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S36SE3R305PKFB

S36SE3R305PKFB

  • 厂商:

    DELTA(台达)

  • 封装:

  • 描述:

    S36SE3R305PKFB - Delphi S36SE, 17W 1x1 Brick Series DC/DC Power Modules: 18~75V in, 3.3V/5A out - De...

  • 数据手册
  • 价格&库存
S36SE3R305PKFB 数据手册
FEATURES High efficiency: 86.5% @3.3V/5A Industry standard 1x1 pinout Size: 27.9x24.4x8.5mm (1.10”x0.96”x0.33”) Fixed frequency operation 4:1 ultra wide input voltage range Input UVLO Output OCP, OVP and OTP Monotonic startup into normal and pre-bias loads Output voltage trim ±10% 2250V isolation and basic insulation No minimum load required SMT and Through-hole versions ISO 9001, TL 9000, ISO 14001, QS9000, OHSAS18001 certified manufacturing facility UL/cUL 60950 (US & Canada) Recognized, and TUV (EN60950) certified. CE mark meets 73/23/EEC and 93/68/EEC directives Delphi S36SE, 17W 1x1 Brick Series DC/DC Power Modules: 18~75V in, 3.3V/5A out OPTIONS The Delphi S36SE series, 1x1 sized, 18~75Vin, single output, isolated DC/DC converters are the latest offering from a world leader in power systems technology and manufacturing  Delta Electronics, Inc. This product family is available in either a surface mount or through-hole package and provides up to 17 watts of power or 5A of output current (3.3V and below) in a standard 1x1 form factor (1.10”x0.96”x0.33”). The pinout is compatible with the popular industry standard 1x2 sized products. With creative design technology and optimization of component placement, these converters possess outstanding electrical and thermal performance, as well as extremely high reliability under highly stressful operating conditions. The S36SE 3.3V module could provide full output power without any airflow up to 85°C ambient temperature while keeping the component junction temperatures under most derating guidelines. Typical efficiency of 3.3V/5A module is better than 86.5% and all modules are fully protected from abnormal input/output voltage, current, and temperature conditions. Positive, negative, or no On/Off Trim pin OTP and Output OVP, OCP mode, Auto-restart (default) or latch-up Surface mounted pins Short pin lengths APPLICATIONS Optical Transport Data Networking Communications, including Wireless and traditional Telecom Servers DATASHEET DS_S36SE3R305_02152007 TECHNICAL SPECIFICATIONS TA = 25°C, airflow rate = 300 LFM, Vin = 48 Vdc, nominal Vout unless otherwise noted. PARAMETER ABSOLUTE MAXIMUM RATINGS Input Voltage Continuous Transient(100ms) Operating Temperature Storage Temperature Input/Output Isolation Voltage INPUT CHARACTERISTICS Operating Input Voltage Input Under-Voltage Lockout Turn-On Voltage Threshold Turn-Off Voltage Threshold Lockout Hysteresis Voltage Maximum Input Current No-Load Input Current Off Converter Input Current Inrush Current (I2t) Input Reflected-Ripple Current Input Voltage Ripple Rejection OUTPUT CHARACTERISTICS Output Voltage Set Point Output Voltage Regulation Over Load Over Line Over Temperature Total Output Voltage Range Output Voltage Ripple and Noise Peak-to-Peak RMS Operating Output Current Range Output DC Current-Limit Inception DYNAMIC CHARACTERISTICS Output Voltage Current Transient Positive Step Change in Output Current Negative Step Change in Output Current Settling Time (within 1% Vout nominal) Turn-On Transient Start-Up Time, From On/Off Control Start-Up Time, From Input Maximum Output Capacitance EFFICIENCY 100% Load 60% Load ISOLATION CHARACTERISTICS Input to Output Isolation Resistance Isolation Capacitance FEATURE CHARACTERISTICS Switching Frequency ON/OFF Control, Negative Remote On/Off logic Logic Low (Module On) Logic High (Module Off) ON/OFF Control, Positive Remote On/Off logic Logic Low (Module Off) Logic High (Module On) ON/OFF Current (for both remote on/off logic) Leakage Current (for both remote on/off logic) Output Voltage Trim Range Output Over-Voltage Protection GENERAL SPECIFICATIONS MTBF Weight Over-Temperature Shutdown NOTES and CONDITIONS S36SE3R305 (Standard) Min. Typ. Max. 80 100 123 125 2250 75 17 16 1 20 5 1 18 17 1.5 1.3 Units Vdc Vdc °C °C Vdc Vdc Vdc Vdc Vdc A mA mA A2s mA dB Vdc mV mV mV V mV mV A % mV mV us 25 25 1000 ms ms µF % % 2250 10 1000 450 Vdc MΩ pF kHz 0.8 18 0.8 18 0.25 -10% 3.79 TBD 9 128 30 10% 5 V V V V mA uA % V M hours grams °C 100ms Refer to Figure 20 for measuring point -40 -55 18 16 15 0.5 100% Load, 18Vin P-P thru 12µH inductor, 5Hz to 20MHz 120 Hz Vin=48V, Io=Io.max, Tc=25°C Io=Io, min to Io, max Vin=18V to 75V Tc=-40°C to 100°C Over sample load, line and temperature 5Hz to 20MHz bandwidth Full Load, 1µF ceramic, 10µF tantalum Full Load, 1µF ceramic, 10µF tantalum Output Voltage 10% Low 48V, 10µF Tan & 1µF Ceramic load cap, 0.1A/µs 50% Io.max to 75% Io.max 75% Io.max to 50% Io.max 3.25 8 60 3.3 ±3 ±3 ±33 3.2 60 10 0 110 120 150 150 300 16 16 5 130 3.35 ±10 ±10 3.4 Full load; 5% overshoot of Vout at startup 86.5 85.5 Von/off Von/off Von/off Von/off Ion/off at Von/off=0.0V Logic High, Von/off=15V Across Trim Pin & +Vo or –Vo, Pout≦max rated Over full temp range; Io=80% of Io, max; Ta=25°C, 300LFM Refer to Figure 20 for measuring point -0.7 2 -0.7 2 DS_S36SE3R305_02152007 2 ELECTRICAL CHARACTERISTICS CURVES Figure 1: Efficiency vs. load current for minimum, nominal, and maximum input voltage at 25°C. Figure 2: Power dissipation vs. load current for minimum, nominal, and maximum input voltage at 25°C. 1.4 1.2 1 0.8 0.6 0.4 0.2 0 15 20 25 30 35 40 45 50 55 60 65 70 75 INPUT VOLTAGE(V) Figure 3: Typical full load input characteristics at room temperature. INPUT CURRENT(A) Figure 4: (For negative remote on/off logic) Turn-on transient at full rated load current (5 ms/div). Vin=48V. Top Trace: Vout, 1V/div; Bottom Trace: ON/OFF input, 5V/div. Figure 5: (For negative remote on/off logic) Turn-on transient at zero load current (5 ms/div). Vin=48V. Top Trace: Vout, 1V/div, Bottom Trace: ON/OFF input, 5V/div. Figure 6: (For positive remote on/off logic) Turn-on transient at full rated load current (5 ms/div). Vin=48V. Top Trace: Vout, 1V/div; Bottom Trace: ON/OFF input, 5V/div. DS_S36SE3R305_02152007 3 ELECTRICAL CHARACTERISTICS CURVES (CON.) Figure 7: (For positive remote on/off logic)Turn-on transient at zero load current (5 ms/div). Vin=48V. Top Trace: Vout, 1V/div; Bottom Trace: ON/OFF input, 5V/div. Figure 8: Output voltage response to step-change in load current (75%-50% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (200mV/div, 100us/div), Bottom Trace: Iout (2A/div). Scope measurement should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module. Figure 9: Output voltage response to step-change in load current (50%-75% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (200mV/div, 100us/div), Bottom Trace: Iout (2A/div). Scope measurement should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module. Figure 10: Test set-up diagram showing measurement points for Input Terminal Ripple Current and Input Reflected Ripple Current. Note: Measured input reflected-ripple current with a simulated source Inductance (LTEST) of 12 µH. Capacitor Cs offset possible battery impedance. Measure current as shown below. DS_S36SE3R305_02152007 4 ELECTRICAL CHARACTERISTICS CURVES Figure 11: Input Terminal Ripple Current, ic, at full rated output current and nominal input voltage with 12µH source impedance and 33µF electrolytic capacitor (100mA/div, 2us/div) Figure 12: Input reflected ripple current, is, through a 12µH source inductor at nominal input voltage and rated load current (20 mA/div, 2us/div) Copper Strip Vo(+) 10u Vo(-) 1u SCOPE RESISTIVE LOAD Figure 13: Output voltage noise and ripple measurement test setup Figure 14: Output voltage ripple at nominal input voltage and rated load current (Io=5A)(50 mV/div, 5us/div).Load capacitance: 1µF ceramic capacitor and 10µF tantalum capacitor. Bandwidth: 20 MHz. Scope measurements should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module Figure 15: Output voltage vs. load current showing typical current limit curves and converter shutdown points DS_S36SE3R305_02152007 5 DESIGN CONSIDERATIONS Input Source Impedance The impedance of the input source connecting to the DC/DC power modules will interact with the modules and affect the stability. A low ac-impedance input source is recommended. If the source inductance is more than a few µH, we advise adding a 10 to 100 µF electrolytic capacitor (ESR < 0.7 Ω at 100 kHz) mounted close to the input of the module to improve the stability. The input source must be insulated from the ac mains by reinforced or double insulation. The input terminals of the module are not operator accessible. If the metal baseplate is grounded, one Vi pin and one Vo pin shall also be grounded. A SELV reliability test is conducted on the system where the module is used, in combination with the module, to ensure that under a single fault, hazardous voltage does not appear at the module’s output. When installed into a Class II equipment (without grounding), spacing consideration should be given to the end-use installation, as the spacing between the module and mounting surface have not been evaluated. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. This power module is not internally fused. To achieve optimum safety and system protection, an input line fuse is highly recommended. The safety agencies require a normal-blow fuse with 5A maximum rating to be installed in the ungrounded lead. A lower rated fuse can be used based on the maximum inrush transient energy and maximum input current. Layout and EMC Considerations Delta’s DC/DC power modules are designed to operate in a wide variety of systems and applications. For design assistance with EMC compliance and related PWB layout issues, please contact Delta’s technical support team. An external input filter module is available for easier EMC compliance design. Application notes to assist designers in addressing these issues are pending to release. Safety Considerations The power module must be installed in compliance with the spacing and separation requirements of the end-user’s safety agency standard, i.e., UL60950, CAN/CSA-C22.2 No. 60950-00 and EN60950: 2000 and IEC60950-1999, if the system in which the power module is to be used must meet safety agency requirements. Basic insulation based on 75 Vdc input is provided between the input and output of the module for the purpose of applying insulation requirements when the input to this DC-to-DC converter is identified as TNV-2 or SELV. An additional evaluation is needed if the source is other than TNV-2 or SELV. When the input source is SELV circuit, the power module meets SELV (safety extra-low voltage) requirements. If the input source is a hazardous voltage which is greater than 60 Vdc and less than or equal to 75 Vdc, for the module’s output to meet SELV requirements, all of the following must be met: Soldering and Cleaning Considerations Post solder cleaning is usually the final board assembly process before the board or system undergoes electrical testing. Inadequate cleaning and/or drying may lower the reliability of a power module and severely affect the finished circuit board assembly test. Adequate cleaning and/or drying is especially important for un-encapsulated and/or open frame type power modules. For assistance on appropriate soldering and cleaning procedures, please contact Delta’s technical support team. DS_S36SE3R305_02152007 6 FEATURES DESCRIPTIONS Over-Current Protection The modules include an internal output over-current protection circuit, which will endure current limiting for an unlimited duration during output overload. If the output current exceeds the OCP set point, the modules will automatically shut down, and enter hiccup mode or latch mode, which is optional. For hiccup mode, the module will try to restart after shutdown. If the overload condition still exists, the module will shut down again. This restart trial will continue until the overload condition is corrected. For latch mode, the module will latch off once it shutdown. The latch is reset by either cycling the input power or by toggling the on/off signal for one second. Remote On/Off The remote on/off feature on the module can be either negative or positive logic. Negative logic turns the module on during a logic low and off during a logic high. Positive logic turns the modules on during a logic high and off during a logic low. Remote on/off can be controlled by an external switch between the on/off terminal and the Vi(-) terminal. The switch can be an open collector or open drain. For negative logic if the remote on/off feature is not used, please short the on/off pin to Vi(-). For positive logic if the remote on/off feature is not used, please leave the on/off pin floating. Over-Voltage Protection The modules include an internal output over-voltage protection circuit, which monitors the voltage on the output terminals. If this voltage exceeds the over-voltage set point, the module will shut down, and enter in hiccup mode or latch mode, which is optional. For hiccup mode, the module will try to restart after shutdown. If the overload condition still exists, the module will shut down again. This restart trial will continue until the over-voltage condition is corrected. For latch mode, the module will latch off once it shutdown. The latch is reset by either cycling the input power or by toggling the on/off signal for one second. ON/OFF Vo(-) Vi(-) Vi( Vi(+) Trim R Load Vo(+) Figure 16: Remote on/off implementation Over-Temperature Protection The over-temperature protection consists of circuitry that provides protection from thermal damage. If the temperature exceeds the over-temperature threshold the module will shut down, and enter in hiccup mode or latch mode, which is optional. For auto-restart mode, the module will monitor temperature after shut down. Once the temperature is within the specification, the module will be auto-restarted. For latch mode, the module will latch off once it shutdown. The latch is reset by either cycling the input power or by toggling the on/off signal for one second. DS_S36SE3R305_02152007 7 FEATURES DESCRIPTIONS (CON.) Output Voltage Adjustment ON/OFF Vo (-) R trim-up Vi (-) Vi (+) Vo Vo (+) Trim R Load To increase or decrease the output voltage set point, the modules may be connected with an external resistor between the TRIM pin and either the Vo(+) or Vo(-). The TRIM pin should be left open if this feature is not used. ON/OFF Vo (-) Figure 18: Circuit configuration for trim-up (increase output voltage) R Vi (-) Trim R trim-down Load Vi (+) Vo Vo (+) Figure 17: Circuit configuration for trim-down (decrease output voltage) If the external resistor is connected between the TRIM and Vo(-) the output voltage set point increases (Fig. 18). The external resistor value required to obtain an output voltage change from 3.3V to the desired Vo_adj is defined as: 2.5 ⋅ 5110 Rtrim_up − 2050 Vo_adj − 3.3 Ex. When Trim-up +10% Vo_adj=3.3V×(1+10%)=3.63V Rtrim_up 2.5 ⋅ 5110 3.63 − 3.3 4 If the external resistor is connected between the TRIM and Vo(+) pins, the output voltage set point decreases (Fig. 17). The external resistor value required to obtain an output voltage change from 3.3V to the desired Vo_adj is defined as: Rtrim_down ( Vo_adj − 2.5 ) ⋅ 5110 3.3 − Vo_adj − 2050 − 2050 Rtrim_up = 3.666 × 10 ohm Ex. When Trim-down -10% Vo_adj=3.3V×(1-10%)=2.97V ( 2.97 − 2.5 ) ⋅ 5110 3.3 − 2.97 3 When using trim function, the output voltage of the module is usually increased, which increases the power output of the module with the same output current. − 2050 Rtrim_down Rtrim_down = 5.228 × 10 Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. ohm DS_S36SE3R305_02152007 8 THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel. Thermal Derating Heat can be removed by increasing airflow over the module. To enhance system reliability, the power module should always be operated below the maximum operating temperature. If the temperature exceeds the maximum module temperature, reliability of the unit may be affected. THERMAL CURVES Thermal Testing Setup Delta’s DC/DC power modules are characterized in heated vertical wind tunnels that simulate the thermal environments encountered in most electronics equipment. This type of equipment commonly uses vertically mounted circuit cards in cabinet racks in which the power modules are mounted. The following figure shows the wind tunnel characterization setup. The power module is mounted on a test PWB and is vertically positioned within the wind tunnel. The space between the neighboring PWB and the top of the power module is constantly kept at 6.35mm (0.25’’). Figure 20: Temperature measurement location The allowed maximum hot spot temperature is defined at 123℃. Ou tp ut Curre nt(A) S 36SE3R305(Standard) Output C urrent vs. A mbient Temperature and A ir Velocity @V in = 24V (Either Orientati on) 5 Natural Convection 4 FACING PWB PWB MODULE 3 2 1 AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED BELOW THE MODULE AIR FLOW 0 60 65 70 75 80 85 Ambient Te mperature (℃) 50.8 (2.0”) Figure 21: Output current vs. ambient temperature and air velocity@ Vin=24V (Either Orientation) Ou tp ut Curre nt(A) S 36SE3R305(Standard) Output C urrent vs. A mbient Temperature and A ir Velocity @V in = 48V (Either Orientati on) 12.7 (0.5”) Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches) 5 Natural Convection 4 Figure 19: Wind tunnel test setup 3 2 1 0 60 65 70 75 80 85 Ambient Te mperature (℃) Figure 21: Output current vs. ambient temperature and air velocity@ Vin=48V (Either Orientation) DS_S36SE3R305_02152007 9 PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL RECOMMENDED PAD LAYOUT (SMD) DS_S36SE3R305_02152007 10 LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE 2nd Ramp-up temp. Peak temp. 1.0~3.0°C /sec. 210~230°C 5sec. Pre-heat temp. 140~180°C 60~120 sec. Cooling down rate
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