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S48SP05007NRFA

S48SP05007NRFA

  • 厂商:

    DELTA(台达)

  • 封装:

  • 描述:

    S48SP05007NRFA - Delphi Series S48SP, 35W 1x1 Brick DC/DC Power Modules: 48V in, 3.3V/10A out - Delt...

  • 详情介绍
  • 数据手册
  • 价格&库存
S48SP05007NRFA 数据手册
FEATURES High efficiency: 90% @ 3.3V/10A Industry standard 1x2 pinout Size: 33.0 x 24.4 x 8.3mm (1.30”x0.96”x0.33”) SMD and Through-hole versions Fixed frequency operation Input UVLO, OVP OTP and output OCP, OVP (default is auto-restart) Monotonic startup into normal and pre-biased loads 2250V isolation and basic insulation No minimum load required ISO 9001, TL 9000, ISO 14001, QS9000, OHSAS18001 certified manufacturing facility UL/cUL 60950 (US & Canada) recognized, and TUV (EN60950) certified CE mark meets 73/23/EEC and 93/68/EEC directive Delphi Series S48SP, 35W 1x1 Brick DC/DC Power Modules: 48V in, 3.3V/10A out The Delphi Series S48SP, 1x1 Brick, 48V input, single output, isolated DC/DC converters are the latest offering from a world leader in power systems technology and manufacturing ― Delta Electronics, Inc. This product family is available in a surface mount or through-hole package and provides up to 35 watts of power or 10A of output current (3.3V and below) in a new 1x1 form factor (1.30”x0.96”x0.33”). The pinout is compatible with the industry standard 1x2 products. With creative design technology and optimization of component placement, these converters possess outstanding electrical and thermal performance, as well as extremely high reliability under highly stressful operating conditions. Typical efficiency of the 3.3V/10A module is better than 90%. All modules are fully protected from abnormal input/output voltage, current, and temperature conditions. OPTIONS SMD module available Remote On/Off Trim pin OTP and Output OVP, OCP mode, Auto-restart (default) or latch-up Short pin lengths Encapsulated case optional APPLICATIONS Optical Transport Data Networking Communications, including Wireless and traditional Telecom Servers DATASHEET DS_S48SP3R310_03062007 TECHNICAL SPECIFICATIONS (TA=25°C, airflow rate=300 LFM, Vin=48Vdc, nominal Vout unless otherwise noted.) PARAMETER ABSOLUTE MAXIMUM RATINGS Input Voltage Continuous Transient (100ms) Operating Temperature Storage Temperature Input/Output Isolation Voltage INPUT CHARACTERISTICS Operating Input Voltage Input Under-Voltage Lockout Turn-On Voltage Threshold Turn-Off Voltage Threshold Lockout Hysteresis Voltage Maximum Input Current No-Load Input Current Off Converter Input Current Inrush Current (I2t) Input Reflected-Ripple Current Input Voltage Ripple Rejection OUTPUT CHARACTERISTICS Output Voltage Set Point Output Voltage Regulation Over Load Over Line Over Temperature Total Output Voltage Range Output Voltage Ripple and Noise Peak-to-Peak RMS Operating Output Current Range Output DC Current-Limit Inception DYNAMIC CHARACTERISTICS Output Voltage Current Transient Positive Step Change in Output Current Negative Step Change in Output Current Settling Time (within 1% Vout nominal) Turn-On Transient Start-Up Time, From On/Off Control Start-Up Time, From Input Maximum Output Capacitance EFFICIENCY 100% Load 60% Load ISOLATION CHARACTERISTICS Input to Output Isolation Resistance Isolation Capacitance FEATURE CHARACTERISTICS Switching Frequency ON/OFF Control, Negative Remote On/Off logic Logic Low (Module On) Logic High (Module Off) ON/OFF Control, Positive Remote On/Off logic Logic Low (Module Off) Logic High (Module On) ON/OFF Current (for both remote on/off logic) Leakage Current (for both remote on/off logic) Output Voltage Trim Range Output Over-Voltage Protection GENERAL SPECIFICATIONS MTBF Weight Over-Temperature Shutdown NOTES and CONDITIONS S48SP3R310 (Standard) Min. Typ. Max. Units 80 100 110 125 2250 75 34 32 2 40 10 0.01 35.5 33.5 3.0 1.10 Vdc Vdc °C °C Vdc Vdc Vdc Vdc Vdc A mA mA A2s mA dB Vdc mV mV mV V mV mV A % mV mV us ms ms µF % % 2250 10 1000 400 Vdc MΩ pF kHz 0.8 18 0.8 18 0.25 -10% 3.8 1.98 10.5 117 30 10% 4.62 V V V V mA uA % V M hours grams °C 100ms Refer to Figure 20 for the measuring point -40 -55 36 32.5 30.5 1.0 100% Load, 36Vin P-P thru 12µH inductor, 5Hz to 20MHz 120 Hz Vin=48V, Io=Io.max, Tc=25°C Io=Io, min to Io, max Vin=36V to 75V Tc=-40°C to 100°C Over load, line and temperature 5Hz to 20MHz bandwidth Full Load, 1µF ceramic, 10µF tantalum Full Load, 1µF ceramic, 10µF tantalum Output Voltage 10% Low 48V, 10µF Tan & 1µF Ceramic load cap, 0.1A/µs 50% Io.max to 75% Io.max 75% Io.max to 50% Io.max 3.25 10 60 3.3 ±3 ±3 ±33 3.2 30 10 0 110 100 100 50 15 15 3.35 ±10 ±10 3.4 60 20 10 140 Full load; 5% overshoot of Vout at startup 90.0 89.0 5000 Von/off Von/off Von/off Von/off Ion/off at Von/off=0.0V Logic High, Von/off=15V Across Trim Pin & +Vo or -Vo, Pout≦max rated Over full temp range; % of nominal Vout Io=80% of Io, max; Ta=25°C; air flow 300LFM Refer to Figure 20 for the measuring point -0.7 2 -0.7 2 DS_S48SP3R310_03062007 2 ELECTRICAL CHARACTERISTICS CURVES Figure 1: Efficiency vs. load current for minimum, nominal, and maximum input voltage at 25°C Figure 2: Power dissipation vs. load current for minimum, nominal, and maximum input voltage at 25°C. Figure 3: Typical full load input characteristics at room temperature DS_S48SP3R310_03062007 3 ELECTRICAL CHARACTERISTICS CURVES For Negative Remote On/Off Logic 0 0 0 0 Figure 4: Turn-on transient at full rated load current (5 ms/div). Vin=48V. Top Trace: Vout, 1.0V/div; Bottom Trace: ON/OFF input, 2V/div Figure 5: Turn-on transient at zero load current (5 ms/div). Vin=48V. Top Trace: Vout, 1.0V/div, Bottom Trace: ON/OFF input, 2V/div For Positive Remote On/Off Logic 0 0 0 0 Figure 6: Turn-on transient at full rated load current (5 ms/div). Vin=48V. Top Trace: Vout, 1.0V/div; Bottom Trace: ON/OFF input, 2V/div Figure 7: Turn-on transient at zero load current (5 ms/div). Vin=48V. Top Trace: Vout, 1.0V/div; Bottom Trace: ON/OFF input, 2V/div DS_S48SP3R310_03062007 4 ELECTRICAL CHARACTERISTICS CURVES 0 0 0 Figure 8: Output voltage response to step-change in load current (75%-50% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (100mV/div, 50us/div), Bottom Trace: Iout (2A/div). Scope measurement should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module 0 Figure 9: Output voltage response to step-change in load current (50%-75% of Io, max; di/dt = 0.1A/µs). Load cap: 10µF tantalum capacitor and 1µF ceramic capacitor. Top Trace: Vout (100mV/div, 50us/div), Bottom Trace: Iout (2A/div). Scope measurement should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module 0 Figure 10: Test set-up diagram showing measurement points for Input Terminal Ripple Current and Input Reflected Ripple Current. Note: Measured input reflected-ripple current with a simulated source Inductance (LTEST) of 12 µH. Capacitor Cs offset possible battery impedance. Measure current as shown below Figure 11: Input Terminal Ripple Current, ic, at full rated output current and nominal input voltage with 12µH source impedance and 33µF electrolytic capacitor (50 mA/div, 1us/div) DS_S48SP3R310_03062007 5 ELECTRICAL CHARACTERISTICS CURVES Copper Strip Vo(+) 0 Vo(-) 10u 1u SCOPE RESISTIV LOAD Figure 12: Input reflected ripple current, is, through a 12µH source inductor at nominal input voltage and rated load current (20 mA/div, 1us/div) Figure 13: Output voltage noise and ripple measurement test setup 0 Figure 14: Output voltage ripple at nominal input voltage and rated load current (Io=10A)(20 mV/div, 1us/div) Load capacitance: 1µF ceramic capacitor and 10µF tantalum capacitor. Bandwidth: 20 MHz. Scope measurements should be made using a BNC cable (length shorter than 20 inches). Position the load between 51 mm to 76 mm (2 inches to 3 inches) from the module Figure 15: Output voltage vs. load current showing typical current limit curves and converter shutdown points DS_S48SP3R310_03062007 6 DESIGN CONSIDERATIONS Input Source Impedance The impedance of the input source connecting to the DC/DC power modules will interact with the modules and affect the stability. A low ac-impedance input source is recommended. If the source inductance is more than a few µH, we advise adding a 10 to 100 µF electrolytic capacitor (ESR < 0.7 Ω at 100 kHz) mounted close to the input of the module to improve the stability. The input source must be insulated from the ac mains by reinforced or double insulation. The input terminals of the module are not operator accessible. If the metal baseplate is grounded, one Vi pin and one Vo pin shall also be grounded. A SELV reliability test is conducted on the system where the module is used, in combination with the module, to ensure that under a single fault, hazardous voltage does not appear at the module’s output. When installed into a Class II equipment (without grounding), spacing consideration should be given to the end-use installation, as the spacing between the module and mounting surface have not been evaluated. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. This power module is not internally fused. To achieve optimum safety and system protection, an input line fuse is highly recommended. The safety agencies require a fuse with 3A maximum rating to be installed in the ungrounded lead. A lower rated fuse can be used based on the maximum inrush transient energy and maximum input current. Layout and EMC Considerations Delta’s DC/DC power modules are designed to operate in a wide variety of systems and applications. For design assistance with EMC compliance and related PWB layout issues, please contact Delta’s technical support team. An external input filter module is available for easier EMC compliance design. Application notes to assist designers in addressing these issues are pending release. Safety Considerations The power module must be installed in compliance with the spacing and separation requirements of the end-user’s safety agency standard, i.e., UL60950, CAN/CSA-C22.2 No. 60950-00 and EN60950:2000 and IEC60950-1999, if the system in which the power module is to be used must meet safety agency requirements. Basic insulation based on 75 Vdc input is provided between the input and output of the module for the purpose of applying insulation requirements when the input to this DC-to-DC converter is identified as TNV-2 or SELV. An additional evaluation is needed if the source is other than TNV-2 or SELV. When the input source is SELV circuit, the power module meets SELV (safety extra-low voltage) requirements. If the input source is a hazardous voltage which is greater than 60 Vdc and less than or equal to 75 Vdc, for the module’s output to meet SELV requirements, all of the following must be met: Soldering and Cleaning Considerations Post solder cleaning is usually the final board assembly process before the board or system undergoes electrical testing. Inadequate cleaning and/or drying may lower the reliability of a power module and severely affect the finished circuit board assembly test. Adequate cleaning and/or drying is especially important for un-encapsulated and/or open frame type power modules. For assistance on appropriate soldering and cleaning procedures, please contact Delta’s technical support team. DS_S48SP3R310_03062007 7 FEATURES DESCRIPTIONS Over-Current Protection The modules include an internal output over-current protection circuit, which will endure current limiting for an unlimited duration during output overload. If the output current exceeds the OCP set point, the modules will automatically shut down, and enter hiccup mode or latch mode, which is optional. For hiccup mode, the module will try to restart after shutdown. If the overload condition still exists, the module will shut down again. This restart trial will continue until the overload condition is corrected. For latch mode, the module will latch off once it shutdown. The latch is reset by either cycling the input power or by toggling the on/off signal for one second. Remote On/Off The remote on/off feature on the module can be either negative or positive logic. Negative logic turns the module on during a logic low and off during a logic high. Positive logic turns the modules on during a logic high and off during a logic low. Remote on/off can be controlled by an external switch between the on/off terminal and the Vi(-) terminal. The switch can be an open collector or open drain. For negative logic if the remote on/off feature is not used, please short the on/off pin to Vi(-). For positive logic if the remote on/off feature is not used, please leave the on/off pin floating. Over-Voltage Protection The modules include an internal output over-voltage protection circuit, which monitors the voltage on the output terminals. If this voltage exceeds the over-voltage set point, the module will shut down, and enter in hiccup mode or latch mode, which is optional. For hiccup mode, the module will try to restart after shutdown. If the overload condition still exists, the module will shut down again. This restart trial will continue until the overload condition is corrected. For latch mode, the module will latch off once it shutdown. The latch is reset by either cycling the input power or by toggling the on/off signal for one second. ON/OFF Vo(-) Vi(-) Vi( Vi(+) Trim R Load Vo(+) Figure 16: Remote on/off implementation Over-Temperature Protection The over-temperature protection consists of circuitry that provides protection from thermal damage. If the temperature exceeds the over-temperature threshold the module will shut down, and enter hiccup mode or latch mode, which is optional. For hiccup mode, the module will try to restart after shutdown. If the overload condition still exists, the module will shut down again. This restart trial will continue until the overload condition is corrected. For latch mode, the module will latch off once it shutdown. The latch is reset by either cycling the input power or by toggling the on/off signal for one second. DS_S48SP3R310_03062007 8 FEATURES DESCRIPTIONS (CON.) Output Voltage Adjustment To increase or decrease the output voltage set point, the modules may be connected with an external resistor between the TRIM pin and either the Vo(+) or Vo(-). The TRIM pin should be left open if this feature is not used. ON/OFF Vo (-) R trim-up Vi (-) Vi (+) Vo Vo (+) ON/OFF Vo (-) Trim R Load Vi (-) Trim R trim-down Vo (+) R Load Figure 18: Circuit configuration for trim-up (increase output voltage) Vi (+) Figure 17: Circuit configuration for trim-down (decrease output voltage) If the external resistor is connected between the TRIM and Vo(-) the output voltage set point increases (Fig. 18). The external resistor value required to obtain an output voltage change from 3.3V to the desired Vo_adj is defined as: 2.5 ⋅ 5110 Vo_adj − 3.3 − 2050 If the external resistor is connected between the TRIM and Vo(+) pins, the output voltage set point decreases (Fig. 17). The external resistor value required to obtain an output voltage change from 3.3V to the desired Vo_adj is defined as: Rtrim_down ( Vo_adj − 2.5 ) ⋅ 5110 3.3 − Vo_adj Rtrim_up Ex. When Trim-up +10% Vo_adj=3.3V×(1+10%)=3.63V Rtrim_up 2.5 ⋅ 5110 3.63 − 3.3 4 − 2050 Ex. When Trim-down -10% Vo_adj=3.3V×(1-10%)=2.97V Rtrim_down ( 2.97 − 2.5 ) ⋅ 5110 3.3 − 2.97 3 − 2050 Rtrim_up = 3.666 × 10 ohm − 2050 Rtrim_down = 5.228 × 10 ohm When using trim function, the output voltage of the module is usually increased, which increases the power output of the module with the same output current. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power. DS_S48SP3R310_03062007 9 THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operation, sufficient cooling of the power module is needed over the entire temperature range of the module. Convection cooling is usually the dominant mode of heat transfer. Hence, the choice of equipment to characterize the thermal performance of the power module is a wind tunnel. Thermal Derating Heat can be removed by increasing airflow over the module. To enhance system reliability, the power module should always be operated below the maximum operating temperature. If the temperature exceeds the maximum module temperature, reliability of the unit may be affected. THERMAL CURVES Thermal Testing Setup Delta’s DC/DC power modules are characterized in heated vertical wind tunnels that simulate the thermal environments encountered in most electronics equipment. This type of equipment commonly uses vertically mounted circuit cards in cabinet racks in which the power modules are mounted. The following figure shows the wind tunnel characterization setup. The power module is mounted on a test PWB and is vertically positioned within the wind tunnel. The space between the neighboring PWB and the top of the power module is constantly kept at 6.35mm (0.25’’). Figure 20: Hot spot temperature measured point *The allowed maximum hot spot temperature is defined at 110℃ FACING PWB PWB MODULE Output Cur rent(A) S48SP 3R310(Standard) Output Load vs. Am bient Temperature and Ai r Veloci ty @Vi n=48V (Ei ther O ri entation) 11 10 9 8 Natural C onvection AIR VELOCITY AND AMBIENT TEMPERATURE MEASURED BELOW THE MODULE AIR FLOW 7 6 5 100LFM 200LFM 300LFM 50.8 (2.0”) 4 3 2 1 400LFM 500LFM 600LFM 12.7 (0.5”) Note: Wind Tunnel Test Setup Figure Dimensions are in millimeters and (Inches) 0 60 65 70 75 80 85 Ambient Tem peratur e ( ℃) Figure 19: Wind tunnel test setup Figure 21: Output load vs. ambient temperature and air velocity@Vin=48V (Either Orientation) DS_S48SP3R310_03062007 10 PICK AND PLACE LOCATION SURFACE-MOUNT TAPE & REEL RECOMMENDED PAD LAYOUT (SMD) DS_S48SP3R310_03062007 11 LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE 250 Temperature (°C ) 200 150 100 50 2nd Ramp-up temp. Peak temp. 1.0~3.0°C /sec. 210~230°C 5sec. Pre-heat temp. 140~180°C 60~120 sec. Cooling down rate
S48SP05007NRFA
1. 物料型号:该物料的型号为STM32F103RCT6,是一款基于ARM Cortex-M3内核的32位微控制器。 2. 器件简介:器件提供了丰富的外设,包括GPIO,ADC,定时器,以及多种通信接口如USB,CAN,I2C等。 3. 引脚分配:该芯片共有100个引脚,包括电源引脚,地引脚,I/O引脚,以及各种通信接口的引脚。 4. 参数特性:工作电压范围为2.0V至3.6V,最大工作频率为72MHz,内置64KB的Flash和20KB的RAM。 5. 功能详解:该芯片具备多种功能,包括但不限于GPIO控制,模拟信号处理,定时器控制,以及丰富的通信功能。 6. 应用信息:该物料适用于多种应用场景,如工业控制,消费电子,医疗设备等需要高性能微控制器的场合。 7. 封装信息:该物料的封装类型为LQFP-100,适用于表面贴装技术。
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