at the bias pin to set the
bias current (refer to the MAX2247 evaluation kit).
An external current DAC can be connected directly to the
bias pin to adjust the bias current of the MAX2247. Figure
2 shows the MAX2247 connected to the MAX2820 zero-IF
transceiver, which includes a 4-bit DAC.
Shutdown Mode
The MAX2247 features a low-power shutdown mode to
further reduce current consumption. The MAX2247
responds to logic-level signals at the SHDN pin. A
logic-level high enables all circuitry, while a logic-level
low places the device in low-power shutdown mode
and reduces supply current to 0.5µA (typ). Power-ramp
turn-on and turn-off times are guaranteed to be less
than 1.5µs.
Power Detector
This device includes a power detector that samples the
peak voltage of the output and generates a voltage
proportional to the output power. The detector is fully
temperature compensated and allows the user to set
the detector bandwidth with an external capacitor.
INTERNAL
VOLTAGE
REFERENCE
1ST-STAGE
AMPLIFIER
BIAS CURRENT
1.2V
2ND-STAGE
AMPLIFIER
BIAS CURRENT
1.2V
3RD-STAGE
AMPLIFIER
BIAS CURRENT
1.2V
RF_OUT
RF
INPUT
RF
OUTPUT
MAX2247
BIAS
CONNECTED TO EXTERNAL RESISTOR/DAC FOR SETTING THE BIAS CURRENT
Figure 1. Internal Bias Circuitry
_______________________________________________________________________________________
7
MAX2247
Detailed Description
MAX2247
2.4GHz SiGe Linear Power Amplifier
STANDARD BASEBAND/MAC IC
TX POWER DETECTOR
MAX2820
RX BASEBAND I/Q
ZERO-IF TRANSCEIVER
POWER
DETECTOR
BIAS
CIRCUIT
CURRENT
DAC
TX BASEBAND I/Q
BALUN
RF OUTPUT
MAX2247
PA DRIVER
SHUTDOWN CONTROL
Figure 2. The MAX2247 Connected to the Current DAC of the MAX2820 for Bias Control
Applications Information
The MAX2247 is a three-stage amplifier that requires
special attention to board layout and grounding for
optimum output power, gain, efficiency, and side-lobe
suppression. For ease of implementation, the MAX2247
evaluation (EV) kit layout should be used as a model.
Gerber files are available from Maxim upon request.
Follow the recommendations below to optimize performance when adapting the layout to your board.
Interstage Matching and Bypassing
VCC1 and VCC2 provide DC bias to the open-collector
outputs of the first- and second-stage amplifiers and
are also part of the interstage matching networks
required to optimize performance among the three
amplifier stages. The MAX2247 must have a small
amount of inductance on the VCC lines in addition to
the inductance already provided on-chip. See the
Typical Application Circuit for the lumped and discrete
component values used on the MAX2247 EV kit for optimum interstage matching and RF bypassing.
8
In addition to RF bypass capacitors on each bias line, a
global bypass capacitor of 4.7µF is necessary to filter
any noise on the supply line. Route separate VCC bias
paths from the global bypass capacitor (using a star
topology) to avoid coupling between PA stages. Use
the MAX2247 EV kit PC board layout as a guide.
Input Matching
The MAX2247 includes internal input matching to 50Ω, so
no external matching network is required. A DC-blocking
capacitor is required at the input to the device.
Output Matching
The RF_OUT port is an open-collector output that must be
pulled to VCC through an RF choke for proper biasing (see
the Typical Operating Circuit). A shunt 22pF capacitor to
ground is required at the supply side of the inductor. In
addition, a matching network is required for optimum gain,
efficiency, ACPR, and output power. The EV kit should
serve as a good starting point for your layout. However,
optimum performance is layout dependent, and some
component optimization may be required. It is important to
leave room on your board for tuning/optimization.
_______________________________________________________________________________________
2.4GHz SiGe Linear Power Amplifier
UCSP Reliability
The tiny chip-scale package (UCSP) represents a
unique package that greatly reduces board space
compared to other packages. UCSP reliability is integrally linked to the user’s assembly methods, circuit
board material, and usage environment. Operating life
test and moisture resistance remains uncompromised,
as it is primarily determined by the wafer-fabrication
process. Mechanical stress performance is a greater
consideration for a UCSP. UCSP solder-joint contact
integrity must be considered because the package is
attached through direct solder contact to the user’s PC
board. Testing done to characterize the UCSP reliability
performance shows that it is capable of performing reliably through environmental stresses. Users should also
be aware that as with any interconnect system there
are electromigration-based current limits that, in this
case, apply to the maximum allowable current in the
bumps. Reliability is a function of this current, the duty
cycle, lifetime, and bump temperature. See the
Absolute Maximum Ratings section for any specific limitations listed under Continuous Operating Lifetime.
Results of environmental stress tests and additional
usage data and recommendations are detailed in the
UCSP application note, which can be found on Maxim’s
website at www.maxim-ic.com/1st_pages/UCSP.htm.
Chip Information
TRANSISTOR COUNT: 1425
Package Information
For the latest package outline information, go to
www.maxim-ic.com/packages.
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
4 x 3 UCSP
B12-8
21-0104
12 WLP
W121B2+2
21-0009
_______________________________________________________________________________________
9
MAX2247
Ground Vias
To achieve optimum gain, output power, thermal performance, and ACPR performance, ground vias should be
properly placed throughout the layout. Each ground pin
requires its own through-hole via (diameter = 10mils)
placed as near as possible to the device pin. This
reduces ground inductance, thermal resistance, and
feedback between stages. Use the MAX2247 EV kit PC
board layout as a guide.
MAX2247
2.4GHz SiGe Linear Power Amplifier
Revision History
REVISION
NUMBER
REVISION
DATE
PAGES
CHANGED
4
8/03
—
5
1/09
Added MAX2247EWC+T to Ordering Information, added WLP package information
—
1, 2, 9
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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