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MAX8795AGCJ/V+TGB

MAX8795AGCJ/V+TGB

  • 厂商:

    AD(亚德诺)

  • 封装:

    LQFP32

  • 描述:

    IC CONV DC-DC TFT-LCD 32LQFP

  • 数据手册
  • 价格&库存
MAX8795AGCJ/V+TGB 数据手册
19-0793; Rev 5; 5/12 KIT ATION EVALU E L B A IL AVA TFT-LCD DC-DC Converter with Operational Amplifiers Features The MAX8795A includes a high-performance step-up regulator, two linear-regulator controllers, and five highcurrent operational amplifiers for active-matrix, thin-film transistor (TFT), liquid-crystal displays (LCDs). Also included is a logic-controlled, high-voltage switch with adjustable delay. The step-up DC-DC converter provides the regulated supply voltage for the panel source driver ICs. The converter is a high-frequency (1.2MHz) current-mode regulator with an integrated 20V n-channel MOSFET that allows the use of ultra-small inductors and ceramic capacitors. It provides fast transient response to pulsed loads while achieving efficiencies over 85%. The gate-on and gate-off linear-regulator controllers provide regulated TFT gate-on and gate-off supplies using external charge pumps attached to the switching node. The MAX8795A includes five high-performance operational amplifiers. These amplifiers are designed to drive the LCD backplane (VCOM) and/or the gammacorrection divider string. The device features high output current (±130mA), fast slew rate (45V/µs), wide bandwidth (20MHz), and rail-to-rail inputs and outputs. The MAX8795A is available in a lead-free, 32-pin, thin QFN package with a maximum thickness of 0.8mm for ultra-thin LCD panels, as well as in a 32-pin LQFP package with 0.8mm pin pitch. o 2.5V to 5.5V Input Supply Range o 1.2MHz Current-Mode Step-Up Regulator Fast Transient Response to Pulsed Load High-Accuracy Output Voltage (1%) Built-In 20V, 3A, 0.16Ω n-Channel MOSFET High Efficiency (85%) o Linear-Regulator Controllers for VGON and VGOFF o High-Performance Operational Amplifiers ±130mA Output Short-Circuit Current 45V/µs Slew Rate 20MHz, -3dB Bandwidth Rail-to-Rail Inputs/Outputs o Logic-Controlled, High-Voltage Switch with Adjustable Delay o Timer-Delay Fault Latch for All Regulator Outputs o Thermal-Overload Protection o 0.6mA Quiescent Current Applications Minimal Operating Circuit VCN VCP VIN VMAIN LX IN FB STEP-UP CONTROLLER PGND COMP AGND Notebook Computer Displays LCD Monitor Panels VCP MAX8795A DRVP GATE-ON CONTROLLER FBP VGON Automotive Displays SRC DEL COM Ordering Information PART MAX8795AETJ+ TEMP RANGE PIN-PACKAGE -40°C to +85°C 32 Thin QFN SWITCH CONTROL CTL VCN DRN DRVN GATE-OFF CONTROLLER SUP VGOFF NEG1 MAX8795AGCJ+ -40°C to +105°C 32 LQFP FBN OUT1 MAX8795AGCJ/V+ -40°C to +105°C 32 LQFP MAX8795AGTJ+ -40°C to +105°C 32 TQFN MAX8795AGTJ/V+ -40°C to +105°C 32 TQFN +Denotes a lead(Pb)-free/RoHS-compliant package. /V denotes an automotive-qualified part. OP1 POS1 REF OUT2 REF NEG4 NEG2 OP2 OP4 OUT4 POS4 POS2 NEG5 OUT3 OP5 OP3 OUT5 POS5 POS3 EP BGND Pin Configurations appear at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX8795A General Description MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers ABSOLUTE MAXIMUM RATINGS IN, CTL to AGND ...................................................-0.3V to +7.5V COMP, FB, FBP, FBN, DEL, REF to AGND ....-0.3V to (VIN + 0.3V) PGND, BGND to AGND ......................................................±0.3V LX to PGND ............................................................-0.3V to +20V SUP to AGND .........................................................-0.3V to +20V DRVP to AGND.......................................................-0.3V to +36V POS_, NEG_, OUT_ to AGND ...................-0.3V to (VSUP + 0.3V) DRVN to AGND ...................................(VIN - 30V) to (VIN + 0.3V) SRC to AGND .........................................................-0.3V to +40V COM, DRN to AGND ................................-0.3V to (VSRC + 0.3V) DRN to COM............................................................-30V to +30V POS_ to NEG_ RMS Current ...................................5mA (Note 1) Note 1: See Figure 2 for the op amp clamp structure. OUT_ Maximum Continuous Output Current....................±75mA LX Switch Maximum Continuous RMS Current .....................1.6A Continuous Power Dissipation (TA = +70°C) 32-Pin Thin QFN (derate 34.5mW/°C above +70°C) 2758mW 32-Pin LQFP (derate 48.4mW/°C above +70°C)....1652.9mW Operating Temperature Range, E Grade ............-40°C to +85°C Operating Temperature Range, G Grade .........-40°C to +105°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = 0°C to +85°C. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER IN Supply Range IN Undervoltage-Lockout Threshold SYMBOL VIN VUVLO CONDITIONS MIN (Note 2) 2.5 VIN rising, typical hysteresis = 50mV 2.05 VFB = VFBP = 1.3V, VFBN = 0V, LX not switching IN Quiescent Current IIN MAX UNITS 6.0 V 2.25 2.45 V 0.6 1.0 2 3 mA VFB = 1.2V, VFBP = 1.4V, VFBN = 0V, LX switching Duration-to-Trigger Fault Condition FB or FBP below threshold or FBN above threshold REF Output Voltage No external load REF Load Regulation 0 < ILOAD < 50µA REF Sink Current In regulation REF Undervoltage Lockout Threshold Rising edge; typical hysteresis = 160mV 200 ms TA = +25°C to +85°C 1.238 1.250 1.262 TA = 0°C to +85°C 1.232 1.250 1.266 10 10 +160 Hysteresis V mV µA 1.15 Temperature rising Thermal Shutdown TYP V °C 15 MAIN STEP-UP REGULATOR Output Voltage Range VMAIN VIN 18 V Operating Frequency fOSC 1000 1200 1400 kHz 86 90 93 % Oscillator Maximum Duty Cycle FB Regulation Voltage FB Fault Trip Level VFB No load TA = +25°C to +85°C 1.221 1.233 1.245 TA = 0°C to +85°C 1.212 1.233 1.248 1.10 1.14 1.17 V VFB falling V FB Load Regulation 0 < IMAIN < full load, transient only -1 FB Line Regulation VIN = 2.5V to 6V 0.1 ±0.4 %/ V FB Input Bias Current VFB = 1.233V +100 +200 nA 2 _______________________________________________________________________________________ % TFT-LCD DC-DC Converter with Operational Amplifiers (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = 0°C to +85°C. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL FB Voltage Gain LX On-Resistance CONDITIONS ∆ICOMP = ±2.5µA FB Transconductance RLX(ON) TYP MAX UNITS 75 160 280 µS 260 mΩ µA From FB to COMP 700 ILX = 200mA 160 LX Leakage Current ILX VLX = 19V LX Current Limit ILIM VFB = 1.2V, duty cycle = 75% Current-Sense Transresistance Soft-Start Period MIN V/ V 10 20 2.5 3.0 3.5 A 0.1 0.2 0.3 V/A tSS Soft-Start Step Size 14 ms VREF / 128 V OPERATIONAL AMPLIFIERS SUP Supply Range VSUP 6.0 SUP Overvoltage Fault Threshold 18.0 ISUP Buffer configuration, VPOS_ = VSUP / 2, no load Input Offset Voltage VOS (VNEG_, VPOS_, VOUT_) ≅ VSUP / 2 Input Bias Current IBIAS (VNEG_ , VPOS_, VOUT_) ≅ VSUP / 2 Input Common-Mode Voltage Range VCM SUP Supply Current Common-Mode Rejection Ratio CMRR -50 0 ≤ (VNEG_, VPOS_) ≤ VSUP Output Voltage Swing, High VOH IOUT_ = 5mA Output Voltage Swing, Low 45 19 19.9 V 3.5 5.0 mA 0 12 mV 0 +50 nA VSUP V 80 dB 125 dB VSUP 100 VSUP 50 mV VOL IOUT_ = -5mA 130 50 Short-Circuit Current To VSUP / 2, source or sink 75 Power-Supply Rejection Ratio DC, 6V ≤ VSUP ≤ 18V, (VNEG_, VPOS_) ≅ VSUP / 2 60 Slew Rate -3dB Bandwidth V 0 Open-Loop Gain PSRR 18.0 RL = 10kΩ, CL = 10pF, buffer configuration 100 mV mA dB 45 V/µs 20 MHz GATE-ON LINEAR-REGULATOR CONTROLLER FBP Regulation Voltage VFBP FBP Fault Trip Level FBP Input Bias Current IFBP FBP Effective Load-Regulation Error (Transconductance) Soft-Start Step Size 1.250 1.269 VFBP falling 0.96 1.00 1.04 V VFBP = 1.25V -50 +50 nA -0.7 -1.5 % ±1 ±10 mV IDRVP = 100µA, 2.5V < VIN < 6V IDRVP DRVP Off-Leakage Current Soft-Start Period 1.231 VDRVP = 10V, IDRVP = 50µA to 1mA FBP Line (IN) Regulation Error DRVP Sink Current IDRVN = 100µA VFBP = 1.1V, VDRVP = 10V VFBP = 1.4V, VDRVP = 34V tSS 1 5 0.01 V mA 10 µA 14 ms VREF / 128 V _______________________________________________________________________________________ 3 MAX8795A ELECTRICAL CHARACTERISTICS (continued) MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers ELECTRICAL CHARACTERISTICS (continued) (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = 0°C to +85°C. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS GATE-OFF LINEAR-REGULATOR CONTROLLER FBN Regulation Voltage VFBN FBN Fault Trip Level FBN Input Bias Current IFBN FBN Effective Load-Regulation Error (Transconductance) 1 1.015 V 370 420 470 mV VFBN = 0.25V -50 +50 nA 11 25 mV ±0.7 ±5 mV IDRVN = 0.1mA, 2.5V < VIN < 6V IDRVN DRVN Off-Leakage Current Soft-Start Period 0.984 VFBN rising VDRVN = -10V, IDRVN = 50µA to 1mA FBN Line (IN) Regulation Error DRVN Source Current IDRVN = 100µA, VREF - VFBN VFBN = 300mV, VDRVN = -10V 1 VFBN = 0V, VDRVN = -25V 5 -0.01 tSS Soft-Start Step Size mA -10 µA 14 ms (VREF VFBN) / 128 V POSITIVE GATE-DRIVER TIMING AND CONTROL SWITCHES DEL Capacitor Charge Current DEL Turn-On Threshold During startup, VDEL = 1V VTH(DEL) 4 5 6 µA 1.19 1.25 1.31 V DEL Discharge Switch On-Resistance During UVLO, VIN = 2.0V CTL Input Low Voltage VIN = 2.5V to 5.5V CTL Input High Voltage VIN = 2.5V to 5.5V 2 CTL Input Leakage Current CTL = AGND or IN -1 CTL-to-SRC Propagation Delay 0.6 +1 100 µA ns 36 ISRC V V SRC Input Voltage Range SRC Input Current Ω 20 VDEL = 1.5V, CTL = IN 200 300 VDEL = 1.5V, CTL = AGND 115 200 V µA SRC-to-COM Switch On-Resistance RSRC(ON) VDEL = 1.5V, CTL = IN 5 10 Ω DRN-to-COM Switch On-Resistance RDRN(ON) VDEL = 1.5V, CTL = AGND 30 60 Ω 4 _______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = -40°C to +85°C, unless otherwise noted.) (Note 3) PARAMETER IN Supply Range SYMBOL VIN IN Undervoltage-Lockout Threshold IN Quiescent Current VUVLO IIN REF Output Voltage REF Undervoltage-Lockout Threshold MAIN STEP-UP REGULATOR CONDITIONS MIN MAX UNITS (Note 2) 2.5 6.0 V VIN rising, typical hysteresis = 150mV 2.05 2.45 V VFB = VFBP = 1.3V, VFBN = 0V, LX not switching 1.0 mA VFB = 1.2V, VFBP = 1.4V, VFBN = 0V, LX switching No external load 3 1.218 1.277 V 1.15 V 18 V 900 1400 kHz 1.198 1.260 V ±0.4 %/ V Rising edge; typical hysteresis = 160mV Output Voltage Range VMAIN Operating Frequency fOSC FB Regulation Voltage VFB FB Line Regulation VIN No load VIN = 2.5V to 6V ∆ICOMP = ±2.5µA FB Transconductance LX On-Resistance RLX(ON) LX Current Limit ILIM 75 280 µS 260 mΩ 2.5 3.5 A 6 18 V 18.0 ILX = 200mA VFB = 1.2V, duty cycle = 75% OPERATIONAL AMPLIFIERS SUP Supply Range VSUP SUP Overvoltage Fault Threshold SUP Supply Current ISUP Buffer configuration, VPOS_ = VSUP / 2, no load Input Offset Voltage VOS (VNEG_, VPOS_, IOUT_) = ≅ VSUP / 2 Input Common-Mode Voltage Range VCM Output Voltage Swing, High VOH IOUT_ = 5mA Output Voltage Swing Low VOL IOUT_ = -5mA Short-Circuit Current 0 To VSUP / 2 19.9 V 5 mA 12 mV VSUP V VSUP 100 mV 100 Source 75 Sink 75 mA GATE-ON LINEAR-REGULATOR CONTROLLER FBP Regulation Voltage VFBP FBP Effective Load-Regulation Error (Transconductance) 1.210 VDRVP = 10V, IDRVP = 50µA to 1mA FBP Line (IN) Regulation Error DRVP Sink Current IDRVP = 100µA IDRVP = 100µA, 2.5V < VIN < 6V IDRVP VFBP = 1.1V, VDRVP = 10V 1 1.280 V -1.5 % 10 mV mA _______________________________________________________________________________________ 5 MAX8795A ELECTRICAL CHARACTERISTICS MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers ELECTRICAL CHARACTERISTICS (continued) (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = -40°C to +85°C, unless otherwise noted.) (Note 3) PARAMETER SYMBOL CONDITIONS MIN MAX UNITS 0.972 1.022 V 25 mV ±5 mV GATE-OFF LINEAR-REGULATOR CONTROLLER FBN Regulation Voltage VFBN FBN Effective Load-Regulation Error (Transconductance) VDRVN = -10V, IDRVN = 50µA to 1mA FBN Line (IN) Regulation Error DRVN Source Current IDRVN = 100µA, VREF - VFBN IDRVN = 0.1mA, 2.5V < VIN < 6V IDRVN VFBN = 300mV, VDRVN = -10V 1 mA POSITIVE GATE-DRIVER TIMING AND CONTROL SWITCHES DEL Capacitor Charge Current DEL Turn-On Threshold During startup, VDEL = 1V VTH(DEL) CTL Input Low Voltage VIN = 2.5V to 5.5V CTL Input High Voltage VIN = 2.5V to 5.5V 4 6 1.19 1.31 V 0.6 V 2 V SRC Input Voltage Range SRC Input Current 36 ISRC µA VDEL = 1.5V, CTL = IN 300 VDEL = 1.5V, CTL = AGND 200 V µA SRC-to-COM Switch On-Resistance RSRC(ON) VDEL = 1.5V, CTL = IN 10 Ω DRN-to-COM Switch On-Resistance RDRN(ON) VDEL = 1.5V, CTL = AGND 60 Ω ELECTRICAL CHARACTERISTICS (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = 0°C to +105°C. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER IN Supply Range IN Undervoltage-Lockout Threshold SYMBOL VIN VUVLO CONDITIONS MIN (Note 2) 2.5 VIN rising, typical hysteresis = 50mV 2.05 VFB = VFBP = 1.3V, VFBN = 0V, LX not switching IN Quiescent Current IIN VFB or FBP below threshold or FBN above threshold REF Output Voltage No external load UNITS 6.0 V 2.25 2.45 V 0.6 1.0 200 ms 1.250 1.262 TA = 0°C to +105°C 1.232 1.250 1.266 0 < ILOAD < 50µA In regulation REF Undervoltage-Lockout Threshold Rising edge, typical hysteresis = 160mV Hysteresis 3 1.238 REF Sink Current Temperature rising 2 TA = +25°C to +105°C REF Load Regulation 6 MAX mA VFB = 1.2V, VFBP = 1.4V, VFBN = 0V, LX switching Duration-to-Trigger Fault Condition Thermal Shutdown TYP 10 10 V mV µA 1.15 +160 15 _______________________________________________________________________________________ V °C TFT-LCD DC-DC Converter with Operational Amplifiers (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = 0°C to +105°C. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 18 V MAIN STEP-UP REGULATOR Output Voltage Range VMAIN VIN Operating Frequency fOSC 1000 1200 1400 kHz 86 90 93 % TA = +25°C to +105°C 1.221 1.233 1.245 TA = 0°C to +105°C 1.212 1.233 1.248 1.10 1.14 1.17 V %/V Oscillator Maximum Duty Cycle FB Regulation Voltage VFB No load FB Fault Trip Level VFB falling FB Load Regulation 0 < IMAIN < full load, transient only FB Line Regulation VIN = 2.5V to 6V FB Input Bias Current VFB = 1.233V FB Transconductance ∆ICOMP = ±2.5µA FB Voltage Gain LX On-Resistance RLX(ON) -1 75 0.1 ±0.4 +100 +200 nA 160 280 µS From FB to COMP 700 ILX = 200mA 160 300 mΩ 10 20 µA 2.5 3.0 3.5 A 0.1 0.2 0.3 V/A LX Leakage Current ILX VLX = 19V LX Current Limit ILIM VFB = 1.2V, duty cycle = 75% Current-Sense Transresistance Soft-Start Period V tSS Soft-Start Step Size V/V 14 ms VREF / 128 V OPERATIONAL AMPLIFIERS SUP Supply Range VSUP 6.0 SUP Overvoltage Fault Threshold 18.0 SUP Supply Current ISUP Buffer configuration, VPOS_ = VSUP / 2, no load Input Offset Voltage VOS (VNEG_, VPOS_, VOUT_) ≅ VSUP / 2 Input Bias Current IBIAS (VNEG_, VPOS_, VOUT_) ≅ VSUP / 2 Input Common-Mode Voltage Range VCM Common-Mode Rejection Ratio CMRR -50 0 ≤ (VNEG_, VPOS_) ≤ VSUP 45 mA 0 12 mV 0 +50 nA VSUP V dB dB VSUP 100 VSUP 50 mV To VSUP / 2, source or sink 75 130 DC, 6V ≤ VSUP ≤ 18V, (VNEG_, VPOS_) ≅ VSUP / 2 60 IOUT_ = 5mA Output Voltage Swing, Low VOL IOUT_ = -5mA Slew Rate -3dB Bandwidth 5.0 80 VOH PSRR 3.5 125 Output Voltage Swing, High Power-Supply Rejection Ratio V 19.9 0 Open-Loop Gain Short-Circuit Current 18.0 19 RL = 10kΩ, CL = 10pF, buffer configuration 50 100 mV mA dB 45 V/µs 20 MHz _______________________________________________________________________________________ 7 MAX8795A ELECTRICAL CHARACTERISTICS (continued) MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers ELECTRICAL CHARACTERISTICS (continued) (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = 0°C to +105°C. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS V GATE-ON LINEAR-REGULATOR CONTROLLER FBP Regulation Voltage VFBP FBP Fault Trip Level FBP Input Bias Current IFBP IDRVP = 100µA 1.231 1.250 1.269 VFBP falling 0.96 1.00 1.04 V VFBP = 1.25V -50 +50 nA FBP Effective Load-Regulation Error (Transconductance) VDRVP = 10V, IDRVP = 50µA to 1mA -0.7 -1.5 % FBP Line (IN) Regulation Error IDRVP = 100µA, 2.5V < VIN < 6V ±1 ±10 mV mA DRVP Sink Current IDRVP DRVP Off-Leakage Current Soft-Start Period VFBP = 1.1V, VDRVP = 10V 1 VFBP = 1.4V, VDRVP = 34V 5 0.01 tSS Soft-Start Step Size 10 µA 14 ms VREF / 128 V GATE-OFF LINEAR-REGULATOR CONTROLLER FBN Regulation Voltage VFBN FBN Fault Trip Level FBN Input Bias Current IFBN IDRVN = 100µA, VREF - VFBN 0.984 1 1.015 V VFBN rising 340 420 510 mV VFBN = 0.25V -50 +50 nA 11 25 mV ±0.7 ±5 mV FBN Effective Load-Regulation Error (Transconductance) VDRVN = -10V, IDRVN = 50µA to 1mA FBN Line (IN) Regulation Error IDRVN = 0.1mA, 2.5V < VIN < 6V DRVN Source Current IDRVN DRVN Off-Leakage Current Soft-Start Period VFBN = 300mV, VDRVN = -10V 1 VFBN = 0V, VDRVN = -25V 5 -0.01 tSS Soft-Start Step Size mA -10 µA 14 ms (VREF VFBN) / 128 V POSITIVE GATE-DRIVER TIMING AND CONTROL SWITCHES DEL Capacitor Charge Current DEL Turn-On Threshold During startup, VDEL = 1V VTH(DEL) 4 5 6 µA 1.19 1.25 1.31 V DEL Discharge Switch On-Resistance During UVLO, VIN = 2.0V CTL Input Low Voltage VIN = 2.5V to 5.5V CTL Input High Voltage VIN = 2.5V to 5.5V 2 CTL Input Leakage Current CTL = AGND or IN -1 CTL-to-SRC Propagation Delay 0.6 V +1 µA V 100 SRC Input Voltage Range SRC Input Current Ω 20 ns 36 ISRC VDEL = 1.5V, CTL = IN 200 300 VDEL = 1.5V, CTL = AGND 115 200 V µA SRC-to-COM Switch On-Resistance RSRC(ON) VDEL = 1.5V, CTL = IN 5 12 Ω DRN-to-COM Switch On-Resistance RDRN(ON) VDEL = 1.5V, CTL = AGND 30 70 Ω 8 _______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = -40°C to +105°C, unless otherwise noted.) (Note3) PARAMETER IN Supply Range SYMBOL VIN IN Undervoltage-Lockout Threshold VUVLO CONDITIONS MIN MAX UNITS (Note 2) 2.5 6.0 V VIN rising, typical hysteresis = 150mV 2.05 2.45 V VFB = VFBP = 1.3V, VFBN = 0V, LX not switching IN Quiescent Current IIN 1.0 mA VFB = 1.2V, VFBP = 1.4V, VFBN = 0V, LX switching REF Output Voltage No external load REF Undervoltage-Lockout Threshold Rising edge, typical hysteresis = 160mV 3 1.218 1.277 V 1.15 V 18 V 900 1400 kHz 1.198 1.260 V ±0.4 %/ V MAIN STEP-UP REGULATOR Output Voltage Range VMAIN Operating Frequency fOSC FB Regulation Voltage VFB FB Line Regulation VIN No load VIN = 2.5V to 6V ∆ICOMP = ±2.5µA FB Transconductance LX On-Resistance LX Current Limit RLX(ON) ILIM 75 280 µS 300 mΩ 3.5 A 6 18 V 18.0 19.9 V ILX = 200mA VFB = 1.2V, duty cycle = 75% 2.5 OPERATIONAL AMPLIFIERS SUP Supply Range VSUP SUP Overvoltage Fault Threshold SUP Supply Current ISUP Buffer configuration, VPOS_ = VSUP / 2, no load 5 mA Input Offset Voltage VOS (VNEG_, VPOS_, VOUT_) ≅ VSUP / 2 12 mV Input Common-Mode Voltage Range VCM VSUP V Output Voltage Swing, High VOH IOUT_ = 5mA Output Voltage Swing, Low VOL IOUT_ = -5mA Short-Circuit Current 0 To VSUP / 2 VSUP 100 mV 100 Source 75 Sink 75 mV mA _______________________________________________________________________________________ 9 MAX8795A ELECTRICAL CHARACTERISTICS MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers ELECTRICAL CHARACTERISTICS (continued) (VIN = 3V, VMAIN = VSUP = 14V, VPGND = VAGND = VBGND = 0V, IREF = 25µA, TA = -40°C to +105°C, unless otherwise noted.) (Note3) PARAMETER SYMBOL CONDITIONS MIN MAX UNITS 1.210 1.280 V -1.5 % 10 mV GATE-ON LINEAR-REGULATOR CONTROLLER FBP Regulation Voltage VFBP FBP Effective Load-Regulation Error (Transconductance) VDRVP = 10V, IDRVP = 50µA to 1mA FBP Line (IN) Regulation Error DRVP Sink Current IDRVP = 100µA IDRVP = 100µA, 2.5V < VIN < 6V IDRVP VFBP = 1.1V, VDRVP = 10V 1 mA GATE-OFF LINEAR-REGULATOR CONTROLLER FBN Regulation Voltage VFBN FBN Effective Load-Regulation Error (Transconductance) 0.972 VDRVN = -10V, IDRVN = 50µA to 1mA FBN Line (IN) Regulation Error DRVN Source Current IDRVN = 100µA, VREF - VFBN IDRVN = 0.1mA, 2.5V < VIN < 6V IDRVN VFBN = 300mV, VDRVN = -10V 1.022 V 25 mV ±5 mV 1 mA POSITIVE GATE-DRIVER TIMING AND CONTROL SWITCHES DEL Capacitor Charge Current DEL Turn-On Threshold During startup, VDEL = 1V VTH(DEL) CTL Input Low Voltage VIN = 2.5V to 5.5V CTL Input High Voltage VIN = 2.5V to 5.5V 4 6 µA 1.19 1.31 V 0.6 2 SRC Input Voltage Range SRC Input Current 36 ISRC V V VDEL = 1.5V, CTL = IN 300 VDEL = 1.5V, CTL = AGND 200 V µA SRC-to-COM Switch On-Resistance RSRC(ON) VDEL = 1.5V, CTL = IN 12 Ω DRN-to-COM Switch On-Resistance RDRN(ON) VDEL = 1.5V, CTL = AGND 70 Ω Note 2: For 5.5V < VIN < 6.0V, use MAX8795A for no longer than 1% of IC lifetime. For continuous operation, input voltage should not exceed 5.5V. Note 3: Specifications to -40°C and +105°C are guaranteed by design, not production tested. 10 ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers 80 75 MAX9795A toc02 18 1.3 1.2 9 6 CURRENT INTO IN PIN 0 1.0 2.5 1000 100 CURRENT INTO INDUCTOR 3 70 10 12 1.1 VIN = 5V VMAIN = 13.9V 1 NO LOAD, SUP DISCONNECTED, R1 = 221kΩ, R2 = 21.5kΩ 15 SUPPLY CURRENT (mA) 85 1.4 SWITCHING FREQUENCY (MHz) MAX9795A toc01 90 EFFICIENCY (%) STEP-UP SUPPLY CURRENT vs. SUPPLY VOLTAGE SWITCHING FREQUENCY vs. INPUT VOLTAGE MAX8795A toc03 STEP-UP EFFICIENCY vs. LOAD CURRENT 3.0 3.5 4.0 4.5 5.0 2.5 5.5 3.0 3.5 STEP-UP REGULATOR PULSED LOAD-TRANSIENT RESPONSE STEP-UP REGULATOR SOFT-START (HEAVY LOAD) 4.0 4.5 5.0 6.0 TIMER-DELAYED OVERLOAD PROTECTION MAX8795A toc05 MAX8795A toc04 5.5 SUPPLY VOLTAGE (V) INPUT VOLTAGE (V) LOAD CURRENT (mA) MAX8795A toc06 A A 0V B 50mA A 13.9V B 0V C B 0A 0A C 0U 0A 10µs/div A: VIN, 5V/div B: VMAIN, 5V/div C: INDUCTOR CURRENT, 1A/div 40ms/div A: VMAIN, 2V/div B: INDUCTOR CURRENT, 1A/div A: LOAD CURRENT, 1A/div B: VMAIN, 200mV/div, AC-COUPLED C: INDUCTOR CURRENT, 1A/div REF VOLTAGE LOAD REGULATION MAX8795A toc08 1.2495 VOLTAGE ERROR (%) 1.2490 1.2485 1.2480 -0.1 VOLTAGE ERROR (%) -0.2 REF VOLTAGE (V) GATE-ON REGULATOR LOAD REGULATION GATE-ON REGULATOR LINE REGULATION 0 MAX8795A toc07 1.2500 -0.4 MAX8795A toc09 2ms/div -0.3 -0.6 1.2475 1.2470 IPOS = 20mA -0.8 0 10 20 30 LOAD CURRENT (µA) 40 50 25 26 27 28 INPUT VOLTAGE (V) 29 IBOOST = 200mA -0.5 30 0 5 10 15 20 LOAD CURRENT (mA) ______________________________________________________________________________________ 11 MAX8795A Typical Operating Characteristics (Circuit of Figure 1, VIN = 5V, VMAIN = 14V, VGON = 25V, VGOFF = -10V, TA = +25°C, unless otherwise noted.) Typical Operating Characteristics (continued) (Circuit of Figure 1, VIN = 5V, VMAIN = 14V, VGON = 25V, VGOFF = -10V, TA = +25°C, unless otherwise noted.) GATE-OFF REGULATOR LOAD REGULATION GATE-OFF REGULATOR LINE REGULATION 0 VOLTAGE ERROR (%) 0.2 0 -0.2 -0.4 -0.6 POWER-UP SEQUENCE MAX8795A toc12 MAX8795A toc11 0.2 MAX8795A toc10 0.4 VOLTAGE ERROR (%) A 0V -0.2 B -0.4 0V 0V -0.6 C D -0.8 -0.8 INEG = 50mA -16 IBOOST = 0mA -1.0 -1.0 -14 -12 0V 0 -10 10 20 30 40 50 4ms/div A: VMAIN, 10V/div B: VPOS, 20V/div LOAD CURRENT (mA) INPUT VOLTAGE (V) C: VNEG, 10V/div D: VCOM, 20V/div OPERATIONAL-AMPLIFIER RAIL-TO-RAIL INPUT/OUTPUT SUP SUPPLY CURRENT vs. SUP VOLTAGE MAX8795A toc14 MAX8795A toc13 3.6 3.5 VSUP = 15V 3.4 ISUP (mA) MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers A 3.3 3.2 0V 3.1 B 3.0 2.9 0V 2.8 6 8 10 12 VSUP (V) 12 14 16 18 4µs/div A: INPUT SIGNAL, 5V/div B: OUTPUT SIGNAL, 5V/div ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers OPERATIONAL-AMPLIFIER LARGE-SIGNAL RESPONSE OPERATIONAL-AMPLIFIER LOAD-TRANSIENT RESPONSE MAX8795A toc15 OPERATIONAL-AMPLIFIER SMALL-SIGNAL RESPONSE MAX8795A toc16 MAX8795A toc17 VSUP = 15V A 0V A A 0V 0V +50mA B 0mA B B 0V -50mA 0V 1µs/div 400ns/div A: OUTPUT VOLTAGE, 1V/div, AC-COUPLED B: OUTPUT CURRENT, 50mA/div 400ns/div A: INPUT SIGNAL, 5V/div B: OUTPUT SIGNAL, 5V/div A: INPUT SIGNAL, 100mV/div B: OUTPUT SIGNAL, 100mV/div Pin Description PIN NAME FUNCTION 1 SRC Switch Input. Source of the internal high-voltage p-channel MOSFET. Bypass SRC to PGND with a minimum 0.1µF capacitor close to the pins. 2 REF Reference Bypass Terminal. Bypass REF to AGND with a minimum of 0.22µF close to the pins. 3 AGND Analog Ground for Step-Up Regulator and Linear Regulators. Connect to power ground (PGND) underneath the IC. 4 PGND Power Ground. PGND is the source of the main step-up n-channel power MOSFET. Connect PGND to the output-capacitor ground terminals through a short, wide PCB trace. Connect to analog ground (AGND) underneath the IC. 5 OUT1 Operational-Amplifier 1 Output 6 NEG1 Operational-Amplifier 1 Inverting Input 7 POS1 Operational-Amplifier 1 Noninverting Input 8 OUT2 Operational-Amplifier 2 Output 9 NEG2 Operational-Amplifier 2 Inverting Input 10 POS2 Operational-Amplifier 2 Noninverting Input 11 BGND Analog Ground for Operational Amplifiers. Connect to power ground (PGND) underneath the IC. 12 POS3 Operational-Amplifier 3 Noninverting Input 13 OUT3 Operational-Amplifier 3 Output 14 SUP Operational-Amplifier Power Input. Positive supply rail for the operational amplifiers. Typically connected to VMAIN. Bypass SUP to BGND with a 0.1µF capacitor. 15 POS4 Operational-Amplifier 4 Noninverting Input 16 NEG4 Operational-Amplifier 4 Inverting Input ______________________________________________________________________________________ 13 MAX8795A Typical Operating Characteristics (continued) (Circuit of Figure 1, VIN = 5V, VMAIN = 14V, VGON = 25V, VGOFF = -10V, TA = +25°C, unless otherwise noted.) TFT-LCD DC-DC Converter with Operational Amplifiers MAX8795A Pin Description (continued) 14 PIN NAME FUNCTION 17 OUT4 Operational-Amplifier 4 Output 18 POS5 Operational-Amplifier 5 Noninverting Input 19 NEG5 Operational-Amplifier 5 Inverting Input 20 OUT5 Operational-Amplifier 5 Output 21 LX n-Channel Power MOSFET Drain and Switching Node. Connect the inductor and Schottky diode to LX and minimize the trace area for lowest EMI. 22 IN Supply Voltage Input. IN can range from 2.5V to 6V. 23 FB Step-Up Regulator Feedback Input. Regulates to 1.233V (nominal). Connect a resistive voltage-divider from the output (VMAIN) to FB to analog ground (AGND). Place the divider within 5mm of FB. 24 COMP 25 FBP Gate-On Linear-Regulator Feedback Input. FBP regulates to 1.25V (nominal). Connect FBP to the center of a resistive voltage-divider between the regulator output and AGND to set the gate-on linearregulator output voltage. Place the resistive voltage-divider within 5mm of FBP. 26 DRVP Gate-On Linear-Regulator Base Drive. Open drain of an internal n-channel MOSFET. Connect DRVP to the base of an external pnp pass transistor. See the Pass-Transistor Selection section. 27 FBN 28 DRVN 29 DEL High-Voltage Switch Delay Input. Connect a capacitor from DEL to AGND to set the high-voltage switch startup delay. 30 CTL High-Voltage Switch Control Input. When CTL is high, the high-voltage switch between COM and SRC is on and the high-voltage switch between COM and DRN is off. When CTL is low, the high-voltage switch between COM and SRC is off and the high-voltage switch between COM and DRN is on. CTL is inhibited by the undervoltage lockout or when the voltage on DEL is less than 1.25V. 31 DRN Switch Input. Drain of the internal high-voltage back-to-back p-channel MOSFETs connected to COM. 32 COM Internal High-Voltage MOSFET Switch Common Terminal. Do not allow the voltage on COM to exceed VSRC. — EP Step-Up Regulator Error-Amplifier Compensation Point. Connect a series RC from COMP to AGND. See the Loop Compensation section for component selection guidelines. Gate-Off Linear-Regulator Feedback Input. FBN regulates to 250mV (nominal). Connect FBN to the center of a resistive voltage-divider between the regulator output and REF to set the gate-off linearregulator output voltage. Place the resistive voltage-divider within 5mm of FBN. Gate-Off Linear-Regulator Base Drive. Open drain of an internal p-channel MOSFET. Connect DRVN to the base of an external npn pass transistor. See the Pass-Transistor Selection section. Exposed Paddle. Must be connected to AGND. Do not use as the only ground connection. ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers -10V gate-driver supplies. The input voltage range for the IC is from +2.5V to +5.5V. The listed load currents in Figure 1 are available from a +4.5V to +5.5V supply. Table 1 lists some recommended components, and Table 2 lists the contact information of component suppliers. The MAX8795A typical operating circuit (Figure 1) is a complete power-supply system for TFT LCDs. The circuit generates a +14V source-driver supply and +25V and LX L1 3.0µH VIN 4.5V TO 5.5V C1 22µF D1 R10 10Ω R1 137kΩ 1% LX IN COMP C10 0.1µF VGOFF -10V/50mA C14 68pF R3 6.8kΩ MAX8795A DRVP Q2 R7 324kΩ 1% FBP R4 191kΩ 1% R5 10.0kΩ 1% R8 31.6kΩ 1% C5 0.47µF SRC COM REF C8 0.22µF VGON 25V/20mA DRN R6 1kΩ CTL DEL SUP C7 0.033µF C6 0.1µF BGND NEG1 R19 100kΩ OUT1 NEG2 TO VCOM BACKPLANE Q1 DRVN FBN C9 0.22µF D2 PGND R9 6.8kΩ D3 C4 0.1µF AGND C12 220µF C11 0.1µF C3 0.1µF R2 13.3kΩ 1% 180kΩ LX LX FB C13 0.1µF VMAIN 14V/500mA C2 22µF OUT2 POS1 OUT3 POS2 NEG4 POS3 OUT4 POS4 R17 100kΩ OUT5 EP R13 100kΩ R11 100kΩ R12 100kΩ POS5 NEG5 R15 100kΩ R20 100kΩ R18 100kΩ R16 100kΩ R14 100kΩ Figure 1. Typical Operating Circuit Table 1. Component List DESIGNATION DESCRIPTION DESIGNATION DESCRIPTION C1 22µF, 6.3V X5R ceramic capacitor (1210) TDK C3225X5R0J227M L1 3.0µH, 3A inductor Sumida CDRH6D28-3R0 C2 22µF, 16V X5R ceramic capacitor (1812) TDK C4532X5X1C226M Q1 200mA, 40V pnp bipolar transistor (SOT23) Fairchild MMBT3906 D1 3A, 30V Schottky diode (M-flat) Toshiba CMS02 Q2 200mA, 40V npn bipolar transistor (SOT23) Fairchild MMBT3904 D2, D3 200mA, 100V, dual ultra-fast diodes (SOT23) Fairchild MMBD4148SE ______________________________________________________________________________________ 15 MAX8795A Typical Operating Circuit MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers Table 2. Component Suppliers SUPPLIER Fairchild Sumida TDK Toshiba PHONE 408-822-2000 847-545-6700 847-803-6100 949-455-2000 VCN FAX 408-822-2102 847-545-6720 847-390-4405 949-859-3963 Detailed Description VCP VIN The MAX8795A contains a high-performance step-up switching regulator, two low-cost linear-regulator controllers, multiple high-current operational amplifiers, and startup timing and level-shifting functionality useful for active-matrix TFT LCDs. Figure 2 shows the MAX8795A functional diagram. VMAIN LX IN WEBSITE www.fairchildsemi.com www.sumida.com www.component.tdk.com www.toshiba.com/taec FB STEP-UP CONTROLLER Main Step-Up Regulator PGND COMP AGND VCP MAX8795A DRVP GATE-ON CONTROLLER FBP VGON SRC DEL COM SWITCH CONTROL CTL VCN DRN DRVN GATE-OFF CONTROLLER SUP VGOFF NEG1 FBN OUT1 REF NEG2 REF NEG4 OP2 OP4 POS2 OUT4 POS4 NEG5 OUT3 OP5 OP3 POS3 OUT5 POS5 EP BGND Figure 2. MAX8795A Functional Diagram 16 V −V D ≈ MAIN IN VMAIN OP1 POS1 OUT2 The main step-up regulator employs a current-mode, fixed-frequency PWM architecture to maximize loop bandwidth and provide fast transient response to pulsed loads typical of TFT-LCD panel source drivers. The 1.2MHz switching frequency allows the use of lowprofile inductors and ceramic capacitors to minimize the thickness of LCD panel designs. The integrated high-efficiency MOSFET and the IC’s built-in digital soft-start functions reduce the number of external components required while controlling inrush currents. The output voltage can be set from VIN to 18V with an external resistive voltage-divider. The regulator controls the output voltage and the power delivered to the output by modulating the duty cycle (D) of the internal power MOSFET in each switching cycle. The duty cycle of the MOSFET is approximated by: Figure 3 shows the functional diagram of the step-up regulator. An error amplifier compares the signal at FB to 1.233V and changes the COMP output. The voltage at COMP sets the peak inductor current. As the load varies, the error amplifier sources or sinks current to the COMP output accordingly to produce the inductor peak current necessary to service the load. To maintain stability at high duty cycles, a slope-compensation signal is summed with the current-sense signal. On the rising edge of the internal clock, the controller sets a flip-flop, turning on the n-channel MOSFET and applying the input voltage across the inductor. The current through the inductor ramps up linearly, storing energy in its magnetic field. Once the sum of the current-feedback signal and the slope compensation exceeds the COMP ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers RESET DOMINANT CLOCK S R pnp PASS TRANSISTOR DRVP PGND Q npn CASCODE TRANSISTOR ILIM COMPARATOR VGON MAX8795A SOFTSTART VLIMIT FBP SLOPE COMP PWM COMPARATOR Σ CURRENT SENSE Figure 4. Using Cascoded npn for Charge-Pump Output Voltages > 36V OSCILLATOR FAULT COMPARATOR LX 0.1µF TO FAULT LATCH 1.14V VMAIN 14V ERROR AMP FB 0.1µF 68pF 1.233V COMP 6.8kΩ Q1 DRVP VGON 35V Figure 3. Step-Up Regulator Functional Diagram voltage, the controller resets the flip-flop and turns off the MOSFET. Since the inductor current is continuous, a transverse potential develops across the inductor that turns on the diode (D1). The voltage across the inductor then becomes the difference between the output voltage and the input voltage. This discharge condition forces the current through the inductor to ramp back down, transferring the energy stored in the magnetic field to the output capacitor and the load. The MOSFET remains off for the rest of the clock cycle. Gate-On Linear-Regulator Controller, REG P The gate-on linear-regulator controller (REG P) is an analog gain block with an open-drain n-channel output. It drives an external pnp pass transistor with a 6.8kΩ base-to-emitter resistor (Figure 1). Its guaranteed basedrive sink current is at least 1mA. The regulator including Q1 in Figure 1 uses a 0.47µF ceramic output capacitor and is designed to deliver 20mA at 25V. Other output voltages and currents are possible with the proper pass transistor and output capacitor. See the Pass-Transistor Selection and Stability Requirements sections. MAX8795A 0.22µF 0.47µF 47pF 274kΩ 1% 150pF 10.2kΩ 1% FBP Figure 5. The linear regulator controls the intermediate chargepump stage. REG P is typically used to provide the TFT-LCD gate drivers’ gate-on voltage. Use a charge pump with as many stages as necessary to obtain a voltage exceeding the required gate-on voltage (see the Selecting the Number of Charge-Pump Stages section). Note the voltage rating of DRVP is 36V. If the charge-pump output voltage can exceed 36V, an external cascode npn transistor should be added as shown in Figure 4. Alternately, the linear regulator can control an intermediate charge-pump stage while regulating the final charge-pump output (Figure 5). ______________________________________________________________________________________ 17 MAX8795A FROM CHARGE-PUMP OUTPUT VMAIN LX MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers REG P is enabled after the REF voltage exceeds 1.0V. Each time it is enabled, the controller goes through a soft-start routine that ramps up its internal reference DAC in 128 steps. Gate-Off Linear-Regulator Controller, REG N The gate-off linear-regulator controller (REG N) is an analog gain block with an open-drain p-channel output. It drives an external npn pass transistor with a 6.8kΩ base-to-emitter resistor (Figure 1). Its guaranteed basedrive source current is at least 1mA. The regulator including Q2 in Figure 1 uses a 0.47µF ceramic output capacitor and is designed to deliver 50mA at -10V. Other output voltages and currents are possible with the proper pass transistor and output capacitor (see the PassTransistor Selection and Stability Requirements sections). REG N is typically used to provide the TFT-LCD gate drivers’ gate-off voltage. A negative voltage can be produced using a charge-pump circuit as shown in Figure 1. REG N is enabled after the voltage on REF exceeds 1.0V. Each time it is enabled, the control goes through a soft-start routine that ramps down its internal reference DAC from VREF to 250mV in 128 steps. Operational Amplifiers The MAX8795A has five operational amplifiers. The operational amplifiers are typically used to drive the LCD backplane (VCOM) or the gamma-correction divider string. They feature ±130mA output short-circuit current, 45V/µs slew rate, and 20MHz/3dB bandwidth. The rail-to-rail input and output capability maximizes system flexibility. Short-Circuit Current Limit and Input Clamp The operational amplifiers limit short-circuit current to approximately ±130mA if the output is directly shorted to SUP or to BGND. If the short-circuit condition persists, the junction temperature of the IC rises until it reaches the thermal-shutdown threshold (+160°C typ). Once the junction temperature reaches the thermal-shutdown threshold, an internal thermal sensor immediately sets the thermal fault latch, shutting off all the IC’s outputs. The device remains inactive until the input voltage is cycled. The operational amplifiers have 4V input clamp structures in series with a 500Ω resistance and a diode (Figure 2). Driving Pure Capacitive Load The operational amplifiers are typically used to drive the LCD backplane (VCOM) or the gamma-correction divider string. The LCD backplane consists of a distributed series capacitance and resistance, a load that can be easily driven by the operational amplifier. However, if the operational amplifier is used in an application with a pure capacitive load, steps must be taken to ensure stable operation. 18 As the operational amplifier’s capacitive load increases, the amplifier’s bandwidth decreases and gain peaking increases. A 5Ω to 50Ω small resistor placed between OUT_ and the capacitive load reduces peaking, but also reduces the gain. An alternative method of reducing peaking is to place a series RC network (snubber) in parallel with the capacitive load. The RC network does not continuously load the output or reduce the gain. Typical values of the resistor are between 100Ω and 200Ω, and the typical value of the capacitor is 10nF. Undervoltage Lockout (UVLO) The UVLO circuit compares the input voltage at IN with the UVLO threshold (2.25V rising, 2.20V falling, typ) to ensure the input voltage is high enough for reliable operation. The 50mV (typ) hysteresis prevents supply transients from causing a restart. Once the input voltage exceeds the UVLO rising threshold, startup begins. When the input voltage falls below the UVLO falling threshold, the controller turns off the main step-up regulator, turns off the linearregulator outputs, and disables the switch control block; the operational-amplifier outputs are high impedance. Reference Voltage (REF) The reference output is nominally 1.25V and can source at least 50µA (see the Typical Operating Characteristics). Bypass REF with a 0.22µF ceramic capacitor connected between REF and AGND. Power-Up Sequence and Soft-Start Once the voltage on IN exceeds approximately 2.25V, the reference turns on. With a 0.22µF REF bypass capacitor, the reference reaches its regulation voltage of 1.25V in approximately 1ms. When the reference voltage exceeds 1.0V, the IC enables the main step-up regulator, the gateon linear-regulator controller, and the gate-off linear-regulator controller simultaneously. The IC employs soft-start for each regulator to minimize inrush current and voltage overshoot and to ensure a welldefined startup behavior. Each output uses a 7-bit soft-start DAC. For the step-up and the gate-on linear regulator, the DAC output is stepped in 128 steps from zero up to the reference voltage. For the gate-off linear regulator, the DAC output steps from the reference down to 250mV in 128 steps from zero up to the reference voltage. For the gateoff linear regulator’s voltage ramp soft-start, the DAC output steps from the reference down to 250mV in 128 steps. The soft-start duration is 14ms (typ) for all three regulators, and DEL remains pulled down to AGND during the soft start period. Once the main step-up regulator, the gate-on linear-regulator controller, and the gate-off linear-regulator controller reach regulation, a 5µA current source starts charging ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers VREF 1.05V VMAIN VGON CDEL = DELAY _ TIME × I6µA 1.25V Switch-Control Block 12ms 1.25V INPUT SOFT- SOFTVOLTAGE START START OK BEGINS ENDS SWITCH CONTROL ENABLED VGOFF VDEL The switch-control input (CTL) is not activated until all four of the following conditions are satisfied: the input voltage exceeds VUVLO, the soft-start routine of all the regulators is complete, there is no fault condition detected, and VDEL exceeds its turn-on threshold. Once activated and if CTL is high, the 5Ω internal p-channel switch (Q1) between COM and SRC turns on and the Figure 6. Power-Up Sequence IN MAX8795A 5µA 2.25V FB OK FBP OK FBN OK Q1 SRC DEL REF COM Q2 CTL DRN Figure 7. Switch-Control Block ______________________________________________________________________________________ 19 MAX8795A VIN 2.25V CDEL. Once the CDEL capacitor voltage exceeds 1.25V (typ), the switch-control block is and op amps are enabled as shown in Figure 6. After the switch-control block is enabled, COM can be connected to SRC or DRN through the internal p-channel switches, depending upon the state of CTL. Before startup and when IN is less than VUVLO, DEL is internally connected to AGND to discharge CDEL. Select CDEL to set the initial start-up delay and the switch-control block startup delay times using the following equation: MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers 30Ω p-channel switch (Q2) between DRN and COM turns off. If CTL is low, Q1 turns off and Q2 turns on. Fault Protection During steady-state operation, if the output of the main regulator or any of the linear-regulator outputs does not exceed its respective fault-detection threshold, the MAX8795A activates an internal fault timer. If any condition or combination of conditions indicates a continuous fault for the fault-timer duration (200ms typ), the MAX8795A sets the fault latch to shut down all the outputs except the reference. Once the fault condition is removed, cycle the input voltage (below the UVLO falling threshold) to clear the fault latch and reactivate the device. The faultdetection circuit is disabled during the soft-start time. Thermal-Overload Protection Thermal-overload protection prevents excessive power dissipation from overheating the MAX8795A. When the junction temperature exceeds +160°C, a thermal sensor immediately activates the fault protection, which shuts down all outputs except the reference, allowing the device to cool down. Once the device cools down by approximately 15°C, cycle the input voltage (below the UVLO falling threshold) to clear the fault latch and reactivate the device. The thermal-overload protection protects the controller in the event of fault conditions. For continuous operation, do not exceed the absolute maximum junction temperature rating of +150°C. Design Procedure Main Step-Up Regulator Inductor Selection The minimum inductance value, peak current rating, and series resistance are factors to consider when selecting the inductor. These factors influence the converter’s efficiency, maximum output load capability, transient-response time, and output voltage ripple. Size and cost are also important factors to consider. The maximum output current, input voltage, output voltage, and switching frequency determine the inductor value. Very high inductance values minimize the current ripple, and therefore, reduce the peak current, which decreases core losses in the inductor and conduction losses in the entire power path. However, large inductor values also require more energy storage and more turns of wire, which increase size and can increase conduction losses in the inductor. Low inductance values decrease the size, but increase the current ripple and peak current. Finding the best inductor involves choosing the best compromise between circuit efficiency, inductor size, and cost. The equations used here include a constant LIR, which is the ratio of the inductor peak-to-peak ripple current to the 20 average DC inductor current at the full load current. The best trade-off between inductor size and circuit efficiency for step-up regulators generally has an LIR between 0.3 and 0.6. However, depending on the AC characteristics of the inductor core material and ratio of inductor resistance to other power-path resistances, the best LIR can shift up or down. If the inductor resistance is relatively high, more ripple can be accepted to reduce the number of turns required and increase the wire diameter. If the inductor resistance is relatively low, increasing inductance to lower the peak current can decrease losses throughout the power path. If extremely thin high-resistance inductors are used, as is common for LCD-panel applications, the best LIR can increase to between 0.5 and 1.0. Once a physical inductor is chosen, higher and lower values of the inductor should be evaluated for efficiency improvements in typical operating regions. Calculate the approximate inductor value using the typical input voltage (VIN), the maximum output current (IMAIN(MAX)), the expected efficiency (ηTYP) taken from an appropriate curve in the Typical Operating Characteristics section, and an estimate of LIR based on the above discussion: ⎞⎛ η ⎛ V ⎞ 2⎛ VMAIN − VIN TYP ⎞ L = ⎜ IN ⎟ ⎜ ⎟ ⎟ ⎜⎝ ⎠ V I f LIR × ⎝ MAIN ⎠ ⎝ MAIN(MAX) OSC ⎠ Choose an available inductor value from an appropriate inductor family. Calculate the maximum DC input current at the minimum input voltage (VIN(MIN)) using conservation of energy and the expected efficiency at that operating point (ηMIN) taken from the appropriate curve in the Typical Operating Characteristics: IIN(DCMAX , )= IMAIN(MAX) × VMAIN VIN(MIN) × ηMIN Calculate the ripple current at that operating point and the peak current required for the inductor: IRIPPLE = VIN(MIN) × (VMAIN − VIN(MIN) ) L × VMAIN × fOSC IRIPPLE IPEAK = IIN(DCMAX , )+ 2 The inductor’s saturation current rating and the MAX8795A’s LX current limit (ILIM) should exceed IPEAK, and the inductor’s DC current rating should exceed IIN(DC,MAX). For good efficiency, choose an inductor with less than 0.1Ω series resistance. Considering the typical operating circuit, the maximum load current (IMAIN(MAX)) is 500mA with a 14V output and ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers be tolerated on CIN if IN is decoupled from CIN using an RC lowpass filter (see R10 and C13 in Figure 1). ⎛ 5V ⎞ 2 ⎛ 14V − 5V ⎞ ⎛ 0.85 ⎞ L=⎜ ⎟ ⎜ ⎟⎜ ⎟ ≈ 3.3µH ⎝ 14V ⎠ ⎝ 0.5A × 1.2 MHz ⎠ ⎝ 0.5 ⎠ Rectifier Diode The MAX8795A’s high switching frequency demands a high-speed rectifier. Schottky diodes are recommended for most applications because of their fast recovery time and low forward voltage. In general, a 2A Schottky diode complements the internal MOSFET well. Using the circuit’s minimum input voltage (4.5V) and estimating efficiency of 80% at that operating point: 0.5A × 14V I IN(DCMAX ≈ 1.94A , )= 4.5V × 0.8 The ripple current and the peak current are: 4.5V × (14V − 4.5V) I RIPPLE = ≈ 0.77A 3.3µH × 14V × 1.2 MHz 0.77A I PEAK = 1.94A + ≈ 2.33A 2 Output-Capacitor Selection The total output voltage ripple has two components: the capacitive ripple caused by the charging and discharging of the output capacitance, and the ohmic ripple due to the capacitor’s equivalent series resistance (ESR): VRIPPLE = VRIPPLE(C) + VRIPPLE(ESR) ⎛V I − VIN ⎞ VRIPPLE(C) ≈ MAIN ⎜ MAIN COUT ⎝ VMAINfOSC ⎟⎠ and : VRIPPLE(ESR) ≈ IPEAKR ESR(COUT) where IRIPPLE is the RIPPLE inductor current (see the Inductor Selection section). For ceramic capacitors, the output voltage ripple is typically dominated by VRIPPLE(C). The voltage rating and temperature characteristics of the output capacitor must also be considered. Input-Capacitor Selection The input capacitor (CIN) reduces the current peaks drawn from the input supply and reduces noise injection into the IC. A 22µF ceramic capacitor is used in the typical applications circuit (Figure 1) because of the high source impedance seen in typical lab setups. Actual applications usually have much lower source impedance since the step-up regulator often runs directly from the output of another regulated supply. Typically, CIN can be reduced below the values used in the typical applications circuit. Ensure a low-noise supply at IN by using adequate CIN. Alternately, greater voltage variation can Output-Voltage Selection The output voltage of the main step-up regulator can be adjusted by connecting a resistive voltage-divider from the output (VMAIN) to AGND with the center tap connected to FB (see Figure 1). Select R2 in the 10kΩ to 50kΩ range. Calculate R1 with the following equation: ⎛V ⎞ R1 = R2 × ⎜ MAIN − 1⎟ ⎝ VFB ⎠ where VFB, the step-up regulator’s feedback set point, is 1.233V. Place R1 and R2 close to the IC. Loop Compensation Choose RCOMP to set the high-frequency integrator gain for fast transient response. Choose CCOMP to set the integrator zero to maintain loop stability. For low-ESR output capacitors, use the following equations to obtain stable performance and good transient response: RCOMP ≈ 253 × VIN × VOUT × COUT L × I MAIN(MAX) CCOMP ≈ VOUT × COUT 10 × I MAIN(MAX) × RCOMP To further optimize transient response, vary RCOMP in 20% steps and CCOMP in 50% steps while observing transient-response waveforms. Charge Pumps Selecting the Number of Charge-Pump Stages For highest efficiency, always choose the lowest number of charge-pump stages that meet the output requirement. Figures 8 and 9 show the positive and negative charge-pump output voltages for a given VMAIN for one-, two-, and three-stage charge pumps. ______________________________________________________________________________________ 21 MAX8795A a typical input voltage of 5V. Choosing an LIR of 0.5 and estimating efficiency of 85% at this operating point: The number of positive charge-pump stages is given by: V +V −V nPOS = GON DROPOUT MAIN VMAIN − 2 × VD where nPOS is the number of positive charge-pump stages, VGON is the gate-on linear-regulator REG P output, VMAIN is the main step-up regulator output, VD is 60 VD = 0.3V TO 1V 3-STAGE CHARGE PUMP 50 G_ON (V) 40 2-STAGE CHARGE PUMP 30 20 10 1-STAGE CHARGE PUMP 0 2 4 6 8 10 12 14 VMAIN (V) Figure 8. Positive Charge-Pump Output Voltage vs. VMAIN NEGATIVE CHARGE-PUMP OUTPUT VOLTAGE vs. VMAIN -0 1-STAGE CHARGE PUMP -5 -10 -15 -20 2-STAGE CHARGE PUMP -25 -30 3-STAGE CHARGE PUMP -35 -40 VD = 0.3V TO 1V 4 6 nNEG = −VGOFF + VDROPOUT VMAIN − 2 × VD V +V +V nPOS = GON DROPOUT IN VMAIN − 2 × VD −V + VDROPOUT + VIN nNEG = GOFF VMAIN − 2 × VD Flying Capacitors Increasing the flying-capacitor (CX) value lowers the effective source impedance and increases the outputcurrent capability. Increasing the capacitance indefinitely has a negligible effect on output-current capability because the internal switch resistance and the diode impedance place a lower limit on the source impedance. A 0.1µF ceramic capacitor works well in most low-current applications. The flying capacitor’s voltage rating must exceed the following: VCX > n × VMAIN -45 2 the forward-voltage drop of the charge-pump diode, and VDROPOUT is the dropout margin for the linear regulator. Use VDROPOUT = 0.3V. The number of negative charge-pump stages is given by: where nNEG is the number of negative charge-pump stages, VGOFF is the gate-off linear-regulator REG N output, VMAIN is the main step-up regulator output, VD is the forward-voltage drop of the charge-pump diode, and VDROPOUT is the dropout margin for the linear regulator. Use VDROPOUT = 0.3V. The above equations are derived based on the assumption that the first stage of the positive charge pump is connected to VMAIN and the first stage of the negative charge pump is connected to ground. Sometimes fractional stages are more desirable for better efficiency. This can be done by connecting the first stage to VIN or another available supply. If the first charge-pump stage is powered from VIN, the above equations become: POSITIVE CHARGE-PUMP OUTPUT VOLTAGE vs. VMAIN G_OFF (V) MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers 8 10 12 14 where n is the stage number in which the flying capacitor appears, and VMAIN is the output voltage of the main step-up regulator. VMAIN (V) Figure 9. Negative Charge-Pump Output Voltage vs. VMAIN 22 ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers COUT _ CP ≥ ILOAD _ CP 2fOSC VRIPPLE _ CP where COUT_CP is the output capacitor of the charge pump, I LOAD_CP is the load current of the charge pump, and VRIPPLE_CP is the peak-to-peak value of the output ripple. Charge-Pump Rectifier Diodes Use low-cost silicon switching diodes with a current rating equal to or greater than two times the average charge-pump input current. If it helps avoid an extra stage, some or all of the diodes can be replaced with Schottky diodes with an equivalent current rating. Linear-Regulator Controllers Output-Voltage Selection Adjust the gate-on linear-regulator (REG P) output voltage by connecting a resistive voltage-divider from the REG P output to AGND with the center tap connected to FBP (Figure 1). Select the lower resistor of the divider R5 in the range of 10kΩ to 30kΩ. Calculate the upper resistor R4 with the following equation: ⎛V ⎞ R4 = R5 × ⎜ GON − 1⎟ V ⎝ FBP ⎠ where VFBP = 1.25V (typ). Adjust the gate-off linear-regulator REG N output voltage by connecting a resistive voltage-divider from VGOFF to REF with the center tap connected to FBN (Figure 1). Select R8 in the 20kΩ to 50kΩ range. Calculate R7 with the following equation: voltage, and power dissipation. The transistor’s current gain limits the guaranteed maximum output current to: ⎛ V ⎞ ILOAD(MAX) = ⎜ IDRV − BE ⎟ × hFE(MIN) RBE ⎠ ⎝ where IDRV is the minimum guaranteed base-drive current, VBE is the transistor’s base-to-emitter forward voltage drop, and RBE is the pullup resistor connected between the transistor’s base and emitter. Furthermore, the transistor’s current gain increases the linear regulator’s DC loop gain (see the Stability Requirements section), so excessive gain destabilizes the output. Therefore, transistors with current gain over 100 at the maximum output current can be difficult to stabilize and are not recommended unless the high gain is needed to meet the load-current requirements. The transistor’s saturation voltage at the maximum output current determines the minimum input-to-output voltage differential that the linear regulator can support. Also, the package’s power dissipation limits the usable maximum input-to-output voltage differential. The maximum power-dissipation capability of the transistor’s package and mounting must exceed the actual power dissipated in the device. The power dissipated equals the maximum load current (ILOAD(MAX)_LR) multiplied by the maximum input-to-output voltage differential: P = ILOAD(MAX)_ LR × (VIN(MAX)_ LR − VOUT _ LR ) where VIN(MAX)_LR is the maximum input voltage of the linear regulator, and VOUT_LR is the output voltage of the linear regulator. Stability Requirements The MAX8795A linear-regulator controllers use an internal transconductance amplifier to drive an external pass transistor. The transconductance amplifier, the pass transistor, the base-emitter resistor, and the output capacitor determine the loop stability. The following applies to both linear-regulator controllers in the MAX8795A. V −V R7 = R8 × FBN GOFF VREF − VFBN The transconductance amplifier regulates the output voltage by controlling the pass transistor’s base current. The total DC loop gain is approximately: where VFBN = 250mV, VREF = 1.25V. Note that REF can only source up to 50µA; using a resistor less than 20kΩ for R8 results in higher bias current than REF can supply. ⎛ 10 ⎞ ⎡ ⎛ I ×h ⎞⎤ A V _ LR ≅ ⎜ ⎟ × ⎢1 + ⎜ BIAS FE ⎟ ⎥ × VREF ⎝ VT ⎠ ⎢⎣ ⎝ ILOAD _ LR ⎠ ⎥⎦ Pass-Transistor Selection The pass transistor must meet specifications for current gain (hFE), input capacitance, collector-emitter saturation where VT is 26mV at room temperature, and IBIAS is the current through the base-to-emitter resistor (RBE). For the MAX8795A, the bias currents for both the gate-on ______________________________________________________________________________________ 23 MAX8795A Charge-Pump Output Capacitor Increasing the output capacitance or decreasing the ESR reduces the output ripple voltage and the peak-topeak transient voltage. With ceramic capacitors, the output voltage ripple is dominated by the capacitance value. Use the following equation to approximate the required capacitor value: MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers and gate-off linear-regulator controllers are 0.1mA. Therefore, the base-to-emitter resistor for both linear regulators should be chosen to set 0.1mA bias current: RBE = 0.7V VBE = ≈ 6.8kΩ 0.1mA 0.1mA The output capacitor and the load resistance create the dominant pole in the system. However, the internal amplifier delay, pass transistor’s input capacitance, and the stray capacitance at the feedback node create additional poles in the system, and the output capacitor’s ESR generates a zero. For proper operation, use the following equations to verify the linear regulator is properly compensated: 1) First, determine the dominant pole set by the linear regulator’s output capacitor and the load resistor: I LOAD(MAX)_ LR fPOLE _ LR = 2π × COUT _ LR × VOUT _ LR The unity-gain crossover of the linear regulator is: fCROSSOVER = AV_LR  fPOLE_LR 2) The pole created by the internal amplifier delay is approximately 1MHz: fPOLE_AMP = 1MHz 3) Next, calculate the pole set by the transistor’s input capacitance, the transistor’s input resistance, and the base-to-emitter pullup resistor: fPOLE _ IN = 1 2π × CIN × (RBE || RIN ) fPOLE _ FB = 1 2π × CFB × (RUPPER || RLOWER ) where CFB is the capacitance between FB_ and AGND, RUPPER is the upper resistor of the linear regulator’s feedback divider, and RLOWER is the lower resistor of the divider. 5) Next, calculate the zero caused by the output capacitor’s ESR: fPOLE _ ESR = 1 2π × COUT _ LR × RESR where RESR is the equivalent series resistance of COUT_LR. To ensure stability, choose COUT_LR large enough so the crossover occurs well before the poles and zero calculated in steps 2 to 5. The poles in steps 3 and 4 generally occur at several megahertz, and using ceramic capacitors ensures the ESR zero occurs at several megahertz as well. Placing the crossover below 500kHz is sufficient to avoid the amplifier-delay pole and generally works well, unless unusual component choices or extra capacitances move one of the other poles or the zero below 1MHz. Applications Information Power Dissipation where : g h CIN = m , RIN = FE 2πfT gm gm is the transconductance of the pass transistor, and fT is the transition frequency. Both parameters can be found in the transistor’s data sheet. Because RBE is much greater than RIN, the above equation can be simplified: fPOLE _ IN = 1 2π × CIN × RIN Substituting for CIN and RIN yields: f fPOLE _ IN = T hFE 24 4) Next, calculate the pole set by the linear regulator’s feedback resistance and the capacitance between FB_ and AGND (including stray capacitance): An IC’s maximum power dissipation depends on the thermal resistance from the die to the ambient environment and the ambient temperature. The thermal resistance depends on the IC package, PCB copper area, other thermal mass, and airflow. The MAX8795A, with its exposed backside paddle soldered to 1in2 of PCB copper and a large internal ground plane layer, can dissipate approximately 2.76W into +70°C still air. More PCB copper, cooler ambient air, and more airflow increase the possible dissipation, while less copper or warmer air decreases the IC’s dissipation capability. The major components of power dissipation are the power dissipated in the step-up regulator and the power dissipated by the operational amplifiers. ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers Operational Amplifier The power dissipated in the operational amplifiers depends on their output current, the output voltage, and the supply voltage: PDSOURCE = IOUT _(SOURCE) × (VSUP − VOUT _ ) PDSINK = IOUT _(SINK) × VOUT _ where IOUT_(SOURCE) is the output current sourced by the operational amplifier, and IOUT_(SINK) is the output current that the operational amplifier sinks. In a typical case where the supply voltage is 13V and the output voltage is 6V with an output source current of 30mA, the power dissipated is 180mW. PCB Layout and Grounding Careful PCB layout is important for proper operation. Use the following guidelines for good PCB layout: • Minimize the area of high-current loops by placing the inductor, the output diode, and the output capacitors near the input capacitors and near the LX and PGND pins. The high-current input loop goes from the positive terminal of the input capacitor to the inductor, to the IC’s LX pin, out of PGND, and to the input capacitor’s negative terminal. The highcurrent output loop is from the positive terminal of the input capacitor to the inductor, to the output diode (D1), and to the positive terminal of the output capacitors, reconnecting between the output capacitor and input capacitor ground terminals. Connect these loop components with short, wide connections. Avoid using vias in the high-current paths. If vias are unavoidable, use many vias in parallel to reduce resistance and inductance. • Create a power-ground island (PGND) consisting of the input and output capacitor grounds, PGND pin, and any charge-pump components. Connect all of these together with short, wide traces or a small ground plane. Maximizing the width of the powerground traces improves efficiency and reduces output voltage ripple and noise spikes. Create an analog ground plane (AGND) consisting of the AGND pin, all the feedback-divider ground connections, the operational-amplifier divider ground connections, the COMP and DEL capacitor ground connections, and the device’s exposed backside paddle. Connect the AGND and PGND islands by connecting the PGND pin directly to the exposed backside paddle. Make no other connections between these separate ground planes. • Place all feedback voltage-divider resistors within 5mm of their respective feedback pins. The divider’s center trace should be kept short. Placing the resistors far away causes their FB traces to become antennas that can pick up switching noise. Take care to avoid running any feedback trace near LX or the switching nodes in the charge pumps, or provide a ground shield. • Place the IN pin and REF pin bypass capacitors as close as possible to the device. The ground connection of the IN bypass capacitor should be connected directly to the AGND pin with a wide trace. • Minimize the length and maximize the width of the traces between the output capacitors and the load for best transient responses. • Minimize the size of the LX node while keeping it wide and short. Keep the LX node away from feedback nodes (FB, FBP, and FBN) and analog ground. Use DC traces to shield if necessary. Refer to the MAX8795A evaluation kit for an example of proper PCB layout. Chip Information TRANSISTOR COUNT: 6595 PROCESS: BiCMOS ______________________________________________________________________________________ 25 MAX8795A Step-Up Regulator The largest portions of power dissipation in the step-up regulator are the internal MOSFET, the inductor, and the output diode. If the step-up regulator has 90% efficiency, approximately 3% to 5% of the power is lost in the internal MOSFET, approximately 3% to 4% in the inductor, and approximately 1% in the output diode. The remaining 1% to 3% is distributed among the input and output capacitors and the PCB traces. If the input power is about 5W, the power lost in the internal MOSFET is approximately 150mW to 250mW. TFT-LCD DC-DC Converter with Operational Amplifiers COMP FB IN LX OUT5 NEG5 POS5 OUT4 TOP VIEW 24 23 22 21 20 19 18 17 FBP 25 16 NEG4 DRVP 26 15 POS4 FBN 27 14 SUP DRVN 28 13 OUT3 DEL 29 12 POS3 CTL 30 11 BGND DRN 31 10 POS2 COM 32 9 NEG2 FBP 25 16 NEG4 DRVP 26 15 POS4 FBN 27 14 SUP DRVN 28 13 OUT3 6 7 8 OUT2 5 POS1 REF 4 NEG1 3 OUT1 2 PGND 1 AGND MAX8795A SRC MAX8795A Pin Configurations FB IN LX OUT5 NEG5 POS5 OUT4 TOP VIEW COMP THIN QFN 5mm x 5mm 24 23 22 21 20 19 18 17 MAX8795A 12 POS3 CTL 30 11 BGND DRN 31 10 POS2 9 NEG2 DEL 29 COM 32 1 2 3 4 5 6 7 8 SRC REF AGND PGND OUT1 NEG1 POS1 OUT2 + LQFP 7mm x 7mm 26 ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 32 TQFN T3255+3 21-0140 90-0025 32 LQFP C32+2 21-0054 90-0111 ______________________________________________________________________________________ 27 MAX8795A Package Information MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers Package Information (continued) For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. 28 ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. ______________________________________________________________________________________ 29 MAX8795A Package Information (continued) MAX8795A TFT-LCD DC-DC Converter with Operational Amplifiers Package Information (continued) For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. 30 ______________________________________________________________________________________ TFT-LCD DC-DC Converter with Operational Amplifiers REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 0 4/07 Initial release 1 6/07 Added LQFP package and G temperature grade versions 0 2 12/10 Added TQFN version 3 3/11 Added automotive-qualified part 1 4 6/11 Corrected automotive /V temperature range 1 5 5/12 Added automotive-qualified part 1 1, 2, 6–30 1–10, 27–30 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. 31 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2012 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX8795A Revision History
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