19-2407; Rev 0; 4/02
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
Features
♦ Tiny UCSP (1.5mm x 1.5mm)
♦ Drives 120mW into 16Ω
♦ 0.03% THD + N at 1kHz
♦ 2.3V to 5.5V Single-Supply Operation
♦ 1mA Supply Current Per Amplifier
♦ Very High Power-Supply Rejection Ratio (96dB)
♦ Unity-Gain Stable
♦ Rail-to-Rail Output Stage
♦ Thermal Overload and Short-Circuit Protection
Ordering Information
Applications
Cellular Phones
PDAs
Headphones
DC Motor Control
Headsets
General-Purpose Audio
PART
TEMP RANGE
BUMPPACKAGE
MAX4369EBL-T
-40°C to +85°C
9 UCSP-9
TOP
MARK
AAN
Bump Configuration appears at end of data sheet.
Typical Application Circuit/Functional Diagram
VCC
RF
R1
CIN
RIN
LEFT AUDIO
INPUT
INACOUT
OUTA
INA+
VBIAS
INB+
MAX4369
OUTB
CIN
RIN
RIGHT AUDIO
INPUT
CBIAS
COUT
INB-
R2
RF
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.
UCSP is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX4369
General Description
The MAX4369 dual, high-output-drive op amp combines
single-supply operation with high-output-current drive,
Rail-to-Rail ® outputs in an ultra chip-scale package
(UCSP™). The device is unity-gain stable to 3.5MHz and
operates from a single 2.3V to 5.5V supply. The MAX4369
is guaranteed to source and sink up to 87mA with a 5V
supply.
The MAX4369 is capable of delivering 120mW of continuous average power to a 16Ω load, or 75mW to a
32Ω load with 1% total harmonic distortion plus noise
(THD + N), making the device ideal for portable audio
applications.
The MAX4369 is specified over the extended temperature range (-40°C to +85°C) and is available in a tiny
(1.5mm x 1.5mm) 9-bump UCSP.
MAX4369
Dual, High-Output-Drive, UCSP, Rail-to-Rail
Output Op Amp
ABSOLUTE MAXIMUM RATINGS
VCC to GND ..............................................................-0.3V to +6V
All Other Pins to GND.................................-0.3V to (VCC + 0.3V)
Output Short Circuit to VCC or GND (Note 1).............Continuous
Continuous Power Dissipation (TA = +70°C)
9-Bump USCP (derate 4.7mW/°C above +70°C)..........379mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering) (Note 2)
Infrared (15s) ................................................................+220°C
Vapor Phase (60s) ........................................................+215°C
Note 1: Continuous power dissipation must also be observed.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile that the
device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles
recommended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = 5V, VCM = 0, VOUT = VCC/2, RL = ∞ connected to VCC/2, TA = TMIN to TMAX, unless otherwise noted. Typical values are at
TA = +25°C.) (Note 3)
PARAMETER
SYMBOL
Supply Voltage Range
VCC
Supply Current Per Amplifier
ICC
Input Offset Voltage
VOS
Open-Loop Voltage Gain
Input Bias Current
AV
CONDITIONS
MIN
Inferred from PSRR test
0.6V ≤ VOUT ≤ VCC - 0.6V
TYP
2.3
RL = 10kΩ
RL = 32Ω
MAX
V
1
2.2
mA
±0.35
±5
mV
88
80
UNITS
5.5
dB
84
IB
0.2
3
µA
Input Offset Current
IOS
0.01
0.3
µA
Input Common-Mode Range
VCM
VCC 1.0
V
Differential Input Resistance
RIN(DIFF)
Power-Supply Rejection Ratio
PSRR
Common-Mode Rejection Ratio
CMRR
Output Source/Sink Current
IOUT
Inferred from CMRR test
VIN+ - VIN- = ±10mV
2.3V ≤ VCC ≤ 5.5V
80
VOUT
Total Harmonic Distortion Plus
Noise
Unity-Gain Bandwidth
Gain-Bandwidth Product
2
POUT
THD + N
kΩ
96
dB
dB
0 ≤ VCM ≤ VCC - 1.0V
70
80
±87
±125
2.3V ≤ VCC ≤ 2.7V, 0.6V ≤ VOUT ≤ VCC - 0.6V
2.7V ≤ VCC ≤
5.5V
RL = 32Ω
RL = 16Ω
Output Power
500
2.7V ≤ VCC ≤ 5.5V, 0.6V ≤ VOUT ≤ VCC - 0.6V
RL = 10kΩ
Output Voltage Swing
0
VCC - VOH
300
VOL
15
VCC - VOH
330
600
VOL
180
600
VCC - VOH
350
THD + N = 1%,
f = 1kHz (Note 4) RL = 32Ω
mV
310
VOL
RL = 16Ω
f = 1kHz (Note 5)
mA
±115
120
56
75
POUT = 100mW, RL = 16Ω
0.05
POUT = 65mW, RL = 32Ω
0.03
mW
%
BW
3.5
MHz
GBWP
3.5
MHz
_______________________________________________________________________________________
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
(VCC = 5V, VCM = 0, VOUT = VCC/2, RL = ∞ connected to VCC/2, TA = TMIN to TMAX, unless otherwise noted. Typical values are at
TA = +25°C.) (Note 3)
PARAMETER
SYMBOL
Full-Power Bandwidth
CONDITIONS
MIN
TYP
MAX
UNITS
FPBW
25
kHz
Phase Margin
PM
73
degrees
Gain Margin
GM
27
dB
90
dB
Crosstalk
Signal-to-Noise Ratio
SNR
Slew Rate
SR
Settling Time
tS
VOUT = 1.5VRMS, AV = 1V/V (Note 5)
100
dB
1
V/µs
Settling to 0.1%
10
µs
Input Capacitance
CIN
1
pF
Input-Voltage Noise Density
en
f = 1kHz
40
nV/√Hz
Input-Current Noise Density
in
f = 1kHz
1.5
pA/√Hz
AV = -1V/V, no sustained oscillations
200
pF
To VCC
185
To GND
215
Capacitive-Load Stability
Short-Circuit Current
ISC
mA
Thermal Shutdown Threshold
165
°C
Thermal Shutdown Hysteresis
10
°C
25
µs
Power-Up Time
tPU
Note 3: All specifications are 100% tested at TA = +25°C; temperature limits are guaranteed by design.
Note 4: Guaranteed by design. Not production tested.
Note 5: Measurement bandwidth is 22Hz to 22kHz.
Typical Operating Characteristics
(THD + N measurement bandwidth = 22Hz to 22kHz, TA = +25°C, unless otherwise noted.)
VCC = 5V
AV = 1000V/V
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
100M
0
MAX4369 toc03
80
60
40
20
0
-20
-40
-60
-80
-100
-120
-140
-160
-180
MAX4369 toc02
VCC = 5V
-20
-40
PSRR (dB)
MAX4369 toc01
GAIN (dB)/PHASE (degees)
GAIN (dB)/PHASE (degrees)
80
60
40
20
0
-20
-40
-60
-80
-100
-120
-140
-160
-180
POWER-SUPPLY REJECTION RATIO
vs. FREQUENCY
GAIN AND PHASE vs. FREQUENCY
GAIN AND PHASE vs. FREQUENCY
-60
-80
VCC = 5V
AV = 1000V/V
CL = 200pF
-100
-120
100
1k
10k
100k
1M
FREQUENCY (Hz)
10M
100M
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
_______________________________________________________________________________________
3
MAX4369
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics (continued)
(THD + N measurement bandwidth = 22Hz to 22kHz, TA = +25°C, unless otherwise noted.)
-50
CROSSTALK (dB)
-60
-80
-100
-70
-80
100
1k
10k
100k
1M
10
100
1k
10k
10
100k
100
1k
10k
FREQUENCY (Hz)
FREQUENCY (Hz)
SUPPLY CURRENT PER AMPLIFIER
vs. TEMPERATURE
OFFSET VOLTAGE vs. TEMPERATURE
OUTPUT HIGH VOLTAGE
vs. TEMPERATURE
1.00
0.75
VCC = 3V
0.50
0.25
VCC = 5V
400
300
200
VCC = 3V
RL = 10kΩ
VOH = VCC - VOUT
100
0
10
35
60
85
400
VCC = 5V
300
VCC = 3V
200
100
0
0
-15
-40
-15
10
35
60
-40
85
-15
10
35
60
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
OUTPUT LOW VOLTAGE
vs. TEMPERATURE
MINIMUM OPERATING VOLTAGE
vs. TEMPERATURE
LARGE-SIGNAL GAIN
vs. OUTPUT SINK CURRENT
SUPPLY VOLTAGE (V)
VCC = 3V
4
15
VCC = 5V
5
120
LARGE-SIGNAL GAIN (dB)
20
140
3
2
85
MAX4369 toc12
5
MAX4369 toc10
25
100k
MAX4369 toc09
500
OUTPUT HIGH VOLTAGE (mV)
500
OFFSET VOLTAGE (µV)
VCC = 5V
MAX4369 toc08
600
MAX4369 toc07
1.25
10
-80
FREQUENCY (Hz)
1.50
-40
-70
-100
-100
10
-60
-90
-90
-120
SUPPLY CURRENT (mA)
-60
VCC = 5V
VINB = 1.5VRMS
OUTA TO OUTB
-50
MAX4369 toc11
PSRR (dB)
-40
VCC = 5V
VINB = 1.5VRMS
OUTB TO OUTA
CROSSTALK (dB)
-20
-40
MAX4369 toc05
VCC = 3V
CROSSTALK vs. FREQUENCY
CROSSTALK vs. FREQUENCY
-40
MAX4369 toc04
0
MAX4369 toc06
POWER-SUPPLY REJECTION RATIO
vs. FREQUENCY
OUTPUT LOW VOLTAGE (mV)
MAX4369
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
VCC = 5V
100
80
60
VCC = 3V
40
1
20
RL = 10kΩ
0
-15
10
35
TEMPERATURE (°C)
4
0
0
-40
60
85
-40
-15
10
35
TEMPERATURE (°C)
60
85
0
25
50
75
OUTPUT SINK CURRENT (mA)
_______________________________________________________________________________________
100
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
TOTAL HARMONIC DISTORTION
PLUS NOISE vs. FREQUENCY
10
MAX4369 toc14
120
VCC = 5V
POUT = 30mW
VCC = 3V
POUT = 10mW
VCC = 5V
80
60
VCC = 3V
1
1
THD + N (%)
100
THD + N (%)
RL = 16Ω
RL = 16Ω
0.1
40
0.1
20
RL = 32Ω
RL = 32Ω
0.01
0
25
0
50
75
0.01
0.01
100
0.1
1
10
100
0.01
0.1
1
FREQUENCY (kHz)
FREQUENCY (kHz)
TOTAL HARMONIC DISTORTION
PLUS NOISE vs. OUTPUT POWER
TOTAL HARMONIC DISTORTION
PLUS NOISE vs. OUTPUT POWER
TOTAL HARMONIC DISTORTION
PLUS NOISE vs. OUTPUT POWER
VCC = 5V
RL = 16Ω
100
MAX4369 toc17
100
MAX4369 toc16
100
VCC = 3V
RL = 16Ω
10
10
10
fIN = 1kHz
1
fIN = 20Hz
0.1
0.1
fIN = 10kHz
0.1
fIN = 1kHz
0.01
0.01
60
80
100
120
0.01
0
140
10
20
fIN = 1kHz
50
60
fIN = 20Hz
1
fIN = 10kHz
0.1
fIN = 1kHz
RL = 16Ω
180
160
OUTPUT POWER (mW)
10
140
THD + N = 10%
100
80
60
THD + N = 1%
OUTPUT POWER (mW)
30
40
80
100
140
120
fIN = 1kHz
RL = 32Ω
100
THD + N = 10%
80
60
40
THD + N = 1%
20
0
0
20
60
OUTPUT POWER vs. SUPPLY VOLTAGE
20
0.01
10
40
OUTPUT POWER (mW)
120
40
0
20
0
OUTPUT POWER vs. SUPPLY VOLTAGE
200
MAX4369 toc19
VCC = 3V
RL = 32Ω
40
OUTPUT POWER (mW)
TOTAL HARMONIC DISTORTION
PLUS NOISE vs. OUTPUT POWER
100
30
OUTPUT POWER (mW)
40
MAX4369 toc20
20
OUTPUT POWER (mW)
THD + N (%)
fIN = 10kHz
fIN = 20Hz
1
MAX4369 toc21
fIN = 1kHz
fIN = 10kHz
THD + N (%)
THD + N (%)
THD + N (%)
1
100
VCC = 5V
RL = 32Ω
fIN = 20Hz
0
10
OUTPUT SOURCE CURRENT (mA)
MAX4369 toc18
LARGE-SIGNAL GAIN (dB)
10
MAX4369 toc13
140
TOTAL HARMONIC DISTORTION
PLUS NOISE vs. FREQUENCY
MAX4369 toc15
LARGE-SIGNAL GAIN
vs. OUTPUT SOURCE CURRENT
2.3
3.1
3.9
SUPPLY VOLTAGE (V)
4.7
5.5
2.3
3.1
3.9
4.7
5.5
SUPPLY VOLTAGE (V)
_______________________________________________________________________________________
5
MAX4369
Typical Operating Characteristics (continued)
(THD + N measurement bandwidth = 22Hz to 22kHz, TA = +25°C, unless otherwise noted.)
MAX4369
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
Typical Operating Characteristics (continued)
(THD + N measurement bandwidth = 22Hz to 22kHz, TA = +25°C, unless otherwise noted.)
SMALL-SIGNAL TRANSIENT RESPONSE
(NONINVERTING)
SMALL-SIGNAL TRANSIENT RESPONSE
(INVERTING)
MAX4369 toc22
MAX4369 toc23
IN_
50mV/div
IN_
50mV/div
OUT_
50mV/div
OUT_
50mV/div
VCC = 5V
AV = 1V/V
RL = 10kΩ
VCC = 5V
AV = -1V/V
RL = 10kΩ
10µs/div
LARGE-SIGNAL TRANSIENT RESPONSE
(NONINVERTING)
LARGE-SIGNAL TRANSIENT RESPONSE
(INVERTING)
MAX4369 toc24
MAX4369 toc25
IN_
1V/div
IN_
1V/div
OUT_
1V/div
OUT_
1V/div
VCC = 5V
AV = 1V/V
RL = 10kΩ
6
10µs/div
10µs/div
VCC = 5V
AV = -1V/V
RL = 10kΩ
10µs/div
_______________________________________________________________________________________
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
BUMP
NAME
A1
INA-
A2
OUTA
Amplifier A Output
A3
INA+
Amplifier A Noninverting Input
B1
GND
Ground
Applications Information
Power Dissipation
FUNCTION
Amplifier A Inverting Input
B2
—
Not Populated
B3
VCC
Power Supply
C1
INB-
Amplifier B Inverting Input
C2
OUTB
Amplifier B Output
C3
INB+
Amplifier B Noninverting Input
Detailed Description
Rail-to-Rail Output
The MAX4369 can drive a 10kΩ load and still swing
within 300mV of the positive-supply rail, and 15mV of
the negative-supply rail. Figure 1 shows the output voltage swing of the MAX4369 configured with AV = 2V/V.
Driving Capacitive Loads
Driving a capacitive load can cause instability in many op
amps. The MAX4369 is unity-gain stable for a range of
capacitive loads to 200pF. Figure 2 shows the response of
the MAX4369 with an excessive capacitive load. Adding a
series resistor between the output and the output capacitor
improves the circuit’s response by isolating the load
capacitance from the op amp’s output.
VCC = 5V
RL = 10kΩ
Under normal operating conditions, linear power amplifiers like the MAX4369 can dissipate a significant
amount of power. The maximum power dissipation of
the UCSP package is given in the Absolute Maximum
Ratings section under Continuous Power Dissipation or
can be calculated by the following equation:
PDISS(MAX) =
TJ(MAX) − TA
θJA
where TJ(MAX) is +150°C and θJA is the reciprocal of
the derating factor in °C/W as specified in the Absolute
Maximum Ratings. For example, θJA of a UCSP package is 211°C/W.
If the power dissipation exceeds the maximum allowed
for a given package, either reduce VCC, increase load
impedance, decrease the ambient temperature or add
heat sinking to the device. Large output, supply, and
ground traces improve the maximum power dissipation
in the package.
Thermal overload protection limits total power dissipation in the MAX4369. When the junction temperature
exceeds +165°C, the thermal protection circuitry disables the amplifier output stage. The amplifiers are
enabled once the junction temperature cools by 10°C.
This results in a pulsing output under continuous thermal overload conditions.
5V
IN_
100mV/div
OUT_
200mV/div
OUT_
GND
4µs/div
400µs/div
AV = 2V/V
VCC = 5V
CLOAD = 1nF
Figure 1. Rail-to-Rail Output Operation
Figure 2. Small-Signal Transient Response with Excessive
Capacitive Load
________________________________________________________________________________________
7
MAX4369
Bump Description
MAX4369
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
RF
10kΩ
VCC
CF
50kΩ 100pF
C3 INB+
1µF
OUTB C2
50kΩ
RFB
10kΩ
CIN
1µF
POSITIVE AUDIO
INPUT
RIN
10kΩ
INB- C1
A3 INA+
RINB
10kΩ
MAX4369
OUTA A2
CIN
1µF
NEGATIVE AUDIO
INPUT
RIN
10kΩ
A1 INA-
RF
10kΩ
CF
10OpF
Figure 3. Differential Input/Differential Output Audio Amplifier
Supply Bypassing
Proper supply bypassing ensures low-noise, low-distortion performance. Place a 0.1µF ceramic capacitor in parallel with a 10µF capacitor from VCC to GND. Locate the
bypass capacitors as close to the device as possible.
Layout Considerations
Good layout improves performance by decreasing the
amount of stray capacitance and noise at the amplifier’s inputs and outputs. Decrease stray capacitance by
minimizing PC board trace lengths, using surfacemount components and placing external components
as close to the device as possible.
UCSP Considerations
For general UCSP information and PC layout considerations, please refer to the Maxim Application Note:
Wafer-Level Ultra-Chip-Scale Package.
Audio Applications
Single-Ended Stereo Amplifier
The high-output-current drive makes the MAX4369
ideal for use as a stereo audio amplifier (see Typical
Application Circuit/Functional Diagram). In this configuration, the MAX4369 can deliver 120mW per channel
into 16Ω with less than 1% THD + N. The input capacitors (CIN) block the DC component of the incoming
8
audio signal from the MAX4369. See the Input Capacitor
section for selecting the value of CIN. The output capacitors (COUT) serve to block the DC bias of the MAX4369
from the speaker load. See the Output Capacitor section
for selecting the value of COUT. Set the DC bias (typically VCC/2) by the resistive voltage-divider formed by R1
and R2. Ensure that the DC-bias level gives the incoming
audio signal the maximum amount of headroom. COUT
can be eliminated by operating the MAX4369 from a dual
supply (±1.15V to ±2.5V) and setting the DC bias to 0.
Differential Input/Differential Output
Audio Amplifier
The MAX4369 can be used as a differential input/differential output (BTL) amplifier (Figure 3). This configuration offers good CMRR, improved low-frequency PSRR,
no large output-coupling capacitors compared to a single-ended amplifier. Resistors RINB and RFB configure
the second amplifier as an inverting unity-gain follower.
Connect the noninverting input of the second amplifier
to a bias voltage, typically VCC/2. Resistors RIN and RF
set the differential gain of the device as follows:
VOUT(DIFF)
VIN(DIFF)
=
RF
RIN
_______________________________________________________________________________________
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
TIP
(LEFT)
RING
(RIGHT)
The MAX4369 can drive a stereo headphone when configured as a single-ended stereo amplifier. Typical 3wire headphone plugs consist of a tip, ring, and sleeve.
The tip and ring are the signal carriers while the sleeve
is the ground connection (Figure 4). Figure 5 shows the
MAX4369 configured to drive a set of headphones.
OUTB is coupled to the ring and OUTA is coupled to
the tip, delivering the signal to the headphone.
Capacitor Selection
Input Capacitor
The input capacitor (CIN), in conjunction with RIN, forms
a high-pass filter that removes the DC bias from
an incoming signal (see the Typical Application Circuit/
Functional Diagram). The AC-coupling capacitor allows
the amplifier to bias the signal to an optimum DC level.
Assuming zero-source impedance, the -3dB point of
the high-pass filter is given by:
SLEEVE
(GND)
f −3dB =
1
2πRINCIN
Choose CIN such that f-3dB is well below the lowest frequency of interest. Setting f-3dB too high affects the
low-frequency response of the amplifier. Use capacitors whose dielectrics have low-voltage coefficients,
Figure 4. Typical 3-Wire Headphone Jack
VCC
RF
R1
CIN
RIN
LEFT AUDIO
INPUT
INACOUT
OUTA
HEADPHONE JACK
INA+
VBIAS
INB+
MAX4369
COUT
OUTB
CIN
RIN
RIGHT AUDIO
INPUT
CBIAS
R2
INB-
RF
Figure 5. Stereo Headphone Driver
_______________________________________________________________________________________
9
MAX4369
Headphone Driver
The capacitors (CF) are necessary to maintain stability.
The amplifier has two feedback paths, one from OUTA
to INA- and the other from OUTB to INA+. At high frequencies, the second amplifier in the OUTB to INA+
feedback path introduces excessive phase shift.
Compensate this phase shift by adding a capacitor
from INA+ to GND. This suppresses the gain of the
device at high frequencies, maintaining stability.
Placing an identical-valued capacitor from INA- to
OUTA improves overall performance.
Proper matching of the RF and RIN components is essential for optimum performance. A resistor pack offers a
cost-effective solution for these matched components.
MAX4369
Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
such as tantalum or aluminum electrolytic. Capacitors
with high-voltage coefficients, such as certain ceramics, can result in an increase in distortion at low frequencies.
Other considerations when designing the input filter
include the constraints of the overall system, the actual
frequency band of interest and click-and-pop suppression. Although high-fidelity audio calls for a flat gain
response between 20Hz and 20kHz, portable voicereproduction devices such as cellular phones and
walkie-talkies need only concentrate on the frequency
range of the spoken human voice (typically 300Hz to
3.5kHz). In addition, speakers used in portable devices
typically have a poor response below 150Hz. Taking
these two factors into consideration, the input filter
might not need to be designed for a 20Hz to 20kHz
response, saving both board space and cost due to the
use of smaller capacitors.
Output-Coupling Capacitor
The MAX4369 requires an output-coupling capacitor
when configured as a single-ended amplifier. The output capacitor blocks the DC component of the amplifier
output, preventing DC current flowing to the load. The
output capacitor and the load impedance form a highpass filter with the -3dB point determined by:
f −3dB =
1
2πRLCOUT
Bump Configuration
TOP VIEW
(BUMP SIDE DOWN)
1
2
3
INA-
OUTA
INA+
A
B
MAX4369
GND
VCC
C
INB-
OUTB
INB+
UCSP
UCSP PKG CODE: B9-2
B2 POSITION IS NOT POPULATED
Chip Information
TRANSISTOR COUNT: 669
PROCESS: BiPOLAR
As with the input capacitor, choose COUT such that
f-3dB is well below the lowest frequency of interest.
Setting f-3dB too high affects the low-frequency response
of the amplifier.
In addition to frequency band considerations, the load
impedance is another concern when choosing COUT.
Load impedance can vary, changing the -3dB point of
the output filter. A lower impedance increases the corner frequency, degrading low-frequency response.
Select COUT such that the worst-case load/COUT combination yields an adequate response.
10
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Dual, Rail-to-Rail, High-Output-Drive
Op Amp in UCSP
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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11
© 2002 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
MAX4369
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
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