2DC4617QLP
NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
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Features
• • • • • Complementary PNP Type Available (2DA1774QLP) Ultra-Small Leadless Surface Mount Package Lead Free By Design/RoHS Compliant (Note 1) "Green" Device (Note 2) Qualified to AEC-Q101 Standards for High Reliability
1
NEW P RO DU CT
E C B
3
Mechanical Data
• • • • • • • • Case: DFN1006-3 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminal Connections Indicator: Collector Dot Terminals: Finish ⎯ NiPdAu over Copper leadframe. Solderable per MIL-STD-202, Method 208 Ordering Information: See Page 3 Marking Information: See Page 3 Weight: 0.0009 grams @TA = 25°C unless otherwise specified Symbol VCBO VCEO VEBO IC ICM Value 50 50 5.0 100 200 BOTTOM VIEW
2
TOP VIEW (Internal Schematic)
DFN1006-3
Maximum Ratings
Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Peak Collector Current
Unit V V V mA mA
Thermal Characteristics
Characteristic Power Dissipation @TA = 25°C (Note 3) Thermal Resistance, Junction to Ambient @TA = 25°C (Note 3) Operating and Storage Temperature Range Symbol PD RθJA TJ, TSTG Value 250 500 -55 to +150 Unit mW °C/W °C
Electrical Characteristics
Characteristic OFF CHARACTERISTICS (Note 4) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Emitter Cutoff Current ON CHARACTERISTICS (Note 4) DC Current Gain Collector-Emitter Saturation Voltage SMALL SIGNAL CHARACTERISTICS Output Capacitance Current Gain-Bandwidth Product
Notes: 1. 2. 3. 4.
@TA = 25°C unless otherwise specified Symbol V(BR)CBO V(BR)CEO V(BR)EBO ICBO IEBO hFE VCE(SAT) Cobo fT Min 50 50 5.0 ⎯ ⎯ 120 ⎯ ⎯ 100 Max ⎯ ⎯ ⎯ 100 5 100 270 0.2 3.5 ⎯ Unit V V V nA μA nA ⎯ V pF MHz Test Condition IC = 50μA, IE = 0 IC = 1.0mA, IB = 0 IE = 50μA, IC = 0 VCB = 30V VCB = 30V, TA = 150°C VEB = 4.0V VCE = 6.0V, IC = 1.0mA IC = 50mA, IB = 5.0mA VCB = 12V, f = 1.0MHz, IE = 0 VCE = 12V, IC = 2.0mA, f = 100MHz
No purposefully added lead. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Part mounted on FR-4 PCB with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. Short duration pulse test used to minimize self-heating effect.
DS31439 Rev. 3 - 2
1 of 3 www.diodes.com
2DC4617QLP
© Diodes Incorporated
300
100
IB = 0.5mA
PD , POWER DISSIPATION (mW)
IC, COLLECTOR CURRENT (mA)
250
80
IB = 0.4mA
200
60
IB = 0.3mA
N EW PRODUCT
150
40
IB = 0.2mA
100
50
RθJA = 500 °C/W
20
IB = 0.1mA
0 0
0
25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve
150
0
1 2 3 4 VCE, COLLECTOR-EMITTER VOLTAGE (V) Fig. 2 Typical Collector Current vs. Collector-Emitter Voltage
5
400
0.5
VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (V)
0.4
IC/IB = 10
hFE, DC CURRENT GAIN
300
0.3
200
0.2
TA = 150ºC TA = 85ºC
100
0.1
TA = 25ºC TA = -55ºC
0 0.1
1 10 100 IC, COLLECTOR CURRENT (mA) Fig. 3 Typical DC Current Gain vs. Collector Current
1,000
0 0.1
1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Fig. 4 Typical Collector-Emitter Saturation Voltage vs. Collector Current
VBE(ON), BASE-EMITTER TURN-ON VOLTAGE (V)
1.2
1.2
1.0 VBE(SAT), BASE-EMITTER SATURATION VOLTAGE (V)
1.0
0.8
0.8
TA = -55°C
0.6
0.6
TA = 25°C T A = 85°C
0.4
0.4
TA = 150°C
0.2
0.2
IC /IB = 10
0 0.1
1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Fig. 5 Typical Base-Emitter Turn-On Voltage vs. Collector Current
0 0.1
1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Fig. 6 Typical Base-Emitter Saturation Voltage vs. Collector Current
DS31439 Rev. 3 - 2
2 of 3 www.diodes.com
2DC4617QLP
© Diodes Incorporated
Ordering Information
Device 2DC4617QLP-7
Notes: 5.
(Note 5) Packaging DFN1006-3 Shipping 3000/Tape & Reel
For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
N EW PRODUCT
Marking Information
DFN1006-3 Taping orientation
8D
8D = Product Type Marking Code Dot Denotes Collector Side
xx
xx
Direction of feed
Package Outline Dimensions
A A1 D b1 E b2 e
L2
L3
L1
DFN1006-3 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.03 b1 0.10 0.20 0.15 b2 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.35 ⎯ ⎯ L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3 0.40 ⎯ ⎯ All Dimensions in mm
Suggested Pad Layout
C
X1
X
G2
Dimensions Z G1 G2 X X1 Y C
Value (in mm) 1.1 0.3 0.2 0.7 0.25 0.4 0.7
Y Z
G1
IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. DS31439 Rev. 3 - 2 3 of 3 www.diodes.com 2DC4617QLP
© Diodes Incorporated
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