19-2954; Rev 2; 8/05
KIT
ATION
EVALU
E
L
B
AVAILA
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
The MAX8560/MAX8561/MAX8562 step-down DC-DC
converters are optimized for applications that prioritize
small size and high efficiency. They utilize a proprietary
hysteretic-PWM control scheme that switches with fixed
frequency and is adjustable up to 4MHz, allowing customers to trade efficiency for smaller external components. Output current is guaranteed up to 500mA, while
quiescent current is only 40µA (typ).
Internal synchronous rectification greatly improves efficiency and eliminates the external Schottky diode
required in conventional step-down converters. Built-in
soft-start eliminates inrush current to reduce input
capacitor requirements. The MAX8561 features logiccontrolled output voltage, while the MAX8562 drives an
external bypass FET.
The MAX8560 is available in a 5-pin Thin SOT23 package. The MAX8561/MAX8562 are available in spacesaving 8-pin 3mm x 3mm Thin DFN packages.
Features
♦ Up to 4MHz PWM Switching Frequency
♦ 500mA Guaranteed Output Current
♦ 40µA (typ) Quiescent Current
♦ Adjustable Output Voltage from 0.6V to 2.5V
♦ Logic-Controlled Output Voltage (MAX8561)
♦ Drives External Bypass FET (MAX8562)
♦ ±1.5% Initial Accuracy
♦ Soft-Start Eliminates Inrush Current
♦ Fast Voltage-Positioning Transient Response
♦ Internal Synchronous Rectifier
♦ 2.7V to 5.5V Input
♦ 0.1µA Logic-Controlled Shutdown
♦ Thermal Shutdown
♦ Thin SOT23 or Space-Saving 3mm x 3mm x
0.8mm TDFN Packages
Ordering Information
Applications
Microprocessor/DSP Core Supplies
Cellular and Smart Phones
CDMA/RF Power-Amplifier Supplies
PDAs, DSC, and MP3 Players
PART
TEMP RANGE
PIN-PACKAGE
TOP
MARK
MAX8560EZK-T
-40°C to +85°C
5 Thin SOT23-5
ADRX
MAX8560EZK+T
-40°C to +85°C
5 Thin SOT23-5
ADRX
MAX8561ETA-T
-40°C to +85°C
8 TDFN
AHD
MAX8561ETA+T
-40°C to +85°C
8 TDFN
AHD
MAX8562ETA-T
-40°C to +85°C
8 TDFN
AHE
MAX8562ETA+T
-40°C to +85°C
8 TDFN
AHE
+Denotes lead-free package.
Typical Operating Circuit
ODO
6
5
COUT
2.2µF
GND 2
MAX8560
SHDN 3
R2
MAX8561/
MAX8562
CFF
4 FB
Thin SOT23-5
1
2
3
4
LX
R1
ODI
SHDN
7
PGND
MAX8560
FB
ON/OFF
8
5 LX
LX
IN
GND
1
IN
CIN
2.2µF
IN
FB
INPUT
2.7V TO 5.5V
OUTPUT
0.6V TO 2.5V
UP TO 500mA
GND
TOP VIEW
L
1µH
SHDN
Pin Configurations
TDFN
3mm × 3mm × 0.8mm
A "+" sign will replace the first pin indicator
on lead-free packages.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX8560/MAX8561/MAX8562
General Description
MAX8560/MAX8561/MAX8562
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
ABSOLUTE MAXIMUM RATINGS
IN, FB, SHDN, ODI, ODO to GND ............................-0.3V to +6V
LX to GND (Note 1)......................................-0.3V to (VIN + 0.3V)
PGND to GND .......................................................-0.3V to +0.3V
LX Current ...........................................................................1.27A
Output Short Circuit to GND
(typical operating circuit)....................................................10s
Continuous Power Dissipation (TA = +70°C)
5-Pin Thin SOT23 (derate 9.1mW/°C above +70°C) ....727mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) .........1951mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: LX has internal clamp diodes to PGND (GND for MAX8560) and IN. Applications that forward bias these diodes should take
care not to exceed the IC’s package power-dissipation limits.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VIN = 3.6V, SHDN = IN, TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 1)
PARAMETER
Supply Voltage Range
UVLO Threshold
SYMBOL
CONDITIONS
VIN
UVLO
MIN
2.7
IIN
Output Voltage Range
VOUT
FB Threshold Voltage
VFB
SHDN = GND
MAX
UNITS
5.5
V
2.5
2.6
V
40
80
TA = +25°C
0.01
0.1
µA
TA = +85°C
0.1
2.5
V
VIN rising, 60mV hysteresis
2.4
ILOAD = 0mA, no switching
Supply Current
TYP
0.6
VFB falling
0.6
V
FB Threshold Line Regulation
VIN = 2.7V to 5.5V
0.3
%/V
FB Threshold Load Regulation
IOUT = 0 to 500mA
-0.001
%/mA
FB Threshold Voltage Accuracy
(Falling) (% of VFB)
ILOAD = 0mA
FB Threshold Voltage Hysteresis
(% of VFB)
FB Bias Current
TA = +25°C
-1.5
+1.5
TA = -40°C to +85°C
-2.5
+2.5
VHYS
IFB
1.0
SHDN = GND, TA = +25°C, VIN = 5.5V
0.01
SHDN = GND, TA = +85°C, VIN = 5.5V
0.1
VFB = 0.5V, TA = +25°C, VIN = 5.5V
0.01
VFB = 0.5V, TA = +85°C, VIN = 5.5V
0.1
Logic Input High Voltage
(SHDN, ODI)
VIH
VIN = 2.7V to 5.5V
Logic Input Low Voltage
(SHDN, ODI)
VIL
VIN = 2.7V to 5.5V
%
%
0.1
0.1
µA
1.41
V
Logic Input Bias Current
ODO Output Low Voltage
(MAX8562 Only)
2
IIH, IIL
VOL
0.4
VIN = 5.5V, SHDN = ODI = GND or IN,
TA = +25°C
0.001
VIN = 5.5V, SHDN = ODI = GND or IN,
TA = +85°C
0.01
1mA sink current, VIN = 2.7V
0.02
0.1
µA
_______________________________________________________________________________________
0.1
V
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
(VIN = 3.6V, SHDN = IN, TA = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise noted.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
5
10
20
kΩ
VIN = 5.5V, ODO = IN, TA = +25°C
0.01
0.1
VIN = 5.5V, ODO = IN, TA = +85°C
0.1
ODO Pullup to IN (MAX8562 Only)
Open-Drain Output Leakage
IOHLEAK
Current Limit
On-Resistance
Rectifier-Off Current Threshold
ILIMP
PFET switch
600
990
1500
ILIMN
NFET rectifier
490
680
900
RONP
PFET switch, ILX = -40mA
0.8
1.5
RONN
NFET rectifier, ILX = +40mA
0.4
0.82
30
60
VIN = 5.5V, LX = GND to IN, ODO = IN,
TA = +25°C, SHDN = GND
0.1
1
VIN = 5.5V, LX = GND to IN, ODO = IN,
TA = +85°C, SHDN = GND
1
ILXOFF
LX Leakage Current
0
ILXLKG
Minimum On- and Off-Times
µA
mA
Ω
mA
µA
tON(MIN)
107
tOFF(MIN)
95
Thermal Shutdown
ns
+160
°C
20
°C
Thermal-Shutdown Hysteresis
Typical Operating Characteristics
(VIN = 3.6V, VOUT = 1.2V, L = 1µH (LQH32CN1R0M53), COUT = 2.2µF, TA = +25°C, unless otherwise noted.)
4.7µH
90
90
EFFICIENCY vs. LOAD CURRENT
(VOUT = 1.5V)
100
MAX8560 toc02
100
MAX8560 toc01
100
EFFICIENCY vs. LOAD CURRENT
(VOUT = 1.8V)
4.7µH
90
MAX8560 toc03
EFFICIENCY vs. LOAD CURRENT
(VOUT = 2.5V)
4.7µH
1µH
70
60
50
80
2.2µH
EFFICIENCY (%)
80
EFFICIENCY (%)
EFFICIENCY (%)
2.2µH
1µH
70
60
50
40
1
10
100
LOAD CURRENT (mA)
1000
2.2µH
1µH
10
100
70
60
50
40
0.1
80
40
0.1
1
10
100
LOAD CURRENT (mA)
1000
0.1
1
1000
LOAD CURRENT (mA)
_______________________________________________________________________________________
3
MAX8560/MAX8561/MAX8562
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics (continued)
(VIN = 3.6V, VOUT = 1.2V, L = 1µH (LQH32CN1R0M53), COUT = 2.2µF, TA = +25°C, unless otherwise noted.)
EFFICIENCY vs. LOAD CURRENT
(VOUT = 0.9V)
90
90
4.7µH
1µH
70
80
60
2.2µH
70
EFFICIENCY (%)
2.2µH
1µH
60
50
50
40
1
10
1000
100
80
2.2µH
1µH
70
60
50
40
0.1
4.7µH
90
4.7µH
80
EFFICIENCY (%)
40
0.1
1
10
100
1000
0.5
1.0
1.5
2.0
LOAD CURRENT (mA)
OUTPUT VOLTAGE (V)
NO-LOAD SUPPLY CURRENT
vs. SUPPLY VOLTAGE
SWITCHING FREQUENCY
vs. LOAD CURRENT
OUTPUT VOLTAGE vs. LOAD CURRENT
(VOLTAGE POSITIONING)
46
1µH
43
42
1.23
OUTPUT VOLTAGE (V)
FREQUENCY (MHz)
45
44
1.24
2.2µH
1
4.7µH
MAX8560 toc09
10
MAX8560 toc07
47
1.22
1.21
1.20
1.19
1.18
41
1.17
40
R1 = R2 = 100kΩ
R1 = R2 = 100kΩ
39
1.16
0.1
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0
SUPPLY VOLTAGE (V)
100
200
300
400
500
0
200
300
HEAVY-LOAD SWITCHING WAVEFORMS
MAX8560 toc10
MAX8560 toc11
50mA LOAD
200ns/div
100
LOAD CURRENT (mA)
LOAD CURRENT (mA)
LIGHT-LOAD SWITCHING WAVEFORMS
4
2.5
LOAD CURRENT (mA)
MAX8560 toc08
EFFICIENCY (%)
100
MAX8560 toc05
100
MAX8560 toc04
100
EFFICIENCY vs. LOAD CURRENT
(LOAD = 7.5Ω)
MAX8560 toc06
EFFICIENCY vs. LOAD CURRENT
(VOUT = 1.2V)
SUPPLY CURRENT (µA)
MAX8560/MAX8561/MAX8562
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
200mA LOAD
VOUT
20mV/div
VOUT
20mV/div
IL
200mA/div
0
IL
200mA/div
0
VLX
2V/div
VLX
2V/div
200ns/div
_______________________________________________________________________________________
400
500
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
LIGHT-LOAD SOFT-START WAVEFORMS
HEAVY-LOAD SOFT-START WAVEFORMS
MAX8560 toc12
LINE-TRANSIENT RESPONSE
MAX8560 toc13
100Ω LOAD
3Ω LOAD
MAX8560 toc14
VOUT
1V/div
IIN
200mA/div
VOUT
1V/div
IIN
200mA/div
5Ω LOAD
VOUT
20mV/div
IL
200mA/div
IL
200mA/div
IL
200mA/div
0
0
VSHDN
2V/div
VSHDN
2V/div
0
VIN = 4.0V
VIN
500mV/div
VIN = 3.5V
20µs/div
20µs/div
2µs/div
LOAD-TRANSIENT RESPONSE
OUTPUT-VOLTAGE TRANSIENT RESPONSE
(MAX8561)
BYPASS-FET TRANSIENT RESPONSE
(MAX8562)
MAX8560 toc15
MAX8560 toc17
MAX8560 toc16
VOUT = 1.5V
VOUT
50mV/div
VOUT = VIN
VOUT
2V/div
VOUT
500mV/div
VOUT = 1.2V
VOUT = 1.0V
0
IL
500mA/div
IL
200mA/div
IL
500mA/div
0
0
0
ILOAD
500mA/div
VODI
2V/div
VODI
2V/div
500mA LOAD
20mA LOAD
20mA LOAD
2µs/div
7.5Ω LOAD, L = 2.2µH
40µs/div
7.5Ω LOAD
20µs/div
_______________________________________________________________________________________
5
MAX8560/MAX8561/MAX8562
Typical Operating Characteristics (continued)
(VIN = 3.6V, VOUT = 1.2V, L = 1µH (LQH32CN1R0M53), COUT = 2.2µF, TA = +25°C, unless otherwise noted.)
MAX8560/MAX8561/MAX8562
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
Pin Description
PIN
MAX8560
MAX8561
MAX8562
NAME
FUNCTION
1
1
IN
2
7
GND
Ground
3
8
SHDN
Active-Low Shutdown Input. Connect to IN or logic high for normal operation. Connect to
GND or logic low for shutdown mode.
4
6
FB
—
2
PGND
5
3
LX
—
5
ODO
Auxiliary Open-Drain Output
—
4
ODI
Digital Input for Open-Drain MOSFET. Connect to IN or logic high to internally pull ODO
low (and force the MAX8562 into 100% duty cycle). Connect to GND or logic low to force
ODO to high impedance (MAX8561) or 10kΩ pullup from ODO to IN (MAX8562).
—
EP
EP
Exposed Pad. Connect to GND.
Supply Voltage Input. 2.7V to 5.5V. Bypass with a 2.2µF ceramic capacitor as close as
possible to the IN and GND pins.
Voltage Feedback Input. FB regulates to 0.6V nominal. Connect FB to the center of an
external resistive divider (see the Setting the Output Voltage section).
Power Ground. Must connect to GND.
Inductor connection to the drains of the internal P-channel and N-channel MOSFETs.
Detailed Description
The MAX8560/MAX8561/MAX8562 step-down converters
deliver a guaranteed 500mA at output levels from 0.6V to
2.5V. They use a proprietary hysteretic-PWM control
scheme that switches up to 4MHz, allowing a trade-off
between efficiency and tiny external components. At light
loads below 100mA, the MAX8560/MAX8561/MAX8562
automatically switch to pulse-skipping mode to keep quiescent supply current as low as 40µA (typ).
Control Scheme
A proprietary hysteretic-PWM control scheme ensures
high efficiency, fast switching, fast transient response,
low output ripple, and physically tiny external components. This control scheme is simple: when the output
voltage falls below the regulation threshold, the error
comparator begins a switching cycle by turning on the
high-side switch. This switch remains on until the minimum on-time expires and the output voltage is in regulation or the current-limit threshold is exceeded. Once
off, the high-side switch remains off until the minimum
off-time expires and the output voltage falls again,
6
below the regulation threshold. During this period, the
low-side synchronous rectifier turns on and remains on
until either the high-side switch turns on again or the
inductor current approaches zero. The internal synchronous rectifier eliminates the need for an external
Schottky diode.
Voltage-Positioning Load Regulation
As seen in the Typical Operating Circuit, the
MAX8560/MAX8561/MAX8562 use a unique feedback
network. By taking feedback from the LX node through
R1, the usual phase lag due to the output capacitor is
removed, making the loop exceedingly stable and
allowing the use of a very small ceramic output capacitor. This configuration causes the output voltage to shift
by the inductor series resistance multiplied by the load
current. This voltage-positioning load regulation greatly
reduces overshoot during load transients, which effectively halves the peak-to-peak output-voltage excursions compared to traditional step-down converters.
See the Load Transient Response graph in the Typical
Operating Characteristics section.
_______________________________________________________________________________________
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
MAX8560/MAX8561/MAX8562
Shutdown Mode
Connecting SHDN to GND or logic low places the
MAX8560/MAX8561/MAX8562 in shutdown mode and
reduces supply current to 0.1µA. In shutdown, the control circuitry, internal-switching P-channel MOSFET, and
synchronous rectifier (N-channel MOSFET) turn off and
LX becomes high impedance. Connect SHDN to IN or
logic high for normal operation.
IN
PFET
SHDN
PWM
LOGIC
NFET
LX
0.6V
PGND
(GND)**
Soft-Start
The MAX8560/MAX8561/MAX8562 have internal softstart circuitry that eliminates inrush current at startup,
reducing transients on the input source. Soft-start is particularly useful for higher impedance input sources,
such as Li+ and alkaline cells. See the Soft-Start and
Shutdown Response graphs in the Typical Operating
Characteristics section.
MAX8560
MAX8561*
MAX8562*
FB
10kΩ
ODO
Open-Drain Output
The 8-pin TDFN versions, the MAX8561 and MAX8562,
include an extra, internal, open-drain N-channel MOSFET
switch that can save an additional package in space-constrained applications. The open drain is connected to
ODO, while the gate is controlled by a digital input at
ODI. For the MAX8561, this circuit can be used to toggle
between two regulated output voltages, as in Figure 2.
For the MAX8562, a 10kΩ resistor pulls ODO up to IN
when ODI is low, and the buck converter is forced into
100% duty cycle when ODI is high. This makes the
MAX8562 ideal for driving an external bypass PFET for
high-power mode in CDMA cell phones, as in Figure 3.
Applications Information
The MAX8560/MAX8561/MAX8562 are optimized for
use with tiny inductors and small ceramic capacitors.
The correct selection of external components, especially CFF, ensures high efficiency, low output ripple, and
fast transient response.
Setting the Output Voltage
Select an output voltage between 0.6V and 2.5V by
connecting FB to a resistive voltage-divider between LX
and GND (see the Typical Operating Circuit). Choose
R2 for a reasonable bias current in the resistive divider.
A wide range of resistor values is acceptable, but a
good starting point is to choose R2 as 100kΩ. Then, R1
is given by:
V
R1 = R2 OUT − 1
V
FB
where VFB = 0.6V.
ODI
GND
*NOTE: ODI/ODO AVAILABLE IN THE MAX8561/MAX8562 ONLY.
THE MAX8561 ODO IS AN OPEN-DRAIN OUTPUT. THE MAX8562
HAS AN INTERNAL 10kΩ PULLUP TO IN.
**GND FOR MAX8560.
Figure 1. Simplified Functional Diagram
Inductor Selection
The MAX8560/MAX8561/MAX8562 operate with inductors
of 1µH to 4.7µH. Low inductance values are smaller but
require faster switching, which results in some efficiency
loss. See the Typical Operating Characteristics section
for efficiency and switching frequency vs. inductor value.
The inductor’s DC current rating only needs to match the
maximum load current of the application + 50mA
because the MAX8560/MAX8561/ MAX8562 feature zero
current overshoot during startup and load transients.
For output voltages above 2.0V, when light-load efficiency is important, the minimum recommended inductor is
2.2µH. For optimum voltage-positioning load transients,
choose an inductor with DC series resistance in the
50mΩ to 150mΩ range. For higher efficiency at heavy
loads (above 200mA) or minimal load regulation (but
some transient overshoot), the resistance should be kept
below 100mΩ. For light-load applications up to 200mA,
much higher resistance is acceptable with very little
impact on performance.
_______________________________________________________________________________________
7
MAX8560/MAX8561/MAX8562
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
INPUT
Li+ BATTERY
INPUT
Li+ BATTERY
2.2µH
GND
PFET
LX
IN
2.2µF
OUTPUT
1.5V OR 1.0V
AT 500mA
2.2µF
MAX8561
IN
100kΩ
2.2µF
GND
FB
120kΩ
ON/OFF
1.5/1.0
SHDN
ODO
2.2µF
MAX8562
100kΩ
220pF
ODO
ODI
OUTPUT
1.2V OR VBATT
1.5µH
LX
FB
150kΩ
PGND
ON/OFF
HP/LP
SHDN
150pF
100kΩ
ODI
HP = HIGH-POWER MODE
LP = LOW-POWER MODE
PGND
Figure 2. Using ODI/ODO to Obtain Two Output Voltages from
the MAX8561
Capacitor Selection
Output Capacitor
The output capacitor, C OUT, is required to keep the
output voltage ripple small and to ensure regulation
loop stability. COUT must have low impedance at the
switching frequency. Ceramic capacitors with X5R or
X7R dielectrics are highly recommended due to their
small size, low ESR, and small temperature coefficients.
Due to the unique feedback network, the output capacitance can be very low. For most applications, a 2.2µF
capacitor is sufficient. For optimum load-transient performance and very low output ripple, the output capacitor value in µFs should be equal to or larger than the
inductor value in µHs.
Input Capacitor
The input capacitor, CIN, reduces the current peaks
drawn from the battery or input power source and
reduces switching noise in the IC. The impedance of
CIN at the switching frequency should be kept very low.
Ceramic capacitors with X5R or X7R dielectrics are
highly recommended due to their small size, low ESR,
and small temperature coefficients. Due to the
MAX8560/MAX8561/MAX8562s’ soft-start, the input
capacitance can be very low. For most applications, a
2.2µF capacitor is sufficient.
8
Figure 3. Using the MAX8562 to Control an External Bypass
PFET for a Two-Step VCC in CDMA-PA Applications
Feed-Forward Capacitor
The feed-forward capacitor, CFF, sets the feedback loop
response, controls the switching frequency, and is critical in obtaining the best efficiency possible. Choose a
small ceramic X7R capacitor with a value given by:
CFF =
L
× 10 Siemens
R1
Select the closest standard value to CFF as possible.
PC Board Layout and Routing
High switching frequencies and relatively large peak currents make the PC board layout a very important part of
design. Good design minimizes excessive EMI on the
feedback paths and voltage gradients in the ground
plane, both of which can result in instability or regulation
errors. Connect CIN close to IN and GND. Connect the
inductor and output capacitor as close to the IC as possible and keep their traces short, direct, and wide.
Connect GND and PGND separately to the ground
plane. The external feedback network should be very
close to the FB pin, within 0.2in (5mm). Keep noisy
traces, such as the LX node, as short as possible. For
the 8-pin TDFN package, connect GND to the exposed
paddle directly under the IC. Figure 4 illustrates an
example PC board layout and routing scheme.
_______________________________________________________________________________________
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
MANUFACTURER
SERIES
INDUCTANCE
(µH)
ESR
(Ω)
CURRENT RATING
(mA)
DIMENSIONS
LB2012
1.0
2.2
0.15
0.23
300
240
2.0 x 1.25 x 1.45 = 3.6mm3
LB2016
1.0
1.5
2.2
3.3
0.09
0.11
0.13
0.20
455
350
315
280
2.0 x 1.6 x 1.8 = 5.8mm3
LB2518
1.0
1.5
2.2
3.3
0.06
0.07
0.09
0.11
500
400
340
270
2.5 x 1.8 x 2.0 = 9mm3
LBC2518
1.0
1.5
2.2
3.3
4.7
0.08
0.11
0.13
0.16
0.20
775
660
600
500
430
2.5 x 1.8 x 2.0 = 9mm3
LQH31C_03
1.0
0.28
510
3.2 x 1.6 x 2.0 = 10mm3
LQH32C_53
1.0
2.2
4.7
0.06
0.10
0.15
1000
790
650
3.2 x 2.5 x 1.7 = 14mm3
LQM43FN
2.2
4.7
0.10
0.17
400
300
4.5 x 3.2 x 0.9 = 13mm3
D310F
1.5
2.2
3.3
0.13
0.17
0.19
1230
1080
1010
3.6 x 3.6 x 1.0 = 13mm3
D312C
1.5
2.2
2.7
3.3
0.10
0.12
0.15
0.17
1290
1140
980
900
3.6 x 3.6 x 1.2 = 16mm3
CDRH2D11
1.5
2.2
3.3
4.7
0.05
0.08
0.10
0.14
900
780
600
500
3.2 x 3.2 x 1.2 = 12mm3
Taiyo Yuden
Murata
TOKO
Sumida
_______________________________________________________________________________________
9
MAX8560/MAX8561/MAX8562
Table 1. Suggested Inductors
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
MAX8560/MAX8561/MAX8562
Chip Information
TRANSISTOR COUNT: 1271
PROCESS: BiCMOS
(a) MAX8560
(b) MAX8561
(c) MAX8562
Figure 4. Recommended PC Board Layout
10
______________________________________________________________________________________
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
THIN SOT23.EPS
______________________________________________________________________________________
11
MAX8560/MAX8561/MAX8562
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
6, 8, &10L, DFN THIN.EPS
MAX8560/MAX8561/MAX8562
4MHz, 500mA Synchronous Step-Down
DC-DC Converters in Thin SOT and TDFN
D2
D
A2
PIN 1 ID
N
0.35x0.35
b
PIN 1
INDEX
AREA
E
[(N/2)-1] x e
REF.
E2
DETAIL A
e
k
A1
CL
A
CL
L
L
e
e
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
21-0137
G
1
2
COMMON DIMENSIONS
MIN.
MAX.
D
0.70
2.90
0.80
3.10
E
A1
2.90
0.00
3.10
0.05
L
k
0.20
0.40
0.25 MIN.
A2
0.20 REF.
SYMBOL
A
PACKAGE VARIATIONS
PKG. CODE
N
D2
E2
e
JEDEC SPEC
b
[(N/2)-1] x e
DOWNBONDS
ALLOWED
T633-1
6
1.50±0.10
2.30±0.10
0.95 BSC
MO229 / WEEA
0.40±0.05
1.90 REF
NO
T633-2
6
1.50±0.10
2.30±0.10
0.95 BSC
MO229 / WEEA
0.40±0.05
1.90 REF
NO
T833-1
8
1.50±0.10
2.30±0.10
0.65 BSC
MO229 / WEEC
0.30±0.05
1.95 REF
NO
T833-2
8
1.50±0.10
2.30±0.10
0.65 BSC
MO229 / WEEC
0.30±0.05
1.95 REF
NO
T833-3
8
1.50±0.10
2.30±0.10
0.65 BSC
MO229 / WEEC
0.30±0.05
1.95 REF
YES
T1033-1
10
1.50±0.10
2.30±0.10
0.50 BSC
MO229 / WEED-3
0.25±0.05
2.00 REF
NO
T1433-1
14
1.70±0.10
2.30±0.10
0.40 BSC
----
0.20±0.05
2.40 REF
YES
T1433-2
14
1.70±0.10
2.30±0.10
0.40 BSC
----
0.20±0.05
2.40 REF
NO
PACKAGE OUTLINE, 6,8,10 & 14L,
TDFN, EXPOSED PAD, 3x3x0.80 mm
-DRAWING NOT TO SCALE-
21-0137
G
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2005 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products, Inc.
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