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MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
LOW THERMAL STRESS STRUCTURE - PASS 5 CYCLE (-55 C TO +150 C) THERMAL SHOCK TEST
DIOTEC ELECTRONICS CORP
2#¢1 ¢¤§¨0)&"! ¢¤§¨¦ ¥ £¤¢ © ¦('% $# © ¡ D SEU T&Q P)¢GEC)¤4 A¤86¤53 SR IHF D B @97 4 i v u s r i gf d b ` Y W cg wE¨t 0¤q pEch¤e 0caX¢XV
PROPRIETARY HIGH TEMPERATURE JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
PRESS FIT INTO HEAT SINK TO FURTHER ENHANCE HEAT HANDLING CAPABILITY
HUGE ROUND DIE FOR ULTRA HIGH POWER & HEAVY DUTY PERFORMANCE
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 5% of Die Area)
MECHANICAL DATA
FEATURES
75 AMP PRESS FIT HIGH VOLTAGE DIODES
0.505”/502” OVER KNURL
0.007” 0.005”
DT B7504A 0452
70 Typ.
MECHANICAL SPECIFICATION
78 Places Equally Spaced
_ 0.052” + 0.002”
ALL DIMENSIONS IN INCHES
RoH
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0.173” 0.157”
0.194” 0.184”
Data Sheet No. B75PF-1A
AN PLI OM SC
ROUND DIE 0.250”
0.401” 0.385” 0.039” 0.031”
1.02” 0.98”
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