BAV756DW-7-F

BAV756DW QUAD SURFACE MOUNT SWITCHING DIODE ARRAY Please click here to visit our online spice models database. Features • • • • • • • • Fast Switching Speed Ultra-Small Surface Mount Package For General Purpose Switching Applications High Conductance One BAV70 Circuit and One BAW56 Circuit In One Package Easily Connected As Full Wave Bridge Lead Free/RoHS Compliant (Note 3) "Green" Device (Notes 4 and 5) Mechanical Data • • • • • • • • • SOT-363 Case: SOT-363 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). Polarity: See Diagram Marking Information: See Page 2 Ordering Information: See Page 2 Weight: 0.006 grams (approximate) C1 A1 C2 A1 C2 A2 TOP VIEW TOP VIEW Internal Schematic Maximum Ratings @TA = 25°C unless otherwise specified Symbol VRM VRRM VRWM VR VR(RMS) IFM IO IFSM Value 100 75 53 300 150 2.0 1.0 Unit V V V mA mA A Characteristic Non-Repetitive Peak Reverse Voltage Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Notes 1 and 2) Average Rectified Output Current (Notes 1 and 2) Non-Repetitive Peak Forward Surge Current @ t = 1.0μs @ t = 1.0s Thermal Characteristics Characteristic Power Dissipation (Notes 1 and 2) Power Dissipation TS = 60°C (Note 2) Thermal Resistance Junction to Ambient Air (Notes 1 and 2) Thermal Resistance Junction to Soldering Point (Note 2) Operating and Storage Temperature Range Symbol PD PD RθJA RθJS TJ, TSTG Value 200 300 625 275 -65 to +150 Unit mW mW °C/W °C/W °C Electrical Characteristics Characteristic Reverse Breakdown Voltage (Note 6) Forward Voltage @TA = 25°C unless otherwise specified Symbol V(BR)R VF Min 75 ⎯ Max ⎯ 0.715 0.855 1.0 1.25 2.5 50 30 25 2.0 4.0 Unit V V μA μA μA nA pF ns Test Condition IR = 2.5μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, TJ = 150°C VR = 25V, TJ = 150°C VR = 20V VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω Reverse Current (Note 6) Total Capacitance Reverse Recovery Time Notes: IR CT trr ⎯ ⎯ ⎯ 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. One or more diodes loaded. 3. No purposefully added lead. 4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 6. Short duration pulse test used to minimize self-heating effect. BAV756DW Document number: DS30148 Rev. 9 - 2 1 of 3 www.diodes.com April 2008 © Diodes Incorporated BAV756DW IF, INSTANTANEOUS FORWARD CURRENT (A) 300 1 PD, POWER DISSIPATION (mW) 250 Note 1 200 0.1 150 100 0.01 50 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve, Total Package 0.001 0.5 1.0 1.5 0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element IR, INSTANTANEOUS REVERSE CURRENT (nA) 10,000 2.0 1.8 CT, TOTAL CAPACITANCE (pF) f = 1.0MHz 1,000 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 100 10 1 0.1 0 20 40 60 80 100 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element 0.0 10 30 40 20 VR, DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element 0 Ordering Information Part Number BAV756DW-7-F Notes: (Notes 5 & 7) Case SOT-363 Packaging 3000/Tape & Reel 7. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information KCA = Product Type Marking Code YM = Date Code Marking Y = Year ex: N = 2002 M = Month ex: 9 = September KCA Date Code Key Year Code Month Code 2001 M Jan 1 2002 N Feb 2 2003 P Mar 3 2004 R Apr 4 YM 2005 S May 5 2006 T Jun 6 2007 U Jul 7 2008 V Aug 8 2009 W Sep 9 2010 X Oct O 2111 Y Nov N 2012 Z Dec D April 2008 BAV756DW Document number: DS30148 Rev. 9 - 2 2 of 3 www.diodes.com © Diodes Incorporated BAV756DW Package Outline Dimensions A BC H K M J D F L SOT-363 Dim Min Max A 0.10 0.30 B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal F 0.30 0.40 H 1.80 2.20 J 0.10 ⎯ K 0.90 1.00 L 0.25 0.40 M 0.10 0.25 0° 8° α All Dimensions in mm Suggested Pad Layout E E Dimensions Value (in mm) Z G Z G C 2.5 1.3 0.42 0.6 1.9 0.65 X Y C E Y X IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. BAV756DW Document number: DS30148 Rev. 9 - 2 3 of 3 www.diodes.com April 2008 © Diodes Incorporated