BAW156_08

BAW156 DUAL SURFACE MOUNT LOW LEAKAGE DIODE Please click here to visit our online spice models database. Features • • • Surface Mount Package Ideally Suited for Automated Insertion Very Low Leakage Current Lead Free/RoHS Compliant (Note 3) Mechanical Data • • • • • • • • • SOT-23 Case: SOT-23 Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). Polarity: See Diagram Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.008 grams (approximate) TOP VIEW TOP VIEW Internal Schematic Maximum Ratings @TA = 25°C unless otherwise specified Symbol VRRM VRWM VR VR(RMS) Single diode Double diode @ t = 1.0μs @ t = 1.0ms @ t = 1.0s IFM IFRM IFSM Value 85 60 160 140 500 4.0 1.0 0.5 Unit V V mA mA A Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 2) Repetitive Peak Forward Current (Note 2) Non-Repetitive Peak Forward Surge Current Thermal Characteristics Characteristic Power Dissipation (Note 2) Thermal Resistance Junction to Ambient Air (Note 2) Operating and Storage Temperature Range Symbol PD RθJA TJ , TSTG Value 250 500 -65 to +150 Unit mW °C/W °C Electrical Characteristics Characteristic Reverse Breakdown Voltage (Note 1) Forward Voltage @TA = 25°C unless otherwise specified Symbol V(BR)R VF Min 85 ⎯ Typ ⎯ ⎯ Max ⎯ 0.90 1.0 1.1 1.25 5.0 80 ⎯ 3.0 Unit V V nA nA pF μs Test Condition IR = 100μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, TJ = 150°C VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω Leakage Current (Note 1) Total Capacitance Reverse Recovery Time Notes: IR CT trr ⎯ ⎯ ⎯ ⎯ 3 ⎯ 1. Short duration pulse test used to minimize self-heating effect. 2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 3. No purposefully added lead. BAW156 Document number: DS30231 Rev. 9 - 2 1 of 3 www.diodes.com March 2008 © Diodes Incorporated BAW156 IF, INSTANTANEOUS FORWARD CURRENT (mA) 300 1,000 PD , POWER DISSIPATION (mW) 250 100 200 10 150 1.0 100 50 0.1 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve, Total Package 0.01 1.6 2.0 0 0.4 0.8 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element IR, INSTANTANEOUS REVERSE CURRENT (nA) 10 VR = 75V 300 Device mounted on an FR4 printed-circuit board IF, FORWARD CURRENT (mA) 250 200 1 150 Single diode loaded 100 50 0.1 Double diode loaded 0 50 100 150 200 TA, AMBIENT TEMPERATURE (°C) Fig. 3 Typical Reverse Characteristics, Per Element 0 0 50 100 150 200 TA, AMBIENT TEMPERATURE (°C) Fig. 4 Current Derating Curve, Per Element 160 140 TA, AMBIENT TEMPERATURE (°C) 120 100 80 60 40 20 0 0.0 0.2 0.8 0.4 0.6 1.0 1.2 1.4 VF(AVE), AVERAGE FORWARD VOLTAGE (V) Fig. 5 Typical Forward Voltage vs. Ambient Temperature, Per Element BAW156 Document number: DS30231 Rev. 9 - 2 2 of 3 www.diodes.com March 2008 © Diodes Incorporated BAW156 Ordering Information Part Number BAW156-7-F Notes: (Note 4) Case SOT-23 Packaging 3000/Tape & Reel 4. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information K53 = Product Type Marking Code YM = Date Code Marking Y = Year ex: N = 2002 M = Month ex: 9 = September K53 Date Code Key Year Code Month Code 1998 J Jan 1 1999 K Feb 2 2000 L 2001 M Mar 3 2002 N Apr 4 2003 P May 5 YM 2004 R Jun 6 2005 S 2006 T Jul 7 2007 U Aug 8 2008 V Sep 9 2009 W Oct O 2010 X 2011 Y Nov N 2012 Z Dec D Package Outline Dimensions A TOP VIEW BC G H K M J D F L SOT-23 Dim Min Max A 0.37 0.51 B 1.20 1.40 C 2.30 2.50 D 0.89 1.03 F 0.45 0.60 G 1.78 2.05 H 2.80 3.00 J 0.013 0.10 K 0.903 1.10 L 0.45 0.61 M 0.085 0.180 8° 0° α All Dimensions in mm Suggested Pad Layout Y Z C Dimensions Value (in mm) Z 2.9 X 0.8 Y 0.9 2.0 C 1.35 E X E IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated. BAW156 Document number: DS30231 Rev. 9 - 2 3 of 3 www.diodes.com March 2008 © Diodes Incorporated