DOCUMENT : CYNP-68-A13
REVISION
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CYNTEC CO., LTD.
乾坤科技股份有限公司
2W, 2512, Low Resistance Chip Resistor (Lead / Halogen Free)
1. Scope
This specification applies to 6.35mm x 3.2mm size 2W.
2. Features / Applications
– Welding construction; excellent long-term stability
– Ideal for all types of current sensing, voltage division and pulse applications
– Industrial applications & Current Sensor Resistor
– RoHS compliant
3. Type Designation
SCMM
(1)
Where
2512
S
2
(2)
(3)
(4)
ー
□□□□
□
(5)
(6)
(1) Series No.
(2) Size
(3) Terminal Type:
S = Short terminal type
(4) Power Rating:
2 = 2W
(5) Resistance value:
R010 = 0.01, 0M30 = 0.0003
(6) Tolerance
F = ±1%, G = ±2%, J = ±5%
4. Dimensions and schematic
Resistance Range1
Dimensions
0.3, 0.5, 0.75, 0.8
(mm)
mΩ
1, 2, 3, 4
mΩ
5, 6
mΩ
7, 8, 9, 10,
15, 20
mΩ
L
6.35 ± 0.25
W
3.20 ± 0.25
t
0.60 ± 0.25
a
2.55 ± 0.25
2.05 ± 0.25
1.15 ± 0.25
0.70 ± 0.25
Note: 1. Other resistance value required, please contact sales
2. 0.3, 0.5, 0.75, 0.8mΩ without marking
Figure 1. Construction and Dimensions
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5. Specification
Characteristics
Feature
Power Rating*
2W
Resistance Value
0.3 ~ 20 m
0.3
mΩ
0.5, 0.75, 0.8
mΩ
1, 2, 3, 4, 5, 6, 7, 8,
9, 10, 15, 20
mΩ
125 ppm/℃
75 ppm/℃
50 ppm/℃
Temperature Coefficient of Resistance
-65℃ ~ +170℃
Operation Temperature Range
Resistance Tolerance
1%(F), 2%(G), 5%(J)
Insulation Resistance
Over 100M
( P*R)1/2
Maximum Working Voltage (V)
Note * :
For resistors operated at ambient temperature in excess of 70℃, the maximum load shall be derated in
accordance with the following curve.
100
80
60
40
20
0
-65
-25
0
25
50
75
100
125
70
Figure 2.:Power Temperature Derating Curve
150
170
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DOCUMENT : CYNP-68-A13
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6. Characteristics
6-1 Electrical
Item
Specification and Requirement
Test Method
Temperature
Coefficient
(TCR)
As follow specification .
JIS-C-5201
+25℃/ +125℃
Short Time Overload
△R: 0.5%
Without damage by flashover, spark,
arcing, burning or breakdown
JIS-C-5201-1 4.13
2.5 x rated power for 5 seconds
Insulation Resistance
Over 100 M on Overcoat layer face
up
JIS-C-5201-1 4.6
100VDC for 60 +10/-0 seconds
Voltage Proof
△R: 1%
Without damage by flashover, spark,
arcing, burning or breakdown
JIS-C-5201-1 4.7
400VAC(rms.) for 60 +10/ -0
seconds
ESD
△R: 1%
AEC-Q200-002
Human body, 3KV
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DOCUMENT : CYNP-68-A13
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6-2 Mechanical
Item
Solderability
Specification and Requirement
The surface of terminal immersed
shall be minimum of 95% covered
with a new coating of solder
Resistance to Solder Heat △R: 0.5%
Without distinct deformation in
appearance
Test Method
JIS-C-5201-1 4.17
245 5℃ for 5 0.5 seconds
JIS-C-5201-1 4.18
260±5℃ for 10 1 seconds
Board Flex
AEC-Q200-005
△R: 1.0%
Without mechanical damage such as Bending value: 2 mm for 60 ± 1
seconds
break
Resistance to solvent
Without mechanical and distinct
damage in appearance
Vibration
MIL-STD-202 Method 204
△R: 0.5%
Without mechanical damage such as 5g’s for 20 minutes,12 cycles each
of 3 orientations. Test from
break
10-2000Hz
Mechanical Shock
MIL-STD-202 Method 213
△R: 0.5%
Without mechanical damage such as 100g’s peak value, 6ms,
Half-sine waveform, 12.3ft/sec
break
Terminal Strength
(SMD)
AEC-Q200-006
△R: 1%
Without mechanical damage such as Force of 1.8Kg for 60 seconds.
break.
MIL-STD-202 Method 215
Add Aqueous wash chemical OKEM Clean or equivalent.
Do not use banned solvents
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6-3 Endurance
Item
Specification and Requirement
Test Method
Temperature Cycling
△R: 0.5%
Without distinct damage in
appearance
JESD22 Method JA-104
1000 cycles, (-55℃~150℃)
30min maximum dwell time at each
temperature.
Biased Humidity
△R: 0.5%
MIL-STD-202 Method 103
1000 hours, 85℃/85%R.H,
applied for 10% rated power
Measurement at 24±4 hours after
test conclusion.
Operational Life
△R: 1.0%
Without distinct
damage in appearance
MIL-STD-202 Method 108
70℃, 100% rated power
1.5 hours ON, 0.5 hours Off
For total 1000 hours
Measurement at 24±4 hours after
test conclusion.
High Temperature
Storage
△R: 1.0%
Without distinct
damage in appearance
MIL-STD-202 Method 108
170℃ for total 1,000 hours
7. Recommended Solder Pad Dimensions
Dimensions
Resistance Range
0.3, 0.5, 0.75, 0.8, 1, 2, 3, 4 mΩ
5, 6 mΩ
7, 8, 9, 10, 15, 20 mΩ
Sensing Trace
W
(mm)
3.7
L
(mm)
D
(mm)
7.35
3.20
2.10
1.65
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8. Packaging
8-1 Dimensions
8-1-1 Tape packaging dimensions
0.3 max.
1.5+0.1
-0.0
4.0 ± 0.1
Feed forward hole
2.0 ± 0.05
1.5 ± 0.1
1.75 ± 0.10
5.50 ± 0.05
B
12.0 ± 0.3
1.5 max.
A
Cavity
4.0 ± 0.1
Pulling direction
A = 3.60 ± 0.20
B = 6.80 ± 0.20
Unit : mm
8-1-2 Reel dimensions
13.0±0.5
4.0
0 +0
-0 .5
2.0±0.5
178.0±2.0
60.2±0.5
13.2±1.5
16.0±0.2
Unit : mm
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8-2 Peel Strength of Top Cover Tape
The peel speed shall be about 300mm/min.
The peel force of top cover tape shall between 0.1 to 0.7N
Top Cover Tape
165 ~ 180°
0.1 ~ 0.7N
Carrier tape
8-3 Number of Taping
2,000 pieces / reel
8-4 Label marking
The following items shall be marked on the reel.
(1) Type designation
(2) Quantity
(3) Manufacturing date code
(4) Manufacturer’s name
(5) The country of origin
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9. Care note
9-1 Care note for storage
(1) Chip resistor shall be stored in a room where temperature and humidity must be controlled.
(temperature 5 to 35℃, humidity < 60% RH) However, a humidity keep it low, as it is
possible.
(2) Chip resistor shall be stored as direct sunshine doesn’t hit on it.
(3) Chip resistor shall be stored with no moisture, dust, a material that will make solderability
inferior, and a harmful gas (Chloridation hydrogen, sulfurous acid gas, and sulfuration
hydrogen)
9-2 Care note for operating and handling
(1) It is necessary to protect the edge and protection coat of resistors from mechanical stress.
(2) Handle with care when printing circuit board (PCB) is divided or fixed on support body,
because bending of printing circuit board (PCB) mounting will make mechanical stress for
resistors.
(3) Resistors shall be used with in rated range shown in specification. Especially, if voltage
more than specified value will be loaded to resistor, there is a case it will make damage for
machine because of temperature rise depending on generating of heat, and increase
resistance value or breaks.
(4) In case that resistor is loaded a rated voltage, it is necessary to confirms temperature of a
resistor and to reduce a load power according to load reduction curve, because a
temperature rise of a resistor depends on influence of heat from mounting density and
neighboring element.
(5) Observe Limiting element voltage and maximum overload voltage specified in each
specification
(6) If there is possibility that a large voltage (pulse voltage, shock voltage) charge to resistor, it
is necessary that operating condition shall be set up before use.