B1xB-13-F

  Green B170/B - B1100/B 1.0A HIGH VOLTAGE SCHOTTKY BARRIER RECTIFIER Features • • • • • • • • Guard Ring Die Construction for Transient Protection Ideally Suited for Automated Assembly Low Power Loss, High Efficiency Surge Overload Rating to 30A Peak For Use in Low Voltage, High Frequency Inverters, Free Wheeling, and Polarity Protection Application High Temperature Soldering: 260°C/10 Second at Terminal Lead Free Finish/RoHS Compliant (Note 1) Green Molding Compound (No Halogen and Antimony) (Note 2) Mechanical Data • • • • • • Case: SMA / SMB Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Lead Free Plating (Matte Tin Finish). Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band or Cathode Notch Weight: SMA 0.064 grams (approximate) SMB 0.093 grams (approximate) Top View Bottom View Ordering Information (Note 3) Part Number B1x-13-F B1xB-13-F Notes: Case SMA SMB Packaging 5000/Tape & Reel 3000/Tape & Reel *x = Device type, e.g. B180-13-F (SMA package); B1100B-13-F (SMB package). 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes. 2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information YWW xxx(x) XXX = Product type marking code, ex: B170 (SMA package) XXXX = Product type marking code, ex: B190B (SMB package) = Manufacturers’ code marking YWW = Date code marking Y = Last digit of year (ex: 2 for 2002) WW = Week code 01 to 52 B170/B - B1100/B Document number: DS30018 Rev. 10 - 2 1 of 4 www.diodes.com September 2010 © Diodes Incorporated B170/B - B1100/B Maximum Ratings @TA = 25°C unless otherwise specified Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%. Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current @ TT = 125°C Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load Repetitive Peak Reverse Current Symbol VRRM VRWM VR VR(RMS) IO IFSM IRRM B170/B 70 49 B180/B 80 56 1.0 30 1.0 B190/B 90 63 B1100/B 100 70 Unit V V A A A Thermal Characteristics Characteristic Typical Thermal Resistance Junction to Terminal (Note 4) Operating and Storage Temperature Range Symbol RθJT TJ, TSTG B170/B B180/B B190/B 25 -65 to +150 B1100/B Unit °C/W °C Electrical Characteristics Characteristic Forward Voltage Drop Leakage Current (Note 5) Total Capacitance Notes: @TA = 25°C unless otherwise specified Symbol VF IR CT Min Typ Max 0.79 0.69 0.5 5.0 80 Unit V mA pF Test Condition IF = 1.0A, TA = 25°C IF = 1.0A, TA = 100°C @ Rated VR, TA = 25°C @ Rated VR, TA = 100°C VR = 4V, f = 1MHz 4. Valid provided that terminals are kept at ambient temperature. 5. Short duration pulse test used to minimize self-heating effect. IF, INSTANTANEOUS FORWARD CURRENT (A) 10 1,000 1.0 CT, TOTAL CAPACITANCE (pF) TJ = 25°C IF Pulse Width = 300µs 100 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Typical Forward Characteristics 10 0.1 1 10 100 VR, DC REVERSE VOLTAGE (V) Fig. 2 Total Capacitance vs. Reverse Voltage B170/B - B1100/B Document number: DS30018 Rev. 10 - 2 2 of 4 www.diodes.com September 2010 © Diodes Incorporated B170/B - B1100/B 1.0 40 IFSM, PEAK FORWARD SURGE CURRENT (A) Single Half Sine-Wave IF(AV), AVERAGE FORWARD CURRENT (A) 30 0.5 20 10 TJ = 150°C 0 25 50 75 100 125 TT, TERMINAL TEMPERATURE (°C) Fig. 3 Forward Current Derating Curve 150 0 10 100 NUMBER OF CYCLES AT 60 Hz Fig. 4 Max Non-Repetitive Peak Forward Surge Current 1 Package Outline Dimensions B SMA Dim Min Max A 2.29 2.92 B 4.00 4.60 C 1.27 1.63 D 0.15 0.31 E 4.80 5.59 G 0.05 0.20 H 0.76 1.52 J 2.01 2.30 All Dimensions in mm SMB Dim Min Max A 3.30 3.94 B 4.06 4.57 C 1.96 2.21 D 0.15 0.31 E 5.00 5.59 G 0.05 0.20 H 0.76 1.52 J 2.00 2.50 All Dimensions in mm A C D J H G E Suggested Pad Layout SMA Value (in mm) Dimensions Z 6.5 G 1.5 X 1.7 Y C 2.5 4.0 SMB Value (in mm) Dimensions Z 6.7 G 1.8 X 2.3 2.5 Y 4.3 C B170/B - B1100/B Document number: DS30018 Rev. 10 - 2 3 of 4 www.diodes.com September 2010 © Diodes Incorporated B170/B - B1100/B IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2010, Diodes Incorporated www.diodes.com B170/B - B1100/B Document number: DS30018 Rev. 10 - 2 4 of 4 www.diodes.com September 2010 © Diodes Incorporated