EVALUATION KIT AVAILABLE
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MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
General Description
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24
communications interface devices feature low power
consumption, high data-rate capabilities, and enhanced
electrostatic-discharge (ESD) protection. The enhanced
ESD structure protects all transmitter outputs and receiver
inputs to ±15kV using IEC 1000-4-2 Air-Gap Discharge,
±8kV using IEC 1000-4-2 Contact Discharge (±9kV for
MAX3246E), and ±15kV using the Human Body Model.
The logic and receiver I/O pins of the MAX3237E are protected to the above standards, while the transmitter output
pins are protected to ±15kV using the Human Body Model.
A proprietary low-dropout transmitter output stage delivers true RS-232 performance from a +3.0V to +5.5V
power supply, using an internal dual charge pump. The
charge pump requires only four small 0.1μF capacitors
for operation from a +3.3V supply. Each device guarantees operation at data rates of 250kbps while maintaining
RS-232 output levels. The MAX3237E guarantees operation at 250kbps in the normal operating mode and 1Mbps
in the MegaBaud™ operating mode, while maintaining
RS-232-compliant output levels.
The MAX3222E/MAX3232E have two receivers and two
transmitters. The MAX3222E features a 1μA shutdown
mode that reduces power consumption in battery-powered portable systems. The MAX3222E receivers remain
active in shutdown mode, allowing monitoring of external
devices while consuming only 1μA of supply current. The
MAX3222E and MAX3232E are pin, package, and functionally compatible with the industry-standard MAX242
and MAX232, respectively.
The MAX3241E/MAX3246E are complete serial ports
(three drivers/five receivers) designed for notebook and
subnotebook computers. The MAX3237E (five drivers/
three receivers) is ideal for peripheral applications that
require fast data transfer. These devices feature a shutdown mode in which all receivers remain active, while
consuming only 1μA (MAX3241E/MAX3246E) or 10nA
(MAX3237E).
The MAX3222E, MAX3232E, and MAX3241E are available in space-saving SO, SSOP, TQFN and TSSOP packages. The MAX3237E is offered in an SSOP package.
The MAX3246E is offered in the ultra-small 6 x 6 UCSP™
package.
MegaBaud and UCSP are trademarks of Maxim Integrated
Products, Inc.
19-1298; Rev 13; 12/18
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Next-Generation Device Features
●● For Space-Constrained Applications
• MAX3228E/MAX3229E: ±15kV ESD-Protected,
+2.5V to +5.5V, RS-232 Transceivers in UCSP
●● For Low-Voltage or Data Cable Applications
• MAX3380E/MAX3381E: +2.35V to +5.5V, 1μA,
2Tx/2Rx, RS-232 Transceivers with ±15kV
• ESD-Protected I/O and Logic Pins
Applications
●●
●●
●●
●●
●●
●●
Battery-Powered Equipment
Cell Phones Smart Phones
Cell-Phone Data Cables
Notebook, Subnotebook, and Palmtop Computers
Printers
xDSL Modems
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX3222ECTP+
0°C to +70°C
20 TQFN-EP**
(5mm x 5mm)
MAX3222ECUP+
0°C to +70°C
20 TSSOP
MAX3222ECAP+
0°C to +70°C
20 SSOP
MAX3222ECWN+
0°C to +70°C
18 Wide SO
MAX3222ECPN+
0°C to +70°C
18 Plastic DIP
MAX3222EC/D+
0°C to +70°C
Dice*
-40°C to +85°C
20 TQFN-EP**
(5mm x 5mm)
MAX3222EEUP/V+
-40°C to +85°C
20 TSSOP
MAX3222EEUP+
-40°C to +85°C
20 TSSOP
MAX3222EEAP+
-40°C to +85°C
20 SSOP
MAX3222EETP+
MAX3222EEWN+
-40°C to +85°C
18 Wide SO
MAX3222EEPN+
-40°C to +85°C
18 Plastic DIP
MAX3232ECAE+
0°C to +70°C
16 SSOP
MAX3232ECWE+
0°C to +70°C
16 Wide SO
MAX3232ECPE+
0°C to +70°C
16 Plastic DIP
+Denotes a lead(Pb)-free/RoHS-compliant package.
*Dice are tested at TA = +25°C, DC parameters only.
**EP = Exposed pad.
/V denotes an automotive qualified part.
Ordering Information continued at end of data sheet.
Pin Configurations, Selector Guide, and Typical Operating
Circuits appear at end of data sheet.
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Absolute Maximum Ratings
VCC to GND.............................................................-0.3V to +6V
V+ to GND (Note 1)..................................................-0.3V to +7V
V- to GND (Note 1)...................................................+0.3V to -7V
V+ + |V-| (Note 1).................................................................+13V
Input Voltages
T_IN, EN, SHDN, MBAUD to GND......................-0.3V to +6V
R_IN to GND....................................................................±25V
Output Voltages
T_OUT to GND..............................................................±13.2V
R_OUT, R_OUTB
(MAX3237E/MAX3241E)....................... -0.3V to (VCC + 0.3V)
Short-Circuit Duration, T_OUT to GND......................Continuous
Continuous Power Dissipation (TA = +70°C)
16-Pin SSOP (derate 7.14mW/°C above +70°C).........571mW
16-Pin TSSOP (derate 9.4mW/°C above +70°C)......754.7mW
16-Pin TQFN (derate 20.8mW/°C above +70°C)....1666.7mW
16-Pin Wide SO (derate 9.52mW/°C above +70°C)....762mW
18-Pin Wide SO (derate 9.52mW/°C above +70°C)....762mW
18-Pin PDIP (derate 11.11mW/°C above +70°C).........889mW
20-Pin TQFN (derate 21.3mW/°C above +70°C).......1702mW
20-Pin TSSOP (derate 10.9mW/°C above +70°C).......879mW
20-Pin SSOP (derate 8.00mW/°C above +70°C).........640mW
28-Pin SSOP (derate 9.52mW/°C above +70°C).........762mW
28-Pin Wide SO (derate 12.50mW/°C above +70°C).........1W
28-Pin TSSOP (derate 12.8mW/°C above +70°C).....1026mW
32-Pin TQFN (derate 33.3mW/°C above +70°C).......2666mW
6 x 6 UCSP (derate 12.6mW/°C above +70°C).........1010mW
Operating Temperature Ranges
MAX32_ _EC_ _..................................................0°C to +70°C
MAX32_ _EE_ _.............................................. -40°C to +85°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................ +260°C
Bump Reflow Temperature (Note 2)
Infrared, 15s.................................................................+200°C
Vapor Phase, 20s......................................................... +215°C
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(VCC = +3V to +5.5V, C1–C4 = 0.1μF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 3, 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
MAX3222E, MAX3232E,
MAX3241E, MAX3246E
0.3
1
MAX3237E
0.5
2.0
UNITS
DC CHARACTERISTICS (V CC = +3.3V or +5V, T A = +25°C)
Supply Current
Shutdown Supply Current
SHDN = V CC, no load
mA
SHDN = GND
1
10
µA
SHDN = R_IN = GND, T_IN = GND or V CC (MAX3237E)
10
300
nA
0.8
V
LOGIC INPUTS
Input Logic Low
Input Logic High
T_IN, EN, SHDN, MBAUD
T_IN, EN, SHDN, MBAUD
VCC = +3.3V
2.0
VCC = +5.0V
2.4
Transmitter Input Hysteresis
Input Leakage Current
www.maximintegrated.com
V
0.5
T_IN, EN, SHDN
MAX3222E, MAX3232E,
MAX3241E, MAX3246E
T_IN, SHDN, MBAUD
MAX3237E (Note 5)
V
±0.01
±1
9
18
µA
Maxim Integrated │ 2
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Electrical Characteristics (continued)
(VCC = +3V to +5.5V, C1–C4 = 0.1μF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 3, 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
±0.05
±10
µA
0.4
V
RECEIVER OUTPUTS
Output Leakage Current
R_OUT (MAX3222E/MAX3237E/MAX3241E/
MAX3246E), EN = VCC, receivers disabled
Output-Voltage Low
IOUT = 1.6mA (MAX3222E/MAX3232E/MAX3241E/
MAX3246E), IOUT = 1.0mA (MAX3237E)
Output-Voltage High
IOUT = -1.0mA
VCC 0.6
VCC 0.1
V
RECEIVER INPUTS
Input Voltage Range
-25
Input Threshold Low
TA = +25°C
Input Threshold High
TA = +25°C
VCC = +3.3V
0.6
1.1
VCC = +5.0V
0.8
1.5
1.5
2.4
VCC = +5.0V
2.0
2.4
0.5
TA = +25°C
3
5
Output Voltage Swing
All transmitter outputs loaded with 3kΩ to ground (Note 6)
±5
±5.4
Output Resistance
VCC = 0V, transmitter output = ±2V
300
50k
V
V
VCC = +3.3V
Input Hysteresis
Input Resistance
+25
V
V
7
kΩ
TRANSMITTER OUTPUTS
Output Short-Circuit Current
Output Leakage Current
VCC = 0V or +3.0V to +5.5V, VOUT = ±12V, transmitters
disabled (MAX3222E/MAX3232E/MAX3241E/MAX3246E)
V
Ω
±60
mA
±25
µA
MOUSE DRIVABILITY (MAX3241E)
Transmitter Output Voltage
T1IN = T2IN = GND, T3IN = VCC, T3OUT loaded with 3kΩ
to GND, T1OUT and T2OUT loaded with 2.5mA each
±5
V
ESD PROTECTION
R_IN, T_OUT
Human Body Model
±15
IEC 1000-4-2 Air-Gap Discharge (except MAX3237E)
±15
IEC 1000-4-2 Contact Discharge (except MAX3237E)
±8
IEC 1000-4-2 Contact Discharge (MAX3246E only)
T_IN, R_IN, R_OUT, EN, SHDN,
MBAUD
www.maximintegrated.com
MAX3237E
kV
±9
Human Body Model
±15
IEC 1000-4-2 Air-Gap Discharge
±15
IEC 1000-4-2 Contact Discharge
±8
kV
Maxim Integrated │ 3
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Timing Characteristics—MAX3222E/MAX3232E/MAX3241E/MAX3246E
(VCC = +3V to +5.5V, C1–C4 = 0.1μF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 3, 4)
PARAMETER
SYMBOL
RL = 3kΩ,
CL = 1000pF,
one transmitter
switching
Maximum Data Rate
Receiver Propagation Delay
Receiver Output Enable Time
tPHL
tPLH
Receiver Output Disable Time
Transmitter Skew
Receiver Skew
CONDITIONS
|tPHL - tPLH|
MIN
TA = TMIN to TMAX
(MAX3222E/MAX3232E/
MAX3241E) (Note 6)
250
TA = +25°C (MAX3246E)
250
MAX
UNITS
kbps
Receiver input to receiver output,
CL = 150pF
0.15
Normal operation (except MAX3232E)
200
ns
Normal operation (except MAX3232E)
200
ns
(Note 7)
100
ns
50
ns
VCC = +3.3V, TA = +25°C,
RL = 3kΩ to 7kΩ, measured
from +3.0V to -3.0V or -3.0V to
+3.0V, one transmitter switching
µs
0.15
|tPHL - tPLH|
Transition-Region Slew Rate
TYP
CL = 150pF
to 1000pF
6
30
V/µs
Timing Characteristics—MAX3237E
(VCC = +3V to +5.5V, C1–C4 = 0.1μF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3)
PARAMETER
Maximum Data Rate
CONDITIONS
250
VCC = +3.0V to +4.5V, RL = 3kΩ, CL = 250pF,
one transmitter switching, MBAUD = VCC
1000
VCC = +4.5V to +5.5V, RL = 3kΩ, CL = 1000pF,
one transmitter switching, MBAUD = VCC
1000
Receiver Propagation Delay
R_IN to R_OUT, CL = 150pF
Receiver Output Enable Time
Normal operation
Receiver Output Disable Time
Normal operation
Transmitter Skew (Note 7)
Receiver Skew
Transition-Region Slew Rate
MIN
RL = 3kΩ, CL = 1000pF, one transmitter switching,
MBAUD = GND
tPHL
CL = 150pF to
1000pF
µs
2.6
µs
2.4
µs
100
ns
50
ns
MBAUD = GND
6
30
MBAUD = VCC
24
150
4
30
CL = 150pF to 2500pF,
MBAUD = GND
UNITS
kbps
0.15
|tPHL - tPLH|, MBAUD = GND
VCC = +3.3V,
RL = 3kΩ to 7kΩ,
+3.0V to -3.0V or
-3.0V to +3.0V,
TA = +25°C
MAX
0.15
tPLH
|tPHL - tPLH|, MBAUD = VCC
|tPHL - tPLH|
TYP
V/µs
Note 3: MAX3222E/MAX3232E/MAX3241E: C1–C4 = 0.1μF tested at +3.3V ±10%; C1 = 0.047μF, C2, C3, C4 = 0.33μF tested at
+5.0V ±10%. MAX3237E: C1–C4 = 0.1μF tested at +3.3V ±5%, C1–C4 = 0.22μF tested at +3.3V ±10%; C1 = 0.047μF, C2,
C3, C4 = 0.33μF tested at +5.0V ±10%. MAX3246E: C1-C4 = 0.22μF tested at +3.3V ±10%; C1 = 0.22μF, C2, C3, C4 =
0.54μF tested at +5.0V ±10%.
Note 4: MAX3246E devices are production tested at +25°C. All limits are guaranteed by design over the operating temperature
range.
Note 5: The MAX3237E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are at
the supply rails.
Note 6: MAX3241EEUI is specified at TA = +25°C.
Transmitter skew is measured at the transmitter zero crosspoints.
www.maximintegrated.com
Maxim Integrated │ 4
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Typical Operating Characteristics
(VCC = +3.3V, 250kbps data rate, 0.1μF capacitors, all transmitters loaded with 3kΩ and CL, TA = +25°C, unless otherwise noted.)
SLEW RATE (V/µs)
T1 TRANSMITTING AT 250kbps
T2 TRANSMITTING AT 15.6kbps
2
1
0
-1
-2
-3
-SLEW
12
10
+SLEW
8
6
4
-4
-5
-6
VOUT0
1000
2000
3000
4000
2
0
5000
0
1000
0
1000
2000
3000
SLEW RATE (V/µs)
4000
120kbps
25
20
20kbps
15
10
5
0
5000
0
2000
3000
4000
5000
MAX3241E
OPERATING SUPPLY CURRENT
vs. LOAD CAPACITANCE
MAX3237E toc05
10
8
6
4
0
5000
1000
LOAD CAPACITANCE (pF)
60
1 TRANSMITTER AT 250kbps
2 TRANSMITTERS AT 15.6kbps
50
250kbps
40
120kbps
30
20kbps
20
10
2
VOUT-
0
1000
2000
3000
4000
0
5000
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
MAX3237E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE (MBAUD = GND)
MAX3237E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE
MAX3237E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE (MBAUD = VCC)
FOR DATA RATES UP TO 250kbps
1 TRANSMITTER AT 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
0
-1
-2
-3
-4
-5
VOUT0
500
1000
1500
2000
LOAD CAPACITANCE (pF)
www.maximintegrated.com
2500
3000
VOUT+
FOR DATA RATES UP TO 250kbps
1 TRANSMITTER 250kbps
4 TRANSMITTERS 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
VOUT0
500
1000
1500
2000
LOAD CAPACITANCE (pF)
2500
3000
7.5
TRANSMITTER OUTPUT VOLTAGE (V)
VOUT+
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
MAX3237E toc08
LOAD CAPACITANCE (pF)
MAX3246E toc07A
LOAD CAPACITANCE (pF)
2
1
-6
12
TRANSMITTER OUTPUT VOLTAGE (V)
6
5
4
3
14
MAX3237E to04
1 TRANSMITTER AT 250kbps
2 TRANSMITTERS AT 15.6kbps
0
-1
-2
-3
-4
-5
-6
4000
250kbps
30
MAX3241E
SLEW RATE vs. LOAD CAPACITANCE
MAX3237E toc07
TRANSMITTER OUTPUT VOLTAGE (V)
TRANSMITTER OUTPUT VOLTAGE (V)
VOUT+
3000
35
LOAD CAPACITANCE (pF)
MAX3241E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE
5
4
3
2
1
2000
T1 TRANSMITTING AT 250kbps
T2 TRANSMITTING AT 15.6kbps
40
FOR DATA RATES UP TO 250kbps
LOAD CAPACITANCE (pF)
6
45
MAX3237E toc03
14
SUPPLY CURRENT (mA)
3
16
MAX3237E toc02
VOUT+
SUPPLY CURRENT (mA)
5
4
MAX3237E toc01
TRANSMITTER OUTPUT VOLTAGE (V)
6
MAX3222E/MAX3232E
OPERATING SUPPLY CURRENT
vs. LOAD CAPACITANCE
MAX3222E/MAX3232E
SLEW RATE vs. LOAD CAPACITANCE
MAX3237E toc06
MAX3222E/MAX3232E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE
1Mbps
5.0
2Mbps
2.5
1.5Mbps
1 TRANSMITTER AT FULL DATA RATE
4 TRANSMITTERS AT 1/16 DATA RATE
3kΩ + CL LOAD, EACH OUTPUT
0
-2.5
-7.5
1.5Mbps
2Mbps
-5.0
1Mbps
0
500
1000
1500
2000
LOAD CAPACITANCE (pF)
Maxim Integrated │ 5
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Typical Operating Characteristics (continued)
(VCC = +3.3V, 250kbps data rate, 0.1μF capacitors, all transmitters loaded with 3kΩ and CL, TA = +25°C, unless otherwise noted.)
SR+
6
1 TRANSMITTER AT 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
1000
1500
2000
2500
0
500
500
1000
1500
2000
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
3000
5000
12
SRSR+
8
4
2000
2500
MAX3237E toc11
3000
30
20
0
5.0
1 TRANSMITTER AT 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ AND 1000pF
2.0
2.5
3.0
3.5
4.0
4.5
5.0
MAX3246E
OPERATING SUPPLY CURRENT
vs. LOAD CAPACITANCE
60
MAX3237E toc16
MAX3237E toc15
TRANSMITTER OUTPUT VOLTAGE (V)
LOAD CAPACITANCE (pF)
www.maximintegrated.com
14
10
1500
SUPPLY VOLTAGE (V)
16
SLEW RATE (V/µs)
4000
4.5
6
VOUT2000
1000
40
10
MAX3246E
SLEW RATE vs. LOAD CAPACITANCE
1 TRANSMITTER AT 250kbps
2 TRANSMITTERS AT 15.6kbps
1000
4.0
500
0
SUPPLY VOLTAGE (V)
MAX3246E
TRANSMITTER OUTPUT VOLTAGE
vs. LOAD CAPACITANCE
VOUT+
3.5
1 TRANSMITTER AT 20kbps, 120kbps, 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
50
VOUT3.0
20
MAX3237E SUPPLY CURRENT
vs. SUPPLY VOLTAGE (MBAUD = GND)
1 TRANSMITTER AT 250kbps
4 TRANSMITTERS AT 15.6kbps
ALL TRANSMITTERS LOADED
WITH 3kΩ + 1000pF
2.5
20kbps
30
LOAD CAPACITANCE (pF)
VOUT+
2.0
120kbps
0
2000
MAX3237E
TRANSMITTER OUTPUT VOLTAGE
vs. SUPPLY VOLTAGE (MBAUD = GND)
|tPLH - tPHL|
1 TRANSMITTER AT 500kbps
4 TRANSMITTERS AT 1/16 DATA RATE
ALL TRANSMITTERS LOADED
WITH 3kΩ + CL
0
1500
MAX3237E
TRANSMITTER SKEW vs. LOAD
CAPACITANCE (MBAUD = VCC)
LOAD CAPACITANCE (pF)
7
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
1000
40
10
LOAD CAPACITANCE (pF)
40
0
1 TRANSMITTER AT FULL DATA RATE
4 TRANSMITTERS AT 1/16 DATA RATE
3kΩ + CL LOAD EACH OUTPUT
LOAD CAPACITANCE (pF)
60
0
0
3000
80
20
20
10
MAX3237E toc12
100
500
30
SUPPLY CURRENT (mA)
0
40
SUPPLY CURRENT (mA)
0
50
250kbps
MAX3237E toc13
4
2
TRANSMITTER SKEW (ns)
SLEW RATE (V/µs)
8
TRANSMITTER OUTPUT VOLTAGE (V)
SLEW RATE (V/µs)
SR-
-SLEW, 1Mbps
+SLEW, 1Mbps
-SLEW, 2Mbps
+SLEW, 2Mbps
MAX3237E toc14
60
SUPPLY CURRENT (mA)
10
50
MAX3237E toc10
70
MAX3237E toc09
12
MAX3237E
SUPPLY CURRENT vs. LOAD CAPACITANCE
WHEN TRANSMITTING DATA (MBAUD = GND)
MAX3237E
SLEW RATE vs. LOAD CAPACITANCE
(MBAUD = VCC)
MAX3237E toc17
MAX3237E
SLEW RATE vs. LOAD CAPACITANCE
(MBAUD = GND)
1 TRANSMITTER AT 250kbps
2 TRANSMITTERS AT 15.6kbps
55
50
45
40
250kbps
35
120kbps
30
25
20
15
20kbps
10
5
0
1000
2000
3000
4000
LOAD CAPACITANCE (pF)
5000
0
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
Maxim Integrated │ 6
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Pin Description
PIN
MAX3222E
MAX3232E
SO/ TSSOP/
TQFN
TQFN
DIP SSOP
MAX3241E
SO/DIP/
SSOP/
MAX3246E
SSOP/ 20-PIN MAX3237E
SO/
TQFN
16-PIN TSSOP
TSSOP
TSSOP
NAME
FUNCTION
19
1
1
—
—
—
13*
23
22
B3
EN
Receiver Enable. Active
low.
1
2
2
16
1
2
28
28
28
F3
C1+
Positive Terminal
of Voltage-Doubler
Charge-Pump Capacitor
20
3
3
15
2
3
27
27
27
F1
V+
+5.5V Generated by the
Charge Pump
2
4
4
1
3
4
25
24
23
F4
C1-
Negative Terminal
of Voltage-Doubler
Charge-Pump Capacitor
3
5
5
2
4
5
1
1
29
E1
C2+
Positive Terminal of
Inverting Charge-Pump
Capacitor
4
6
6
3
5
6
3
2
30
D1
C2-
Negative Terminal of
Inverting Charge-Pump
Capacitor
5
7
7
4
6
7
4
3
31
C1
V-
-5.5V Generated by the
Charge Pump
6, 15
8,
15
8, 17
5,
12
7, 14
8, 17
5, 6, 7, 10,
12
9, 10,
11
6, 7,
8
F6, E6, D6
T_OUT
7, 14
9,
14
9, 16
6, 11
8, 13
9, 16
8, 9, 11
4–8
1–5
A4, A5, A6,
B6, C6
R_IN
15–19
13,
14,
15,
17,
18
C2, B1, A1,
TTL/CMOS Receiver
R_OUT
A2, A3
Outputs
8, 13
10,
13
10, 15
7, 10
9, 12
12, 15
18, 20, 21
10, 11
11,
12
12, 13
8, 9
10, 11
13, 14
17*, 19*,
22*, 23*,
24*
12, 13,
10,
E3, E2, D2
14
11, 12
T_IN
RS-232 Transmitter
Outputs
RS-232 Receiver Inputs
TTL/CMOS Transmitter
Inputs
*These pins have an active positive feedback resistor internal to the MAX3237E, allowing unused inputs to be left unconnected.
www.maximintegrated.com
Maxim Integrated │ 7
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Pin Description (continued)
PIN
MAX3222E
MAX3232E
SO/ TSSOP/
TQFN
TQFN
DIP SSOP
MAX3241E
SO/DIP/
SSOP/
MAX3246E
SSOP/ 20-PIN MAX3237E
SO/
TQFN
16-PIN TSSOP
TSSOP
TSSOP
NAME
FUNCTION
16
16
18
13
15
18
2
25
24
F5
GND
Ground
17
17
19
14
16
19
26
26
26
F2
VCC
+3.0V to +5.5V Supply
Voltage
18
18
20
—
—
—
14*
22
21
B2
SHDN
—
1, 10,
11, 20
9, 12
—
—
—
—
—
—
—
11, 14
—
—
—
www.maximintegrated.com
—
—
—
—
—
—
—
—
—
—
—
—
C3, D3, B4,
9, 16,
C4, D4, E4,
25,
B5, C5, D5,
32
E5
15*
—
—
16
20,
21
19,
20
—
—
—
—
—
—
N.C.
Shutdown Control.
Active low.
No Connection. For
MAX3246E, these
locations are not
populated with solder
bumps.
MegaBaud Control
Input. Connect to GND
for normal operation;
MBAUD
connect to VCC for
1Mbps transmission
rates.
R_
OUTB
EP
Noninverting
Complementary
Receiver Outputs.
Always active.
Exposed Pad. Solder
the exposed pad to the
ground plane or leave
unconnected (for TQFN
only).
Maxim Integrated │ 8
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
VCC
VCC
0.1µF
0.1µF
VCC
C1+
C1
C1C2+
C2
C2-
MAX3222E
MAX3232E
MAX3237E
MAX3241E
MAX3246E
C3
C1
C4
C2
MAX3222E
MAX3232E
MAX3237E
MAX3241E
MAX3246E
3kΩ
MINIMUM SLEW-RATE TEST CIRCUIT
VC4
R_ IN
5kΩ
1000pF
(2500pF, MAX3237E only)
C3
T_ OUT
R_ OUT
5kΩ
GND
C2-
V+
T_ IN
R_ IN
R_ OUT
C1C2+
V-
T_ OUT
T_ IN
VCC
C1+
V+
GND
7kΩ
150pF
MAXIMUM SLEW-RATE TEST CIRCUIT
Figure 1. Slew-Rate Test Circuits
Detailed Description
Dual Charge-Pump Voltage Converter
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E’s internal power supply consists of a regulated dual charge pump that provides output voltages
of +5.5V (doubling charge pump) and -5.5V (inverting
charge pump) over the +3.0V to +5.5V VCC range. The
charge pump operates in discontinuous mode; if the
output voltages are less than 5.5V, the charge pump
is enabled, and if the output voltages exceed 5.5V, the
charge pump is disabled. Each charge pump requires a
flying capacitor (C1, C2) and a reservoir capacitor (C3,
C4) to generate the V+ and V- supplies (Figure 1).
RS-232 Transmitters
The transmitters are inverting level translators that convert
TTL/CMOS-logic levels to ±5V EIA/TIA-232-compliant
levels.
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E transmitters guarantee a 250kbps data rate
with worst-case loads of 3kΩ in parallel with 1000pF,
providing compatibility with PC-to-PC communication
software (such as LapLink™). Transmitters can be paralleled to drive multiple receivers or mice.
The MAX3222E/MAX3237E/MAX3241E/MAX3246E
transmitters are disabled and the outputs are forced into
a high-impedance state when the device is in shutdown
mode (SHDN = GND). The MAX3222E/MAX3232E/
MAX3237E/MAX3241E/MAX3246E permit the outputs to
be driven up to ±12V in shutdown.
The MAX3222E/MAX3232E/MAX3241E/MAX3246E
transmitter inputs do not have pullup resistors. Connect
unused inputs to GND or VCC. The MAX3237E’s transmitter inputs have a 400kΩ active positive-feedback resistor,
allowing unused inputs to be left unconnected.
MAX3237E MegaBaud Operation
For higher-speed serial communications, the MAX3237E
features MegaBaud operation. In MegaBaud operating
mode (MBAUD = VCC), the MAX3237E transmitters guarantee a 1Mbps data rate with worst-case loads of 3kΩ in
parallel with 250pF for +3.0V < VCC < +4.5V. For +5V
±10% operation, the MAX3237E transmitters guarantee a
1Mbps data rate into worst-case loads of 3kΩ in parallel
with 1000pF.
RS-232 Receivers
The receivers convert RS-232 signals to CMOS-logic
output levels. The MAX3222E/MAX3237E/MAX3241E/
MAX3246E receivers have inverting three-state outputs.
Drive EN high to place the receiver(s) into a high-impedance state. Receivers can be either active or inactive in
shutdown (Table 1).
LapLink is a trademark of Traveling Software.
www.maximintegrated.com
Maxim Integrated │ 9
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
VCC
VCC
5V/div
0
PREVIOUS
RS-232
PROTECTION
DIODE
Rx
2V/div
0
5kΩ
UART
GND
SHDN = GND
40µs/div
Figure 3. Transmitter Outputs Recovering from Shutdown or
Powering Up
a) OLDER RS-232: POWERED-DOWN UART DRAWS CURRENT FROM
A ACTIVE RECEIVER OUTPUT IN SHUTDOWN.
MAX3222E/MAX3237E/MAX3241E/
MAX3246E Shutdown Mode
VCC
LOGIC
TRANSITION
DETECTOR
MAX3237E/
MAX3241E
R1OUTB
VCC
PROTECTION
DIODE
Rx
R1IN
R1OUT
THREE-STATED
EN = VCC
UART
T1IN
Tx
GND
T1OUT
VCC = 3.3V
C1–C4 = 0.1µF
Tx
TO
µP
SHDN
T2OUT
5kΩ
T1OUT
SHDN = GND
b) NEW MAX3237E/MAX3241E: EN SHUTS DOWN RECEIVER OUTPUTS
B (EXCEPT FOR B OUTPUTS), SO NO CURRENT FLOWS TO UART IN SHUTDOWN.
B B OUTPUTS INDICATE RECEIVER ACTIVITY DURING SHUTDOWN WITH EN HIGH.
Figure 2. Detection of RS-232 Activity when the UART
and Interface are Shut Down; Comparison of MAX3237E/
MAX3241E (b) with Previous Transceivers (a)
The complementary outputs on the MAX3237E/
MAX3241E (R_OUTB) are always active, regardless of
the state of EN or SHDN. This allows the device to be
used for ring indicator applications without forward biasing
other devices connected to the receiver outputs. This is
ideal for systems where VCC drops to zero in shutdown
to accommodate peripherals such as UARTs (Figure 2).
www.maximintegrated.com
Supply current falls to less than 1μA in shutdown mode
(SHDN = low). The MAX3237E’s supply current falls
to10nA (typ) when all receiver inputs are in the invalid
range (-0.3V < R_IN < +0.3V). When shut down, the
device’s charge pumps are shut off, V+ is pulled down
to VCC, V- is pulled to ground, and the transmitter outputs are disabled (high impedance). The time required
to recover from shutdown is typically 100μs, as shown
in Figure 3. Connect SHDN to VCC if shutdown mode is
not used. SHDN has no effect on R_OUT or R_OUTB
(MAX3237E/MAX3241E).
±15kV ESD Protection
As with all Maxim devices, ESD-protection structures
are incorporated to protect against electrostatic discharges encountered during handling and assembly. The
driver outputs and receiver inputs of the MAX3222E/
MAX3232E/MAX3237E/MAX3241E/MAX3246E have
extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage.
The ESD structures withstand high ESD in all states:
normal operation, shutdown, and powered down. After
an ESD event, Maxim’s E versions keep working without
latchup, whereas competing RS-232 products can latch
and must be powered down to remove latchup.
Furthermore, the MAX3237E logic I/O pins also have
±15kV ESD protection. Protecting the logic I/O pins
to ±15kV makes the MAX3237E ideal for data cable
applications.
Maxim Integrated │ 10
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Table 1. MAX3222E/MAX3237E/MAX3241E/
MAX3246E Shutdown and Enable Control
Truth Table
ESD protection can be tested in various ways; the transmitter outputs and receiver inputs for the MAX3222E/
MAX3232E/MAX3241E/MAX3246E are characterized for
protection to the following limits:
●● ±15kV using the Human Body Model
SHDN
EN
T_OUT
R_OUT
R_OUTB
(MAX3237E/
MAX3241E)
0
0
High
impedance
Active
Active
0
1
High
impedance
High
impedance
●● ±9kV (MAX3246E only) using the Contact Discharge
method specified in IEC 1000-4-2
Active
1
0
Active
Active
Active
●● ±15kV using the Air-Gap Discharge method specified
in IEC 1000-4-2
Active
High
impedance
Active
1
1
RC
1MΩ
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
100pF
RD
1500Ω
IP 100%
90%
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
●● ±8kV using the Contact Discharge method specified
in IEC 1000-4-2
Ir
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
AMPERES
DEVICEUNDERTEST
Figure 4a. Human Body ESD Test Model
36.8%
10%
0
0
tRL
TIME
tDL
CURRENT WAVEFORM
Figure 4b. Human Body Model Current Waveform
I
100%
CHARGE-CURRENTLIMIT RESISTOR
HIGHVOLTAGE
DC
SOURCE
Cs
150pF
90%
RD
330Ω
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
I PEAK
RC
50MΩ to 100MΩ
DEVICEUNDERTEST
10%
t r = 0.7ns to 1ns
t
30ns
60ns
Figure 5a. IEC 1000-4-2 ESD Test Model
www.maximintegrated.com
Figure 5b. IEC 1000-4-2 ESD Generator Current Waveform
Maxim Integrated │ 11
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Table 2. Required Minimum Capacitor
Values
C1
(ΜF)
C2, C3, C4
(ΜF)
MAX3222E/MAX3232E/MAX3241E
3.0 to 3.6
0.1
0.1
4.5 to 5.5
0.047
0.33
3.0 to 5.5
0.1
0.47
3.0 to 3.6
0.22
0.22
3.15 to 3.6
0.1
0.1
4.5 to 5.5
0.047
0.33
3.0 to 5.5
0.22
1.0
MAX3237E/MAX3246E
Table 3. Logic-Family Compatibility with
Various Supply Voltages
SYSTEM
POWER-SUPPLY
VOLTAGE
(V)
V CC SUPPLY
VOLTAGE
(V)
3.3
3.3
Compatible with all
CMOS families
5
5
Compatible with
all TTL and CMOS
families
5
3.3
COMPATIBILITY
Compatible with ACT
and HCT CMOS,
and with AC, HC, or
CD4000 CMOS
For the MAX3237E, all logic and RS-232 I/O pins are
characterized for protection to ±15kV per the Human
Body Model.
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents test
setup, test methodology, and test results.
Human Body Model
Figure 4a shows the Human Body Model, and Figure
4b shows the current waveform it generates when discharged into a low impedance. This model consists of a
100pF capacitor charged to the ESD voltage of interest,
which is then discharged into the test device through a
1.5kΩ resistor.
www.maximintegrated.com
TRANSMITTER OUTPUT VOLTAGE (V)
V CC
(V)
6
5
4
3
VOUT+
VCC = 3.0V
2
1
0
VOUT+
-1
-2
-3
-4
-5
-6
MAX3222E-fig06a
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
VCC
VOUTVOUT-
0
1
2
3
4
5
6
7
8
9
10
LOAD CURRENT PER TRANSMITTER (mA)
Figure 6a. MAX3241E Transmitter Output Voltage vs. Load
Current Per Transmitter
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifically
refer to integrated circuits. The MAX3222E/MAX3232E/
MAX3237E/MAX3241E/MAX3246E help you design
equipment that meets level 4 (the highest level) of IEC
1000-4-2, without the need for additional ESDprotection
components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2, because series resistance is lower
in the IEC 1000-4-2 model. Hence, the ESD withstand
voltage measured to IEC 1000-4-2 is generally lower
than that measured using the Human Body Model. Figure
5a shows the IEC 1000-4-2 model, and Figure 5b shows
the current waveform for the ±8kV IEC 1000-4-2 level 4
ESD Contact Discharge test. The Air-Gap Discharge test
involves approaching the device with a charged probe.
The Contact Discharge method connects the probe to the
device before the probe is energized.
Machine Model
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufacturing.
All pins require this protection during manufacturing, not
just RS-232 inputs and outputs. Therefore, after PC board
assembly, the Machine Model is less relevant to I/O ports.
Maxim Integrated │ 12
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
VCC = +3.0V TO +5.5V
C1
28
24
1
C2
VCC
2
C1+
CBYPASS
26
VCC
V+
27
C1C2+
MAX3241E
V-
3
14
C2T1IN
T1OUT
9
13
T2IN
T2OUT
10
12
T3IN
T3OUT
11
21
R1OUTB
20
R2OUTB
19
R1OUT
18
R2OUT
17
C3
COMPUTER SERIAL PORT
C4
+V
+V
-V
GND
R1IN
4
5kΩ
R2IN
5
R3OUT
5kΩ
R3IN
6
16
R4OUT
5kΩ
R4IN
7
15
R5OUT
R5IN
8
23
EN
SHDN
22
5kΩ
5kΩ
GND
25
Tx
MOUSE
VCC
Figure 6b. Mouse Driver Test Circuit
Applications Information
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors can
be used. The charge pump requires 0.1μF capacitors for
3.3V operation. For other supply voltages, see Table 2 for
required capacitor values. Do not use values smaller than
those listed in Table 2. Increasing the capacitor values
(e.g., by a factor of 2) reduces ripple on the transmitter
outputs and slightly reduces power consumption. C2, C3,
and C4 can be increased without changing C1’s value.
However, do not increase C1 without also increasing
the values of C2, C3, C4, and CBYPASS to maintain
the proper ratios (C1 to the other capacitors).
excessively with temperature. If in doubt, use capacitors
with a larger nominal value. The capacitor’s equivalent
series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V-.
Power-Supply Decoupling
In most circumstances, a 0.1μF VCC bypass capacitor
is adequate. In applications sensitive to power-supply
noise, use a capacitor of the same value as charge-pump
capacitor C1. Connect bypass capacitors as close to the
IC as possible.
Operation Down to 2.7V
Transmitter outputs meet EIA/TIA-562 levels of ±3.7V
with supply voltages as low as 2.7V.
When using the minimum required capacitor values,
make sure the capacitor value does not degrade
www.maximintegrated.com
Maxim Integrated │ 13
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Transmitter Outputs Recovering
from Shutdown
transmitters are enabled only when the magnitude of Vexceeds approximately -3.0V.
Figure 3 shows two transmitter outputs recovering from
shutdown mode. As they become active, the two transmitter outputs are shown going to opposite RS-232 levels
(one transmitter input is high; the other is low). Each
transmitter is loaded with 3kΩ in parallel with 2500pF.
The transmitter outputs display no ringing or undesirable
transients as they come out of shutdown. Note that the
Mouse Drivability
The MAX3241E is designed to power serial mice while
operating from low-voltage power supplies. It has been
tested with leading mouse brands from manufacturers
such as Microsoft and Logitech. The MAX3241E successfully drove all serial mice tested and met their current and
voltage requirements.
VCC
0.1µF
VCC
C1+
C1
C1C2+
C2
C2-
V+
MAX3222E
MAX3232E
MAX3237E
MAX3241E
MAX3246E
V-
C3
C4
T1IN
5V/div
T1OUT
5V/div
5V/div
R1OUT
VCC = 3.3V, C1–C4 = 0.1µF
T_ OUT
T_ IN
2µs/div
Figure 9. MAX3241E Loopback Test Result at 250kbps
R_ IN
R_ OUT
5kΩ
1000pF
GND
+5V
T_IN
0
+5V
Figure 7. Loopback Test Circuit
T_OUT
5kΩ + 250pF
0
-5V
+5V
5V/div
T1IN
VCC = 3.3V
C1–C4 = 0.1µF
R_OUT
0
400ns/div
5V/div
T1OUT
R1OUT
5V/div
VCC = 3.3V
C1–C4 = 0.1µF
Figure 10. MAX3237E Loopback Test Result at 1000kbps
(MBAUD = VCC)
2µs/div
Figure 8. MAX3241E Loopback Test Result at 120kbps
www.maximintegrated.com
Maxim Integrated │ 14
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Figure 6a shows the transmitter output voltages under
increasing load current at +3.0V. Figure 6b shows a typical mouse connection using the MAX3241E.
High Data Rates
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E maintain the RS-232 ±5V minimum transmitter output voltage even at high data rates. Figure 7
shows a transmitter loopback test circuit. Figure 8 shows
a loopback test result at 120kbps, and Figure 9 shows
the same test at 250kbps. For Figure 8, all transmitters
were driven simultaneously at 120kbps into RS-232 loads
in parallel with 1000pF. For Figure 9, a single transmitter
was driven at 250kbps, and all transmitters were loaded
with an RS-232 receiver in parallel with 1000pF.
The MAX3237E maintains the RS-232 ±5.0V minimum
transmitter output voltage at data rates up to 1Mbps.
Figure 10 shows a loopback test result at 1Mbps with
MBAUD = VCC. For Figure 10, all transmitters were
loaded with an RS-232 receiver in parallel with 250pF.
Interconnection with 3V and 5V Logic
UCSP Reliability
The UCSP represents a unique packaging form factor that
may not perform equally to a packaged product through
traditional mechanical reliability tests. UCSP reliability is
integrally linked to the user’s assembly methods, circuit
board material, and usage environment. The user should
closely review these areas when considering use of a
UCSP package. Performance through Operating Life Test
and Moisture Resistance remains uncompromised as the
wafer-fabrication process primarily determines it.
Mechanical stress performance is a greater consideration
for a UCSP package. UCSPs are attached through direct
solder contact to the user’s PC board, foregoing the
inherent stress relief of a packaged product lead frame.
Solder joint contact integrity must be considered. Table
4 shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable
of performing reliably through environmental stresses as
indicated by the results in the table. Additional usage data
and recommendations are detailed in Application Note
1891: Wafer-Level Packaging (WLP) and Its Applications.
The MAX3222E/MAX3232E/MAX3237E/MAX3241E/
MAX3246E can directly interface with various 5V logic
families, including ACT and HCT CMOS. See Table 3
for more information on possible combinations of interconnections.
Table 4. Reliability Test Data
TEST
Temperature Cycle
Operating Life
DURATION
FAILURES PER
SAMPLE SIZE
TA = -35°C to +85°C,
TA = -40°C to +100°C
150 cycles,
900 cycles
0/10,
0/200
TA = +70°C
TA = -20°C
CONDITIONS
240 hours
0/10
TA = +20°C to +60°C, 90% RH
240 hours
0/10
240 hours
0/10
TA = -10°C
24 hours
0/10
8-hour steam age
—
0/15
ESD
±15kV, Human Body Model
—
0/5
High-Temperature Operating Life
TJ = +150°C
168 hours
0/45
Moisture Resistance
Low-Temperature Storage
Low-Temperature Operational
Solderability
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Maxim Integrated │ 15
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Pin Configurations
TOP VIEW
+
C1+ 2
20 SHDN
N.C. 1
19 VCC
20 N.C.
C1+ 1
C1+ 2
19 VCC
V+ 2
18 GND
C1- 3
17 T1OUT
C2+ 4
16 R1IN
C2- 5
V+ 3
16 GND
V+ 3
18 GND
V+ 3
C1- 4
15 T1OUT
C1- 4
17 T1OUT
C1- 4
14 R1IN
C2+ 5
16 R1IN
C2+ 5
C2-
6
13 R1OUT
V-
7
12 T1IN
V- 7
T2OUT
8
11 T2IN
R2IN
9
10 R2OUT
MAX3232E
15 R1OUT
C2- 6
V- 6
11 T1IN
14 T1IN
T2OUT 7
10 T2IN
T2OUT 8
13 T1IN
T2OUT 8
13 T2IN
R2IN 8
R2IN 9
12 T2IN
R2IN 9
12 R2OUT
R2OUT 10
11 N.C.
N.C. 10
11 N.C.
4
25 C1-
R1IN
4
25 GND
R1IN
1
T1OUT
5
24 T1IN
R2IN
5
24 C1-
R2IN
23 EN
R3IN
MAX3237E
23 T2IN
6
R3IN
6
MAX3241E
N.C.
V-
VCC
26 VCC
25
27 V+
3
26
2
V-
V+
C2-
26 VCC
C1+
27 V+
3
27
2
T2OUT
28 C1+
TOP VIEW
1
C2-
SO/DIP/SSOP/TSSOP
28
+
9 R2OUT
TSSOP
C2+
GND
13 R1IN
12 R1OUT
C2+
+
14 T1OUT
V- 7
15 R1OUT
28 C1+
1
MAX3232E
14 N.C.
C2- 6
TSSOP/SSOP
C2+
15 GND
C2-
SO/DIP
MAX3222E
16 VCC
29
MAX3222E
+
V-
C2+ 5
+
30
17 VCC
C1+ 2
EN 1
31
18 SHDN
N.C.
+
32
EN 1
+
24
GND
2
23
C1-
3
22
EN
R4IN
4
21
SHDN
T3OUT
7
22 T3IN
R4IN
7
22 SHDN
R1IN
8
21 R1OUT
R5IN
8
21 R1OUTB
R5IN
5
20
R1OUTB
20 R2OUTB
T1OUT
6
19
R2OUTB
18
R1OUT
17
R2OUT
SSOP
15
T1IN 14
16
SHDN 14
N.C.
16 R4OUT
15 R5OUT
15 MBAUD
R3OUT
17 R3OUT
T2IN 13
14
T3IN 12
16 R1OUTB
13
17 T5IN
R4OUT
EN 13
R5OUT
T5OUT 12
*EP
12
8
T1IN
7
T3OUT
11
T2OUT
18 R2OUT
10
19 R1OUT
T2IN
R3IN 11
T3IN
T2OUT 10
18 R3OUT T3OUT 11
19 T4IN
T4OUT 10
9
9
20 R2OUT T1OUT
9
N.C.
R2IN
MAX3241E
SSOP/SO/TSSOP
*CONNECT EP TO GND.
www.maximintegrated.com
TQFN
Maxim Integrated │ 16
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
12
11
GND 16
10
T2IN
VCC 17
9
N.C.
8
R2OUT
7
R2IN
6
T2OUT
MAX3222E
SHDN 18
EN 19
*EP
11
10
9
GND 13
VCC 14
MAX3232E
V+ 15
*EP
3
4
5
1
2
3
4
C1-
C2+
C2-
V-
+
V-
C1+ 16
C2-
2
12
C2+
1
C1-
+
C1+
V+ 20
T1IN
T1IN
13
R1OUT
N.C.
14
R1IN
R1OUT
15
TOP VIEW
T1OUT
R1IN
TOP VIEW
T1OUT
Pin Configurations (continued)
TQFN
8
T2IN
7
R2OUT
6
R2IN
5
T2OUT
TQFN
TOP VIEW
(BUMPS ON BOTTOM)
B2: SHDN
C2: R1OUT
D2: T3IN
E2: T2IN
B3: EN
E3: T1IN
BUMPS B4, B5, C3, C4,
C5, D3, D4, D5, E4, AND
E5 NOT POPULATED
+
R4OUT R5OUT
R1IN
R2IN
A4
A5
R3OUT A1
A2
A3
R2OUT B1
B2
B3
V- C1
C2
C2- D1
D2
C2+ E1
E2
E3
V+ F1
F2
F3
F4
F5
VCC
C1+
C1-
GND
A6 R3IN
B6 R4IN
C6 R5IN
MAX3246E
D6 T3OUT
E6 T2OUT
F6 T1OUT
UCSP
*CONNECT EP TO GND.
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Maxim Integrated │ 17
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Typical Operating Circuits
+3.3V
+3.3V
17
CBYPASS
C1
0.1µF
C2
0.1µF
2 C1+
4
5
6
C1-
VCC
MAX3222E
C2+
V-
C3*
0.1µF
C1
0.1µF
C4
0.1µF
C2
0.1µF
7
T1OUT 15
T2OUT 8
11 T2IN
5kΩ
10 R2OUT
R2IN 9
1 C1+
3
4
5
C1-
VCC
RS-232
OUTPUTS
TTL/CMOS
INPUTS
V+
MAX3232E
C2+
V-
TTL/CMOS
OUTPUTS
GND
SHDN
6
T2OUT 7
10 T2IN
C4
0.1µF
RS-232
OUTPUTS
R1IN 13
5kΩ
9 R2OUT
R2IN 8
5kΩ
1 EN
C3*
0.1µF
T1OUT 14
12 R1OUT
RS-232
INPUTS
2
C2-
11 T1IN
R1IN 14
13 R1OUT
TTL/CMOS
OUTPUTS
3
C2-
12 T1IN
TTL/CMOS
INPUTS
V+
16
CBYPASS
RS-232
INPUTS
5kΩ
18
16
GND
15
*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.
NOTE: PIN NUMBERS REFER TO SO/DIP PACKAGES.
MAX3222E PINOUT REFERS TO SO/DIP PACKAGES.
MAX3232E PINOUT REFERS TO TSSOP/SSOP/SO/DIP PACKAGES
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SEE TABLE 2 FOR CAPACITOR SELECTION.
Maxim Integrated │ 18
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Typical Operating Circuits (continued)
+3.3V
+3.3V
CBYPASS
0.1µF
28 C1+
25
1
0.1µF
3
C1-
VCC
V+
MAX3237E
C2+
V-
27
C3*
0.1µF
4
0.1µF
C2-
24 T1IN
23 T2IN
LOGIC
INPUTS
CBYPASS
26
22 T3IN
19 T4IN
T1
T2
T3
T4
17 T5IN
T5
C1
0.1µF
C2
0.1µF
T1OUT 5
T2OUT 6
T3OUT 7
TTL/CMOS
INPUTS
RS-232
OUTPUTS
28 C1+
24
1
2
C1-
26
VCC
V+
MAX3241E
C2+
V-
20 R2OUT
C4
0.1µF
14 T1IN
T1OUT 9
13 T2IN
T2OUT 10
12 T3IN
T3OUT 11
RS-232
OUTPUTS
20 R2OUTB
T5OUT 12
19 R1OUT
R1IN 4
5kΩ
R2IN
R2
9
R3IN 11
R3
R2IN
18 R2OUT
R1IN 8
R1
5kΩ
18 R3OUT
3
21 R1OUTB
T4OUT 10
5kΩ
LOGIC
OUTPUTS
C3*
0.1µF
C2-
16 R1OUTB
21 R1OUT
27
RS-232
INPUTS
TTL/CMOS
OUTPUTS
5kΩ
17 R3OUT
R3IN 6
5kΩ
16 R4OUT
5kΩ
15 R5OUT
MBAUD
GND
SHDN
RS-232
INPUTS
R4IN 7
5kΩ
13 EN
5
R5IN 8
15
14
5kΩ
23 EN
2
GND
SHDN
22
25
*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.
www.maximintegrated.com
Maxim Integrated │ 19
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Typical Operating Circuits (continued)
+3.3V
CBYPASS
C1
0.1µF
C2
0.1µF
TTL/CMOS
INPUTS
F3 C1+
F4 C1E1
D1
F2
VCC
V+
MAX3246E
C2+
V-
F1
C3*
0.1µF
C1
C4
0.1µF
C2-
E3 T1IN
T1OUT F6
E2 T2IN
T2OUT E6
D2 T3IN
T3OUT D6
C2 R1OUT
RS-232
OUTPUTS
R1IN A4
5kΩ
R2IN
B1 R2OUT
A5
5kΩ
TTL/CMOS
OUTPUTS
A1 R3OUT
R3IN A6
5kΩ
A2 R4OUT
RS-232
INPUTS
R4IN B6
5kΩ
A3 R5OUT
R5IN C6
5kΩ
B3 EN
GND
SHDN
B2
F5
*C3 CAN BE RETURNED TO EITHER VCC OR GROUND.
www.maximintegrated.com
Maxim Integrated │ 20
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Ordering Information (continued)
PART
TEMP RANGE
PIN-PACKAGE
MAX3232ECTE+
0°C to +70°C
16 TQFN-EP**
(5mm x 5mm)
MAX3232ECUE+
0°C to +70°C
16 TSSOP
MAX3232ECUP+
0°C to +70°C
20 TSSOP
MAX3232ECSE+
0°C to +70°C
16 SOIC
MAX3232EESE+
-40°C to +85°C
16 SOIC
MAX3232EEAE+
-40°C to +85°C
16 SSOP
MAX3232EEWE+
-40°C to +85°C
16 Wide SO
MAX3232EEPE+
-40°C to +85°C
16 Plastic DIP
MAX3232EETE+
-40°C to +85°C
16 TQFN-EP**
(5mm x 5mm)
MAX3232EEUE+
-40°C to +85°C
16 TSSOP
MAX3232EEUP+
-40°C to +85°C
20 TSSOP
MAX3237ECAI+
0°C to +70°C
28 SSOP
MAX3237EEAI+
-40°C to +85°C
28 SSOP
MAX3241ECAI+
0°C to +70°C
28 SSOP
MAX3241ECWI+
0°C to +70°C
28 Wide SO
MAX3241ECUI+
0°C to +70°C
28 TSSOP
MAX3241ECTJ+
0°C to +70°C
32 TQFN-EP**
(7mm x 7mm)
MAX3241EEAI+
-40°C to +85°C
28 SSOP
MAX3241EEWI+
-40°C to +85°C
28 Wide SO
MAX3241EEUI+
-40°C to +85°C
28 TSSOP
MAX3246ECBX-T+
0°C to +70°C
6 x 6 UCSP†
MAX3246EEBX-T+
-40°C to +85°C
6 x 6 UCSP†
+Denotes a lead(Pb)-free/RoHS-compliant package.
†Requires solder temperature profile described in the Absolute
Maximum Ratings section. UCSP Reliability is integrally linked
to the user’s assembly methods, circuit board material, and
environment. Refer to the UCSP Reliability Notice in the UCSP
Reliability section of this datasheet for more information.
**EP = Exposed pad.
Chip Information
PROCESS: BiCMOS
www.maximintegrated.com
Selector Guide
PART
NO. OF
LOWGUARANTEED
DRIVERS/
POWER
DATA RATE
RECEIVERS SHUTDOWN
(bps)
MAX3222E
2/2
P
250k
MAX3232E
2/2
—
250k
MAX3237E
(Normal)
5/3
P
250k
MAX3237E
(MegaBaud)
5/3
P
1M
MAX3241E
3/5
P
250k
MAX3246E
3/5
P
250k
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status
only. Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
90-0010
T2055+5
21-0140
20 TSSOP
H20+2
21-0066
90-0116
20 SSOP
A20+1
21-0056
90-0094
18 Wide SO
W18+1
21-0042
90-0181
18 PDIP
P18+5
21-0043
—
16 SOIC
S16 +1
21-0041
90-0097
16 SSOP
A16+2
21-0056
90-0106
16 Wide SO
W16+3
21-0042
90-0107
16 PDIP
P16+1
21-0043
—
16 TQFN
T1655+2
21-0140
90-0072
20 TQFN
16 TSSOP
U16+1
21-0066
90-0117
28 SSOP
A28+1
21-0056
90-0095
28 Wide SO
W28+6
21-0042
90-0109
28 TSSOP
U28+2
21-0066
90-0171
32 TQFN
T3277+2
21-0144
90-0125
6x6 HCSP
B36+3
21-0082
Refer to
Application
Note 1891
Maxim Integrated │ 21
MAX3222E/MAX3232E/
MAX3237E/MAX3241E/
MAX3246E
±15kV ESD-Protected, Down to 10nA,
3.0V to 5.5V, Up to 1Mbps,
True RS-232 Transceivers
Revision History
REVISION
NUMBER
REVISION
DATE
PAGES
CHANGED
11
10/07
Corrected Package Information
22–28
12
12/10
Changed all parts to lead free in the Ordering Information, added automotive qualified
part to Ordering Information, corrected capacitor in Typical Operating Circuits
1, 19
13
12/18
Updated Ordering Information and Package Information tables
DESCRIPTION
21
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Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
© 2018 Maxim Integrated Products, Inc. │ 22