BAV199DW_09

BAV199DW QUAD SURFACE MOUNT LOW LEAKAGE DIODE Please click here to visit our online spice models database. Features • • • • • Surface Mount Package Ideally Suited for Automated Insertion Very Low Leakage Current Lead Free/RoHS Compliant (Note 3) "Green" Device (Notes 4 and 5) Qualified to AEC-Q101 Standards for High Reliability Mechanical Data • • • • • • • • SOT-363 AC 1 Case: SOT-363 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Polarity: See Diagram Marking Information: See Page 2 Ordering Information: See Page 2 Weight: 0.008 grams (approximate) C2 A2 A1 C1 AC 2 TOP VIEW TOP VIEW Internal Schematic Maximum Ratings @TA = 25°C unless otherwise specified Symbol VRRM VRWM VR VR(RMS) Single diode Double diode @ t = 1.0μs @ t = 1.0ms @ t = 1.0s IFM IFRM IFSM Value 85 60 160 140 500 4.0 1.0 0.5 Unit V V mA mA A Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 2) Repetitive Peak Forward Current (Note 2) Non-Repetitive Peak Forward Surge Current Thermal Characteristics Characteristic Power Dissipation (Note 2) Thermal Resistance Junction to Ambient Air (Note 2) Operating and Storage Temperature Range Symbol PD RθJA TJ , TSTG Value 200 625 -65 to +150 Unit mW °C/W °C Electrical Characteristics Characteristic Reverse Breakdown Voltage (Note 1) Forward Voltage @TA = 25°C unless otherwise specified Symbol V(BR)R VF Min 85 ⎯ Typ ⎯ ⎯ Max ⎯ 0.90 1.0 1.1 1.25 5.0 80 ⎯ 3.0 Unit V V nA nA pF μs Test Condition IR = 100μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, TJ = 150°C VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω Leakage Current (Note 1) Total Capacitance Reverse Recovery Time Notes: 1. 2. 3. 4. 5. IR CT trr ⎯ ⎯ ⎯ ⎯ 2 ⎯ Short duration pulse test used to minimize self-heating effect. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. No purposefully added lead. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. BAV199DW Document number: DS30417 Rev. 9 - 2 1 of 4 www.diodes.com August 2009 © Diodes Incorporated BAV199DW IF, INSTANTANEOUS FORWARD CURRENT (mA) 300 1,000 PD, POWER DISSIPATION (mW) 250 100 200 10 150 1.0 100 50 0.1 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve, Total Package 0.01 2.0 0 0.4 1.2 1.6 0.8 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element IR , INSTANTANEOUS REVERSE CURRENT (nA) 10 300 Device mounted on an FR4 printed-circuit board IF, FORWARD CURRENT (mA) 50 100 150 200 TA, AMBIENT TEMPERATURE (°C) Fig. 3 Typical Reverse Characteristics, Per Element 0 250 200 1 150 100 50 0.1 0 0 50 100 150 200 TA, AMBIENT TEMPERATURE (°C) Fig. 4 Current Derating Curve, Per Element Ordering Information Part Number BAV199DW-7-F Notes: (Notes 5 & 6) Case SOT-363 Packaging 3000/Tape & Reel 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information K52 YM Date Code Key Year Code Month Code 2006 T Jan 1 Feb 2 2007 U Mar 3 Apr 4 YM K52 2008 V May 5 K52 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September) 2009 W Jun 6 Jul 7 2010 X Aug 8 Sep 9 2011 Y Oct O Nov N 2012 Z Dec D August 2009 © Diodes Incorporated BAV199DW Document number: DS30417 Rev. 9 - 2 2 of 4 www.diodes.com BAV199DW Package Outline Dimensions A BC H K M J D F L SOT-363 Dim Min Max A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 Typ F 0.40 0.45 H 1.80 2.20 J 0 0.10 K 0.90 1.00 L 0.25 0.40 M 0.10 0.22 0° 8° α All Dimensions in mm Suggested Pad Layout C2 C2 Z G C1 Y X Dimensions Value (in mm) Z 2.5 G 1.3 X 0.42 Y 0.6 C1 1.9 C2 0.65 BAV199DW Document number: DS30417 Rev. 9 - 2 3 of 4 www.diodes.com August 2009 © Diodes Incorporated BAV199DW IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2009, Diodes Incorporated www.diodes.com BAV199DW Document number: DS30417 Rev. 9 - 2 4 of 4 www.diodes.com August 2009 © Diodes Incorporated