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MAX5876EVKIT+

MAX5876EVKIT+

  • 厂商:

    AD(亚德诺)

  • 封装:

    -

  • 描述:

    KIT EVALUATION FOR MAX5876

  • 数据手册
  • 价格&库存
MAX5876EVKIT+ 数据手册
19-3636; Rev 1; 6/07 MAX5876/MAX5877/MAX5878 Evaluation Kits The MAX5876/MAX5877/MAX5878 evaluation kits (EV kit) are fully assembled and tested printed circuit boards (PCBs) that contain all the components necessary to evaluate the performance of the MAX5876/MAX5877/ MAX5878 digital-to-analog converters (DACs). The MAX5876 (12-bit)/MAX5877 (14-bit)/MAX5878 (16-bit) are 250Msps, dual DACs with interleaved LVDS inputs, integrated 1.2V voltage reference, and differential current outputs. The EV kits operate with LVDS-compatible digital data inputs, a single-ended clock input, and a 3.3V/1.8V dual power supply for simple board operation. The MAX5876/MAX5877/MAX5878 EV kits also contain an external 1.25V voltage-reference circuit that can be used to drive the MAX5876/MAX5877/MAX5878 input reference voltage pin. Features ♦ Fast Evaluation and Performance Testing ♦ LVDS-Compatible Inputs ♦ SMA Coaxial Connectors for Clock Input and Analog Outputs ♦ On-Board External 1.25V Voltage-Reference Circuit ♦ 50Ω Matched Clock Input and Analog Output Signal Lines ♦ Single-Ended-to-Differential Clock Signal Conversion Circuitry ♦ Differential-Current-to-Single-Ended-Voltage Output Conversion Circuitry ♦ Full-Scale Current Output Configured for 20mA ♦ Fully Assembled and Tested Part Selection Table PART Ordering Information BITS SPEED (Msps) MAX5876EGK+D 12 250 MAX5876EVKIT# 0°C to +70°C 68 QFN-EP* MAX5877EGK+D 14 250 MAX5877EVKIT# 0°C to +70°C 68 QFN-EP* MAX5878EGK+D 16 250 MAX5878EVKIT# 0°C to +70°C 68 QFN-EP* PART TEMP RANGE IC PACKAGE #Denotes lead-free and RoHS-compliant EV Kit. *EP = Exposed paddle. Component List DESIGNATION C1, C2, C4–C14, C37 C3 C15–C19 C20–C24 C25–C29 C30–C36 QTY 14 DESCRIPTION 0.1µF ±10%, 10V X5R ceramic capacitors (0402) TDK C1005X5R1A104KT or Taiyo Yuden LMK105BJ104KV DESIGNATION QTY DESCRIPTION CLK, OUTPUTI, OUTPUTQ 3 SMA PC-mount vertical connectors J1, J2 2 2 x 20-pin surface-mount headers (0.1in) 1µF ±10%, 6.3V X5R ceramic capacitor (0402) TDK C1005X5R0J105K JU1, JU2 2 3-pin headers 1 JU3, JU4 2 2-pin headers L1–L5 5 Ferrite bead cores (0805) Fair-Rite 2508051217Z0 5 1µF ±10%, 10V X5R ceramic capacitors (0603) TDK C1608X5R1A105KT OUTIP, OUTIN, OUTQP, OUTQN 0 Not installed, SMA PC-mount vertical connectors R1, R2, R4, R5 4 49.9Ω ±0.1% resistors (0603) IRC PFC-W0603RLF-03-49R9-B Panasonic ERA3EHB49R9V 5 10µF ±10%, 10V tantalum capacitors (A) AVX TAJA106K010R or Kemet T494A106K010AS 5 47µF ±10%, 6.3V tantalum capacitors (B) AVX TAJB476K006R or Kemet T494B476K006AS 0 Not installed, ceramic capacitors (0603) R3, R6 2 100Ω ±1% resistors (0603) R7 1 2kΩ ±1% resistor (0603) R8, R9 2 24.9Ω ±1% resistors (0603) R10–R14 0 Not installed, resistors (0603) R15, R16 2 10kΩ ±5% resistors (0603) ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 Evaluate: MAX5876/MAX5877/MAX5878 General Description Evaluate: MAX5876/MAX5877/MAX5878 MAX5876/MAX5877/MAX5878 Evaluation Kits Component List (continued) DESIGNATION QTY T1, T2, T3 3 DESCRIPTION 1:1 RF transformers Mini-Circuits ADTL1-12 T4, T5 2 1:1 RF transformers Coilcraft TTWB3010-1 U1 1 See the EV Kit-Specific Component List U2 1 1.25V voltage reference (8-pin SO) MAX6161AESA or MAX6161BESA None 4 Shunts (JU1–JU4) None 1 PCB: MAX5876/7/8 Evaluation Kit # EV Kit-Specific Component List Quick Start Recommended equipment: • Three 3.3V, 100mA DC power supplies • Two 1.8V, 100mA DC power supplies • Two signal generators with low phase noise and low jitter for clock input (e.g., HP 8664A) • One 20-bit LVDS digital pattern generator for data inputs (e.g., HP 81250) • One spectrum analyzer (e.g., HP 8560E) • One voltmeter The MAX5876/MAX5877/MAX5878 EV kits are fully assembled and tested surface-mount boards. Follow the steps below for board operation. Do not turn on power supplies or enable signal generators until all connections are completed (Figure 1): DESCRIPTION 1) Verify that shunts are installed across pins 2 and 3 of jumpers JU1 (normal operation) and JU2 (offset binary input mode). MAX5876EVKIT# MAX5876EGK+D (68-pin QFN-EP, 10mm x 10mm x 0.9mm) 2) Verify that shunts are not installed across jumpers JU3 and JU4 (internal reference). MAX5877EVKIT# MAX5877EGK+D (68-pin QFN-EP, 10mm x 10mm x 0.9mm) EV KIT DESIGNATION MAX5878EVKIT# U1 MAX5878EGK+D (68-pin QFN-EP, 10mm x 10mm x 0.9mm) 3) Synchronize the digital pattern generator with the clock signal generator. 4) Connect the clock signal generator to the EV kit CLK SMA connector. 5) Verify that the digital pattern generator HP 81250 is programmed for valid LVDS output voltage levels and binary digital output. 6) Connect the digital pattern generator output to the J1 and J2 input header connectors on the EV kit board. The input header pins are labeled for proper connection to the digital pattern generator. Component Suppliers SUPPLIER PHONE WEBSITE AVX 843-946-0238 www.avxcorp.com Coilcraft 847-639-6400 www.coilcraft.com Fair-Rite Products 845-895-2055 www.fair-rite.com IRC 361-992-7900 www.irctt.com Kemet 864-963-6300 www.kemet.com Mini-Circuits 718-934-4500 www.minicircuits.com Panasonic 800-344-2112 www.panasonic.com Taiyo Yuden 800-348-2496 www.t-yuden.com TDK 847-803-6100 www.component.tdk.com Note: Indicate that you are using the MAX5876/MAX5877/MAX5878 when contacting these component suppliers. 2 _______________________________________________________________________________________ MAX5876/MAX5877/MAX5878 Evaluation Kits MASTER PATTERN GENERATOR SIGNAL GENERATOR HP 81250 HP 8664A RF OUTPUT INT* LVDS DATA CLOCK INPUT* 36 (B0P/N–B15P/N, SELIQP/N, XORP/N) SLAVE MAX5876/MAX5877/MAX5878 EV KIT SIGNAL GENERATOR SPECTRUM ANALYZER J1 HP 8664A EXT* RF OUTPUT CLK OUTPUTI OUTPUTQ J2 HP 8560E INPUT EXT* *THESE CONNECTORS ARE LOCATED ON THE BACK SIDE OF THE EQUIPMENT. Figure 1. MAX5876/MAX5877/MAX5878 EV Kit Quick Start Setup 7) Connect a 1.8V power supply to the AVDD1 PC board pad. Connect the ground terminal of this supply to the AGND pad. 8) Connect a 3.3V power supply to the AVDD2 PC board pad. Connect the ground terminal of this supply to the AGND pad. 9) Connect a 1.8V power supply to the DVDD1 PC board pad. Connect the ground terminal of this supply to the DGND pad. 10) Connect a 3.3V power supply to the DVDD2 PC board pad. Connect the ground terminal of this supply to the DGND pad. 11) Connect a 3.3V power supply to the VDD_CK PC board pad. Connect the ground terminal of this supply to the GND_CK pad. 12) Turn on all five power supplies. 13) Enable the clock signal generator and the digital pattern generator. 14) Set the clock signal generator output power between +8dBm to +12dBm and the frequency (fCLK) to ≤ 500MHz. 15) An LVDS logic-high signal at SELIQP/SELIQN directs data into the I-DAC register. An LVDS logiclow signal at SELIQP/SELIQN directs data into the Q-DAC register. Refer to the LVDS-Compatible Digital Inputs section in the MAX5876/MAX5877/ MAX5878 IC data sheets for detailed information on the SELIQ function. 16) Use the spectrum analyzer to view the MAX5876/ MAX5877/MAX5878 output spectrums or view the single-ended output waveforms by connecting an oscilloscope to OUTPUTQ or OUTPUTI SMA connectors. Detailed Description The MAX5876/MAX5877/MAX5878 EV kits are designed to simplify the evaluation of the MAX5876/MAX5877/ MAX5878 dual, 12-bit/14-bit/16-bit, 250Msps, currentoutput DACs. The MAX5876/MAX5877/MAX5878 operate with LVDS-compatible digital data inputs, a differential or single-ended clock input signal, and two power supplies (3.3V and 1.8V). The MAX5876/MAX5877/MAX5878 feature internal 1.2V reference voltage. _______________________________________________________________________________________ 3 Evaluate: MAX5876/MAX5877/MAX5878 DATA GENERATOR Evaluate: MAX5876/MAX5877/MAX5878 MAX5876/MAX5877/MAX5878 Evaluation Kits The MAX5876/MAX5877/MAX5878 EV kits provide header connectors J1 and J2 to interface with a pattern generator, circuitry that converts the differential current outputs to single-ended voltage signals, and circuitry to convert a user-supplied single-ended clock signal to a differential clock signal. The EV kit circuit also includes an external 1.25V reference source U2 (MAX6161) and a test point connector that can be used to overdrive the MAX5876/MAX5877/MAX5878 internal 1.2V bandgap reference. The EV kit board layout separates the circuit power into digital, analog, and clock planes to improve dynamic performance. The input data PC traces are 100Ω differential controlled impedance and the analog output PC traces are 50Ω controlled impedance. Power Supplies The MAX5876/MAX5877/MAX5878 EV kits operate from a single 1.8V power supply connected to the DVDD1 and AVDD1 input power pads, and a single 3.3V power supply connected to the DVDD2, AVDD2, and VDD_CK input power pads for simple operation. However, five separate power supplies are recommended to optimize dynamic performance. The EV kit PCB layout is divided into three sections: digital, analog, and clock. Using separate power supplies for each section reduces noise and improves the integrity of the analog output signal. When using separate power supplies, connect a 1.8V power supply across the DVDD1 and DGND pads and a 3.3V power supply across DVDD2 and DGND pads (digital). Connect a 1.8V power supply across the AVDD1 and AGND pads and a 3.3V power supply across AVDD2 and AGND pads (analog). Connect a 3.3V power supply across VDD_CK and GND_CK pads (clock). LVDS Digital Input Data The MAX5876/MAX5877/MAX5878 EV kits provide two 0.1in, 2 x 20 headers (J1, J2) to interface an LVDS pattern generator to the EV kit. The header data pins are labeled on the PCB with their appropriate LVDS data bit designator. Use the labels on the EV kit board to match the data bits from the pattern generator to the corresponding data pins on headers J1 and J2. The input data is latched on the rising edge of the clock signal. The MAX5876/MAX5877/MAX5878 SELIQ and XOR functions can also be controlled by applying an LVDS logic signal to the J1 header pins labeled SELIQP, SELIQN, XORP, and XORN. Refer to the LVDS-Compatible Digital Inputs section in the MAX5876/MAX5877/MAX5878 IC data sheets for detailed information on the SELIQ and XOR functions. When using the XOR function, install a 100Ω resistor at the EV kit R14 PCB pad. 4 Clock Signal The MAX5876/MAX5877/MAX5878 operate with a differential clock input signal. However, the EV kit boards only require an external single-ended clock signal connected to the CLK SMA connector. The EV kits feature circuitry that converts the single-ended clock signal to a differential clock signal. The clock signal can be either a sine or a square wave. A minimum signal power amplitude of +8dBm is recommended to drive the clock input. The MAX5876/MAX5877/MAX5878 accept a clock input frequency in the 2MHz to 500MHz range. Two’s-Complement/Offset-Binary Input Format The two’s-complement or offset-binary input modes of the MAX5876/MAX5877/MAX5878 are configured with jumper JU2. Apply either a two’s-complement or offsetbinary formatted input pattern to connectors J1 and J2. See Table 1 for the jumper JU2 configuration. Reference Voltage The MAX5876/MAX5877/MAX5878 require a reference voltage to set the full-scale output current of the DAC. The MAX5876/MAX5877/MAX5878 integrate a stable onchip bandgap reference of 1.2V that is selected by default during initial power-up. An external voltage reference must be connected to test point TP1 when the internal voltage reference is overdriven. The EV kits circuit also features an on-board, external 1.25V voltage reference (U2, MAX6161) that can be used to overdrive the internal bandgap reference. U2 has a tighter voltage-output tolerance and is less susceptible to temperature variations. See Table 2 to select the voltage reference source. Full-Scale Output Current The MAX5876/MAX5877/MAX5878 require an external resistor to set the full-scale output current. The MAX5876/MAX5877/MAX5878 EV kits full-scale current are set to 20mA with resistor R7 (2kΩ). Replace resistor R7 to adjust the full-scale output current. Refer to the Reference Architecture and Operation section in the MAX5876/MAX5877/MAX5878 IC data sheets to select different values for resistor R7. _______________________________________________________________________________________ MAX5876/MAX5877/MAX5878 Evaluation Kits To evaluate the converter’s single-ended outputs, remove transformers T1, T2, and install SMA connectors at the OUTIP, OUTIN, OUTQP, and OUTQN locations. Probe the single-ended signals at the OUTIP and OUTIN SMA connectors for I-DAC. Probe the singleended signals at the OUTQP and OUTQN SMA connectors for Q-DAC. In a single-ended configuration the DAC output signal amplitude is equal to 1VP-P at each of the outputs. Power-Down Mode The MAX5876/MAX5877/MAX5878 EV kits powerdown/normal operation mode can be configured with jumper JU1. See Table 3 for jumper JU1 configuration. PCB Layout The MAX5876/MAX5877/MAX5878 EV kits are 4-layer PCB designs optimized for high-speed signals. All high-speed digital signal lines are routed through 100Ω differential impedance-matched transmission lines. All analog output traces are routed through 50Ω impedance-matched transmission lines. The length of these 100Ω and 50Ω transmission lines is matched to within 40 mils (1mm) to minimize layout-dependent data skew. The PCB layout separates the digital, analog, and clock sections of the circuit for optimum performance. Table 1. Jumper JU2 TORB Configuration SHUNT POSITION TORB PIN CONNECTION 1-2 Connected to DVDD2 2-3 Connected to DGND Not installed EV KIT FUNCTION Two’s-complement digital signal input format MAX5876/MAX5877/MAX5878 have an internal pulldown resistor Offset-binary digital signal input format Table 2. Reference Voltage JUMPER JU3 SHUNT POSITION JUMPER JU4 SHUNT POSITION Not installed Not installed Installed Installed REFIO PIN CONNECTION EV KIT FUNCTION Open (REFIO becomes the output of the internal bandgap reference) Internal 1.2V reference enabled or connect an external reference to TP1 Connected to U2 (MAX6161) U2 provides a precise 1.25V voltage reference Table 3. JUMPER JU1 Power-Down Configuration SHUNT POSITION PD PIN CONNECTION 1-2 Connected to DVDD2 2-3 Connected to DGND Not installed MAX5876/MAX5877/MAX5878 have an internal pulldown resistor EV KIT FUNCTION Power-down mode Normal operation _______________________________________________________________________________________ 5 Evaluate: MAX5876/MAX5877/MAX5878 Outputs The dual-output channels of the MAX5876/MAX5877/ MAX5878 are configured for differential current mode to achieve the best dynamic performance. The resistor and transformer networks at the DAC outputs are designed to convert the differential current signals into single-ended voltage signals with a 50Ω output impedance. When an LVDS logic-high input signal is applied to the SELIQP/SELIQN pins, the data on the input bus (J1 and J2) is loaded into I-DAC and the reconstructed single-ended signal is available at the OUTPUTI SMA connector. When an LVDS logic-low input signal is applied to the SELIQP/SELIQN pins, the data on the input bus is loaded into Q-DAC and the reconstructed single-ended signal is available at the OUTPUTQ SMA connector. When outputs OUTPUTQ and OUTPUTI are terminated with 50Ω external loads, the full-scale output signal level is equal to -2dBm. Evaluate: MAX5876/MAX5877/MAX5878 MAX5876/MAX5877/MAX5878 Evaluation Kits Table 4. MAX5876/MAX5877/MAX5878 EV Kit Board Connector Guide EV KIT CONNECTOR PIN MAX5878 INPUT MAX5877 INPUT MAX5876 INPUT J1-39 XORN XORN XORN J1-37 XORP XORP XORP J1-35 SELIQP SELIQP SELIQP J1-33 SELIQN SELIQN SELIQN J1-31 B15P (MSB) B13P (MSB) B11P (MSB) J1-29 B15N (MSB) B13N (MSB) B11N (MSB) J1-27 B14P B12P B10P J1-25 B14N B12N B10N J1-23 B13P B11P B9P J1-21 B13N B11N B9N J1-19 B12P B10P B8P J1-17 B12N B10N B8N J1-15 B11P B9P B7P J1-13 B11N B9N B7N J1-11 B10P B8P B6P J1-9 B10N B8N B6N J1-7 B9P B7P B5P J1-5 B9N B7N B5N J1-3 B8P B6P B4P B4N J1-1 B8N B6N J2-39 B7P B5P B3P J2-37 B7N B5N B3N J2-35 B6P B4P B2P J2-33 B6N B4N B2N J2-31 B5P B3P B1P J2-29 B5N B3N B1N J2-27 B4P B2P B0P (LSB) J2-25 B4N B2N B0N (LSB) J2-23 B3P B1P N.C. J2-21 B3N B1N N.C. J2-19 B2P B0P (LSB) N.C. J2-17 B2N B0N (LSB) N.C. J2-15 B1P N.C. N.C. J2-13 B1N N.C. N.C. J2-11 B0P (LSB) N.C. N.C. J2-9 B0N (LSB) N.C. N.C. N.C. = No connection. 6 _______________________________________________________________________________________ MAX5876/MAX5877/MAX5878 Evaluation Kits Evaluate: MAX5876/MAX5877/MAX5878 DVDD1.8 J1 DVDD3.3 HEADER 2 x 20 J1-40 R15 10kΩ 41 J1-39 PD XORN J1-36 42 J1-37 J1-34 JU1 DVDD3.3 R14 OPEN J1-38 40 TORB XORP 39 JU2 1 2 3 C12 0.1μF R16 10kΩ CLKP 38 J1-32 J1-30 J1-35 J1-28 J1-33 J1-26 J1-31 J1-24 J1-29 J1-22 J1-27 J1-20 J1-25 J1-18 J1-23 J1-16 J1-21 J1-14 J1-19 J1-12 J1-17 J1-10 J1-15 J1-8 J1-13 J1-6 J1-11 J1-4 J1-9 J1-2 J1-7 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 J1-5 59 J1-3 60 J1-1 SELIQN CLKN B11N B10P AVCLK GND AVDD1.8 B8P GND B7P B7N B6P GND_CK 36 U1 AVDD3.3 AVDD3.3 34 J2-39 GND OUTIP J2-38 J2-37 J2-36 J2-35 J2-34 J2-33 J2-32 J2-31 J2-30 J2-29 J2-28 J2-27 J2-26 J2-25 J2-24 J2-23 J2-22 J2-21 J2-20 J2-19 J2-18 J2-17 J2-16 J2-15 J2-14 J2-13 J2-12 J2-11 J2-10 J2-9 J2-8 J2-7 63 64 65 66 67 68 1 2 3 4 5 6 7 8 9 DVDD1.8 B2N GND AVDD3.3 B0P GND B0N AVDD1.8 N.C. DACREF N.C. REFIO N.C. GND N.C. AVDD3.3 N.C. GND N.C. J2-6 J2-5 J2-3 J2-2 J2-1 R12 OPEN AVDD1.8 R11 OPEN T5 T2 4 R6 100Ω 1% 6 C33 OPEN 3 2 6 1 1 AVDD3.3 C28 47μF 6.3V C23 10μF 10V C18 1μF OUTQN OPEN AVDD3.3 18 R7 2kΩ 1% C3 1μF 7 JU3 C35 OPEN C36 OPEN N.C. N.C. 1 JU4 C34 OPEN TP1 16 14 L4 C4 AVDD1.8 0.1μF 19 15 C17 1μF C5 0.1μF 20 17 C22 10μF 10V R13 OPEN AVDD2 C6 AVDD3.3 0.1μF 21 C27 47μF 6.3V OUTPUTQ 3 5 23 22 L3 AVDD1 OUTIN OPEN 8 FSADJ 1 24 N.C. N.C. 6 1 4 B1P AVDD3.3 2 AGND R5 49.9Ω 0.1% OUTQN 3 6 25 B3N B2P T1 4 C32 OPEN OUTQP OPEN 26 C16 1μF OUTPUTI 3 27 B3P B1N R1O OPEN R3 100Ω 1% T4 5 28 R4 49.9Ω 0.1% GND J2-4 4 R2 49.9Ω 0.1% GND C21 10μF 10V OUTIP OPEN 29 B5N OUTIN C26 47μF 6.3V C7 0.1μF 30 R1 49.9Ω 0.1% B4P DVDD3.3 L2 DVDD2 C8 AVDD3.3 0.1μF 31 MAX5876 OUTQP 62 GND_CK 32 HEADER 2 x 20 J2-40 GND_CK C9 0.1μF 33 B5P C13 0.1μF VDD_CK C29 47μF 6.3V C24 10μF 10V C19 1μF B6N B4N C20 10μF 10V AVDD1.8 B9N B8N C25 47μF 6.3V DGND 1 L5 35 B10N B9P L1 DVDD1 3 37 C10 0.1μF GND 61 C15 1μF C11 0.1μF B11P 4 T3 6 R9 24.9Ω GND_CK 1% C31 OPEN DVDD1.8 CLK R8 24.9Ω 1% C30 OPEN SELIQP DVDD1.8 J2 1 2 3 6 C37 0.1μF N.C. U2 OUT MAX6161 IN N.C. 2 3 C14 0.1μF GND_CK 5 N.C. GND 4 C2 AVDD3.3 0.1μF 13 12 DVDD3.3 DVDD3.3 GND 11 10 C1 0.1μF Figure 2a. MAX5876 EV Kit Schematic _______________________________________________________________________________________ 7 Evaluate: MAX5876/MAX5877/MAX5878 MAX5876/MAX5877/MAX5878 Evaluation Kits DVDD1.8 J1 DVDD3.3 HEADER 2 x 20 J1-40 R15 10kΩ 41 J1-39 PD XORN DVDD3.3 R14 OPEN J1-38 J1-36 42 J1-37 J1-34 JU1 40 TORB XORP 39 JU2 1 2 3 C12 0.1μF R16 10kΩ CLKP 38 J1-32 J1-30 J1-35 J1-28 J1-33 J1-26 J1-31 J1-24 J1-29 J1-22 J1-27 J1-20 J1-25 J1-18 J1-23 J1-16 J1-21 J1-14 J1-19 J1-12 J1-17 J1-10 J1-15 J1-8 J1-13 J1-6 J1-11 J1-4 J1-9 J1-2 J1-7 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 J1-5 59 J1-3 60 J1-1 SELIQP CLKN B13N B12P AVCLK J2-39 J2-38 J2-37 J2-36 J2-35 GND B11P B11N AVDD1.8 B10P GND B10N B9P B9N B8P J2-34 J2-33 J2-32 J2-31 J2-30 J2-29 J2-28 J2-27 J2-26 J2-25 J2-24 J2-23 J2-22 J2-21 J2-20 J2-19 J2-18 J2-17 J2-16 J2-15 J2-14 J2-13 J2-12 J2-11 J2-10 J2-9 64 65 66 67 68 1 2 3 4 5 6 7 8 9 U1 AVDD3.3 AVDD3.3 36 34 J2-7 J2-6 J2-5 J2-4 J2-3 J2-2 J2-1 GND_CK GND_CK GND OUTIP 32 C7 0.1μF 30 GND 29 4 R1O OPEN DVDD1.8 B4N GND OUTQP OPEN AVDD3.3 B2P GND B2N AVDD1.8 B1P DACREF B0N REFIO GND N.C. AVDD3.3 N.C. GND N.C. R12 OPEN AVDD1.8 T5 R11 OPEN T2 4 R6 100Ω 1% 6 C33 OPEN 3 2 6 1 AVDD3.3 C28 47μF 6.3V OUTQN OPEN AVDD3.3 18 R7 2kΩ 1% C3 1μF 14 7 JU3 C35 OPEN C36 OPEN N.C. N.C. 1 JU4 C34 OPEN TP1 16 15 6 C37 0.1μF N.C. U2 OUT MAX6161 IN N.C. 2 3 C14 0.1μF GND_CK 5 N.C. GND 4 C2 AVDD3.3 0.1μF 13 12 DVDD3.3 DVDD3.3 GND 11 10 C1 0.1μF Figure 2b. MAX5877 EV Kit Schematic 8 L4 C4 AVDD1.8 0.1μF 19 C17 1μF 1 C5 0.1μF 20 17 C22 10μF 10V R13 OPEN AVDD2 C6 AVDD3.3 0.1μF 21 C27 47μF 6.3V OUTPUTQ 3 5 23 22 L3 AVDD1 OUTIN OPEN 8 FSADJ 1 24 B1N B0P 6 1 4 B3P AVDD3.3 2 AGND R5 49.9Ω 0.1% B5N OUTQN 3 6 C32 OPEN 25 B5P C16 1μF OUTPUTI 3 27 R4 49.9Ω 0.1% B4P T1 4 R3 100Ω 1% T4 5 28 26 C21 10μF 10V OUTIP OPEN R2 49.9Ω 0.1% OUTIN C26 47μF 6.3V C8 AVDD3.3 0.1μF 31 L2 DVDD2 R1 49.9Ω 0.1% B6P DVDD3.3 C9 0.1μF 33 MAX5877 GND J2-8 C20 10μF 10V VDD_CK C29 47μF 6.3V C24 10μF 10V C19 1μF B7N N.C. C25 47μF 6.3V DGND GND_CK B7P B3N 3 1 L5 B8N B6N 4 L1 DVDD1 AVDD1.8 OUTQP 63 6 R9 24.9Ω GND_CK 1% 35 B12N C13 0.1μF 62 C31 OPEN T3 37 HEADER 2 x 20 J2-40 R8 24.9Ω 1% C10 0.1μF GND 61 C15 1μF C11 0.1μF B13P DVDD1.8 CLK C30 OPEN SELIQN DVDD1.8 J2 1 2 3 _______________________________________________________________________________________ C23 10μF 10V C18 1μF MAX5876/MAX5877/MAX5878 Evaluation Kits Evaluate: MAX5876/MAX5877/MAX5878 DVDD1.8 J1 DVDD3.3 HEADER 2 x 20 J1-40 R15 10kΩ 41 J1-39 PD XORN J1-36 42 J1-37 J1-34 JU1 DVDD3.3 R14 OPEN J1-38 40 TORB XORP 39 JU2 1 2 3 C12 0.1μF R16 10kΩ CLKP 38 J1-32 J1-30 J1-35 J1-28 J1-33 J1-26 43 44 45 J1-31 J1-24 J1-29 J1-22 J1-27 J1-20 J1-25 J1-18 J1-23 J1-16 J1-21 J1-14 J1-19 J1-12 J1-17 J1-10 J1-15 J1-8 J1-13 J1-6 J1-11 J1-4 J1-9 J1-2 J1-7 46 47 48 49 50 51 52 53 54 55 56 57 58 J1-5 59 J1-3 60 J1-1 SELIQP CLKN B15N B14P AVCLK J2-39 J2-38 J2-37 GND B13N AVDD1.8 B12P GND B12N B11P B11N B10P J2-36 J2-35 J2-34 J2-33 J2-32 J2-31 J2-30 J2-29 J2-28 J2-27 J2-26 J2-25 J2-24 J2-23 J2-22 J2-21 J2-20 J2-19 J2-18 J2-17 J2-16 J2-15 J2-14 J2-13 J2-12 J2-11 J2-10 J2-9 64 65 66 67 68 1 2 3 4 5 6 7 8 9 U1 AVDD3.3 AVDD3.3 36 34 J2-7 J2-6 J2-5 J2-4 J2-3 J2-2 J2-1 C20 10μF 10V VDD_CK GND_CK GND_CK GND OUTIP 33 32 C7 0.1μF 30 GND DVDD1.8 4 29 R1O OPEN B6N GND OUTQP OPEN AVDD3.3 B4P GND B4N AVDD1.8 B3P DACREF B2N REFIO GND B1N AVDD3.3 B0P GND B0N R12 OPEN R11 OPEN T2 4 R6 100Ω 1% 6 C33 OPEN T5 3 2 6 1 R13 OPEN 1 AVDD3.3 C28 47μF 6.3V C23 10μF 10V C18 1μF OUTQN OPEN AVDD3.3 18 R7 2kΩ 1% C3 1μF 7 JU3 C35 OPEN C36 OPEN N.C. N.C. 1 JU4 C34 OPEN TP1 16 14 L4 C4 AVDD1.8 0.1μF 19 15 C17 1μF C5 0.1μF 20 17 C22 10μF 10V OUTPUTQ 3 5 AVDD2 C6 AVDD3.3 0.1μF 21 C27 47μF 6.3V OUTIN OPEN 23 22 L3 AVDD1 24 B3N FSADJ 1 AVDD1.8 8 B2P 6 1 4 B5P AVDD3.3 2 AGND R5 49.9Ω 0.1% B7N OUTQN 3 6 C32 OPEN 25 B7P C16 1μF OUTPUTI 3 27 R4 49.9Ω 0.1% B6P T1 4 R3 100Ω 1% T4 5 28 26 C21 10μF 10V OUTIP OPEN R2 49.9Ω 0.1% OUTIN C26 47μF 6.3V C8 AVDD3.3 0.1μF 31 L2 DVDD2 R1 49.9Ω 0.1% B8P DVDD3.3 C9 0.1μF MAX5878 GND J2-8 C25 47μF 6.3V DGND C29 47μF 6.3V C24 10μF 10V C19 1μF B9N B1P 3 GND_CK B9P B5N L1 DVDD1 1 L5 B10N B8N 4 T3 AVDD1.8 OUTQP 63 6 R9 24.9Ω GND_CK 1% C10 0.1μF B13P C13 0.1μF 62 C31 OPEN 35 HEADER 2 x 20 J2-40 R8 24.9Ω 1% 37 B14N GND 61 C15 1μF C11 0.1μF B15P DVDD1.8 CLK C30 OPEN SELIQN DVDD1.8 J2 1 2 3 6 C37 0.1μF N.C. U2 OUT MAX6161 IN N.C. 2 3 C14 0.1μF GND_CK 5 N.C. GND 4 C2 AVDD3.3 0.1μF 13 12 DVDD3.3 DVDD3.3 GND 11 10 C1 0.1μF Figure 2c. MAX5878 EV Kit Schematic _______________________________________________________________________________________ 9 Evaluate: MAX5876/MAX5877/MAX5878 MAX5876/MAX5877/MAX5878 Evaluation Kits Figure 3. MAX5876/MAX5877/MAX5878 EV Kit Component Placement Guide—Component Side 10 ______________________________________________________________________________________ MAX5876/MAX5877/MAX5878 Evaluation Kits Evaluate: MAX5876/MAX5877/MAX5878 Figure 4. MAX5876/MAX5877/MAX5878 EV Kit PCB Layout—Component Side (Layer 1) ______________________________________________________________________________________ 11 Evaluate: MAX5876/MAX5877/MAX5878 MAX5876/MAX5877/MAX5878 Evaluation Kits Figure 5. MAX5876/MAX5877/MAX5878 EV Kit PCB Layout—Ground Planes (Layer 2) 12 ______________________________________________________________________________________ MAX5876/MAX5877/MAX5878 Evaluation Kits Evaluate: MAX5876/MAX5877/MAX5878 Figure 6. MAX5876/MAX5877/MAX5878 EV Kit PCB Layout—Power Planes (Layer 3) ______________________________________________________________________________________ 13 Evaluate: MAX5876/MAX5877/MAX5878 MAX5876/MAX5877/MAX5878 Evaluation Kits Figure 7. MAX5876/MAX5877/MAX5878 EV Kit PCB Layout—Solder Side (Layer 4) Revision History All pages changed at Rev 1. Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.
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