MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
General Description
Features
The MAXQ612/MAXQ622 are low-power, 16-bit MAXQM
S High-Performance, Low-Power, 16-Bit RISC Core
microcontrollers designed for low-power applications
including universal remote controls, consumer electronics, and white goods. Both devices use a lowpower, high-throughput, 16-bit RISC microcontroller.
Serial peripherals include two universal synchronous/
asynchronous receiver-transmitters (USARTs), two SPIK
master/slave communications ports, and an inter-integrated circuit (I2C) bus. The devices also incorporate
an IR module with carrier frequency generation and
flexible port I/O capable of multiplexed keypad control.
The MAXQ622 adds a universal serial bus (USB) with
integrated physical interface (PHY).
S DC to 12MHz Operation Across Entire Operating Range
The MAXQ612/MAXQ622 include 128KB of flash memory
and 6KB of data SRAM. Intellectual property (IP) protection is
provided by a secure memory management unit (MMU) that
supports multiple application privilege levels and protects
code against copying and reverse engineering. Privilege
levels enable vendors to provide libraries and applications to
execute on the MAXQ612/MAXQ622, while limiting access
to only data and code allowed by their privilege level.
For the ultimate in low-power battery-operated performance, the devices include an ultra-low-power stop mode
(0.3FA typical). In this mode, the minimum amount of
circuitry is powered. Wake-up sources include external
interrupts, the power-fail interrupt, and a timer interrupt.
The microcontroller runs from a wide operating voltage of
1.70V to 3.6V, and can also be powered from the USB.
Applications
Remote Controls
Battery-Powered Portable Equipment
Consumer Electronics
Home Appliances
White Goods
Ordering Information/Selector Guide appears at end of
data sheet.
S 1.70V to 3.6V Operating Voltage
S Can Be Powered from Battery (VDD) or USB (VDDB)
S 33 Total Instructions for Simplified Programming
S Three Independent Data Pointers Accelerate Data
Movement with Automatic Increment/Decrement
S Dedicated Pointer for Direct Read from Code Space
S 16-Bit Instruction Word, 16-Bit Data Bus
S 16 x 16-Bit General-Purpose Working Registers
S Secure MMU for Application Partitioning and IP
Protection
S Memory Features
128KB Flash Memory
512-Byte Sectors
20,000 Erase/Write Cycles per Sector
6KB Data SRAM
S USB Features (MAXQ622 Only)
USB 2.0 Full-Speed Compatible
Hardware Receive and Transmit Buffers for High
Throughput
Integrated Full-Speed Transceiver
On-Chip Termination and Pullup Resistors
S Additional Peripherals
Power-Fail Warning
Power-On Reset (POR)/Brownout Reset
Automatic IR Carrier Frequency Generation and
Modulation
Two 16-Bit Programmable Timers/Counters with
Prescaler and Capture/Compare
Two SPI Communication Ports
Two USART Communication Ports
I2C Port
Programmable Watchdog Timer
8kHz Nanopower Ring Oscillator Wake-Up Timer
Up to 56 General-Purpose I/O
S Low Power Consumption
0.3µA (typ), 3µA (max) in Stop Mode
TA = +25NC, Power-Fail Monitor Disabled
4.8mA (typ) at 12MHz, 520µA (typ) at 1MHz in
MAXQ is a registered trademark of Maxim Integrated
Products, Inc. SPI is a trademark of Motorola, Inc.
Active Mode
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
may be simultaneously available through various sales channels. For information about device errata, go to: www.maximintegrated.com/errata.
For pricing, delivery, and ordering information, please contact Maxim Direct at
1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
19-5117; Rev 2; 5/11
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
TABLE OF CONTENTS
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
I2C Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
I2C Bus Controller Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Pin Descriptions—TQFN, LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Pin Descriptions— Bare Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Memory Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Stack Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Utility ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
IR Carrier Generation and Modulation Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Carrier Generation Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
IR Transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
IR Transmit—Independent External Carrier and Modulator Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
IR Receive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Carrier Burst-Count Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
16-Bit Timers/Counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
General-Purpose I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Serial Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
USART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Serial Peripheral Interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
USB Controller (MAXQ622 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
On-Chip Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
ROM Loader . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Loading Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
In-Application Flash Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
In-Circuit Debug and JTAG Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Power-Supply Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Power-Fail Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
2
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
TABLE OF CONTENTS (continued)
Power-Fail Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Applications Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Grounds and Bypassing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Additional Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Development and Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Ordering Information/Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
LIST OF FIGURES
Figure 1. Series Resistors (RS) for Protecting Against High-Voltage Spikes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 2. I2C Bus Controller Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3. On-Chip Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 4. In-Circuit Debugger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 5. Power-Fail Detection During Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 7. Stop Mode Power-Fail Detection with Power-Fail Monitor Disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
LIST OF TABLES
Table 1. Memory Areas and Associated Maximum Privilege Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 2. Watchdog Interrupt Timeout (Sysclk = 12MHz, CD[1:0] = 00) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 3. USART Mode Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 4. Power-Fail Warning Level Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 5. Power-Fail Detection States During Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 7. Stop Mode Power-Fail Detection States with Power-Fail Monitor Disabled . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Maxim Integrated
3
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
ABSOLUTE MAXIMUM RATINGS
Voltage Range on VDD with Respect to GND......-0.3V to +3.6V
Voltage Range on Any Lead with
Respect to GND Except VBUS............... -0.3V to (VDD + 0.5V)
Voltage Range on VBUS with Respect to GND.....-0.3V to +6.0V
Continuous Output Current
Any Single I/O Pin............................................................25mA
All I/O Pins Combined......................................................25mA
Voltage Range on DP, DM with
Respect to GND....................................-0.3V to (VBUS + 0.3V)
Operating Temperature Range.............................. 0NC to +70NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
(VDD = VRST to 3.6V, TA = 0NC to +70NC.) (Note 1)
PARAMETER
Supply Voltage
1.8V Internal Regulator
Power-Fail Warning Voltage for
Supply
SYMBOL
CONDITIONS
MIN
VDD
VRST
VREG18
1.62
TYP
MAX
UNITS
3.6
V
1.8
1.98
V
1.85
V
VPFW
Monitors VDD
(Notes 2, 3, 4)
1.75
1.8
Power-Fail Reset Voltage
VRST
Monitors VDD (Note 5)
1.64
1.67
POR Voltage
VPOR
Monitors VDD
1.0
RAM Data-Retention Voltage
VDRV
(Note 6)
1.0
IDD_1
Sysclk = 12MHz
4.8
5.5
IDD_2
Sysclk = 1MHz (Note 6)
0.52
0.8
Active Current
IS1
Power-Fail Off
(Note 7)
IS2
Power-Fail On
Stop-Mode Current
Current Consumption During
Power Fail
IPFR
(Notes 6, 8, 9)
Current Consumption During
POR
IPOR
(Note 10)
Stop-Mode Resume Time
tON
Power-Fail Monitor Startup
Time
tPFM_ON
1.70
V
1.42
V
V
TA = +25NC
0.3
3
TA = +70NC
2.8
13
TA = +25NC
24
30
TA = +70NC
30
40
[(3 x IS2)
+ ((PCI 3) x (IS1 +
INANO))]/
PCI
(Note 6)
mA
FA
FA
100
nA
375 +
8192
tHFXIN
Fs
150
Fs
Power-Fail Warning Detection
Time
tPFW
Input Low Voltage for IRTX,
IRRX, RESET, and All Port Pins
VIL
VGND
0.3 x VDD
V
Input High Voltage for IRTX,
IRRX, RESET, and All Port Pins
VIH
0.7 x VDD
VDD
V
4
(Notes 6, 11)
10
Fs
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
RECOMMENDED OPERATING CONDITIONS (continued)
(VDD = VRST to 3.6V, TA = 0NC to +70NC.) (Note 1)
PARAMETER
Input Hysteresis (Schmitt)
SYMBOL
CONDITIONS
MIN
TYP
MAX
300
VIHYS
UNITS
mV
Input Low Voltage for HFXIN
VIL_HFXIN
External driven clock and not
feedback connected crystal
oscillator
VGND
0.3 x VDD
V
Input High Voltage for HFXIN
VIH_HFXIN
External driven clock and not
feedback connected crystal
oscillator
0.7 x VDD
VDD
V
IRRX Input Filter Pulse-Width
Reject
tIRRX_R
50
ns
IRRX Input Filter Pulse-Width
Accept
tIRRX_A
Output Low Voltage for IRTX
Output Low Voltage for RESET
and All Port Pins (Note 12)
VOL_IRTX
VOL
300
VDD = 3.6V, IOL = 25mA (Note 6)
VDD = 2.35V, IOL = 10mA (Note 6)
1.0
VDD = 1.85V, IOL = 4.5mA
1.0
0.4
0.5
VDD = 2.35V, IOL = 8mA (Note 6)
VDD = 1.85V, IOL = 4.5mA
0.4
0.5
0.4
0.5
VOH
IOH = -2mA
Input/Output Pin Capacitance
for All Port Pins Except DP, DM
CIO
(Note 6)
Input Pullup Resistor for
RESET, IRTX, IRRX, P0 to P6
GPIO Supply Output High
Voltage
IL
RPU
VDDIOH
1.0
VDD = 3.6V, IOL = 11mA (Note 6)
Output High Voltage for IRTX
and All Port Pins
Input Leakage Current
ns
Internal pullup disabled
VDDIO 0.5
-100
V
15
pF
+100
nA
16
25
39
VDD = 2V, VOL = VDD/2
VDD = 3.0V, VOL = 0.4V (Note 6)
17
27
41
16
28
39
VDD = 2.0V, VOL = 0.4V (Note 6)
17
30
41
VDD - 0.4
V
VDDIO
VDD = 3V, VOL = VDD/2 (Note 6)
VDDIOH current is the sum of VDDIO
current and IOH of all GPIO, IOH =
10mA
V
kW
VDD
V
12
MHz
EXTERNAL CRYSTAL/RESONATOR
Crystal/Resonator
fHFXIN
Crystal/Resonator Period
tHFXIN
Crystal/Resonator Warmup
Time
Oscillator Feedback Resistor
tXTAL_RDY
ROSCF
Crystal ESR
(Note 13)
1
From initial oscillation
(Note 6)
0.5
1/fHFXIN
ns
8192 x
tHFXIN
ms
1.0
(Note 6)
1.5
MW
60
W
12
MHz
EXTERNAL CLOCK INPUT
External Clock Frequency
fXCLK
External Clock Period
tXCLK
External Clock Duty Cycle
System Clock Frequency
Maxim Integrated
(Note 13)
1/fXCLK
45
tXCLK_DUTY
fCK
DC
fHFXIN
HFXOUT = GND
ns
55
fXCLK
%
MHz
5
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
RECOMMENDED OPERATING CONDITIONS (continued)
(VDD = VRST to 3.6V, TA = 0NC to +70NC.) (Note 1)
PARAMETER
System Clock Period
SYMBOL
CONDITIONS
MIN
TYP
MAX
1/fCK
tCK
UNITS
ns
NANOPOWER RING
3
13
TA = +25NC, VDD = POR voltage
(Note 6)
1.7
2.4
tNANO
(Note 6)
40
INANO
Typical at VDD = 1.64V, TA =
+25°C (Note 6)
TA = +25NC
Nanopower Ring Frequency
fNANO
Nanopower Ring Duty Cycle
Nanopower Ring Current
40
20
kHz
60
%
400
nA
65,535/
fNANO
s
WAKE-UP TIMER
Wake-Up Timer Interval
tWAKEUP
1/fNANO
fFPSYSCLK
1
FLASH MEMORY
System Clock During Flash
Programming/Erase
Flash Erase Time
Flash Programming Time per
Word
MHz
tME
Mass erase
20
40
tERASE
Page erase
20
40
tPROG
(Note 14)
20
100
Write/Erase Cycles
Data Retention
ms
Fs
20,000
Cycles
TA = +25NC
100
Years
(Note 15)
4.5
USB
USB Supply Voltage
VBUS Supply Current (Note 16)
VBUS Supply Current During
Idle (Note 16)
VBUS Suspend Supply Current
VBUS
IVBUS
IVBUSID
5.5
V
Transmitting on DP and DM at
12Mbps, CL = 50pF on DP and DM
to GND, FRCVDD = 0
13.5
mA
Transmitting on DP and DM at
12Mbps, CL = 50pF on DP and DM
to GND, FRCVDD = 1
3.5
mA
DP = high, DM = low, FRCVDD = 0
(Note 6)
6
mA
0.2
mA
500
FA
DP = high, DM = low, FRCVDD = 1
IVBUSSUS
Single-Ended Input High
Voltage DP, DM
VIHD
Single-Ended Input Low
Voltage DP, DM
VILD
5.0
2.0
V
0.8
V
0.3
V
Output Low Voltage DP, DM
VOLD
RL = 1.5kI from DP to 3.6V
Output High Voltage DP, DM
VOHD
RL = 15kI from DP and DM to GND
2.8
V
V
Differential Input Sensitivity
DP, DM
VDI
DP to DM
0.2
Common-Mode Voltage Range
VCM
Includes VDI range
0.8
6
2.5
V
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
RECOMMENDED OPERATING CONDITIONS (continued)
(VDD = VRST to 3.6V, TA = 0NC to +70NC.) (Note 1)
PARAMETER
SYMBOL
Single-Ended Receiver
Threshold
VSE
Single-Ended Receiver
Hysteresis
VSEH
Differential Output Signal
Cross-Point Voltage
VCRS
DP, DM Off-State Input
Impedance
Driver Output Impedance
DP Pullup Resistor
CONDITIONS
RPU
TYP
0.8
MAX
UNITS
2.0
V
200
CL = 50pF (Note 6)
RLZ
RDRV
MIN
1.3
mV
2.0
300
V
kW
Steady-state drive
28
44
Idle
0.9
1.575
Receiving
1.425
3.090
W
kW
USB TIMING
DP, DM Rise Time (Transmit)
tR
CL = 50pF
4
20
ns
DP, DM Fall Time (Transmit)
tF
CL = 50pF
4
20
ns
CL = 50pF (Note 6)
90
110
%
fIR
fCK/2
Hz
SPI Master Operating
Frequency
1/tMCK
fCK/2
MHz
SPI Slave Operating
Frequency
1/tSCK
fCK/4
MHz
SPI I/O Rise/Fall Time
tSPI_RF
24
ns
Rise/Fall Time Matching
(Transmit)
tR/tF
IR
Carrier Frequency
SPI (Note 6)
SCLK_ Output Pulse-Width
High/Low
CL = 15pF, pullup = 560W
8
tMCH, tMCL
tMCK/2 tSPI_RF
ns
MOSI_ Output Hold Time After
SCLK_ Sample Edge
tMOH
tMCK/2 tSPI_RF
ns
MOSI_ Output Valid to Sample
Edge
tMOV
tMCK/2 tSPI_RF
ns
MISO_ Input Valid to SCLK_
Sample Edge Rise/Fall Setup
tMIS
25
ns
MISO_ Input to SCLK_ Sample
Edge Rise/Fall Hold
tMIH
0
ns
SCLK_ Inactive to MOSI_
Inactive
tMLH
tMCK/2 tSPI_RF
ns
SCLK_ Input Pulse-Width
High/Low
tSCH, tSCL
SSEL_ Active to First Shift
Edge
tSSE
Maxim Integrated
tSCK/2
tSPI_RF
ns
ns
7
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
RECOMMENDED OPERATING CONDITIONS (continued)
(VDD = VRST to 3.6V, TA = 0NC to +70NC.) (Note 1)
PARAMETER
SYMBOL
MOSI_ Input to SCLK_ Sample
Edge Rise/Fall Setup
CONDITIONS
MIN
TYP
MAX
tSIS
tSPI_RF
ns
MOSI_ Input from SCLK_
Sample Edge Transition Hold
tSIH
tSPI_RF
ns
MISO_ Output Valid After
SCLK_ Shift Edge Transition
tSOV
SSEL_ Inactive
tSSH
tCK +
tSPI_RF
ns
SCLK_ Inactive to SSEL_
Rising
tSD
tSPI_RF
ns
MISO_ Output Disabled After
SSEL_ Edge Rise
tSLH
50
2tCK +
2tSPI_RF
UNITS
ns
ns
I2C ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V, TA = 0NC to +70NC.) (Note 1, Figure 1)
PARAMETER
SYMBOL
CONDITIONS
STANDARD MODE
MIN
MAX
0.3 x VDD
-0.5
0.3 x VDD
V
0.7 x VDD
VDD +
0.5V
V
VIL_I2C
(Note 18)
-0.5
Input High Voltage
VIH_I2C
(Note 18)
0.7 x VDD
Input Hysteresis (Schmitt)
VIHYS_I2C
VDD > 2V
Output Logic-Low (Open
Drain or Open Collector)
VOL_I2C
VDD > 2V, 3mA sink current
Output Fall Time from
VIH_MIN to VIL_MAX with
Bus Capacitance from
10pF to 400pF
tOF_I2C
(Notes 19, 20)
Pulse Width of Spike
Filtering That Must Be
Suppressed by Input
Filter
tSP_I2C
Input Current on I/O
IIN_I2C
I/O Capacitance
CIO_I2C
8
UNITS
MAX
Input Low Voltage
Input voltage from
0.1 x VDD to 0.9 x VDD
FAST MODE
MIN
0.05 x
VDD
0
-10
V
0.4
0
0.4
V
250
20 +
0.1CB
250
ns
0
50
ns
-10
+10
FA
10
pF
+10
10
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
I2C BUS CONTROLLER TIMING
(Notes 6, 21) (Figure 2)
PARAMETER
SYMBOL
STANDARD MODE
FAST MODE
MIN
MAX
MIN
MAX
100
0
400
I2C Bus Operating Frequency
fI2C
0
System Frequency
fSYS
0.90
I2C Bit Rate
fI2C
3.60
fSYS/8
UNITS
kHz
MHz
fSYS/8
Hz
tHD:STA
4.0
0.6
Fs
Clock Low Period
tLOW_I2C
4.7
1.3
Fs
Clock High Period
tHIGH_I2C
4.0
0.6
Fs
Setup Time for Repeated START
tSU:STA
4.7
0.6
Hold Time for Data (Notes 22, 23)
tHD:DAT
0
Setup Time for Data (Note 24)
tSU:DAT
250
SDA/SCL Fall Time (Note 20)
tF_I2C
Hold Time After (Repeated) START
SDA/SCL Rise Time (Note 20)
tR_I2C
3.45
0
Fs
0.9
100
Fs
ns
300
20 + 0.1CB
300
ns
1000
20 + 0.1CB
300
ns
tSU:STO
4.0
0.6
Fs
Bus Free Time Between STOP and
START
tBUF
4.7
1.3
Fs
Setup Time for STOP
Capacitive Load for Each Bus Line
CB
Noise Margin at the Low Level for
Each Connected Device (Including
Hysteresis)
VnL_I2C
0.1 x VDD
0.1 x VDD
V
Noise Margin at the Low Level for
Each Connected Device (Including
Hysteresis)
VnH_I2C
0.2 x VDD
0.2 x VDD
V
400
400
pF
Note 1: Specifications to 0NC are guaranteed by design and are not production tested.
Note 2: VPFW can be programmed to the following nominal voltage trip points: 1.8V, 1.9V, 2.55V, and 2.75V Q3%. The values
listed in the Recommended Operating Conditions table are for the default configuration of 1.8V nominal.
Note 3: It is not recommended to write to flash when the supply voltage drops below the power-fail warning levels, as there is
uncertainty in the duration of continuous power supply. The user application should check the status of the power-fail
warning flag before writing to flash to ensure complete write operations.
Note 4: The power-fail warning monitor and the power-fail reset monitor are designed to track each other with a minimum delta
between the two of 0.11V.
Note 5: The power-fail reset and POR detectors are designed to operate in tandem to ensure that one or both of these signals
is active at all times when VDD < VRST, ensuring the device maintains the reset state until minimum operating voltage is
achieved.
Note 6: Guaranteed by design and not production tested.
Note 7: IS1 is measured with the USB data RAM powered down.
Note 8: The power-check interval (PCI) can be set to always on, or to 1024, 2048, or 4096 nanopower ring clock cycles.
Note 9: Measured on the VDD pin and the device not in reset. All inputs are connected to GND or VDD. Outputs do not source/
sink any current. The device is executing code from flash memory.
Note 10: Current consumption during POR when powering up while VDD is less than the POR release voltage.
Note 11: The minimum amount of time that VDD must be below VPFW before a power-fail event is detected.
Note 12: The maximum total current, IOH(MAX) and IOL(MAX), for all listed outputs combined should not exceed 25mA to satisfy the
maximum specified voltage drop. This does not include the IRTX output.
Note 13: External clock frequency must be 12MHz to support USB functionality. Full-speed USB(12Mbps)-required bit-rate accuracy is Q2500ppm or Q0.25%. This is inclusive of all potential error sources: frequency tolerance, temperature, aging,
crystal capacitive loading, board layout, etc.
Note 14: Programming time does not include overhead associated with utility ROM interface.
Maxim Integrated
9
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Note 15: For USB operation, both VDD and VBUS must be connected.
Note 16: FRCVDD is the force VDD power-supply bit (PWCN.10). When FRCVDD = 1, VDDB power switching is disabled, and VDD
is always used as the core 3V power supply.
Note 17: The ESD protection scheme is in production on existing parts. The 1FF capacitor on VBUS is intended to protect that
pin from ESD damage (rather than DP or DM) since it is externally exposed. The ESD test uses 150pF charged to 15kV
applied to the 1FF capacitor creating a delta V of approximately 2.25V and limiting the voltage on VBUS.
Note 18: Devices that use nonstandard supply voltages that do not conform to the intended I2C bus system levels must relate their
input levels to the voltage to which the pullup resistors RP are connected.
Note 19: The maximum fall time, tF_I2C of 300ns for the SDA and SCL bus lines is longer than the specificed maximum tOF_I2C of
250ns for the output stages. This allows series protection resistors (RS) to be connected between the SDA/SCL pins and
the SDA/SCL bus lines as shown in I2C Bus Controller Timing without exceeding the maximum specified fall time.
Note 20: CB = Capacitance of one bus line in pF.
Note 21: All values referred to VIH_I2C(MIN) and VIL_I2C (MAX).
Note 22: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIH_I2C(MIN) of the SCL
signal) to bridge the undefined region of the falling edge of SCL.
Note 23: The maximum tHD:DAT need only be met if the device does not stretch the low period (tLOW_I2C) of the SCL signal.
Note 24: A fast-mode I2C bus device can be used in a standard-mode I2C bus system, but the requirement tSU:DAT R 250ns must
be met. This is automatically the case if the device does not stretch the low period of the SCL signal. If such a device
does stretch the low period of the SCL signal, it must output the next data bit to the SDA line tR_I2C(MAX) + tSU:DAT =
1000 + 250 = 1250ns (according to the standard-mode I2C specification) before the SCL line is released.
Note 25: AC electrical specifications are guaranteed by design and are not production tested.
VDD
I2C
DEVICE
MAXQ612
MAXQ622
I2C
DEVICE
RP
RS
P0.3
P0.4
RS
RS
RP
RS
SDA
SCL
Figure 1. Series Resistors (RS) for Protecting Against High-Voltage Spikes
S
SR
P
S
SDA
tF_I2C
tBUF
tR_I2C
tLOW_I2C
tSU:DAT
tSU:STA
SCL
tHD:STA
tHD:DAT
tHIGH_I2C
tSU:STO
NOTE: TIMING REFERENCED TO VIH_I2C(MIN) AND VIL_I2C(MAX).
Figure 2. I2C Bus Controller Timing Diagram
10
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
P2.7/TDO
P2.6/TMS
P2.5/TDI
P2.4/TCK
GND
N.C.
N.C.
P3.7/INT15
P3.6/INT14
P3.5/INT13
30
29
28
27
26
25
24
23
31
P1.0/INT0
32
TOP VIEW
33
Pin Configurations
P1.1/INT1
34
22
P3.4/INT12
P1.2/INT2
P1.3/INT3
35
21
P3.3/INT11
36
20
P3.2/INT10
P1.4/INT4
37
19
P3.1/INT9
P1.5/INT5
38
18
P3.0/INT8
P1.6/INT6
39
17
HFXOUT
P1.7/INT7
40
16
HFXIN
GND
41
15
GND
IRTX
42
14
REG18
IRRX
43
13
P0.0/IRTXM
44
VDD
RESET
MAXQ612
*EP
+
4
5
6
7
8
9
10
11
P0.4/TX1/SCL
P0.5/TBA0/TBA1
P0.6/TBB0
P0.7/TBB1
P2.0/MOSI0
P2.1/MISO0
P2.2/SCLK0
P2.3/SSEL0
2
P0.2/TX0
P0.3/RX1/SDA
3
1
P0.1/RX0
12
TQFN
*EXPOSED PAD.
Maxim Integrated
11
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
P3.6/INT14
P3.7/INT15
GND
P5.0/MOSI1
N.C.
P5.1/MISO1
P5.2/SCLK1
P5.3/SSEL1
P2.4/TCK
P2.5/TDI
P2.6/TMS
P2.7/TDO
P1.0/INT0
N.C.
P1.1/INT1
TOP VIEW
N.C.
Pin Configurations (continued)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P1.2/INT2 49
32 P3.5/INT13
P1.3/INT3 50
31 P3.4/INT12
P1.4/INT4 51
30 P3.3/INT11
P1.5/INT5 52
29 P3.2/INT10
P1.6/INT6 53
28 P3.1/INT9
P1.7/INT7 54
27 P3.0/INT8
P4.0 55
26 HFXOUT
P4.1 56
25 HFXIN
MAXQ612
P4.2 57
24 GND
9
10 11 12 13 14 15 16
N.C.
8
RESET
7
P2.3/SSEL0
6
P2.2/SCLK0
5
P2.1/MISO0
4
P2.0/MOSI0
3
P0.7/TBB1
2
P0.6/TBB0
1
GND
17 N.C.
P0.5/TBA0/TBA1
18 N.C.
IRTX 64
P0.4/TX1/SCL
19 N.C.
GND 63
P0.3/RX1/SDA
20 N.C.
P4.7 62
P0.2/TX0
21 N.C.
P4.6 61
P0.1/RX0
22 VDD
P4.5 60
IRRX
23 REG18
P4.4 59
P0.0/IRTXM
P4.3 58
LQFP
12
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
P3.6/INT14
P3.7/INT15
GND
P5.0/MOSI1
N.C.
P5.1/MISO1
P5.2/SCLK1
P5.3/SSEL1
P2.4/TCK
P2.5/TDI
P2.6/TMS
P2.7/TDO
P1.0/INT0
N.C.
P1.1/INT1
TOP VIEW
N.C.
Pin Configurations (continued)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
P1.2/INT2 49
32 P3.5/INT13
P1.3/INT3 50
31 P3.4/INT12
P1.4/INT4 51
30 P3.3/INT11
P1.5/INT5 52
29 P3.2/INT10
P1.6/INT6 53
28 P3.1/INT9
P1.7/INT7 54
27 P3.0/INT8
P4.0 55
26 HFXOUT
P4.1 56
25 HFXIN
MAXQ622
P4.2 57
24 GND
9
10 11 12 13 14 15 16
DP
8
RESET
7
P2.3/SSEL0
6
P2.2/SCLK0
5
P2.1/MISO0
4
P2.0/MOSI0
3
P0.7/TBB1
2
P0.6/TBB0
1
GND
17 GND
P0.5/TBA0/TBA1
18 DM
IRTX 64
P0.4/TX1/SCL
19 VBUS
GND 63
P0.3/RX1/SDA
20 VDDB
P4.7 62
P0.2/TX0
21 VDDIO
P4.6 61
P0.1/RX0
22 VDD
P4.5 60
IRRX
23 REG18
P4.4 59
P0.0/IRTXM
P4.3 58
LQFP
Pin Descriptions—TQFN, LQFP
PIN
MAXQ612
TQFN-EP
MAXQ612
LQFP
MAXQ622
LQFP
NAME
FUNCTION
13
22
22
VDD
Supply Voltage
15, 28, 41
8, 24, 35,
63
8, 17, 24,
35, 63
GND
Ground
POWER PINS
14
Maxim Integrated
23
23
REG18
Regulator Capacitor. This pin must be connected to ground through a
1.0FF external ceramic-chip capacitor. The capacitor must be placed as
close to this pin as possible. No external devices other than the capacitor should be connected to this pin.
13
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Pin Descriptions—TQFN, LQFP (continued)
PIN
MAXQ612
TQFN-EP
MAXQ612
LQFP
MAXQ622
LQFP
NAME
FUNCTION
RESET PINS
12
15
15
RESET
Digital, Active-Low, Reset Input/Output. The CPU is held in reset when this
pin is low and begins executing from the reset vector when released. The
pin includes pullup current source and should be driven by an open-drain,
external source capable of sinking in excess of 4mA. This pin is driven low
as an output when an internal reset condition occurs.
CLOCK PINS
16
25
25
HFXIN
17
26
26
HFXOUT
High-Frequency Crystal Input. Connect an external crystal or resonator between HFXIN and HFXOUT as the high-frequency system clock.
Alternatively, HFXIN is the input for an external, high-frequency clock
source when HFXOUT is shorted to ground during POR.
USB FUNCTION PINS
USB VBUS Supply Voltage. Connect VBUS to a positive 5.0V power supply. Bypass VBUS to ground with a 1.0FF ceramic capacitor as close to
the VBUS pin as possible.
—
—
19
VBUS
—
—
16
DP
USB D+ Signal. This bidirectional pin carries the positive differential
data or single-ended data. Connect this pin to a USB “B” connector.
This pin is weakly pulled high internally when the USB is disabled.
—
—
18
DM
USB D- Signal. This bidirectional pin carries the negative differential
data or single-ended data. Connect this pin to a USB “B” connector.
This pin is weakly pulled high internally when the USB is disabled.
—
—
—
—
20
21
VDDB
USB Transceiver Supply Voltage. This is the power output of the internal
voltage regulator that is used for the USB transceiver (3.3V) block. This
pin is bypassed to ground with a 1.0FF capacitor as close as possible
to the package. No external circuitry should be powered from this pin.
VDDIO
Switched 3V Power Supply. This is the power output after selection
between VBUS and VDD. Must be connected to an external ceramic
chip capacitor. The capacitor must be placed as close to this pin as
possible. No external devices other than the capacitor should be connected to this pin.
IR FUNCTION PINS
14
42
64
64
IRTX
IR Transmit Output. Active-low IR transmit pin capable of sinking 25mA.
This pin defaults to three-state input with the weak pullup disabled during all forms of reset. Software must configure this pin after release from
reset to remove the three-state input condition.
43
1
1
IRRX
IR Receive Input
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Pin Descriptions—TQFN, LQFP (continued)
PIN
MAXQ612
TQFN-EP
MAXQ612
LQFP
MAXQ622
LQFP
NAME
FUNCTION
GENERAL-PURPOSE I/O AND SPECIAL FUNCTION PINS
General-Purpose, Digital, I/O, Type C Port. These port pins function as
bidirectional I/O pins. All port pins default to three-state mode after a
reset. All alternate functions must be enabled from software.
44, 1–7
2–7, 9, 10
2–7, 9, 10
P0.0–P0.7;
IRTXM,
RX0, TX0,
RX1, TX1,
SDA, SCL,
TBA0,
TBA1,
TBB0, TBB1
MAXQ612
TQFN-EP
MAXQ612
LQFP
MAXQ622
LQFP
PORT
SPECIAL
FUNCTION
44
2
2
P0.0
IRTXM
1
3
3
P0.1
RX0
2
4
4
P0.2
TX0
3
5
5
P0.3
RX1/SDA
4
6
6
P0.4
TX1/SCL
5
7
7
P0.5
TBA0/TBA1
6
9
9
P0.6
TBB0
7
10
10
P0.7
TBB1
General-Purpose, Digital, I/O, Type D Port; External Edge-Selectable
Interrupt. These port pins function as bidirectional I/O pins or as interrupts. All port pins default to three-state mode after a reset. All interrupt
functions must be enabled from software.
MAXQ612
TQFN-EP
33–40
45, 48–54
Maxim Integrated
45, 48–54
P1.0–P1.7;
INT0–INT7
MAXQ612
LQFP
MAXQ622
LQFP
PORT
SPECIAL
FUNCTION
33
45
45
P1.0
INT0
34
48
48
P1.1
INT1
35
49
49
P1.2
INT2
36
50
50
P1.3
INT3
37
51
51
P1.4
INT4
38
52
52
P1.5
INT5
39
53
53
P1.6
INT6
40
54
54
P1.7
INT7
15
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Pin Descriptions—TQFN, LQFP (continued)
PIN
MAXQ612
TQFN-EP
8–11, 29–32
MAXQ612
LQFP
11–14,
41–44
MAXQ622
LQFP
11–14,
41–44
NAME
P2.0–P2.7;
MOSI0,
MISO0,
SCLK0,
SSEL0,
TCK, TDI,
TMS, TDO
FUNCTION
General-Purpose, Digital, I/O, Type C Port. These port pins function as
bidirectional I/O pins. P2.0 to P2.3 default to three-state mode after a
reset. All alternate functions must be enabled from software. Enabling
the pin’s special function disables the general-purpose I/O on the pin.
The JTAG pins (P2.4 to P2.7) default to their JTAG function with weak
pullups enabled after a reset. The JTAG function can be disabled using
the TAP bit in the SC register.
P2.7 functions as the JTAG test-data output on reset and defaults to
an input with a weak pullup. The output function of the test data is only
enabled during the TAP’s shift_IR or shift_DR states.
MAXQ612
TQFN-EP
MAXQ612
LQFP
MAXQ622
LQFP
PORT
SPECIAL
FUNCTION
8
11
11
P2.0
MOSI0
9
12
12
P2.1
MISO0
10
13
13
P2.2
SCLK0
11
14
14
P2.3
29
41
41
P2.4
SSEL0
TCK
30
42
42
P2.5
TDI
31
43
43
P2.6
TMS
32
44
44
P2.7
TDO
General-Purpose, Digital, I/O, Type D Port; External Edge-Selectable
Interrupt. These port pins function as bidirectional I/O pins or as interrupts. All port pins default to three-state mode after a reset. All interrupt
functions must be enabled from software.
18–25
16
27–34
27–34
P3.0–P3.7;
INT8–INT15
MAXQ612
TQFN
MAXQ612
LQFP
MAXQ622
LQFP
18
27
27
P3.0
INT8
19
28
28
P3.1
INT9
20
29
29
P3.2
INT10
21
30
30
P3.3
INT11
22
31
31
P3.4
INT12
23
32
32
P3.5
INT13
24
33
33
P3.6
INT14
25
34
34
P3.7
INT15
PORT
SPECIAL
FUNCTION
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Pin Descriptions—TQFN, LQFP (continued)
PIN
MAXQ612
TQFN-EP
MAXQ612
LQFP
MAXQ622
LQFP
NAME
FUNCTION
General-Purpose, Digital, I/O, Type C Port. These port pins function as
bidirectional I/O pins. All port pins default to three-state mode after a
reset.
—
55-62
—
37–40
55–62
37–40
P4.0–P4.7
P5.0–P5.3;
MOSI1,
MISO1,
SCLK1,
SSEL1
MAXQ612
TQFN-EP
MAXQ612
LQFP
MAXQ622
LQFP
PORT
SPECIAL
FUNCTION
—
55
55
P4.0
—
—
56
56
P4.1
—
—
57
57
P4.2
—
—
58
58
P4.3
—
—
59
59
P4.4
—
—
60
60
P4.5
—
—
61
61
P4.6
—
—
62
62
P4.7
—
General-Purpose, Digital, I/O, Type C Port. These port pins function as
bidirectional I/O pins. All port pins default to three-state mode after a
reset. All alternate functions must be enabled from software. Enabling
the pin’s special function disables the general-purpose I/O on the pin.
MAXQ612
TQFN-EP
MAXQ612
LQFP
MAXQ622
LQFP
PORT
SPECIAL
FUNCTION
—
37
37
P5.0
MOSI1
—
38
38
P5.1
MISO1
—
39
39
P5.2
SCLK1
—
40
40
P5.3
SSEL1
NO CONNECTION PINS
26, 27
16–21, 36,
46, 47
36, 46, 47
N.C.
—
—
—
EP
No Connection. Reserved for future use. Leave these pins unconnected.
EXPOSED PAD
Maxim Integrated
Exposed Pad (TQFN Only). Connect EP to the ground plane.
17
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Pin Descriptions—Bare Die
PIN
NAME
FUNCTION
MAXQ612
MAXQ622
28
28
VDD
Supply Voltage
8, 30, 45, 73
8, 23, 30, 45,
73
GND
Ground
POWER PINS
29
29
REG18
Regulator Capacitor. This pin must be connected to ground through a 1.0FF
external ceramic-chip capacitor. The capacitor must be placed as close to this
pin as possible. No external devices other than the capacitor should be connected to this pin.
RESET PINS
21
21
RESET
Digital, Active-Low, Reset Input/Output. The CPU is held in reset when this pin is
low and begins executing from the reset vector when released. The pin includes
pullup current source and should be driven by an open-drain, external source
capable of sinking in excess of 4mA. This pin is driven low as an output when an
internal reset condition occurs.
CLOCK PINS
31
31
HFXIN
32
32
HFXOUT
High-Frequency Crystal Input. Connect an external crystal or resonator between
HFXIN and HFXOUT as the high-frequency system clock. Alternatively, HFXIN is
the input for an external, high-frequency clock source when HFXOUT is shorted
to ground during POR.
USB FUNCTION PINS
—
25
VBUS
—
22
DP
USB D+ Signal. This bidirectional pin carries the positive differential data or
single-ended data. Connect this pin to a USB “B” connector. This pin is weakly
pulled high internally when the USB is disabled.
—
24
DM
USB D- Signal. This bidirectional pin carries the negative differential data or
single-ended data. Connect this pin to a USB “B” connector. This pin is weakly
pulled high internally when the USB is disabled.
VDDB
USB Transceiver Supply Voltage. This is the power output of the internal voltage
regulator that is used for the USB transceiver (3.3V) block. This pin is bypassed
to ground with a 1.0FF capacitor as close as possible to the package. No external circuitry should be powered from this pin.
VDDIO
Switched 3V Power Supply. This is the power output after selection between
VBUS and VDD. Must be connected to an external ceramic chip capacitor. The
capacitor must be placed as close to this pin as possible. No external devices
other than the capacitor should be connected to this pin.
—
—
18
USB VBUS Supply Voltage. Connect VBUS to a positive 5.0V power supply.
Bypass VBUS to ground with a 1.0FF ceramic capacitor as close to the VBUS pin
as possible.
26
27
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Pin Descriptions—Bare Die (continued)
PIN
MAXQ612
MAXQ622
NAME
FUNCTION
IR FUNCTION PINS
74
74
IRTX
IR Transmit Output. Active-low IR transmit pin capable of sinking 25mA. This
pin defaults to three-state input with the weak pullup disabled during all forms
of reset. Software must configure this pin after release from reset to remove the
three-state input condition.
75
75
IRRX
IR Receive Input
GENERAL-PURPOSE I/O AND SPECIAL FUNCTION PINS
General-Purpose, Digital, I/O, Type C Port. These port pins function as bidirectional I/O pins. All port pins default to three-state mode after a reset. All alternate
functions must be enabled from software.
1, 2, 3, 5, 6,
7, 9, 10
1, 2, 3, 5, 6,
7, 9, 10
P0.0–P0.7;
IRTXM, RX0,
TX0, RX1,
TX1, SDA,
SCL, TBA0,
TBA1, TBB0,
TBB1
MAXQ612
MAXQ622
PORT
SPECIAL FUNCTION
1
1
P0.0
IRTXM
2
2
P0.1
RX0
3
3
P0.2
TX0
5
5
P0.3
RX1/SDA
6
6
P0.4
TX1/SCL
7
7
P0.5
TBA0/TBA1
9
9
P0.6
TBB0
10
10
P0.7
TBB1
General-Purpose, Digital, I/O, Type D Port; External Edge-Selectable Interrupt.
These port pins function as bidirectional I/O pins or as interrupts. All port pins
default to three-state mode after a reset. All interrupt functions must be enabled
from software.
55, 56, 58–63
Maxim Integrated
55, 56, 58–63
P1.0–P1.7;
INT0–INT7
MAXQ612
MAXQ622
PORT
SPECIAL FUNCTION
55
55
P1.0
INT0
56
56
P1.1
INT1
58
58
P1.2
INT2
59
59
P1.3
INT3
60
60
P1.4
INT4
61
61
P1.5
INT5
62
62
P1.6
INT6
63
63
P1.7
INT7
19
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Pin Descriptions—Bare Die (continued)
PIN
MAXQ612
16, 18, 19,
20, 50, 51,
53, 54
MAXQ622
16, 18, 19,
20, 50, 51,
53, 54
NAME
P2.0–P2.7;
MOSI0,
MISO0,
SCLK0,
SSEL0, TCK,
TDI, TMS,
TDO
FUNCTION
General-Purpose, Digital, I/O, Type C Port. These port pins function as bidirectional I/O pins. P2.0 to P2.3 default to three-state mode after a reset. All alternate
functions must be enabled from software. Enabling the pin’s special function disables the general-purpose I/O on the pin.
The JTAG pins (P2.4 to P2.7) default to their JTAG function with weak pullups
enabled after a reset. The JTAG function can be disabled using the TAP bit in
the SC register.
P2.7 functions as the JTAG test-data output on reset and defaults to an input with
a weak pullup. The output function of the test data is only enabled during the
TAP’s shift_IR or shift_DR states.
MAXQ612
16
18
19
20
50
51
53
54
MAXQ622
16
18
19
20
50
51
53
54
PORT
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
SPECIAL FUNCTION
MOSI0
MISO0
SCLK0
SSEL0
TCK
TDI
TMS
TDO
General-Purpose, Digital, I/O, Type D Port; External Edge-Selectable Interrupt.
These port pins function as bidirectional I/O pins or as interrupts. All port pins
default to three-state mode after a reset. All interrupt functions must be enabled
from software.
33–37, 39,
40, 42
33–40
P3.0–P3.7;
INT8–INT15
MAXQ612
33
34
35
36
37
39
40
42
MAXQ622
33
34
35
36
37
38
39
40
PORT
P3.0
P3.1
P3.2
P3.3
P3.4
P3.5
P3.6
P3.7
SPECIAL FUNCTION
INT8
INT9
INT10
INT11
INT12
INT13
INT14
INT15
General-Purpose, Digital, I/O, Type C Port. These port pins function as bidirectional I/O pins. All port pins default to three-state mode after a reset.
65–72
20
65–72
P4.0–P4.7
MAXQ612
65
66
67
68
69
70
71
72
MAXQ622
65
66
67
68
69
70
71
72
PORT
P4.0
P4.1
P4.2
P4.3
P4.4
P4.5
P4.6
P4.7
SPECIAL FUNCTION
—
—
—
—
—
—
—
—
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Pin Descriptions—Bare Die (continued)
PIN
MAXQ612
46–49
MAXQ622
46–49
NAME
P5.0–P5.3;
MOSI1,
MISO1,
SCLK1,
SSEL1
FUNCTION
General-Purpose, Digital, I/O, Type C Port. These port pins function as bidirectional I/O pins. All port pins default to three-state mode after a reset. All alternate
functions must be enabled from software. Enabling the pin’s special function disables the general-purpose I/O on the pin.
MAXQ612
MAXQ622
PORT
SPECIAL FUNCTION
46
46
P5.0
MOSI1
47
47
P5.1
MISO1
48
48
P5.2
SCLK1
49
49
P5.3
SSEL1
General-Purpose, Digital, I/O, Type C Port. These port pins function as bidirectional I/O pins. All port pins default to three-state mode after a reset.
12–15, 38,
41, 43, 44
12–15, 41–44
P6.0–P6.7
MAXQ612
MAXQ622
PORT
SPECIAL FUNCTION
12
12
P6.0
—
13
13
P6.1
—
14
14
P6.2
—
15
15
P6.3
—
38
41
P6.4
—
41
42
P6.5
—
43
43
P6.6
—
44
44
P6.7
—
NO CONNECTION PINS
4, 11, 17,
22–27, 52,
57, 64
4, 11, 17, 52,
57, 64
N.C.
No Connection. Reserved for future use. Leave these pins unconnected.
Detailed Description
The MAXQ612/MAXQ622 provide integrated, low-cost
solutions that simplify the design of IR communications
equipment such as universal remote controls. Standard
features include the highly optimized, single-cycle,
MAXQ, 16-bit RISC core; 128KB of flash memory; 6KB
data RAM; soft stack; 16 general-purpose registers; and
three data pointers. The MAXQ core has the industry’s
best MIPS/mA rating, allowing developers to achieve
the same performance as competing microcontrollers at
substantially lower clock rates. Lower active-mode current combined with the even lower MAXQ612/MAXQ622
stop-mode current results in increased battery life. IR
application-specific peripherals include flexible timers
Maxim Integrated
for generating IR carrier frequencies and modulation. A
high-current, 25mA, IR drive pin and output pins capable
of sinking up to 5mA support IR applications. It also
includes a USB slave interface compatible with existing
host HID device drivers, I2C, dual SPI, dual USARTs, up
to 56 general-purpose I/O pins ideal for keypad matrix
input, and a power-fail-detection circuit to notify.
Operating from DC to 12MHz, almost all instructions execute
in a single clock cycle (83.3ns at 12MHz), enabling nearly
12MIPS true-code operation. When active device operation is not required, an ultra-low-power stop mode can be
invoked from software, resulting in quiescent current consumption of less than 300nA typical and 3FA maximum. The
combination of high-performance instructions and ultra-low
21
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
stop-mode current increases battery life over competing
microcontrollers. An integrated POR circuit with brownout
support resets the device to a known condition following a
power-up cycle or brownout condition. Additionally, a powerfail warning flag is set, and a power-fail interrupt can be
generated when the system voltage falls below the powerfail warning voltage, VPFW. The power-fail warning feature
allows the application to notify the user that the system supply is low and appropriate action should be taken.
Memory is accessed through specific data-pointer registers with autoincrement/decrement support.
Memory
The microcontroller incorporates several memory types:
• 128KB program flash memory
• 6KB SRAM data memory
• 6KB utility ROM
• Soft stack
Microprocessor
Memory Protection
The MAXQ612/MAXQ622 are based on Maxim’s MAXQ20
core, which is a low-power implementation of the new
16-bit MAXQ family of RISC cores. The core supports
the Harvard memory architecture with separate internal
16-bit program and data address buses. A fixed 16-bit
instruction word is standard, but data can be arranged
in 8 or 16 bits. The MAXQ core is a pipelined processor with performance approaching 1MIPS per MHz.
The 16-bit data path is implemented around register
modules, and each register module contributes specific
functions to the core. The accumulator module consists
of sixteen 16-bit registers and is tightly coupled with the
arithmetic logic unit (ALU). Program flow is supported by
a configurable soft stack.
The optional memory-protection feature separates code
memory into three areas: system, user loader, and user
application. Code in the system area can be kept confidential. Code in the user areas can be prevented from
reading and writing system code. The user loader can
also be protected from user application code.
Memory protection is implemented using privilege levels
for code. Each area has an associated privilege level.
RAM/ROM are assigned privilege levels as well. Refer to
the MAXQ622 User’s Guide for a more thorough explanation of the topic.
Stack Memory
A 16-bit-wide internal stack provides storage for program return addresses and can also be used for generalpurpose data storage. The stack is used automatically
by the processor when the CALL, RET, and RETI instructions are executed and when an interrupt is serviced. An
application can also store values in the stack explicitly
by using the PUSH, POP, and POPI instructions.
Execution of instructions is triggered by data transfer
between functional register modules or between a functional register module and memory. Because data movement involves only source and destination modules,
circuit switching activities are limited to active modules
only. For power-conscious applications, this approach
localizes power dissipation and minimizes switching
noise. The modular architecture also provides a maximum of flexibility and reusability that are important for a
microprocessor used in embedded applications.
On reset, the stack pointer, SP, initializes to the top of the
stack (BF0h). The CALL, PUSH, and interrupt-vectoring
operations decrement SP, then store a value at the location pointed to by SP. The RET, RETI, POP, and POPI
operations retrieve the value at SP and then increment SP.
The MAXQ instruction set is highly orthogonal. All arithmetical and logical operations can use any register
in conjunction with the accumulator. Data movement
is supported from any register to any other register.
Utility ROM
The utility ROM is a 6KB block of internal ROM memory
that defaults to a starting address of 8000h. The utility
Table 1. Memory Areas and Associated Maximum Privilege Levels
AREA
22
PAGE ADDRESS
MAXIMUM PRIVILEGE LEVEL
System
0 to ULDR-1
High
User Loader
ULDR to UAPP-1
Medium
User Application
UAPP to top
Low
Utility ROM
N/A
High
Other (RAM)
N/A
Low
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
ROM consists of subroutines that can be called from
application software. These include the following:
• In-system programming (bootstrap loader) using
JTAG interface
• In-circuit debug routines
• T
est routines (internal memory tests, memory loader,
etc.)
• U
ser-callable routines for in-application flash memory
programming and fast table lookup
Following any reset, execution begins in the utility ROM.
The ROM software determines whether the program
execution should immediately jump to location 0000h,
the start of system code, or to one of the special routines mentioned. Routines within the utility ROM are user
accessible and can be called as subroutines by the
application software. More information on the utility ROM
functions is contained in the MAXQ622 User’s Guide.
Some applications require protection against unauthorized viewing of program code memory. For these
applications, access to in-system programming, inapplication programming, or in-circuit debugging functions is prohibited until a password has been supplied.
The password is defined as the 16 words of physical
program memory at addresses 0010h to 001Fh.
Three password locks protect three different program
memory segments. When the PWL is set to one (poweron reset default) and the contents of the memory at
addresses 0010h to 001Fh are any value other than FFh
or 00h, the password is required to access the utility
ROM, including in-circuit debug and in-system programming routines that allow reading or writing of internal
memory. When PWL is cleared to zero, these utilities are
fully accessible without password. The PWLS bit uses a
password that is at ULDR + 0010 to ULDR + 001F, and
the PWLL uses a password at UAPP + 0010 to UAPP +
001F. The password is automatically set to all ones following a mass erase.
Watchdog Timer
The internal watchdog timer greatly increases system
reliability. The timer resets the device if software execution is disturbed. The watchdog timer is a free-running
counter designed to be periodically reset by the application software. If software is operating correctly, the counter is periodically reset and never reaches its maximum
count. However, if software operation is interrupted,
the timer does not reset, triggering a system reset and
optionally a watchdog timer interrupt. This protects the
system against electrical noise or electrostatic discharge
(ESD) upsets that could cause uncontrolled processor
operation. The internal watchdog timer is an upgrade to
older designs with external watchdog devices, reducing
system cost and simultaneously increasing reliability.
The watchdog timer functions as the source of both the
watchdog timer timeout and the watchdog timer reset.
The timeout period can be programmed in a range of
215 to 224 system clock cycles. An interrupt is generated when the timeout period expires if the interrupt
is enabled. All watchdog timer resets follow the programmed interrupt timeouts by 512 system clock cycles.
If the watchdog timer is not restarted for another full
interval in this time period, a system reset occurs when
the reset timeout expires.
IR Carrier Generation
and Modulation Timer
The dedicated IR timer/counter module simplifies lowspeed infrared (IR) communication. The IR timer implements two pins (IRTX and IRRX) for supporting IR
transmit and receive, respectively. The IRTX pin has no
corresponding port pin designation, so the standard
PD, PO, and PI port control status bits are not present.
However, the IRTX pin output can be manipulated high
or low using the PWCN.IRTXOUT and PWCN.IRTXOE
bits when the IR timer is not enabled (i.e., IREN = 0).
Table 2. Watchdog Interrupt Timeout (Sysclk = 12MHz, CD[1:0] = 00)
WD[1:0]
WATCHDOG CLOCK
WATCHDOG INTERRUPT TIMEOUT
WATCHDOG RESET AFTER
WATCHDOG INTERRUPT (μs)
00
Sysclk/215
2.7ms
42.7
01
Sysclk/218
21.9ms
42.7
10
Sysclk/221
174.7ms
42.7
11
Sysclk/224
1.4s
42.7
Maxim Integrated
23
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
The IR timer is composed of a carrier generator and a
carrier modulator. The carrier generation module uses
the 16-bit IR carrier register (IRCA) to define the high
and low time of the carrier through the IR carrier high
byte (IRCAH) and IR carrier low byte (IRCAL). The carrier
modulator uses the IR data bit (IRDATA) and IR modulator time register (IRMT) to determine whether the carrier
or the idle condition is present on IRTX.
Carrier Generation Module
The IRCAH byte defines the carrier high time in terms of
the number of IR input clocks, whereas the IRCAL byte
defines the carrier low time.
condition, as defined by IRTXPOL, is output on the IRTX
pin during the next IRMT cycles.
The IR timer acts as a down counter in transmit mode. An
IR transmission starts when the IREN bit is set to 1 when
IRMODE = 1; when the IRMODE bit is set to 1 when IREN
= 1; or when IREN and IRMODE are both set to 1 in the
same instruction. The IRMT and IRCA registers, along
with the IRDATA and IRTXPOL bits, are sampled at the
beginning of the transmit process and every time the IR
timer value reload its value. When the IRV reaches 0000h
value, on the next carrier clock, it does the following:
1) Reloads IRV with IRMT.
• IR Input Clock (fIRCLK) = fSYS/2IRDIV[1:0]
2) Samples IRCA, IRDATA, and IRTXPOL.
• C
arrier Frequency (fCARRIER) = fIRCLK/(IRCAH +
IRCAL + 2)
3) Generates IRTX accordingly.
• Carrier High Time = IRCAH + 1
5) Generates an interrupt to the CPU if enabled (IRIE = 1).
• Carrier Low Time = IRCAL + 1
• Carrier Duty Cycle = (IRCAH + 1)/(IRCAH + IRCAL + 2)
During transmission, the IRCA register is latched for
each IRV downcount interval, and is sampled along with
the IRTXPOL and IRDATA bits at the beginning of each
new IRV downcount interval so that duty-cycle variation
and frequency shifting is possible from one interval to the
next. The starting/idle state and the carrier polarity of the
IRTX pin can be configured when the IR timer is enabled.
IR Transmission
During IR transmission (IRMODE = 1), the carrier generator creates the appropriate carrier waveform, while
the carrier modulator performs the modulation. The carrier modulation can be performed as a function of carrier
cycles or IRCLK cycles dependent on the setting of the
IRCFME bit. When IRCFME = 0, the IRV down counter is
clocked by the carrier frequency and thus the modulation is a function of carrier cycles. When IRCFME = 1, the
IRV down counter is clocked by IRCLK, allowing carrier
modulation timing with IRCLK resolution.
The IRTXPOL bit defines the starting/idle state as well as
the carrier polarity for the IRTX pin. If IRTXPOL = 1, the
IRTX pin is set to a logic-high when the IR timer module is
enabled. If IRTXPOL = 0, the IRTX pin is set to a logic-low
when the IR timer is enabled.
A separate register bit, IR data (IRDATA), is used to
determine whether the carrier generator output is output
to the IRTX pin for the next IRMT carrier cycles. When
IRDATA = 1, the carrier waveform (or inversion of this
waveform if IRTXPOL = 1) is output on the IRTX pin during the next IRMT cycles. When IRDATA = 0, the idle
24
4) Sets IRIF to 1.
IR Transmit—Independent External Carrier
and Modulator Outputs
The normal transmit mode modulates the carrier based
upon the IRDATA bit. However, the user has the option
to input the modulator (envelope) on an external pin if
desired. The IRDATA bit is output directly to the IRTXM
pin (if IRTXPOL = 0) on each IRV downcount interval
boundary just as if it were being used to internally modulate the carrier frequency. If IRTXPOL = 1, the inverse
of the IRDATA bit is output to the IRTXM pin on the IRV
interval downcount boundaries. When the envelope
mode is enabled, it is possible to output either the modulated (IRENV[1:0] = 01b) or unmodulated (INENV[1:0] =
10b) carrier to the IRTX pin.
IR Receive
When configured in receive mode (IRMODE = 0), the
IR hardware supports the IRRX capture function. The
IRRXSEL[1:0] bits define which edge(s) of the IRRX pin
should trigger the IR timer capture function. Once started,
the IR timer (IRV) starts up counting from 0000h when a
qualified capture event as defined by IRRXSEL happens.
The IRV register is, by default, counting carrier cycles
as defined by the IRCA register. However, the IR carrier
frequency detect (IRCFME) allows clocking of the IRV
register directly with the IRCLK for finer resolution. When
IRCFME = 0, the IRCA defined carrier is counted by IRV.
When IRCFME = 1, the IRCLK clocks the IRV register.
On the next qualified event, it does the following:
1) C
aptures the IRRX pin state and transfers its value
to IRDATA. If a falling edge occurs, IRDATA = 0. If a
rising edge occurs, IRDATA = 1.
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
2) Transfers its current IRV value to the IRMT.
• 16-bit timer with capture
3) Resets IRV content to 0000h (if IRXRL = 1).
• 16-bit timer with compare
4) Continues counting again until the next qualified event.
• Input/output enhancements for pulse-width modulation
If the IR timer value rolls over from 0FFFFh to 0000h
before a qualified event happens, the IR timer overflow
(IROV) flag is set to 1 and an interrupt is generated, if
enabled. The IR module continues to operate in receive
mode until it is stopped by switching into transmit mode
or clearing IREN = 0.
• Set/reset/toggle output state on comparator match
Carrier Burst-Count Mode
A special mode reduces the CPU processing burden
when performing IR learning functions. Typically, when
operating in an IR learning capacity, some number of
carrier cycles are examined for frequency determination.
Once the frequency has been determined, the IR receive
function can be reduced to counting the number of carrier pulses in the burst and the duration of the combined
mark-space time within the burst. To simplify this process, the receive burst-count mode can be used. When
RXBCNT = 0, the standard IR receive capture functionality is in place. When RXBCNT = 1, the IRV capture
operation is disabled and the interrupt flag associated
with the capture no longer denotes a capture. In the
carrier burst-count mode, the IRMT register only counts
qualified edges. The IRIF interrupt flag now sets if two
IRCA cycles elapse without getting a qualified edge. The
IRIF interrupt flag thus denotes absence of the carrier
and the beginning of a space in the receive signal. The
IRCFME bit is still used to define whether the IRV register
is counting system IRCLK clocks or IRCA-defined carrier
cycles. The IRXRL bit defines whether the IRV register
is reloaded with 0000h on detection of a qualified edge
(per the IRXSEL[1:0] bits).
16-Bit Timers/Counters
The microcontroller provides two general-purpose timers/counters that support the following functions:
• Prescaler with 2n divider (for n = 0, 2, 4, 6, 8, 10)
General-Purpose I/O
The microcontroller provides port pins for general-purpose I/O that have the following features:
• CMOS output drivers
• Schmitt trigger inputs
• O
ptional weak pullup to VDD when operating in input
mode
While the microcontroller is in a reset state, all port pins
become three-state with both weak pullups and input
buffers disabled, unless otherwise noted.
From a software perspective, each port appears as a
group of peripheral registers with unique addresses.
Special function pins can also be used as general-purpose I/O pins when the special functions are disabled.
For a detailed description of the special functions available for each pin, refer to the IC-specific user’s guide,
e.g., the MAXQ622 User’s Guide describes all special
functions available on the MAXQ612/MAXQ622.
Serial Peripherals
The microcontroller supports two independent USARTs,
two SPI master/slave communications ports, and an I2C
bus.
USART
The USART units are implemented with the following
characteristics:
• 2-wire interface
• Full-duplex operation for asynchronous data transfers
• 16-bit timer/counter
• Half-duplex operation for synchronous data transfers
• 16-bit up/down autoreload
• Programmable interrupt for receive and transmit
• Counter function of external pulse
• Independent baud-rate generator
Table 3. USART Mode Details
MODE
TYPE
START BITS
DATA BITS
STOP BITS
Mode 0
Synchronous
N/A
8
N/A
Mode 1
Asynchronous
1
8
1
Mode 2
Asynchronous
1
8+1
1
Mode 3
Asynchronous
1
8+1
1
Maxim Integrated
25
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
• Programmable 9th bit parity support
by a USB host as a peripheral, characterized by the following endpoints:
• Start/stop bit support
Serial Peripheral Interface (SPI)
The dual-integrated SPI interfaces provide independent
serial communication channels that communicate synchronously with peripheral devices in a multiple master
or multiple slave system. The interface allows access to
a 4-wire, full-duplex serial bus, and can be operated in
either master mode or slave mode. Collision detection
is provided when two or more masters attempt a data
transfer at the same time.
The maximum SPI master transfer rate is Sysclk/2. When
operating as an SPI slave, the MAXQ612/MAXQ622 can
support up to Sysclk/4 SPI transfer rate. Data is transferred as an 8-bit or 16-bit value, MSB first. In addition,
the SPI module supports configuration of an active SSEL
state through the slave active select. Separate pins and
registers are used to differentiate between the two SPI ports.
I2C Bus
The microcontroller integrates an internal I2C bus mas-
ter/slave for communication with a wide variety of other
I2C–enabled peripherals. The I2C bus is a 2-wire, bidirectional bus using two bus lines—the serial data line
(SDA) and the serial clock line (SCL)—and a ground line.
Both the SDA and SDL lines must be driven as opencollector/drain outputs. External resistors are required as
shown in Figure 1 to pull the lines to a logic-high state.
The device supports both the master and slave protocols. In the master mode, the device has ownership of
the I2C bus, drives the clock, and generates the START
and STOP signals. This allows it to send data to a slave
or receive data from a slave as required. In slave mode,
the device relies on an externally generated clock to
drive SCL and responds to data and commands only
when requested by the I2C master device.
• E
P0: Bidirectional CONTROL endpoint with a 64-byte
data storage.
• E
P1-OUT: BULK (or INT) OUT endpoint. Doublebuffered 64 bytes data storage.
• E
P2-IN: BULK (or INT) IN endpoint. Double-buffered
64 bytes data storage.
• E
P3-IN: BULK (or INT) IN endpoint. Single-buffered 64
bytes data storage.
The choice to use EP1, EP2, and EP3 as BULK or
INTERRUPT endpoints is strictly a function of the endpoint descriptors that the USB controller returns to the
USB host during enumeration.
The USB controller communicates to a total of 384
bytes of endpoint data memory (2 x 64 bytes for each
data moving endpoint EP1 and EP2), 64 bytes for the
CONTROL endpoint, and 64 bytes for endpoint EP3.
Double-buffering EP1 and EP2 improves throughput by
allowing the CPU to read or load the next packet while
the USB controller is moving the current packet over
USB. EP3-IN is intended to serve as a large interrupt
endpoint for various USB class specifications such as
the Still Image Capture Device. It can also be used as a
second BULK IN endpoint.
On-Chip Oscillator
An external quartz crystal or a ceramic resonator can be
connected between HFXIN and HFXOUT, as illustrated
in Figure 3.
To operate the core from an external clock, connect the
clock source to the HFXIN pin and connect the HFXOUT
VDD
USB Controller (MAXQ622 Only)
The integrated USB controller is compliant with the USB
2.0 specification, providing full-speed operation with the
newest generation of USB peripherals. The USB controller functions as a full-speed USB peripheral device.
Integrating the USB physical interface (PHY) allows
direct connection to the USB cable, reducing board
space and overall system cost. A system interrupt can
be enabled to signal that the USB needs to be serviced.
The CPU communicates to the USB controller module
through the SFR interface. The microcontroller is seen
HFXIN
CLOCK CIRCUIT
STOP
RF
HFXOUT
C1
C2
RF = 1MI Q50%
C1 = C2 = 12pF
Figure 3. On-Chip Oscillator
26
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
pin to GND. The clock source should be driven through
a CMOS driver. If the clock driver is a TTL gate, its output
must be connected to VDD through a pullup resistor to
ensure a satisfactory logic level for active clock pulses.
To minimize system noise on the clock circuitry, the
external clock source must meet the maximum rise and
fall times and the minimum high and low times specified
for the clock source. The external noise can affect the
clock generation circuit if these parameters do not meet
the specification.
Noise at HFXIN and HFXOUT can adversely affect onchip clock timing. It is good design practice to place
the crystal and capacitors as near the oscillator circuitry
as possible with a direct short trace. The typical values
of external capacitors vary with the type of crystal to be
used.
ROM Loader
The ROM loader loads program memory and configures loader-specific configuration features. To increase
the security of the system, the loader denies access to
the system, user loader, or user-application memories
unless an area-specific password is provided.
Loading Flash Memory
An internal bootstrap loader allows reloading over a
simple JTAG interface. As a result, software can be
upgraded in-system, eliminating the need for a costly
hardware retrofit when updates are required. Remote
software uploads are possible that enable physically
inaccessible applications to be frequently updated. The
interface hardware can be a JTAG connection to another
microcontroller, or a connection to a PC serial port using
a USB-to-JTAG converter such as the MAXQUSBJTAGKIT#, available from Maxim. If in-system programmability is not required, a commercial gang programmer can
be used for mass programming. Activating the JTAG
interface and loading the test access port (TAP) with the
system programming instruction invokes the bootstrap
loader. Setting the SPE bit to one during reset through
the JTAG interface executes the bootstrap-loader mode
program that resides in the utility ROM. When programming is complete, the bootstrap loader can clear the SPE
bit and reset the device, allowing the device to bypass
the utility ROM and begin execution of the application
software.
In addition, the ROM loader also enforces the memoryprotection policies. Passwords that are 16 words are
required to access the ROM loader interface.
Maxim Integrated
In-Application Flash Programming
From user-application code, flash memory can be programmed using the ROM utility functions from either C
or assembly language. The function declarations below
show examples of some of the ROM utility functions
provided for in-application flash memory programming:
/* Write one 16-bit word to code address ‘dest’.
* Dest must be aligned to 16 bits.
* Returns 0 = failure, 1 = OK.
*/
int flash_write (uint16_t dest, uint16_t data);
To erase, the following function would be used:
/* Erase the given Flash page
* addr: Flash offset (anywhere within page)
*/
int flash_erasepage(uint16_t addr);
The in-application flash memory programming must call
ROM utility functions to erase and program any of the
flash memory. Memory protection is enforced by the
ROM utility functions.
In-Circuit Debug and JTAG
Interface
Embedded debug hardware and software are developed and integrated to provide full in-circuit debugging
capability in a user-application environment. These hardware and software features include the following:
• Debug engine
• S
et of registers providing the ability to set breakpoints
on register, code, or data using debug service routines stored in ROM
Collectively, these hardware and software features support two modes of in-circuit debug functionality:
• Background mode:
CPU is executing the normal user program
Allows the host to configure and set up the in-circuit
debugger
• Debug mode:
Debugger takes over the control of the CPU
Read/write accesses to internal registers and memory
Single-step of the CPU for trace operation
The interface to the debug engine is the TAP controller. The interface allows for communication with a bus
27
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
then (VDDIO = VDDB)
else (VDDIO = VDD)
DEBUG
SERVICE
ROUTINES
(UTILITY ROM)
MAXQ612
MAXQ622
CPU
DEBUG
ENGINE
TMS
TCK
TDI
TDO
CONTROL
BREAKPOINT
ADDRESS
DATA
TAP
CONTROLLER
• C
ase 1: The device is powered from VDD and
the batteries are removed. Power decays until the
power-fail-reset trip point is hit, then the part goes into
low-power mode.
• C
ase 2: The device is set to be powered from VDD
only, it is connected to USB, and the batteries are
removed. Response is identical to Case 1.
Figure 4. In-Circuit Debugger
master that can either be automatic test equipment or a
component that interfaces to a higher level test bus as
part of a complete system. The communication operates
across a 4-wire serial interface from a dedicated TAP
that is compatible with the JTAG IEEE Standard 1149.
The TAP provides an independent serial channel to communicate synchronously with the host system.
To prevent unauthorized access of the protected memory regions through the JTAG interface, the debug engine
prevents modification of the privilege registers and
disallows all access to system memory, unless memory
protection is disabled. In addition, all services (such as
register display or modification) are denied when code
is executing inside the system area.
Operating Modes
Power-Supply Selection
For maximum flexibility the microcontroller can be powered by either the USB (VBUS) or VDD. When a USB
connection is made to a valid VBUS power source, an
internal voltage regulator generates a 3.3V supply voltage. When the internal voltage is at an adequate level, it
automatically powers itself from the USB supply. This is
especially beneficial in systems where the VDD supply is
from a battery. In either case, the chip is fully functional
when operating from either the battery or the VBUS.
The power monitor is attached to the switched supply,
VDDIO. This supply is equivalent to the higher of VDDB or
VDD. This can be expressed as follows:
If (VDDB > 3.0V or VDDB > VDD)
28
This means that if there is a power-fail event on VDD and
the device is not powered from VBUS, it causes a powerfail interrupt (PFI) if enabled. If the device is powered by
VBUS and there is a supply on VDD, then no power-fail
event is triggered. If the device is powered by VBUS
and there is no supply on VDD and VBUS fails, the chip
attempts to switch to VDD, detects a power-fail event,
and a PFI occurs. Some specific examples are given
below:
• C
ase 3: The device is set to be powered from either
VDD or VBUS, it is connected to USB, and the batteries are removed. Because the part is already
powered from VBUS, nothing changes. If the USB
port is subsequently disconnected, power switches
over to VDD, the supply decays to the power-fail-reset
trip point, and the part goes into low-power mode. As
long as there is sufficient charge on the VDD bypass
capacitor, it supports the part in power-fail. The holdup time is similar to the MAXQ610 since the USB
port is powered only by VBUS. Note that if the part is
powered from VBUS and no battery has been present
for a long time (VDD = 0), then upon USB port disconnection, the power collapses to ground in less than a
second.
Stop Mode
The lowest power mode of operation is stop mode. In this
mode, CPU state and memories are preserved, but the
CPU is not actively running. Wake-up sources include
external I/O interrupts, the power-fail warning interrupt,
wake-up timer, or a power-fail reset. Any time the microcontroller is in a state where code does not need to be
executed, the user software can put the microcontroller
into stop mode. The nanopower ring oscillator is an internal ultra-low-power (400nA) 8kHz ring oscillator that can
be used to drive a wake-up timer that exits stop mode.
The wake-up timer is programmable by software in steps
of 125Fs up to approximately 8s.
The power-fail monitor is always on during normal operation. However, it can be selectively disabled during stop
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Table 4. Power-Fail Warning Level Selection
PWCN.PFWARNCN[1:0]
PFW THRESHOLD
(V)
00
1.8
01
1.9
10
2.55
11
2.75
mode to minimize power consumption. This feature is
enabled using the power-fail monitor disable (PFD) bit
in the PWCN register. The reset default state for the PFD
bit is 1, which disables the power-fail monitor function
during stop mode. If power-fail monitoring is disabled
(PFD = 1) during stop mode, the circuitry responsible
for generating a power-fail warning or reset is shut down
and neither condition is detected. Thus, the VDD < VRST
condition does not invoke a reset state. However, in the
event that VDD falls below the POR level, a POR is generated. The power-fail monitor is enabled prior to stop
mode exit and before code execution begins. If a powerfail warning condition (VDD < VPFW) is then detected,
the power-fail interrupt flag is set on stop mode exit. If a
power-fail reset condition is detected (VDD < VRST), the
CPU goes into reset.
VDD
t < tPFW
t ≥ tPFW
Power-Fail Warning
The power-fail monitor can assert an interrupt if the voltage falls below a configurable threshold between the
operating voltage and the reset voltage. This, if enabled,
can allow the firmware to perform housekeeping tasks if
the voltage level decays below the warning threshold.
The power-fail threshold value should only be changed
when the power-fail warning interrupt is disabled (CKCN.
PFIE = 0) to prevent unintended triggering of the powerfail warning condition.
The power-fail warning threshold is reset to 1.8V by a
POR and is not affected by other resets. See Table 4.
Power-Fail Detection
Figures 5, 6, and 7 show the power-fail detection and
response during normal and stop-mode operation.
If a reset is caused by a power-fail, the power-fail monitor
can be set to one of the following intervals:
• Always on—continuous monitoring
• 211 nanopower ring oscillator clocks (~256ms)
• 212 nanopower ring oscillator clocks (~512ms)
• 213 nanopower ring oscillator clocks (~1.024s)
In the case where the power-fail circuitry is periodically
turned on, the power-fail detection is turned on for two
t ≥ tPFW
t ≥ tPFW
C
VPFW
G
VRST
E
F
B
H
D
VPOR
I
A
INTERNAL RESET
(ACTIVE HIGH)
Figure 5. Power-Fail Detection During Normal Operation
Maxim Integrated
29
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Table 5. Power-Fail Detection States During Normal Operation
STATE
POWER-FAIL
INTERNAL
REGULATOR
CRYSTAL
OSCILLATOR
SRAM
RETENTION
A
On
Off
Off
—
VDD < VPOR.
B
On
On
On
—
VPOR < VDD < VRST.
Crystal warmup time, tXTAL_RDY.
CPU held in reset.
C
On
On
On
—
VDD > VRST.
CPU normal operation.
D
On
On
On
—
Power drop too short.
Power-fail not detected.
—
VRST < VDD < VPFW.
PFI is set when VRST < VDD < VPFW and
maintains this state for at least tPFW, at
which time a power-fail interrupt is generated (if enabled).
CPU continues normal operation.
E
On
F
On
(Periodically)
On
Off
On
On
Off
On
Yes
G
On
H
On
(Periodically)
Off
Off
Yes
I
Off
Off
Off
—
nanopower ring-oscillator cycles. If VDD > VRST during
detection, VDD is monitored for an additional nanopower
ring-oscillator period. If VDD remains above VRST for
the third nanopower ring period, the CPU exits the reset
state and resumes normal operation from utility ROM at
8000h after satisfying the crystal warmup period.
30
—
COMMENTS
VPOR < VDD < VRST.
Power-fail detected.
CPU goes into reset.
Power-fail monitor turns on periodically.
VDD > VRST.
Crystal warmup time, tXTAL_RDY.
CPU resumes normal operation from
8000h.
VPOR < VDD < VRST.
Power-fail detected.
CPU goes into reset.
Power-fail monitor turns on periodically.
VDD < VPOR.
Device held in reset. No operation allowed.
If a reset is generated by any other event, such as the
RESET pin being driven low externally or the watchdog
timer, the power-fail, internal regulator, and crystal
remain on during the CPU reset. In these cases, the CPU
exits the reset state in less than 20 crystal cycles after
the reset source is removed.
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
VDD
t < tPFW
A
t ≥ tPFW
t ≥ tPFW
VPFW
D
VRST
B
C
E
VPOR
F
STOP
INTERNAL RESET
(ACTIVE HIGH)
Figure 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled
Table 6. Stop Mode Power-Fail Detection States with Power-Fail Monitor Enabled
STATE
POWER-FAIL
INTERNAL
REGULATOR
CRYSTAL
OSCILLATOR
SRAM
RETENTION
A
On
Off
Off
Yes
Application enters stop mode.
VDD > VRST.
CPU in stop mode.
B
On
Off
Off
Yes
Power drop too short.
Power-fail not detected.
COMMENTS
C
On
On
On
Yes
VRST < VDD < VPFW.
Power-fail warning detected.
Turn on regulator and crystal.
Crystal warmup time, tXTAL_RDY.
Exit stop mode.
D
On
Off
Off
Yes
Application enters stop mode.
VDD > VRST.
CPU in stop mode.
E
On
(Periodically)
Off
Off
Yes
VPOR < VDD < VRST.
Power-fail detected.
CPU goes into reset.
Power-fail monitor turns on periodically.
F
Off
Off
Off
—
Maxim Integrated
VDD < VPOR.
Device held in reset. No operation allowed.
31
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
VDD
A
D
VPFW
B
VRST
C
E
VPOR
F
STOP
INTERNAL RESET
(ACTIVE HIGH)
INTERRUPT
Figure 7. Stop Mode Power-Fail Detection with Power-Fail Monitor Disabled
Table 7. Stop Mode Power-Fail Detection States with Power-Fail Monitor Disabled
STATE
POWER-FAIL
INTERNAL
REGULATOR
CRYSTAL
OSCILLATOR
SRAM
RETENTION
A
Off
Off
Off
Yes
Application enters stop mode.
VDD > VRST.
CPU in stop mode.
B
Off
Off
Off
Yes
VDD < VPFW.
Power-fail not detected because power-fail
monitor is disabled.
Yes
VRST < VDD < VPFW.
An interrupt occurs that causes the CPU to
exit stop mode.
Power-fail monitor is turned on, detects a
power-fail warning, and sets the power-fail
interrupt flag.
Turn on regulator and crystal.
Crystal warmup time, tXTAL_RDY.
On stop mode exit, CPU vectors to the
higher priority of power-fail and the interrupt that causes stop mode exit.
C
32
On
On
On
COMMENTS
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Table 7. Stop Mode Power-Fail Detection States with Power-Fail Monitor Disabled
(continued)
STATE
POWER-FAIL
INTERNAL
REGULATOR
CRYSTAL
OSCILLATOR
SRAM
RETENTION
D
Off
Off
Off
Yes
Application enters stop mode.
VDD > VRST.
CPU in stop mode.
COMMENTS
E
On
(Periodically)
Off
Off
Yes
VPOR < VDD < VRST.
An interrupt occurs that causes the CPU to
exit stop mode.
Power-fail monitor is turned on, detects a
power-fail, and puts CPU in reset.
Power-fail monitor is turned on periodically.
F
Off
Off
Off
—
VDD < VPOR.
Device held in reset. No operation allowed.
Applications Information
The low-power, high-performance RISC architecture of
this device makes it an excellent fit for many portable
or battery-powered applications. It is ideally suited for
applications such as universal remote controls that
require the cost-effective integration of IR transmit/
receive capability.
Grounds and Bypassing
purpose I/O pins. Negative voltage spikes on power pins
are especially problematic as they directly couple to the
internal power buses. Devices such as keypads can
conduct electrostatic discharges directly into the microcontroller and seriously damage the device. System
designers must protect components against these transients that can corrupt system memory.
Additional Documentation
Careful PCB layout significantly minimizes system-level
digital noise that could interact with the microcontroller
or peripheral components. The use of multilayer boards
is essential to allow the use of dedicated power planes.
The area under any digital components should be a continuous ground plane if possible. Keep bypass capacitor
leads short for best noise rejection and place the capacitors as close to the leads of the devices as possible.
Designers must have the following documents to fully
use all the features of this device. This data sheet
contains pin descriptions, feature overviews, and electrical specifications. Errata sheets contain deviations
from published specifications. The user’s guides offer
detailed information about device features and operation. The following documents can be downloaded from
www.maximintegrated.com/microcontrollers.
CMOS design guidelines for any semiconductor require
that no pin be taken above VDD or below GND. Violation
of this guideline can result in a hard failure (damage to
the silicon inside the device) or a soft failure (unintentional modification of memory contents). Voltage spikes
above or below the device’s absolute maximum ratings
can potentially cause a devastating IC latchup.
• T
his MAXQ612/MAXQ622 data sheet, which contains
electrical/timing specifications and pin descriptions.
Microcontrollers commonly experience negative voltage spikes through either their power pins or general-
Maxim Integrated
• T
he MAXQ612 /MAXQ622 revision-specific errata sheet
(www.maximintegrated.com/errata).
• T
he MAXQ622 User’s Guide, which contains detailed
information on features and operation, including programming.
33
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Block Diagram
MAXQ612/MAXQ622
16-BIT MAXQ
RISC CPU
REGULATOR
VOLTAGE
MONITOR
GPIO
USB SIE*
TXCVR
IR DRIVER
6KB ROM
SECURE MMU
CLOCK
128KB FLASH
WATCHDOG
6KB SRAM
2x
16-BIT TIMER
8kHz NANO
RING
IR TIMER
2x SPI
2x USART
I2C
*MAXQ622 ONLY.
Development and
Technical Support
Maxim and third-party suppliers provide a variety of
highly versatile, affordably priced development tools for
this microcontroller, including the following:
• Compilers
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maximintegrated.com/packages.
Note that a “+”, “#”, or “-” in the package code indicates RoHS
status only. Package drawings may show a different suffix
character, but the drawing pertains to the package regardless
of RoHS status.
PACKAGE
TYPE
• In-circuit emulators
• Integrated Development Environments (IDEs)
• J TAG-to-serial converters for programming and
debugging
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
64 LQFP
C64+5
21-0083
90-0141
44 TQFN-EP
T4477+2
21-0144
90-0127
A partial list of development tool vendors can be found at
www.maximintegrated.com/MAXQ_tools.
For technical support, go to https://support.maximintegrated.com/micro.
Ordering Information/Selector Guide
PART
TEMP RANGE
OPERATING
VOLTAGE (V)
PROGRAM
MEMORY (KB)
DATA
MEMORY (KB)
USB FULL
SPEED
PIN-PACKAGE
MAXQ612J-0000+
0NC to +70NC
1.7 to 3.6
128 Flash
6
No
44 TQFN-EP*
MAXQ612G-0000+
0NC to +70NC
1.7 to 3.6
128 Flash
6
No
64 LQFP
MAXQ622G-0000+
0NC to +70NC
1.7 to 3.6
128 Flash
6
Yes
64 LQFP
Note: The 4-digit suffix “-0000” indicates a microcontroller in the default state with the flash memory unprogrammed. Any value other
than 0000 indicates a device preprogrammed at Maxim with proprietary customer-supplied software. For more information on factory
preprogramming of these devices, contact Maxim at https://support.maximintegrated.com/micro. Information on masked ROM devices
and bare die versions for most of these devices are available. Contact the factory for availability.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
34
Maxim Integrated
MAXQ612/MAXQ622
16-Bit Microcontrollers with
Infrared Module and Optional USB
Revision History
REVISION
NUMBER
REVISION
DATE
0
2/10
Initial release
—
1
5/10
Changed the VDDIOH spec for IOH from IOH = 20mA to IOH = 10mA in the
Recommended Operating Conditions table
5
2
5/11
Added the Pin Descriptions—Bare Die table
DESCRIPTION
PAGES
CHANGED
18–21
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and
max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
© 2011
Maxim Integrated Products, Inc.
35
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
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