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S24SA05006NTFB

S24SA05006NTFB

  • 厂商:

    DELTA(台达)

  • 封装:

  • 描述:

    S24SA05006NTFB - Delphi Series S24SA, 2”x1” Family DC/DC Power Modules: 18~36Vin, 1.2V, 12A out - De...

  • 数据手册
  • 价格&库存
S24SA05006NTFB 数据手册
FEATURES High efficiency: 85.5% @ 1.2V/ 12A Size: 47.2mm x 29.5mm x 8.5mm (1.86" x 1.16" x 0.33") Low profile: 0.33" Industry standard footprint and pin out Surface mountable Fixed frequency operation Input UVLO, Output OCP, OVP, OTP No minimum load required 2:1 input voltage range Basic insulation 2250 isolation ISO 9001, TL 9000, ISO 14001, QS9000, OHSAS18001 certified manufacturing facility UL/cUL 60950 (US & Canada) recognized, and TUV (EN60950) certified Delphi Series S24SA, 2”x1” Family DC/DC Power Modules: 18~36Vin, 1.2V, 12A out The Delphi Series S24SA, surface mountable, 24V input, single output, isolated DC/DC converter is the latest offering from a world leader in power system and technology and manufacturing -- Delta Electronics, Inc. This product family provides up to 36 watts of power or up to 12A of output current (for output voltage 1.8V or below) in a low profile 2”x1” industry standard form factor and pinout. The S24SA operates from a wide input range of 18V to 36V, output ranges from 1.2V to 12V. For 1.2V at 12A full load, the efficiency is up to 85.5%. With creative design technology and optimization of component placement, these converters possess outstanding electrical and thermal performance, as well as extremely high reliability under highly stressful operating conditions. All models are protected from abnormal input/output voltage and current conditions, and feature 2250V input/output isolation and basic insulation. OPTIONS Positive on/off logic SMD or Through hole mounting APPLICATIONS Telecom/DataCom Wireless Networks Optical Network Equipment Server and Data Storage Industrial/Test Equipment DATASHEET DS_S24SA1R212_05102006 Delta Electronics, Inc. TECHNICAL SPECIFICATIONS (TA=25°C, airflow rate=200 LFM, Vin=24Vdc, nominal Vout unless otherwise noted.) PARAMETER ABSOLUTE MAXIMUM RATINGS Input Voltage Continuous Operating Temperature Storage Temperature Input/Output Isolation Voltage INPUT CHARACTERISTICS Operating Input Voltage Input Under-Voltage Lockout Turn-On Voltage Threshold Turn-Off Voltage Threshold Lockout Hysteresis Voltage Maximum Input Current No-Load Input Current Off Converter Input Current Inrush Current(I2t) Input Reflected-Ripple Current Input Voltage Ripple Rejection OUTPUT CHARACTERISTICS Output Voltage Set Point Output Voltage Regulation Over Load Over Line Over Temperature Total Output Voltage Range Output Voltage Ripple and Noise Peak-to-Peak RMS Operating Output Current Range Output DC Current-Limit Inception DYNAMIC CHARACTERISTICS Output Voltage Current Transient Positive Step Change in Output Current Negative Step Change in Output Current Settling Time to 1% of Final value Turn-On Transient Start-Up Time, From On/Off Control Start-Up Time, From Input Maximum Output Capacitance EFFICIENCY 100% Load ISOLATION CHARACTERISTICS Isolation Voltage Isolation Resistance Isolation Capacitance FEATURE CHARACTERISTICS Switching Frequency ON/OFF Control, (Logic Low-Module ON) Logic Low Logic High ON/OFF Current Leakage Current Output Voltage Trim Range Output Over-Voltage Protection(Hiccup) GENERAL SPECIFICATIONS Calculated MTBF Weight Over-Temperature Shutdown NOTES and CONDITIONS Min. -0.3 -40 -55 18 13 1 100% Load, 18Vin S24SA1R212NRFA Typ. Max. Units 50 110 125 2250 24 17 15 2 40 7 0.01 5 50 1.17 1.20 ±2 ±2 100 1.15 20 5 0 13.2 30 30 200 1.23 ±10 ±5 300 1.25 50 15 12 18 75 75 12 12 2200 85.5 2250 10 1500 330 36 18 3 2.2 Vdc °C °C Vdc V V V V A mA mA A2s mA dB V mV mV ppm/℃ V mV mV A A mV mV µs ms ms µF % V MΩ pF kHz 0.8 15 1 50 +10 160 6.2 18 115 V V mA uA % % Mhours grams °C Please refer to Fig. 18 For measuring point P-P thru 12µH inductor, 5Hz to 20MHz 120 Hz Vin=24V, Io=50%Io.max, Ta=25℃ Io=Io,min to Io,max Vin=18V to36V Ta=-40℃ to 85℃ Over sample load, line and temperature 5Hz to 20MHz bandwidth Full Load, 1µF ceramic, 10µF tantalum Full Load, 1µF ceramic, 10µF tantalum Output Voltage 10% Low 24V, 10µF Tan & 1µF Ceramic load cap, 0.1A/µs 50% Io,max to 75% Io,max 75% Io,max to 50% Io.max Full load; 5% overshoot of Vout at startup Von/off at Ion/off=1.0mA Von/off at Ion/off=0.0 µA Ion/off at Von/off=0.0V Logic High, Von/off=15V Across Trim Pin & +Vo or –Vo, Pout≦max rated Over full temp range; % of nominal Vout Io=80% of Io, max; Ta=25°C, Airflow=200LFM Please refer to Fig.18 For measuring point 0 -10 115 2 DS_S24SA1R212_05102006 ELECTRICAL CHARACTERISTICS CURVES POW ER DISSIPATION ( W ) EFFI CIENCY (%) 95 90 85 80 75 70 65 60 55 50 45 40 1 2 3 4 5 6 7 8 9 10 11 12 18Vin 24Vin 36Vin 4.0 3.5 3.0 2.5 2.0 1.5 1.0 18Vin 0.5 0.0 1 2 3 4 5 6 7 8 9 24Vin 36Vin 10 11 12 OUTPUT CU RRENT ( A) OU TPUT C UR REN T (A) Figure 1: Efficiency vs. load current for minimum, nominal, and maximum input voltage at 25°C. INP UT CURRE NT (A ) Figure 2: Power dissipation vs. load current for minimum, nominal, and maximum input voltage at 25°C. 1.2 Io= 12A 1.0 0.8 0.6 0.4 0.2 0.0 15 20 25 Io= 7.2A Io= 1.2A 30 35 INPUT V OLT AGE (V ) Figure 3: Typical input characteristics at room temperature. Figure 4: Turn-on transient at full rated load current (1 ms/div). Top Trace: Vout (500mV/div); Bottom Trace: ON/OFF Control (5V/div). 3 DS_S24SA1R212_05102006 ELECTRICAL CHARACTERISTICS CURVES Figure5: Turn-on transient at zero load current (1 ms/div). Top Trace: Vout (500mV/div); Bottom Trace: ON/OFF Control (5V/div). Figure 6: Output voltage response to step-change in load current (50%-75% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF, 100 mΩESR tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (50mV/div), Bottom Trace: Iout (5A/div). is Vi (+) Cs : 220uF ESR < 0.1 Ω @20℃ 100KHZ Cs :100uF ESR < 0.5 Ω @20℃ 100KHZ Vi (-) Figure 7: Output voltage response to step-change in load current (75%-50% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF, 100 mΩESR tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (50mV/div), Bottom Trace: Iout 5A/div). Figure 8: Test set-up diagram showing measurement points for Input Reflected Ripple Current (Figure 9). Note: Measured input reflected-ripple current with a simulated source Inductance (LTEST) of 12 µH. Capacitor Cs offset possible battery impedance. 4 DS_S24SA1R212_05102006 ELECTRICAL CHARACTERISTICS CURVES Copper Strip Vo(+) 10u Vo(-) 1u SCOPE RESISTIVE LOAD Figure 9: Input Reflected Ripple Current, is, at full rated output current and nominal input voltage with 12µH source impedance and 100µF electrolytic capacitor (2 mA/div). Figure 10: Output voltage noise and ripple measurement test setup. Scope measurement should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module. OU TPU T VOLTAGE ( V) 1.4 1.2 1.0 0.8 0.6 0.4 Vi n= 24V 0.2 0.0 0 .0 2 .0 4.0 6.0 8.0 10.0 12.0 1 4.0 1 6.0 LOAD C URRENT ( A) Figure 11: Output voltage ripple at nominal input voltage and rated load current (10 mV/div). Load capacitance: 1µF ceramic capacitor and 10µF tantalum capacitor. Bandwidth: 20 MHz. Figure 12: Output voltage vs. load current showing typical current limit curves and converter shutdown points. 5 DS_S24SA1R212_05102006 DESIGN CONSIDERATIONS Input Source Impedance The impedance of the input source connecting to the DC/DC power modules will interact with the modules and affect the stability. A low ac-impedance input source is recommended. If the source inductance is more than a few µH, we advise adding a 10 to 100 µF electrolytic capacitor (ESR < 0.7 Ω at 100 kHz) mounted close to the input of the module to improve the stability. This power module is not internally fused. To achieve optimum safety and system protection, an input line fuse is highly recommended. The safety agencies require a normal-blow fuse with 5A maximum rating to be installed in the ungrounded lead. A lower rated fuse can be used based on the maximum inrush transient energy and maximum input current. Soldering and Cleaning Considerations Post solder cleaning is usually the final board assembly process before the board or system undergoes electrical testing. Inadequate cleaning and/or drying may lower the reliability of a power module and severely affect the finished circuit board assembly test. Adequate cleaning and/or drying is especially important for un-encapsulated and/or open frame type power modules. For assistance on appropriate soldering and cleaning procedures, please contact Delta’s technical support team. Layout and EMC Considerations Delta’s DC/DC power modules are designed to operate in a wide variety of systems and applications. For design assistance with EMC compliance and related PWB layout issues, please contact Delta’s technical support team. An external input filter module is available for easier EMC compliance design. Application notes to assist designers in addressing these issues are pending release. Safety Considerations The power module must be installed in compliance with the spacing and separation requirements of the enduser’s safety agency standard if the system in which the power module is to be used must meet safety agency requirements. When the input source is 60Vdc or below, the power module meets SELV (safety extra-low voltage) requirements. If the input source is a hazardous voltage which is greater than 60 Vdc and less than or equal to 75 Vdc, for the module’s output to meet SELV requirements, all of the following must be met: The input source must be insulated from any hazardous voltages, including the ac mains, with reinforced insulation. One Vi pin and one Vo pin are grounded, or all the input and output pins are kept floating. The input terminals of the module are not operator accessible. A SELV reliability test is conducted on the system where the module is used to ensure that under a single fault, hazardous voltage does not appear at the module’s output. Do not ground one of the input pins without grounding one of the output pins. This connection may allow a nonSELV voltage to appear between the output pin and ground. 6 DS_S24SA1R212_05102006 FEATURES DESCRIPTIONS Over-Current Protection The modules include an internal output over-current protection circuit, which will endure current limiting for an unlimited duration during output overload. If the output current exceeds the OCP set point, the modules will automatically shut down (hiccup mode). The modules will try to restart after shutdown. If the overload condition still exists, the module will shut down again. This restart trial will continue until the overload condition is corrected. Vi(+) Vo(+) Sense(+) ON/OFF Sense(-) Vi(-) Vo(-) Figure 13: Remote on/off implementation Remote Sense (Optional) Remote sense compensates for voltage drops on the output by sensing the actual output voltage at the point of load. The voltage between the remote sense pins and the output terminals must not exceed the output voltage sense range given here: [Vo(+) – Vo(–)] – [SENSE(+) – SENSE(–)] ≤ 10% × Vout Over-Voltage Protection The modules include an internal output over-voltage protection circuit, which monitors the voltage on the output terminals. If this voltage exceeds the overvoltage set point, the module will shut down (Hiccup mode). The modules will try to restart after shutdown. If the fault condition still exists, the module will shut down again. This restart trial will continue until the fault condition is corrected. This limit includes any increase in voltage due to remote sense compensation and output voltage set point adjustment (trim). Over-Temperature Protection The over-temperature protection consists of circuitry that provides protection from thermal damage. If the temperature exceeds the over-temperature threshold the module will shut down. The module will try to restart after shutdown. If the overtemperature condition still exists during restart, the module will shut down again. This restart trial will continue until the temperature is within specification. Vi(+) Vo(+) Sense(+) Sense(-) Contact Resistance Vi(-) Vo(-) Contact and Distribution Losses Remote On/Off The remote on/off feature on the module can be either negative or positive logic. Negative logic turns the module on during a logic low and off during a logic high. Positive logic turns the modules on during a logic high and off during a logic low. Remote on/off can be controlled by an external switch between the on/off terminal and the Vi(-) terminal. The switch can be an open collector or open drain. For negative logic if the remote on/off feature is not used, please short the on/off pin to Vi(-). For positive logic if the remote on/off feature is not used, please leave the on/off pin floating. Figure 14: Effective circuit configuration for remote sense operation If the remote sense feature is not used to regulate the output at the point of load, please connect SENSE(+) to Vo(+) and SENSE(–) to Vo(–) at the module. The output voltage can be increased by both the remote sense and the trim; however, the maximum increase is the larger of either the remote sense or the trim, not the sum of both. When using remote sense and trim, the output voltage of the module is usually increased, which increases the power output of the module with the same output current. Care should be taken to ensure that the maximum output power does not exceed the maximum rated power. 7 DS_S24SA1R212_05102006 FEATURES DESCRIPTIONS (CON.) Output Voltage Adjustment (TRIM) To increase or decrease the output voltage set point, the modules may be connected with an external resistor between the TRIM pin and either the Vo+ or Vo -. The TRIM pin should be left open if this feature is not used. Rtrim − up = 15.9(100 + ∆Vo%) − 1089 − 62[ΚΩ] ∆Vo% Ex. When trim-up +10% (1.2V X 1.1 = 1.32V) 15.9(100 + 10) − 1089 − 62 = 4[ΚΩ ] 10 Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. Rtrim − up = Figure 15: Circuit configuration for trim-down (decrease output voltage) If the external and Vo- pins, The external percentage of as: Rtrim − down = resistor is connected between the TRIM the output voltage set point decreases. resistor value required to obtain a output voltage change △Vo% is defined 1089 − 62[ΚΩ ] ∆Vo% Ex. When trim-down –10% (1.2V X 0.9 = 1.08V) 1089 Rtrim − down = − 62 = 46.9[ΚΩ] 10 Figure 16: Circuit configuration for trim-up (increase output voltage) If the external resistor is connected between the TRIM and Vo+ pins, the output voltage set point increases. The external resistor value required to obtain a percentage output voltage change △Vo% is defined as: 8 DS_S24SA1R212_05102006 THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel. THERMAL CURVES Thermal Testing Setup Delta’s DC/DC power modules are characterized in heated vertical wind tunnels that simulate the thermal environments encountered in most electronics equipment. This type of equipment commonly uses vertically mounted circuit cards in cabinet racks in which the power modules are mounted. The following figure shows the wind tunnel characterization setup. The power module is mounted on a test PWB and is vertically positioned within the wind tunnel. The space between the neighboring PWB and the top of the power module or a heat sink is 6.35mm (0.25”). Figure 18: Hot spot temperature measured point *The allowed maximum hot spot temperature is defined at 110℃ Output Current(A) S24SA1R212NR (Standard) Output Current vs. Ambient Temperature and Air Velocity (Either Orientation) 12 10 Natural Convection 7 100LFM 200LFM Thermal Derating Heat can be removed by increasing airflow over the module. The module’s maximum hot spot temperature is To. To enhance system reliability, the power module should always be operated below the maximum operating temperature. If the temperature exceeds the maximum module temperature, reliability of the unit may be affected. FACING PW B PW B MODULE 5 300LFM 2 0 50 55 60 65 70 75 80 85 Ambient Temperature (℃) Figure 19: Output current vs. ambient temperature and air velocity (Either Orientation) AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED BELOW THE MODULE AIR FLOW 50.8 (2.0”) 10 (0.4”) Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches) Figure 17: Wind tunnel test setup 9 DS_S24SA1R212_05102006 PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL RECOMMENDED PAD LAYOUT (SMD) 10 DS_S24SA1R212_05102006 LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE 2nd Ramp-up temp. Peak temp. 1.0~3.0°C /sec. 210~230°C 5sec. Pre-heat temp. 140~180°C 60~120 sec. Cooling down rate
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