BAS116
SURFACE MOUNT LOW LEAKAGE DIODE
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Features
• • • Surface Mount Package Ideally Suited for Automated Insertion Very Low Leakage Current Lead Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 3 and 4)
Mechanical Data
• • • • • • • • •
SOT-23
Case: SOT-23 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminal Connections: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). Polarity: See Diagram Marking Information: See Page 2 Ordering Information: See Page 2 Weight: 0.008 grams (approximate)
TOP VIEW
TOP VIEW Internal Schematic
Maximum Ratings
@TA = 25°C unless otherwise specified Symbol VRRM VRWM VR VR(RMS) IFM IFRM @ t = 1.0μs @ t = 1.0ms @ t = 1.0s IFSM Value 85 60 215 500 4.0 1.0 0.5 Unit V V mA mA A
Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 1) Repetitive Peak Forward Current Non-Repetitive Peak Forward Surge Current
Thermal Characteristics
Characteristic Power Dissipation (Note 1) @TA = 25°C Thermal Resistance Junction to Ambient Air (Note 1) @TA = 25°C Operating and Storage Temperature Range Symbol PD RθJA TJ, TSTG Value 250 500 -65 to +150 Unit mW °C/W °C
Electrical Characteristics
Characteristic Reverse Breakdown Voltage (Note 2) Forward Voltage
@TA = 25°C unless otherwise specified Symbol V(BR)R VF Min 85 ⎯ Typ ⎯ ⎯ Max ⎯ 0.90 1.0 1.1 1.25 5.0 80 ⎯ 3.0 Unit V V nA nA pF μs Test Condition IR = 100μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, Tj = 150°C VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω
Leakage Current (Note 2) Total Capacitance Reverse Recovery Time
Notes:
IR CT trr
⎯ ⎯ ⎯
⎯ 2 ⎯
1. Part mounted on FR-4 PC board with pad layout as shown on page 3. 2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead. Halogen and Antimony Free.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS116
Document number: DS30233 Rev. 9 - 2
1 of 3 www.diodes.com
May 2008
© Diodes Incorporated
BAS116
300 PD, POWER DISSIPATION (mW) 250
300
RθJA = 500°C/W
250 IF, FORWARD CURRENT (mA)
Note 1
200
200
150
150
100
100
50
50 0 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) Fig. 2 Current Derating Curve 200
0
0
25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve
150
IF, INSTANTANEOUS FORWARD CURRENT (mA)
1,000
10
VR = 75V
100
10
T A = 150°C
IR, REVERSE CURRENT (nA)
1
T A = 125°C
1
T A = 85°C TA = 25°C
0.1
0.01
0.001 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 3 Typical Forward Characteristics
0.1 0 50 100 150 TA, AMBIENT TEMPERATURE (°C) Fig. 4 Typical Reverse Characteristics 200
Ordering Information
Part Number BAS116-7-F
Notes:
(Note 5) Case SOT-23 Packaging 3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
XXX = Product Type Marking Code; K50, K54 YM = Date Code Marking Y = Year ex: N = 2002 M = Month ex: 9 = September
XXX
Date Code Key Year Code Month Code
2001 M Jan 1
2002 N Feb 2
2003 P Mar 3
2004 R Apr 4
2005 S May 5
YM
2006 T Jun 6
2007 U Jul 7
2008 V Aug 8
2009 W Sep 9
2010 X Oct O
2011 Y Nov N
2012 Z Dec D May 2008
BAS116
Document number: DS30233 Rev. 9 - 2
2 of 3 www.diodes.com
© Diodes Incorporated
BAS116
Package Outline Dimensions
A
TOP VIEW
BC
G H K M
J
D
F
L
SOT-23 Dim Min Max A 0.37 0.51 B 1.20 1.40 C 2.30 2.50 D 0.89 1.03 F 0.45 0.60 G 1.78 2.05 H 2.80 3.00 J 0.013 0.10 K 0.903 1.10 L 0.45 0.61 M 0.085 0.180 8° 0° α All Dimensions in mm
Suggested Pad Layout
Y Z C
Dimensions Value (in mm) Z 2.9 X 0.8 Y 0.9 C 2.0 E 1.35
X
E
IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
BAS116
Document number: DS30233 Rev. 9 - 2
3 of 3 www.diodes.com
May 2008
© Diodes Incorporated
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